JPH04134609A - Manufacturing method for thin film magnetic head - Google Patents

Abstract

PURPOSE:To simplify a gap forming process, and to prevent a gap from peeling and inclining by using a part of sliding protection film as a gap member, and forming a magnetic gap integrally with the sliding protection film. CONSTITUTION:On an element substrate 1, a sliding protection film 2 is formed by spattering and the like. Next, etching is done by using a resist as a mask, the gap is formed by the same materials with the sliding protection film on the sliding protection film 2. At that time, without etching the sliding protection film to the element substrates, several hundreds and thousands Angstrom is left, and a gap 3 and the sliding protection film 2 are connected integrally. Next, a bottom magnetic core 4 is formed by plating. After that, an upper magnetic core, a loading conductor and so on are formed, and after connecting a support substrate, the element substrate is dissolved. And after exposing the sliding protection film surface, the surface is dry-etched or ground lightly, and the gap is exposed. Since the exposed sliding protection film surface is ground or dry-etched, and the magnetic gap is exposed, it becomes unnecessary to newly form a gap film to form the gap, and the film forming process can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a thin film magnetic head, particularly a method of manufacturing a planar head.

[Conventional technology]

Thin-film magnetic heads are manufactured using film-forming techniques such as vapor deposition and sputtering, as well as phosphorography techniques such as photolithography and etching, similar to semiconductor integrated circuit elements, and high-precision heads can be produced in large quantities. The points are distinctive.

As thin film magnetic heads, a vertical type in which a magnetic gap is formed in the horizontal direction (film thickness direction) on a substrate surface, and a 1000-sided type in which a magnetic gap is formed in the substrate surface are conventionally known.

Currently, the vertical type is in practical use because of its ease of gap formation and durability against media sliding.On the other hand, since the surface facing the head becomes the substrate, it is not active inside the substrate. The advantage is that the air bearing surface can be processed, and furthermore, since the magnetic gap depth is determined by the film thickness, it is easy to control.

With a vertical head, these processes usually have to be performed individually after cutting and separating from the substrate, which has been a factor in increasing costs.

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PPROCHTo MAKENG THIN
IRDgvx from F Engineering LM H Nagimu D 8L
The manufacturing method of the flat type agL head shown in "cz" (XGXZ ENGINEERING RM G'89) is shown in the cross-sectional view.
In the figure, it is an element substrate, 121 is a sliding protective film, and 13
) is the magnetic gap, 141 is the lower magnetic core, iIl is the insulating layer, (6) is the coil % + 7 + Fi upper magnetic 2 core, (
82 is a coil lead-out conductor, (9) is an insulating film #I, 1 is a support substrate, and dυ is a connection conductor provided in the support substrate.

Next, the manufacturing method will be explained using FIG. 8.

On the substrate (1), there is a sliding support a # +21 facing the medium.
The recess that forms the magnetic gap 13+ is protected against sliding by etching. i#121
(FIG. 3, 1Bl) Next, a gap film 1r is formed on the above substrate, a resist T-layer is applied on it, a plate is made into a sub-micro 7 width by the direct beam method, and this resist is masked. A gap 411 is formed by etching. (FIG. 3 IQ) - Reducing this magnetic gap width is important for increasing the linear density of the 5i51Le record, and submicron pattern width is required. Next, the lower blow core 14+ is formed by plating. (FIG. 30) At this time, no magnetic film is formed in the magnetic gap portion VC. On this ICl
lj order, insulation layer I button, coil 16), upper mother air core)
, the coil lead-out conductor (8)% is formed using phosphorography technique #. Next, an insulating protective layer (9) is laminated, polished until the coil lead-out conductor connection part is exposed, and a support substrate (2) that also supports the coil terminal is bonded (1).
Next, the entire X-substrate Ill is etched and dissolved to expose the magnetic gap surface. This surface is subjected to photolithography, and a single active surface is processed using an ion beam or the like (floating rotation D1 is performed using a hard disk head).

According to this method, since the magnetic gap (3) is accommodated in the flat part, that is, the surface facing the medium, the gear gap can be controlled by the film thickness, and the floating surface shape can be processed for each substrate at once. , it has the advantage that the time for slider processing can be significantly shortened.

[Problem to be solved by the invention]

The conventional planar thin film a-air head is manufactured as described above, and in one or more manufacturing processes, the gear part shape is formed by etching a part of the sliding protection S, and after gap AT sputtering on it, A resist mask is formed and the parts other than the mask are etched to form the entire gear. At this time, the width of the gap is submicron, so when forming the lower magnetic core in the first step by plating, the interface between the element substrate and the gap film is from,
There was a problem in that the gap was peeled off or tilted, making it impossible to form a correct gap.

This invention was made to solve the above-mentioned problems, and aims to provide a manufacturing method for a thin-film magnetic head that can simplify the gap formation process and prevent gap peeling and tilting. shall be.

[Means to solve the problem]

In the method for manufacturing a thin film magnetic head according to the present invention, when etching the 11eIVC sliding protective film for gear formation, it is used as a -gt gap material of the sliding protective film, and magnetically integrated with the sliding protection IiI #4. After forming a gap and removing the element substrate, the exposed fc sliding protection surface is polished or dry etched.

The magnetic gap is exposed.

In addition, it is preferable that the sliding support S and magnetic gap be formatted as 81Nχ.

[Function] Since this method is used as a frame and sliding protection St gap material, there is no need to newly form a gap film, and the film forming process can be reduced. Furthermore, when forming the lower magnetic core, since the gap and the sliding protection layer are integrally connected, it is possible to prevent the gap from peeling off from the element substrate or from tilting.

〔Example〕

An embodiment of the manufacturing method according to the present invention will be described above. FIG. 1 is a sectional view showing a method for forming a gear according to an embodiment of the present invention. Il+ is a sliding protector 1i on the element substrate (Li is a sliding protector!! film, 13)
A magnetic gap using #, 41 is a magnetic core.

On the 19th prisoner is an element substrate (e.g. silicon) Ill,
It is formed by a sliding protective film (f%, for example, 91N)+tl'Ik sputtering. Next, etching is performed using a resist as a mask on the Vc sliding protective film (21) to form a gap using the same material as the sliding protective film.At this time, as shown in Figure (8), the sliding protective film 21 is etched. The lower magnetic core (41 gold plating) is then etched as shown in Figure 1 IQK, leaving several hundred to 1000 micrometers of the gap (3) and the sliding protective film (1) integrally, without etching it all the way to the element substrate. Translate.

Regarding the subsequent steps, the upper magnetic core, lead-out conductor, etc. are formed in the same manner as in the cited document.

To support substrate 1: After bonding, the element substrate is melted. After setting and exposing the sliding protection surface, lightly dry etch or polish this surface to fully expose the gear.

In the above embodiment, silicon was used for the element substrate forming the element, and EliNX was used for the sliding protective film and the gap. With this configuration, an alkaline etching solution can be used in the step of removing the element substrate after bonding the support substrate, and the sliding protective film and the gap can be 81N.
Since Z can withstand alkaline etching solutions, it can be used as a sliding protection Sat etching stop layer to prevent element damage from S1G etching solutions, and can also be used as a lubricant with the air disk. 6 advantages
In the above example, as mentioned above, 5iNX was used for the dynamic protection shield and the gap, but depending on the type of etching solution for dissolving and removing the element substrate, other materials such as Muj
'xos, DLo, etc. may be used.

〔Effect of the invention〕

As mentioned above, this invention: Sliding protection 11 for forming a gap! When etching the film, use part of the sliding protective film as a gap material.

A magnetic gap is formed integrally with the sliding protective film, and after removing the element substrate, the exposed sliding protective film surface is polished or dry etched to expose the magnetic gap. SIt'', there is no need to form a new film, the entire film forming process can be completed, and in addition, it is possible to prevent gap peeling and tilting during the plating process for forming the lower magnetic core, thereby improving the yield. .

Further, by forming the sliding protective film and the magnetic gap with a thickness of 81 Nχ, it is possible to prevent the element from being damaged by the etching liquid on the element substrate, and furthermore, it can be used as a lubricant with the magnetic disk.

[Brief explanation of drawings]

1-Q are sectional views showing a method of manufacturing a magnetic gap portion according to an embodiment of the present invention. FIG. 2 is a sectional view showing the structure of a flat-plane 11illi type magnetic head, and FIGS. In the figure, the width is the element substrate, 121 is the sliding protective film, 13
1 is the magnetic gap, 41 is the lower magnetic core% + 51 is the insulating layer, (6) is the coil, 17) is the upper magnetic core, (8)
is the lead-out conductor, (9) is the S retaining film, and IIω is the support substrate 1.
The mouth is a connecting conductor. In addition, in the figure, the same or equivalent part is indicated by the same reference numeral '8.

Claims (2)

[Claims] (1) Step of forming a sliding protective film on the element substrate surface and a magnetic gap connected to this sliding protective film and integrally formed of the same material as the sliding protective film, sandwiching the magnetic gap. a step of forming a lower magnetic core, the above-mentioned sliding protective film;
A step of forming a coil on the magnetic gap and the lower magnetic core via an insulating layer, a step of forming an upper magnetic core magnetically connected to the lower magnetic core, and a connecting conductor of a coil terminal on the insulating layer. , a step of adhering a support substrate that also serves as head element support, a step of removing the element substrate after each of the above steps, and a step of polishing or dry etching the surface of the sliding protective film exposed after removing the element substrate. A method of manufacturing a thin film magnetic head, which includes the step of exposing the magnetic gap. (2) The method of manufacturing a thin film magnetic head according to claim 1, wherein the sliding protective film and the magnetic gap are formed of SiNx.