JPH04134293A - Positioning device - Google Patents
Positioning deviceInfo
- Publication number
- JPH04134293A JPH04134293A JP2255259A JP25525990A JPH04134293A JP H04134293 A JPH04134293 A JP H04134293A JP 2255259 A JP2255259 A JP 2255259A JP 25525990 A JP25525990 A JP 25525990A JP H04134293 A JPH04134293 A JP H04134293A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- positioning device
- positioning
- fixed
- oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Machine Tool Units (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は半導体集積回路製造用の露光装置およびNC工
作機械、各種測定機に関し、特に平板状物体を載置、傾
斜させて所定の基準面と平板状物体の表面とを一致させ
る位置決め装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an exposure apparatus, an NC machine tool, and various measuring instruments for manufacturing semiconductor integrated circuits, and in particular, the present invention relates to an exposure apparatus, an NC machine tool, and various measuring instruments for manufacturing semiconductor integrated circuits, and in particular, a flat object is placed and tilted to measure the precision of a predetermined reference surface. The present invention relates to a positioning device that aligns the surface of a flat object with the surface of a flat object.
[従来の技術]
従来の半導体露光装置のZTi℃tステージ(2傾斜ス
テージ、以下Zステージという)を第3.4図に示す。[Prior Art] A ZTi°Ct stage (two-tilt stage, hereinafter referred to as Z stage) of a conventional semiconductor exposure apparatus is shown in FIG. 3.4.
投影レンズ1は図示しないレチクル(原板)に描かれた
回路パターンの投影像を予め定められた露光基準面すな
わち像面に形成する・。露光すべきウェハ2はZステー
ジ3上にチャック4を介して保持される。板バネ5aの
一端は基盤6に固定された板バネ台7aに固定され、他
端は2ステージ3に固定されている。5a〜5cおよび
7a〜7cがZステージ3のカイトを構成する。駆動手
段はZ方向に伸縮するピエゾ8a〜8Cからなり各ビニ
ソの一端は基盤に固定され他端;;ポールを介して2ス
テージと接触している。The projection lens 1 forms a projected image of a circuit pattern drawn on a reticle (original plate) (not shown) on a predetermined exposure reference plane, that is, an image plane. A wafer 2 to be exposed is held on a Z stage 3 via a chuck 4. One end of the leaf spring 5a is fixed to a leaf spring stand 7a fixed to the base 6, and the other end is fixed to the two stages 3. 5a to 5c and 7a to 7c constitute a Z stage 3 kite. The driving means consists of piezos 8a to 8C that extend and contract in the Z direction, and one end of each piezo is fixed to the base, and the other end is in contact with the two stages via a pole.
像面とウェハ2表面の高さズレおよび傾きズレを検出す
る2検出器9と不図示の制御装置によりピエゾ8a〜8
cを駆動し、像面とウェハ表面を致させる。この時ピエ
ゾの剛性、Zステージの重量、板ハネの剛性等によって
決まる機械的共振周波数で2ステージ3は振動し、位置
決め時間を長くする。これを防くためにダンパか取付け
られている。このタンパは2ステージに固定されたLア
ングル13aと基盤6に固定されたしアングル14aと
の間に制振ゴム15aを挟み、板16aを介して予圧ポ
ルI〜17aで制振ゴムに予圧を与える構成である。こ
のような構成により、2ステジの振動を素早く吸収し位
置決め時間の短縮を図っていた。The piezos 8a to 8 are controlled by a second detector 9 that detects a height deviation and a tilt deviation between the image plane and the surface of the wafer 2, and a control device (not shown).
c to align the image plane with the wafer surface. At this time, the second stage 3 vibrates at a mechanical resonance frequency determined by the stiffness of the piezo, the weight of the Z stage, the stiffness of the plate springs, etc., prolonging the positioning time. A damper is installed to prevent this. In this tamper, a damping rubber 15a is sandwiched between an L angle 13a fixed to the second stage and an angle 14a fixed to the base 6, and a preload is applied to the damping rubber by preload ports I to 17a via a plate 16a. It is a configuration that gives. With this configuration, the vibrations of the two stages can be quickly absorbed and the positioning time can be shortened.
[発明か解決しようとする課題]
しかしながら、上記従来例では制振ゴムか徐々に劣化し
たり、また製造はらつきか比較的大きいため、制振性能
の安定性か悪かった。またZステージを下に押し付ける
力を発生させているため、Zステージの初期位置(例え
ばピエゾにCMvを印加した状態)は予圧力によって変
化する。また、制振ゴムの劣化によっても変化する。こ
のようにZステージの初期位置か経時変化し再調整か必
要であった。[Problems to be Solved by the Invention] However, in the conventional example described above, the damping rubber gradually deteriorated, and manufacturing irregularities were relatively large, so the stability of the damping performance was poor. Furthermore, since a force is generated to press the Z stage downward, the initial position of the Z stage (for example, a state in which CMv is applied to the piezo) changes depending on the preload force. It also changes due to deterioration of the damping rubber. In this way, the initial position of the Z stage changed over time and had to be readjusted.
本発明は上記従来技術の欠点に鑑みなされたものであっ
て、初期位置の経時変化を抑制し安定した制振性を有す
る位置決め装置の提供を目的とする。The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a positioning device that suppresses changes in the initial position over time and has stable vibration damping properties.
[課題を解決するための手段および作用]前記目的を達
成するため、本発明によれは2ステージの制振手段とし
て高粘度のシリコンオイル等をZステージと基盤との間
に挿入することにより、位置決め時間の短縮を図りしか
もダンパ性能の経時変化を極めて小さく抑える。また2
ステシに対し、外力を加えていないのでその初期位置の
経時変化はない。[Means and effects for solving the problem] In order to achieve the above object, according to the present invention, high viscosity silicone oil or the like is inserted between the Z stage and the base as a two-stage vibration damping means. To shorten positioning time and to minimize changes in damper performance over time. Also 2
Since no external force is applied to the stem, its initial position does not change over time.
[実施例コ
第1図および第2図は各々本発明の実施例の平面図およ
び縦断面図である。[Embodiment] FIGS. 1 and 2 are a plan view and a vertical sectional view of an embodiment of the present invention, respectively.
投影しンズ1はレチクルに描かれた回路バタンの投影像
を予め定められた露光基準面すなわち像面に形成する。The projection lens 1 forms a projected image of a circuit button drawn on a reticle on a predetermined exposure reference plane, that is, an image plane.
露光すべきウェハ2はZステージ3上にチャック4を介
して保持される。板ハネ5aの一端は、基盤6に固定さ
れた板ハネ台7aに固定され、他端はZステージ3に固
定されている。この2ステージ3の板バネ5aへの固定
点は2方向には弾性変形できるが、X、Y方向には全く
変位しない。他の板バネ5b、5cおよび板ハネ台7b
、7cについても同様である。これらにより2ステージ
3のガイドを構成している。駆動手段はZ方向に伸縮す
るピエゾ8a〜8cからなり各ピエゾの一端は基盤に固
定され他端は鋼球を介してZステージと接触しこれを支
持している。A wafer 2 to be exposed is held on a Z stage 3 via a chuck 4. One end of the plate spring 5a is fixed to a plate spring stand 7a fixed to the base 6, and the other end is fixed to the Z stage 3. The fixed point of the two stages 3 to the leaf spring 5a can be elastically deformed in two directions, but is not displaced at all in the X and Y directions. Other leaf springs 5b, 5c and leaf spring stand 7b
, 7c as well. These constitute a 2-stage 3 guide. The driving means consists of piezos 8a to 8c that expand and contract in the Z direction, and one end of each piezo is fixed to the base, and the other end contacts and supports the Z stage via a steel ball.
このような構成により2ステージは任意方向に傾斜可能
(X軸回りの回転およびY軸回りの回転)で、かつZ方
向にもB動できる。像面とウェハ表面の高さズレおよび
傾きズレを検出する2検出器9と不図示の制御装置によ
りピエゾ8a〜8cを駆動し、像面とウェハ表面を一致
させる。位置決め時の振動を吸収するためのダンパ手段
は、2ステージ3に固定されたピストン10a〜10c
と、これらピストンを包み込むように基盤6に固定され
たシリンダ11a〜llcと、各シリンタ内に充填され
た高粘度のシリコンオイル12a〜12cとにより構成
されている。これにより2ステージの振動は純粋な粘性
抵抗のみにより減衰、停止されることになり、位置決め
時間を短縮することかてぎる。この時、2ステージ3に
は振動を減衰させる力だけが働きその他の外力は全く作
用しないため、2ステージ3の初期位置を変化させたり
、Zステージ自身を変形させることはない。With this configuration, the two stages can be tilted in any direction (rotation around the X axis and rotation around the Y axis) and can also move in the Z direction. The piezos 8a to 8c are driven by a second detector 9 that detects a height deviation and a tilt deviation between the image plane and the wafer surface and a control device (not shown) to align the image plane and the wafer surface. Damper means for absorbing vibrations during positioning are pistons 10a to 10c fixed to the two stages 3.
The cylinders 11a to 11c are fixed to the base 6 so as to enclose these pistons, and high viscosity silicone oils 12a to 12c are filled in each cylinder. As a result, the vibrations of the two stages are attenuated and stopped only by pure viscous resistance, which greatly reduces the positioning time. At this time, only the force for damping vibration acts on the second stage 3 and no other external force acts on it, so the initial position of the second stage 3 is not changed or the Z stage itself is not deformed.
また、シリコンオイルは非常に安定して、かつ蒸発も少
ないため制振性能の経時変化はほとんどない。また粘性
抵抗力を強めるには、シリコンオイルを増量したりピス
トンとシリンダのすきまを小さくした′す、さらに高粘
度のシリコンオイルを用いたりすることにより容易に調
整できる。Furthermore, silicone oil is very stable and evaporates very little, so there is almost no change in damping performance over time. In addition, the viscous resistance can be easily increased by increasing the amount of silicone oil, reducing the gap between the piston and cylinder, or using silicone oil with a higher viscosity.
なお、ダンパの高粘度シリコンオイルの代わりに磁性流
体を用いても同し作用効果か得られる。Note that the same effect can be obtained by using a magnetic fluid instead of the high viscosity silicone oil of the damper.
[発明の効果]
以上説明したように、Zステージの制振に高粘度シリコ
ンオイル等の粘性抵抗力だけを用いることにより、位置
決め時間を短縮するとともに制振性能の経時変化を非常
に小さく抑えることかできる。またZステージに外力(
予圧力)を加えていないのてZステージ自体の経時的姿
勢安定性か高まる。[Effects of the Invention] As explained above, by using only the viscous resistance of high-viscosity silicone oil or the like to damp the vibration of the Z stage, it is possible to shorten the positioning time and keep the change in vibration damping performance to a very small level over time. I can do it. Also, an external force (
Since no preload force is applied, the posture stability of the Z stage itself increases over time.
第1図は本発明実施例の平面図、 第2図は第1図の縦断面図、 第3図は従来例の平面図、 第4図は第3図の縦断面図である。 に投影レンズ、 2・ウェハ、 3 Zステージ、 4 チャック、 58〜5C8板ハネ、 6 基盤、 ω〜つ寸 Q ロ Oト a〜7c 板ハネ台、 a〜8C・ビニソ、 2検出器、 Oa〜10c 1 a 〜 11 C 2a〜12c 3a〜13c 4a〜14c: 5a〜15c 6a〜16c 7a〜17c ピストン、 シリンジ、 高粘度シリコンオイル、 Lアングル、 Lアングル、 制振ゴム、 板、 予圧ホルト。 FIG. 1 is a plan view of an embodiment of the present invention; Figure 2 is a longitudinal sectional view of Figure 1; Figure 3 is a plan view of the conventional example; FIG. 4 is a longitudinal sectional view of FIG. 3. into the projection lens, 2. Wafer, 3 Z stage, 4 Chuck, 58~5C8 plate blade, 6. Foundation, ω~tsu size Q B O a~7c board board stand, a~8C Viniso, 2 detectors, Oa~10c 1 a ~ 11 C 2a-12c 3a-13c 4a-14c: 5a-15c 6a-16c 7a-17c piston, Syringe, high viscosity silicone oil, L angle, L angle, vibration damping rubber, board, Preload Holt.
Claims (3)
、所定の基準面に対する前記平板状物体の高さおよび傾
きを検出する位置検出手段と、前記高さおよび傾きを変
位させるための位置調節手段と、前記ステージを前記変
位可能に支持する基盤と、前記位置検出手段の検出結果
に基づき前記位置調節手段を駆動する制御手段と、前記
ステージおよび基盤間に介装した粘性流体のみからなる
ピストンシリンダ形式のダンパ手段とを具備したことを
特徴とする位置決め装置。(1) A stage on which a flat object to be positioned is mounted, a position detection means for detecting the height and inclination of the flat object with respect to a predetermined reference plane, and a position adjustment means for displacing the height and inclination. a base for movably supporting the stage; a control means for driving the position adjusting means based on the detection result of the position detecting means; and a piston cylinder made of only viscous fluid interposed between the stage and the base. A positioning device characterized by comprising a type of damper means.
接し各々独立に駆動されるピエゾ素子からなることを特
徴とする特許請求の範囲第1項記載の位置決め装置。(2) The positioning device according to claim 1, wherein the position adjustment means comprises piezo elements that abut three locations on the stage and are each driven independently.
徴とする特許請求の範囲第1項記載の位置決め装置。(3) The positioning device according to claim 1, wherein the viscous fluid is made of silicone oil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2255259A JPH04134293A (en) | 1990-09-27 | 1990-09-27 | Positioning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2255259A JPH04134293A (en) | 1990-09-27 | 1990-09-27 | Positioning device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04134293A true JPH04134293A (en) | 1992-05-08 |
Family
ID=17276264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2255259A Pending JPH04134293A (en) | 1990-09-27 | 1990-09-27 | Positioning device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04134293A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339263A (en) * | 2005-05-31 | 2006-12-14 | Sumitomo Heavy Ind Ltd | Z-axis adjustment mechanism and micromotion stage |
JP2007005669A (en) * | 2005-06-27 | 2007-01-11 | Nikon Corp | Supporting equipment, stage equipment and exposure device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5340163A (en) * | 1976-09-27 | 1978-04-12 | Japan Steel Works Ltd:The | Damper |
JPS62266490A (en) * | 1986-05-14 | 1987-11-19 | 株式会社東芝 | Precision positioning device |
JPH01250891A (en) * | 1988-03-31 | 1989-10-05 | Toshiba Corp | Plane positioning device |
-
1990
- 1990-09-27 JP JP2255259A patent/JPH04134293A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5340163A (en) * | 1976-09-27 | 1978-04-12 | Japan Steel Works Ltd:The | Damper |
JPS62266490A (en) * | 1986-05-14 | 1987-11-19 | 株式会社東芝 | Precision positioning device |
JPH01250891A (en) * | 1988-03-31 | 1989-10-05 | Toshiba Corp | Plane positioning device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339263A (en) * | 2005-05-31 | 2006-12-14 | Sumitomo Heavy Ind Ltd | Z-axis adjustment mechanism and micromotion stage |
JP4489639B2 (en) * | 2005-05-31 | 2010-06-23 | 住友重機械工業株式会社 | Z-axis adjustment mechanism and fine movement stage device |
JP2007005669A (en) * | 2005-06-27 | 2007-01-11 | Nikon Corp | Supporting equipment, stage equipment and exposure device |
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