JPH04133440A - Resin-sealing metal mold - Google Patents
Resin-sealing metal moldInfo
- Publication number
- JPH04133440A JPH04133440A JP25568590A JP25568590A JPH04133440A JP H04133440 A JPH04133440 A JP H04133440A JP 25568590 A JP25568590 A JP 25568590A JP 25568590 A JP25568590 A JP 25568590A JP H04133440 A JPH04133440 A JP H04133440A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- recess
- runner
- flow
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 10
- 239000002184 metal Substances 0.000 title abstract description 7
- 229910052751 metal Inorganic materials 0.000 title abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 229910001111 Fine metal Inorganic materials 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体集積回路が形成されたチップを樹脂封
止する樹脂封止金型に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin molding mold for resin-sealing a chip on which a semiconductor integrated circuit is formed.
第２図（ａ）及び（ｂ）は従来の樹脂封止金型の一例を
説明するための樹脂の流れ状態を示す樹脂封止金型の部
分断面図である。従来、この種の樹脂封止金型は、例え
ば、第２図に示すように、窪み７ａを有する上型２と、
この上型２の窪み７ａと対称形状の窪み７ｂ及びこの窪
み７ｂと連なるランナ一部８が一面に形成された下型１
とを有している。FIGS. 2(a) and 2(b) are partial cross-sectional views of a resin-sealed mold showing the flow state of resin for explaining an example of a conventional resin-sealed mold. Conventionally, this type of resin sealing mold has, for example, an upper mold 2 having a recess 7a, as shown in FIG.
A lower mold 1 having a recess 7b symmetrical to the recess 7a of the upper mold 2 and a runner portion 8 connected to the recess 7b.
It has
この金型で、電子回路が形成された半導体基板であるチ
ップを樹脂封止する場合は、まず、第２図（ａ）に示す
ように、下型１と上型２とを開き、リードフレーム５に
搭載され、金属細線６でチップ４を下型１の窪み７ｂに
またがって載置する。次に、上型２と下型１を閉じ、溶
融樹脂３をランナ一部８より圧力をかけて、窪み７ａと
７ｂとでなるキャビデイに注入する。この樹脂３の注入
状態を示したが、第２図（ａ）及び（ｂ）である、すな
わち、注入初期の状態では、第２図（ａ）に示すように
、樹脂３はランナ一部８からゲート１０に向い、矢印１
１の方向で流れる。さらに、この矢印１１の樹脂の流れ
は、抵抗の少い矢印１３の方向と、抵抗のやや高い矢印
１２の方向とに分岐され、両方の窪み７ａ及び７ｂを充
填し始める。次に、第２図（ｂ）に示すように、抵抗の
少ない方向である矢印１３ａの樹脂の流れは、下型の窪
み側に回り込み、抵抗の大きい流れである矢印１２ａの
樹脂の流れと合流する。このように、樹脂の流れが、二
方向の流れに分岐され、その流れが異った状態で、樹脂
が固化され、半導体集積回路装置の外部体を形成してい
た。When using this mold to resin-seal a chip, which is a semiconductor substrate on which an electronic circuit is formed, first, as shown in FIG. 2(a), open the lower mold 1 and upper mold 2, and then 5, and the chip 4 is placed across the recess 7b of the lower die 1 using a thin metal wire 6. Next, the upper mold 2 and the lower mold 1 are closed, and the molten resin 3 is injected into the cavity formed by the depressions 7a and 7b by applying pressure from the runner part 8. The injection state of the resin 3 is shown in FIGS. 2(a) and 2(b). In other words, in the initial injection state, the resin 3 is poured into the runner part 8 as shown in FIG. 2(a). From there, head towards gate 10 and follow arrow 1.
Flows in one direction. Furthermore, the flow of the resin shown by arrow 11 is branched into the direction of arrow 13 where resistance is low and the direction of arrow 12 where resistance is slightly higher, and begins to fill both depressions 7a and 7b. Next, as shown in FIG. 2(b), the flow of resin in the direction of arrow 13a, which is the direction of least resistance, goes around the hollow side of the lower mold, and merges with the flow of resin in the direction of arrow 12a, which is the direction of high resistance. do. In this way, the flow of the resin is branched into flows in two directions, and the resin is solidified in different flows to form the external body of the semiconductor integrated circuit device.
しかしながら、上述した樹脂封止金型では、樹脂の流れ
が、ランナ一部８の傾斜により、上型２の窪み７ａ方向
に沿って流れ、上型の窪み７ａから下型１の窪み７ｂに
向って流れ込むので、下型１の窪み７ｂに沿って流れる
樹脂と下型の窪みで合流する。このため、下型１の窪み
７ｂに向って流れ込む樹脂が、エアベント部９より逃げ
る空気を一部を抱き込む状態になり、成形後に合流箇所
に気泡が発生することになる。この気泡が、成形外観が
不完全なものにすると同時に半導体集積回路装置の耐湿
性能を劣化させるという欠点がある。また、この樹脂の
上型から下型に流れ込む流体力により金ＩｉＸ細線を変
形させ、切断させるといった問題を生じる。However, in the resin-sealed mold described above, the resin flows along the direction of the recess 7a of the upper mold 2 due to the inclination of the runner part 8, and flows from the recess 7a of the upper mold toward the recess 7b of the lower mold 1. Since the resin flows along the depression 7b of the lower mold 1, it merges with the resin flowing along the depression 7b of the lower mold. For this reason, the resin flowing toward the depression 7b of the lower mold 1 will partially trap the air escaping from the air vent portion 9, and air bubbles will be generated at the merging location after molding. These air bubbles have the drawback of making the molded appearance incomplete and at the same time deteriorating the moisture resistance of the semiconductor integrated circuit device. Further, the problem arises that the gold IiX thin wire is deformed and cut due to the fluid force flowing from the resin upper mold to the lower mold.
本発明の目的は、かかる欠点を解消する樹脂封止金型を
提供することにある。An object of the present invention is to provide a resin-sealed mold that eliminates such drawbacks.
本発明の樹脂封止金型は、−面に窪みが形成された上型
と、この窪みと対称形状の窪み及びこの窪みに樹脂が流
れ込む湯道であるランナ部が一面に形成された下型とを
有する樹脂封止金型において、前記ランナ部に前記窪み
の底面と平行な平坦部を有している。The resin-sealed mold of the present invention includes an upper mold in which a recess is formed on the negative side, a lower mold in which a recess having a symmetrical shape with the recess and a runner portion, which is a runner through which resin flows into the recess, is formed on one side. In the resin-sealed mold having the above-mentioned runner part, the runner part has a flat part parallel to the bottom surface of the recess.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）及び（ｂ）は、本発明の樹脂封止金型の一
実施例を説明するための樹脂の流れ状態を示す部分断面
図である。この樹脂封止金型は、同図に示すように、下
型１のランナ一部８のゲート１０側に窪み７ｂの底部と
平行な平坦部８ａを設けたことである。それ以外は、従
来例と同じである。FIGS. 1(a) and 1(b) are partial cross-sectional views showing the flow state of resin for explaining one embodiment of the resin-sealed mold of the present invention. As shown in the figure, this resin-sealed mold is provided with a flat portion 8a parallel to the bottom of the recess 7b on the gate 10 side of the runner portion 8 of the lower mold 1. Other than that, it is the same as the conventional example.
次に、この樹脂封止金型の樹脂封止する状態を説明する
。まず、第１図（ａ）に示すように、ランナ一部８より
流れ込む樹脂３は、平坦部８と上型２の面となす湯道に
より、流れ方向は、リードフレーム５と平行の矢印１１
ａの方向に強制される。次に、この樹脂の流れは、矢印
１２で示す窪み７ｂに添って流れる方向と、矢印１３で
示す窪み７ａに添って流れる方向とに分岐される。この
二つの樹脂流れは等しく、第１図（ｂ）に示すように、
はぼ、同時にエアベント部９に到達し、空気をエアベン
ト部９より押し出す。次に、樹脂が固化され、樹脂封止
が完了する。Next, the resin-sealing state of this resin-sealing mold will be explained. First, as shown in FIG. 1(a), the resin 3 flowing from the runner part 8 is directed by the arrow 11 parallel to the lead frame 5 due to the runner formed by the flat part 8 and the surface of the upper mold 2.
is forced in the direction of a. Next, the flow of this resin is branched into a direction in which it flows along the depression 7b as indicated by an arrow 12 and a direction in which it flows along the depression 7a as indicated by an arrow 13. These two resin flows are equal, and as shown in Figure 1(b),
The air reaches the air vent part 9 at the same time and pushes out the air from the air vent part 9. Next, the resin is solidified and resin sealing is completed.
以上説明したように本発明は、ランナ一部のゲート側に
窪みの底面と平行な平坦部を設けることによって、樹脂
の流れ方向を、この平坦部と上型の面とである湯道によ
って、リードフレームと平行方向に強制し、上型及び下
型の窪みに沿って流れる樹脂の流速を等しくすることが
出来るので、下型の窪みに向って流れ込む樹脂が無くな
り、気泡の発生や、樹脂の流れによる金属細線の変形及
び断線が発生しない樹脂封止金型が得られたという効果
がある。As explained above, the present invention provides a flat part parallel to the bottom surface of the recess on the gate side of a part of the runner, so that the flow direction of the resin can be controlled by the runner, which is the flat part and the surface of the upper mold. By forcing the resin in the direction parallel to the lead frame, the flow velocity of the resin flowing along the recesses of the upper and lower molds can be equalized, so there is no resin flowing toward the recesses of the lower mold, preventing the generation of air bubbles and the resin flow. This has the effect of providing a resin-sealed mold that does not cause deformation or disconnection of the thin metal wire due to flow.
第１図（ａ）及び（ｂ）は本発明の樹脂封止金型の一実
施例を説明するための樹脂の流れ状態を示す部分断面図
、第２図（ａ）及び（ｂ）は従来の樹脂封止金型の一例
を説明するための樹脂の流れ状態を示す部分断面図であ
る。
１・・・下型、２・・・上型、３・・・樹脂、４・・・
チップ、５・・・リードフレーム、６・・・金属細線、
７ａ、７ｂ・・・窪み、８・・・ランナ一部、８ａ・・
・平坦部、９・・・エアベント部、ｉｏ−・・ゲート、
１１．ｌｌａ、１２゜１２ａ、１３．１３ａ・・・矢印
。FIGS. 1(a) and (b) are partial cross-sectional views showing the resin flow state for explaining one embodiment of the resin-sealed mold of the present invention, and FIGS. 2(a) and (b) are conventional FIG. 2 is a partial cross-sectional view showing a resin flow state for explaining an example of a resin-sealing mold. 1...Lower mold, 2...Upper mold, 3...Resin, 4...
Chip, 5... Lead frame, 6... Fine metal wire,
7a, 7b...dent, 8...part of runner, 8a...
・Flat part, 9...air vent part, io-...gate,
11. lla, 12°12a, 13.13a...arrow.
Claims (1)
の窪み及びこの窪みに樹脂が流れ込む湯道であるランナ
部が一面に形成された下型とを有する樹脂封止金型にお
いて、前記ランナ部に前記窪みの底面と平行な平坦部を
有することを特徴とする樹脂封止金型。In the resin sealing mold, the resin sealing mold has an upper mold having a recess formed on one side, and a lower mold having a recess symmetrically shaped with the recess and a runner portion, which is a runner through which resin flows into the recess, formed on one side. A resin-sealed mold characterized in that the runner portion has a flat portion parallel to the bottom surface of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25568590A JPH04133440A (en) | 1990-09-26 | 1990-09-26 | Resin-sealing metal mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25568590A JPH04133440A (en) | 1990-09-26 | 1990-09-26 | Resin-sealing metal mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04133440A true JPH04133440A (en) | 1992-05-07 |
Family
ID=17282204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25568590A Pending JPH04133440A (en) | 1990-09-26 | 1990-09-26 | Resin-sealing metal mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04133440A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016072012A1 (en) * | 2014-11-07 | 2017-06-22 | 三菱電機株式会社 | Power semiconductor device and manufacturing method thereof |
-
1990
- 1990-09-26 JP JP25568590A patent/JPH04133440A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016072012A1 (en) * | 2014-11-07 | 2017-06-22 | 三菱電機株式会社 | Power semiconductor device and manufacturing method thereof |
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