JPH04132177A - Hybrid integrated circuit device and method of fitting terminal lead to prism member thereof - Google Patents

Abstract

PURPOSE:To make a hybrid integrated circuit device strong against the shock in the horizontal direction, and treat all terminal leads and the hybrid integrated circuit device as one parts at the time of fitting by connecting land electrodes of a hybrid integrated circuit substrate and terminal leads of prism members respectively. CONSTITUTION:A hybrid integrated circuit substrate 1 is, for example, an insulating substrate made of ceramics, and a predetermined pattern of the conductive paste is screen-printed on both surfaces thereof, and thereafter, baking is performed to form land electrodes 4 and a wiring pattern. The wiring pattern is loaded with a surface mounted electron circuit parts 5 of the integrated circuit device or the like. Prism members 2 comprising terminal leads 3 are fitted to, at least, both side edges of the hybrid integrated circuit substrate 1. The terminal leads 3 and the land electrodes 4 of the hybrid integrated circuit substrate 1 are connected by reflow soldering.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device convenient for attaching the hybrid integrated circuit device to a mother circuit board, and a method for connecting terminal leads to a prismatic member in the hybrid integrated circuit device. This relates to the mounting method.

In recent years, electronic devices equipped with hybrid integrated circuit devices and the like are required to be small, lightweight, and reliable.

[Conventional technology]

FIG. 11 is an explanatory diagram of a state in which a conventional hybrid integrated circuit device is attached to a mother circuit board.

In FIG. 11, a wiring pattern (not shown) and a land electrode 22 connected to the wiring notch are formed on the main surface of the mother circuit board 21. Furthermore, a hybrid integrated circuit device or an electronic circuit component (not shown) is mounted on the wiring pattern.

On the other hand, on the main surface of the insulating substrate in the hybrid integrated circuit device 23, land electrodes 25 and predetermined wiring notches (not shown) are formed by thick film printing. A plurality of external connection terminals 24 connected to the land electrodes 25 are led out from the two mutually opposing edge portions of the hybrid integrated circuit device 23 (=).

To attach the dual in-line hybrid integrated circuit device 23 equipped with electronic components as described above to the mother circuit board 21, the hybrid integrated circuit device 23 equipped with the terminal leads 24 is mounted on the land electrode 22 via cream solder. After that, for example, a reflow process is performed. In this way, the mother circuit board 21 and the hybrid integrated circuit device 23 are mechanically and electrically connected.

[Problem to be solved by the invention]

In order to establish mechanical and electrical connections between the mother circuit board 21 and the hybrid integrated circuit device 23 as described above, the terminal leads 24 for external connection must be arranged individually.

Thereafter, each terminal lead 24 is connected one by one. However, if the terminal lead 24 is, for example, as shown in FIG. 12, the attachment may be defective. That is, even if the hybrid integrated circuit device 23 is moved to the correct position, if even one terminal lead 24 for external connection is not aligned as described above, the installation will be defective. Further, after the hybrid integrated circuit device 23 is mounted on the mother circuit board 21, for example, the hybrid integrated circuit device 2
If a force is applied in the horizontal direction to the board surface of the hybrid integrated circuit device 123 due to the dropping accident of No. 3 or for some other reason, the terminal leads 24 of the hybrid integrated circuit device 23 are fragile and will bend, causing the hybrid integrated circuit to collapse. The device 23 will be tilted.

In such a case, there is a risk that the wiring pattern of the mother circuit board 21 and the wiring pattern of the hybrid integrated circuit device 23 may come into contact with each other, resulting in a short circuit accident.

The present invention is intended to solve the above problems.
It is an object of the present invention to provide a hybrid integrated circuit device which is strong against horizontal impact and in which all terminal leads and the hybrid integrated circuit device can be handled as one component when attached.

Another object of the present invention is to provide a method for attaching a terminal lead to a prismatic member in the hybrid integrated circuit device.

[Means to solve the problem]

In order to achieve the above object, the hybrid integrated circuit device of the present invention includes a wiring pattern formed on the main surface of an insulating substrate, and further land electrodes formed along at least two side edges of the insulating substrate. , a hybrid integrated circuit board on which electronic circuit components are mounted on the wiring pattern, a prismatic member disposed along at least two side edges of the hybrid integrated circuit board, and a prismatic member that goes around the circumferential surface of the prismatic member. and a plurality of terminal leads mounted in a manner such that the land electrodes of the hybrid integrated circuit board and the terminal leads of the prismatic member are respectively connected.

Further, the prismatic member is made of a heat-resistant insulating member, or a groove is formed so as to press the terminal lead.

Further, the method for attaching the terminal lead to the prismatic member in the hybrid integrated circuit device of the present invention includes a first step of forming the terminal lead into a shape that can be wound around the periphery of the prismatic member, and opening the lower part of the terminal lead. A second step of expanding the open portion, a third step of sequentially placing the terminal lead with the open portion expanded on the prismatic member, and a fourth step of pressing the terminal lead against the prismatic member with a suppressing member. be done.

Further, the method for attaching terminal leads to a prismatic member in a hybrid integrated circuit device of the present invention includes a first step of molding a lead frame consisting of a desired number of terminal leads and a frame portion that connects both ends of the terminal leads. a second step of placing the lead frame across two pressing blocks arranged at approximately equal intervals to the prismatic member; and pushing the lead frame between the pressing blocks by pressing the prismatic member. , consists of a third step of forming the lead frame into a U-shape, a fourth step of cutting the frame portion of the lead frame, and a fifth step of wrapping both ends of the terminal lead around the circumferential surface of the prismatic member. Ru.

[For production]

The plurality of terminal leads are provided so as to be wound around the circumferential surface of the prismatic member. In this way, a prismatic member with terminal leads can be handled in the same way as a single electronic circuit component, so compared to conventional hybrid integrated circuit devices in which terminal leads must be aligned one by one, hybrid integrated circuit devices are Improve productivity.

Further, the hybrid integrated circuit device having terminal leads made of the above-mentioned prismatic members on at least two side edges has sufficient strength to withstand even if it is dropped or receives some kind of impact.

Furthermore, by selecting the vertical and horizontal widths of the prismatic members, the height or effective area of the hybrid integrated circuit device can be appropriately designed.

Further, as a method for attaching the terminal lead to the prismatic member, it is possible to use a simple, ready-made automatic molding machine.

Furthermore, when attaching terminal leads to a prismatic member, the method of using a lead frame allows the terminal leads to be always placed at a fixed distance by the frame, so it is possible to accurately connect terminals at narrow intervals without having to position the terminal leads. Lead rows can be formed.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view of a hybrid integrated circuit device according to the present invention, FIG. 2 is a sectional view of a hybrid integrated circuit device according to the present invention,
FIG. 3 is an explanatory diagram of the mounting of the prismatic member in the present invention.

In the figure, the hybrid integrated circuit board l is an insulating board made of ceramic, for example, and conductive paste is screen printed on both sides of the board in a predetermined pattern, and then baked to form land electrodes 4 and wiring (not shown). A pattern is formed. A surface-mounted electronic circuit component 5 such as an integrated circuit device is mounted on the wiring pattern.

Furthermore, a prismatic member 2 having terminal leads 3 is attached to the hybrid integrated circuit board 1 at least on both side edges thereof. The prismatic member 2 is made of, for example, a heat-resistant insulating material that can withstand glue-flow soldering described later, and the terminal lead 3 is attached as described later. Then, the terminal leads 3 and the land electrodes 4 of the hybrid integrated circuit board 1 are connected by reflow soldering. When connecting the terminal leads 3 to the hybrid integrated circuit board l, since there is a step between one end surface of the terminal leads 3 and the prismatic member 2, a space is generated between the terminal leads 3.

This helps prevent short circuits between terminal leads 3 that are adjacent to each other in the space.

In particular, when a hybrid integrated circuit device having a prismatic member with terminal leads 3 is connected to a mother circuit board, the terminal leads 3
The opening 8 is placed on a land electrode of a mother circuit board (not shown).

The land electrode of the mother circuit board and the terminal lead 3 are connected by solder, or the excess solder is removed from the opening 8.
and does not short-circuit with the adjacent terminal lead 3.

Next, the process of attaching the terminal lead to the prismatic member in the present invention will be explained with reference to FIGS. 4(a) to 4(e).

The prismatic member 2 is an insulating member and can be arbitrarily selected to have a square or rectangular cross section. By this selection, it is possible to change the height of the hybrid integrated circuit device or the effective area on the hybrid integrated circuit board l on which electronic circuit components, wiring patterns, land electrodes, etc. are provided.

The terminal lead 3 is made of, for example, a tin-plated copper wire member, and is attached so as to go around the circumferential surface of the prismatic member 2 as described above.

Further, for example, the terminal lead 3 is formed into a shape with an open portion 8 provided at the lower end as shown in FIG. 4(A). The cross section of the terminal lead 3 can be round, square, or rectangular.

Next, the upper part of the terminal lead 3 having the shape shown in FIG. 4(a) is bent into a bent portion 8', and both ends are opened in the direction of the arrow shown in FIG. 4(b).

On the other hand, at the position where the terminal lead 3 of the prismatic member 2 is placed,
Adhesive is pre-applied. Therefore, the terminal lead 3 whose lower end has been expanded by the automatic machine is automatically placed at the position of the prismatic member 2 where the adhesive is applied.

Thereafter, in FIG. 4(c), the pressing members 9 to 11 press around the terminal lead 3 at the same time from both ends and the upper end arrow direction shown in the figure, or after the pressing member 9 presses the upper part of the terminal lead 3, the pressing member lO and 11 also press the sides from both sides. Due to this pressure, the terminal lead 3 is
As shown in FIG.

Note that when placing the terminal lead 3 on the prismatic member 2,
Although adhesive is applied in advance, it is possible to bite into the prismatic member 2 by the pressing force of the pressing members 9 to 11 or the like without applying adhesive. Alternatively, a groove 6 indicated by a dotted line may be formed in the prismatic member 2 in advance as shown in FIG. 4(E), and the terminal lead 3 may be pushed into the groove 6.

Another embodiment of the prismatic member 2 will be described with reference to FIG. In FIG. 5, the prismatic member 2 is the terminal lead 3.
It is also possible to form the grooves 6 in advance at the positions where the grooves 6 are arranged. When the grooves 6 are provided in this manner, the terminal leads 3 are not easily misaligned, and excess solder does not enter into the gaps between the grooves 6 due to its surface tension and short-circuit adjacent terminal leads 3.

Further, another embodiment of the hybrid integrated circuit device will be described with reference to FIG. In FIG. 6, two pairs of prismatic members 2 (prismatic members 2.2 and prismatic members 2'2') with terminal leads 3 facing each other are provided at the edges of a hybrid integrated circuit board 1'.

Further, other embodiments of a method for attaching terminal leads to a prismatic member will be described with reference to FIGS. 7 to 10 (a) and (b).

In FIG. 7, the lead frame 14 is formed by press working from a metal strip member so as to be composed of a desired number of terminal leads 3 and a frame portion 16 connecting both ends of the terminal leads. Note that the opening 15 is a pilot hole in the above-mentioned press working or the like. As shown in FIG. 8, the lead frame 14 molded in this manner is placed across between pressing blocks 17 and 17' corresponding to press molds. The pressing blocks 17, 17' are arranged slightly narrower than the spacing between one side of the prismatic member 2.

Next, the prismatic member 2 is pressed by a pressing member (not shown) as shown in FIG. 9 (A) and FIG. 1θ (A).
, are pushed between the suppression blocks 17 and 17'. By pressing the prismatic member 2, the terminal leads 3 of the lead frame 14 are made to run along three sides of the prismatic member 2.

Then, both ends of the terminal lead 3 and the connected frame portion 16 are connected to the suppression block 17, 17' and the prismatic member 2.
It is derived from between.

After that, in the lead frame 14, the frame portion 16 connecting the terminal leads 3 is cut by a press or the like. Then, both ends of the terminal lead 3 are bent by pressing members 18, -18' so as to go around one side of the prismatic member 2, as shown in FIG. 9(A).
b) It is molded as shown. Note that when pressing the terminal lead 3 into a U-shape, one side of the lead frame 14 is fixed with a pin 19 as shown in FIG. 10(a) so that it does not move, and It is also possible to bend only the other side.

The terminal lead 3 is attached to the prismatic member 2 by pressing the pressing member 1.
8. Although it is tightened by pressing 18', the square column member 2
It is possible to apply an adhesive in advance to the surface or to apply a double-sided adhesive film to the surface. In this way,
For example, even if an excessive external force is applied to the prismatic member 2 and the terminal lead 3, the positional relationship between the two will not shift.

When the terminal leads 3 are attached to the prismatic member 2 using the lead frame 14 as described above, there is no shift in the positional relationship between the two, so it is possible to further narrow the distance between the terminal leads 3.

The prismatic member 2 equipped with such a terminal lead 3 is handled like one electronic circuit component and attached to the hybrid integrated circuit board, and at the same time, the hybrid integrated circuit device is also treated as one electronic circuit component. handled and attached to the mother circuit board.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the scope of the invention as set forth in the claims.

For example, the shape of the terminal lead 3 may be a U-shape, an L-shape, a frame, or the like in addition to the above embodiments.

In addition, in the case of the above-mentioned U-shape, attachment to the prismatic member can be done by simply placing it on the adhesive portion of the prismatic member from above. Further, in the case of a frame, the open portion in this embodiment is made into a notch, and the frame is attached by widening that portion.

Further, the lead frame can be formed by etching in addition to pressing.

〔Effect of the invention〕

According to the present invention, since the prismatic member provided with the terminal lead and the hybrid integrated circuit device to which it is attached are handled as one component, the terminal lead can be attached to the hybrid integrated circuit device, and the mother circuit of the hybrid integrated circuit device Attachment to the board can be done quickly and accurately.

According to the present invention, the terminal lead is arranged so as to go around the circumferential surface of the prismatic member, and the prismatic member is provided at least on both edges of the hybrid integrated circuit board, so that the terminal lead does not bend as in the conventional case. .

A hybrid integrated circuit device provided with a prismatic member as in the present invention is
In the event of a fall accident or a horizontal force applied to the hybrid integrated circuit board, it will not shift from the mother circuit board or short-circuit the wiring pattern.

According to the present invention, excess solder can enter between the terminal lead and the prismatic member or into the space of the open part of the terminal lead, so that there is no possibility of short-circuiting with the adjacent terminal lead.

According to the present invention, since the terminal leads are attached to the prismatic member using a lead frame, the terminal leads can be arranged accurately without any deviation, so the terminal lead spacing can be narrower than in the conventional example. It becomes possible.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a hybrid integrated circuit device according to the present invention, and FIG.
The figure is a sectional view of the hybrid integrated circuit device according to the present invention, FIG. 3 is an explanatory diagram of the mounting of the prismatic member in the present invention, and FIG.
to E) are explanatory diagrams of the process of attaching the terminal lead to the prismatic member according to the present invention, FIG. 5 is an explanatory diagram of an embodiment of the prismatic member according to the present invention, and FIG. 6 is an explanatory diagram of another hybrid integrated circuit device according to the present invention, Fig. 7 is an explanatory diagram of the lead frame in the present invention, Fig. 8 is an explanatory diagram of terminal lead forming in the present invention, and Figs. Explanatory diagram, Figure 1O (a)
and (b) are explanatory diagrams of other embodiments in which the terminal leads of the present invention are wound around a prismatic member, FIG. 11 is an explanatory diagram of a conventional example in which a hybrid integrated circuit device is attached to a mother circuit board, and FIG. 12 is a conventional example It is an explanatory diagram of a terminal lead in . ■...Hybrid integrated circuit board 2...Prismatic member 3...Terminal lead 4...Land electrode 5...Electronic circuit component 6...Groove 7...Bend portion 8...Open Portion 8'...Bending portions 9 to 11...Press member 14...Lead frame 15...Opening hole 16...Frame portion 17.17'...Press block 18.18'...・Press member 19...Pin Fig. 1 Fig. 3 Fig. 2 Fig. 5 Fig. 1 2 Fig. 4 Fig. 1 1 Fig. 6

Claims (5)

[Claims] (1) A wiring pattern is formed on the main surface of the insulating substrate, land electrodes 4 are further formed along at least two side edges of the insulating substrate, and electronic circuit components 5 are mounted on the wiring pattern. a prismatic member 2 disposed along at least two side edges of the prismatic integrated circuit board 1; and a plurality of prismatic members 2 disposed so as to extend along the circumferential surface of the prismatic member 2. A hybrid integrated circuit device comprising: a plurality of terminal leads 3; and a land electrode 4 of the hybrid integrated circuit board 1 and the terminal lead 3 of the prismatic member 2 are respectively connected. (2) The hybrid integrated circuit device according to claim (1), wherein the prismatic member 2 is formed of a heat-resistant insulating member. (3) A first step of forming the terminal lead 3 into a shape that allows it to go around the circumferential surface of the prismatic member 2; a second step of widening the lower open part 8 of the terminal lead 3; and widening the open part 8. Connect the terminal lead 3 in the prismatic member 2
and a fourth step of pressing the terminal lead 3 onto the prismatic member 2 using pressing members 9 or 10. How to attach the terminal lead. (4) The hybrid integrated circuit device according to claim (3), wherein the terminal lead 3 is pressed into the groove 6 of the prismatic member 2. (5) A first step of forming a lead frame 14 consisting of a desired number of terminal leads 3 and a frame portion 16 that connects both ends of the terminal leads 3; A second step of placing the lead frame 14 across the pressing blocks 17, 17' and pressing the prismatic member 2 causes the lead frame 14 to be placed on the pressing blocks 17, 1.
7' to form the lead frame 14 into a U-shape; a fourth step of cutting the frame portion 16 of the lead frame 14; and a fourth step of cutting the frame portion 16 of the lead frame 14. A method for attaching a terminal lead to a prismatic member in a hybrid integrated circuit device, comprising: a fifth step of rotating the part;