JPH04127493A - Electronic device on which surface mounting type electronic component is mounted - Google Patents
Electronic device on which surface mounting type electronic component is mountedInfo
- Publication number
- JPH04127493A JPH04127493A JP24702990A JP24702990A JPH04127493A JP H04127493 A JPH04127493 A JP H04127493A JP 24702990 A JP24702990 A JP 24702990A JP 24702990 A JP24702990 A JP 24702990A JP H04127493 A JPH04127493 A JP H04127493A
- Authority
- JP
- Japan
- Prior art keywords
- component
- resin
- adhesive
- silicone compound
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 claims abstract description 34
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 30
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000003795 chemical substances by application Substances 0.000 abstract description 8
- 239000003566 sealing material Substances 0.000 abstract description 7
- 239000004744 fabric Substances 0.000 abstract description 4
- 239000000123 paper Substances 0.000 abstract description 4
- 229920002379 silicone rubber Polymers 0.000 abstract description 4
- 239000004945 silicone rubber Substances 0.000 abstract description 4
- 229920006255 plastic film Polymers 0.000 abstract description 3
- 239000002985 plastic film Substances 0.000 abstract description 3
- 229920002050 silicone resin Polymers 0.000 abstract description 3
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 239000000654 additive Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- -1 polydimethylsiloxane Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000013464 silicone adhesive Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000013872 montan acid ester Nutrition 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- UTOPWMOLSKOLTQ-UHFFFAOYSA-M octacosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC([O-])=O UTOPWMOLSKOLTQ-UHFFFAOYSA-M 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、樹脂封止された表面実装型電子部品を搭載し
た電子装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device equipped with a resin-sealed surface-mounted electronic component.
近年、各種家電品１時計、カメラ、電卓、事務機器、音
響機器、映像機器、輸送機器等には種々の電子部品が実
装されている。これらの電子部品は機器の高性能、高機
能化や小型軽量化に伴い、実装の高密度化が求められ、
また、実装の合理化や自動化も求められている。そのた
め、これら部品の実装方法は従来のピン挿入方式から表
面実装方式へと移行し、部品の外形も従来のＤＩＰ（Ｄ
ｕａｌ Ｉｎ１ｉｎｅ Ｐａｃｋａｇｅ）で代表される
ピン挿入型からＱ Ｆ Ｐ （Ｑｕａｄ Ｆｌａｔ Ｐ
ａｃｋａｇｅ） 、 Ｓ ＯＰ （ＳｍａｌｌＯｕｔｌ
ｉｎｅ Ｊ−ｂｅｎｄｅｄ Ｐａｃｋａｇｅ） 、 Ｐ
Ｌ ＣＣ（ＰｌａｓｔｉｃＬｅａｄｅｄ ｃｈｉｐ
ｃａｒｒｉｅｒ）等の表面実装型パッケージに移行して
いる。In recent years, various electronic components have been mounted on various home appliances such as watches, cameras, calculators, office equipment, audio equipment, video equipment, transportation equipment, etc. These electronic components are required to be mounted at higher densities as equipment becomes higher performance, more functional, and smaller and lighter.
There is also a need to streamline and automate implementation. Therefore, the mounting method for these components has shifted from the conventional pin insertion method to the surface mount method, and the external shape of the components has changed from the conventional DIP (DIP) method.
From the pin insertion type represented by
ackage), S OP (SmallOutl
ine J-bended Package), P
L CC (Plastic Leaded chip)
carrier) and other surface-mount packages.
ピン挿入型電子部品の実装は、一般に、ピンをプリント
回路基板のスルーホールに挿入した後、プリント回路基
板をはんだ浴に浮かベスルーホールにはんだを侵入させ
電子部品とプリント回路基板を電気的に導通させる実装
が行われる。一方、表面実装型電子部品は、部品を接着
剤を用いてプリント回路基板の所定の位置に仮止めした
後、これを赤外線ランプや高温蒸気で加熱し、予めプリ
ント回路基板の配線部品並びに部品のリードに被覆して
おいたはんだを溶融させるいわゆる、赤外線リフローあ
るいはペーパーリフロ一方式と呼ばれる実装が採用され
ている。Mounting of pin-insertion type electronic components generally involves inserting pins into through-holes on a printed circuit board, then floating the printed circuit board in a solder bath and injecting solder into the through-holes to electrically connect the electronic components and the printed circuit board. A conductive implementation is performed. On the other hand, surface-mounted electronic components are made by temporarily fixing the components in a predetermined position on a printed circuit board using adhesive, and then heating them with an infrared lamp or high-temperature steam. A so-called infrared reflow or paper reflow mounting method is used in which the solder coated on the leads is melted.
ここで、部品の仮止めに用いる接着剤は一般に粘着テー
プと呼ばれる接着剤が広く用いられており、これは、ポ
リ塩化ビニル、ポリエステル、ナイロン、ポリイミド、
テフロン等のプラスチックフィルム、紙やアセテート、
ガラス等の不織布やクロス、あるいは、これにポリエス
テル樹脂、エポキシ樹脂、シリコーンゴム又は樹脂等を
含浸した基板に天然ゴム、合成ゴム等の粘着性物質を含
浸又は塗布したものをテープ状に切断したものであり、
常温で各種被接着体に押し当てるだけで良好な接着性を
示す材料である。Here, the adhesive used for temporarily fixing the parts is generally an adhesive called adhesive tape, which is made of polyvinyl chloride, polyester, nylon, polyimide,
Plastic films such as Teflon, paper and acetate,
Nonwoven fabrics or cloths such as glass, or substrates impregnated with polyester resin, epoxy resin, silicone rubber, resin, etc., and then impregnated or coated with adhesive substances such as natural rubber or synthetic rubber, cut into tape shapes. and
It is a material that exhibits good adhesive properties simply by pressing it against various objects to be adhered at room temperature.
上記表面実装型電子部品の実装には従来特別問題は無か
った。ところが、最近プリント回路基板に仮止めした電
子部品がはんだ付けを行う工程に移るまでの間に基板か
ら剥離、脱落する問題が発生するようしこなった。特に
、最近の電子部品はその９０％近くがエポキシ樹脂系の
材料で樹脂封止されているが、この問題は一部の樹脂封
止された電子部品で頻繁に発生するようになった。Conventionally, there have been no special problems in mounting the above-mentioned surface-mounted electronic components. However, recently a problem has arisen in which electronic components temporarily attached to a printed circuit board peel or fall off the board before the soldering process is carried out. In particular, nearly 90% of recent electronic components are resin-sealed with epoxy resin-based materials, and this problem has frequently occurred with some resin-sealed electronic components.
本発明の目的は、仮止めした電子部品がはんだ付けを行
う工程までの間に基板から剥離、脱落する問題を解決し
、電子部品の実装作業性の改善を図ることにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the problem of temporarily attached electronic components peeling off or falling off a board before the soldering process, and to improve the workability of mounting electronic components.
本発明者等はこの問題を解決するため先ず部品が基板か
ら剥離、脱落する原因について種々検討を行った。その
結果、基板から剥離、脱落しやすい樹脂封止型電子部品
は封止材料の熱応力を低減、あるいは、耐湿信頼性の向
上を目的としてシリコーン系化合物を配合した材料で封
止した部品に限られていることが明らかになった。そこ
で、封止品の表面を詳細に分析したところ、このような
封止樹脂の表面には封止材料に添加したポリジメチルシ
ロキシサン系のシリコーン系化合物が僅かながら染み出
していることが確認された。このようなポリジメチルシ
ロキサン系のシリコーン化合物は、一般に、極性基が少
ないために、接着剤との親和性が弱く、接着剤との接着
性を低下させているのではないかと推察された。そこで
、封止樹脂の表面にシリコーン化合物が染みだした状態
でも接着するような接着剤を検討した結果、本発明に至
った。In order to solve this problem, the present inventors first conducted various studies on the causes of parts peeling off and falling off from the board. As a result, resin-sealed electronic components that tend to peel or fall off the substrate are limited to those that are encapsulated with materials containing silicone compounds to reduce the thermal stress of the encapsulation material or to improve moisture-resistance reliability. It became clear that the Therefore, a detailed analysis of the surface of the encapsulated product revealed that a small amount of the polydimethylsiloxane-based silicone compound added to the encapsulating material oozed out onto the surface of the encapsulating resin. Ta. It was surmised that such polydimethylsiloxane-based silicone compounds generally have a small number of polar groups and therefore have a weak affinity with adhesives, reducing their adhesion with adhesives. Therefore, as a result of research into an adhesive that can adhere even when a silicone compound has oozed out onto the surface of the sealing resin, the present invention has been achieved.
本発明の特徴は、樹脂封止された表面実装型電子部品を
回路基板に接着剤を用いて仮止めした後、はんだ付けす
る実装工程を経て組み立て製造される電子装置において
、前記樹脂封止された表面実装型電子部品はシリコーン
系化合物を必須成分とするエポキシ樹脂系材料で封止さ
れ、かつ、前記樹脂封止された表面実装型電子部品を回
路基板に仮止めする接着剤としてシリコーン化合物を必
須成分とする接着剤を用いることにある。A feature of the present invention is that an electronic device is assembled and manufactured through a mounting process in which a resin-sealed surface-mounted electronic component is temporarily fixed to a circuit board using an adhesive and then soldered. The surface-mounted electronic component is sealed with an epoxy resin material containing a silicone compound as an essential component, and a silicone compound is used as an adhesive to temporarily attach the resin-sealed surface-mounted electronic component to a circuit board. The key is to use an adhesive as an essential component.
本発明に用いるシリコーン系化合物を必須成分とするエ
ポキシ樹脂系封止材料とはエポキシ樹脂。The epoxy resin sealing material containing a silicone compound as an essential component used in the present invention is an epoxy resin.
硬化剤、硬化促進剤等の樹脂成分に必要に応じシリカ、
アルミナ、水酸化アルミニウム等の充填剤。Add silica to resin components such as curing agents and curing accelerators as necessary.
Fillers such as alumina and aluminum hydroxide.
カップリング剤、離型剤２着色剤、難燃化剤等の各種添
加剤のほかに、封止材料の熱応力低減や耐湿信頼性を向
上するため各種のシリコーン系化合物を添加した材料で
ある。このようなシリコーン系化合物は、例えば、末端
、側鎖に水素、ヒドリキシル基、エポキシ基、アミノ基
、カルボキシル基、メルカプト基等の各種官能基をもつ
ポリジメチルあるいはポリメチルフェニルシロキサン化
合物である。In addition to various additives such as coupling agents, mold release agents 2, colorants, and flame retardants, this material contains various silicone compounds to reduce thermal stress and improve moisture resistance reliability of the sealing material. . Such a silicone compound is, for example, a polydimethyl or polymethylphenylsiloxane compound having various functional groups such as hydrogen, hydroxyl group, epoxy group, amino group, carboxyl group, and mercapto group at the terminal or side chain.
一方、シコン系化合物を必須成分とする接着剤はポリ塩
化ビニル、ポリエステル、ナイロン、ポリイミド、テフ
ロン等のプラスチックフィルム。On the other hand, adhesives containing silicone compounds as essential components are used for plastic films such as polyvinyl chloride, polyester, nylon, polyimide, and Teflon.
紙やアセテート、ガラス等の布織布やクロス、あるいは
これにポリエステル樹脂、エポキシ樹脂。Fabrics such as paper, acetate, glass, etc. or cloth, or polyester resin or epoxy resin.
シリコーンゴム又は樹脂等を含浸した基材に一般式
で表されるシリコーンゴム又はシリコーン樹脂を必須成
分とする樹脂成分を含浸、又は、塗布したものである。A base material impregnated with silicone rubber or resin is impregnated with or coated with a resin component whose essential component is silicone rubber or silicone resin represented by the general formula.
この場合、樹脂成分全てがシリコーン系化合物で構成さ
れていても良いが、天然ゴム。In this case, the entire resin component may be composed of a silicone compound, but natural rubber may be used.
ポリイソプレンゴム、ブチルゴム、ブタジェンアクリロ
ニトリルゴム、スチレンブタジェンゴム等の合成ゴム、
アクリル樹脂、ポリビニルエーテル樹脂、ポリビニルア
ルコール樹脂、フェノール樹脂、ポリエステル樹脂、等
の各種弾性体との混合物であっても良い。また、必要に
応じて粘着付与剤、可塑剤、充填剤、老化防止剤等が添
加されていても良い。なお、このような接着剤のシリコ
ーン系化合物量はシリコーン系化合物を必須成分とする
エポキシ樹脂系封止材料で封止した成形品との接着力に
著しい影響を及ぼし、接着剤中のシリコーン系化合物量
が多すぎると接着が強すぎ、付替え作業を行う際にプリ
ント回路基板を損傷する恐れがあるため必要に応じてそ
の種類や量を調整することが望ましい。Synthetic rubbers such as polyisoprene rubber, butyl rubber, butadiene-acrylonitrile rubber, styrene-butadiene rubber,
It may also be a mixture with various elastic bodies such as acrylic resin, polyvinyl ether resin, polyvinyl alcohol resin, phenol resin, and polyester resin. Furthermore, tackifiers, plasticizers, fillers, anti-aging agents, etc. may be added as necessary. Note that the amount of silicone compounds in such adhesives has a significant effect on the adhesive strength with molded products sealed with epoxy resin sealing materials that contain silicone compounds as an essential component. If the amount is too large, the adhesion will be too strong and there is a risk of damaging the printed circuit board during replacement work, so it is desirable to adjust the type and amount as necessary.
本発明でシリコーン系化合物を添加したエポキシ樹脂系
封止材料で封止した電子部品とシリコーン系化合物を必
須成分とする接着剤が良く接着理由はつきりしないが、
恐らく、被接着体と接着剤の双方がシリコーン化合物を
含有することによって両者の親和性が高まり、分子間力
が増すためと考えられる。According to the present invention, electronic components sealed with an epoxy resin sealing material containing a silicone compound and an adhesive containing a silicone compound as an essential component adhere well, although the reason for their adhesion is unclear.
This is probably because both the adherend and the adhesive contain silicone compounds, which increases their affinity and increases intermolecular forces.
次に、本発明の効果を実施例によってより具体的に示す
。Next, the effects of the present invention will be illustrated more specifically by examples.
〈実施例１〜３〉
樹脂成分として０−クレゾールノボラック型エポキシ樹
脂（エポキシ当量１９５．軟化温度７５〜８０℃）９０
重量部、臭素化ビスフェノールＡ型エポキシ樹脂（エポ
キシ当量３９４．軟化温度６５℃）１０重量部、硬化剤
としてフェノールノボラック樹脂（水酸基当量１０６．
軟化温度６５℃）５５重量部、硬化促進剤としてトリフ
ェニルホスフィン１．０ 重量部、可撓化剤として、第
１表に示すように、各種のポリジメチルシロキサンをそ
れぞれ１０重量部、充填剤として平均粒径１５μｍの球
形の溶融シリカ４７０重量部、難燃化助剤として二酸化
アンチモン１０重量部、カップリング剤としてエポキシ
シラン３．０ 重量部、離型剤としてモンタン酸エステ
ルロウ１．０重量部、着色剤としてカーボンブラックを
１．０ 重量部を約８０℃に加熱した二軸ロールを用い
て約１０分間混練し冷却後粉砕機で２ｍｍ以下に粉砕し
成形材料を作製した。<Examples 1 to 3> 0-Cresol novolac type epoxy resin (epoxy equivalent: 195. Softening temperature: 75 to 80°C) as a resin component 90
Parts by weight, 10 parts by weight of brominated bisphenol A epoxy resin (epoxy equivalent: 394. Softening temperature: 65°C), phenol novolac resin (hydroxyl equivalent: 106.
Softening temperature: 65°C) 55 parts by weight, 1.0 parts by weight of triphenylphosphine as a curing accelerator, 10 parts by weight of each of various polydimethylsiloxanes as shown in Table 1 as a flexibilizing agent, and 10 parts by weight of each of various polydimethylsiloxanes as a filler. 470 parts by weight of spherical fused silica with an average particle size of 15 μm, 10 parts by weight of antimony dioxide as a flame retardant aid, 3.0 parts by weight of epoxy silane as a coupling agent, 1.0 parts by weight of montanate wax as a mold release agent. 1.0 parts by weight of carbon black as a coloring agent was kneaded for about 10 minutes using a twin-screw roll heated to about 80°C, cooled, and then ground to 2 mm or less using a grinder to prepare a molding material.
次いで、この成形材料を用いＳ ＯＰ ’（Ｓｍａｌｌ
Ｏｕｔｌｉｎｅ Ｐｌａｓｔｅｃ Ｐａｃｋａｇｅ）型
の半導体装置を樹脂封止した。成形にはトランスファー
プレスを用い、金型温度１８０”Ｃ１成形圧力フ０ｋｇ
／ｃｄ、成形時間９０ｓｅｃとし、成形品は金型から取
り出した後。Next, using this molding material, SOP' (Small
The Outline Plastic Package) type semiconductor device was sealed with resin. A transfer press was used for molding, mold temperature 180"C1 molding pressure 0kg
/cd, the molding time was 90 seconds, and the molded product was removed from the mold.
１８０℃で１時間の後硬化を行った。この成形品を市販
のシリコーン系粘着剤テープと接着し接着強度を測定し
た。また、これらの試料を４０℃で３０日、６０日、９
０日放置した場合の接着力の経時変化も調べた。結果を
第１表に纏めて示す。Post-curing was carried out at 180° C. for 1 hour. This molded article was adhered to a commercially available silicone adhesive tape and the adhesive strength was measured. In addition, these samples were incubated at 40°C for 30 days, 60 days, and 9 days.
Changes in adhesive strength over time were also investigated after being left for 0 days. The results are summarized in Table 1.
上記成形品を市販の非ノリコーン系粘着剤テープと接着
し接着強度を測定した。また、これらの試料を４０℃で
３０日、６０日、９０日放置した場合の接着力の経時変
化も調べた。この結果も第１表に纏めて示す。The molded article was adhered to a commercially available non-nolicone adhesive tape and the adhesive strength was measured. In addition, changes in adhesive strength over time were also investigated when these samples were left at 40° C. for 30 days, 60 days, and 90 days. The results are also summarized in Table 1.
樹脂成分として０−タレゾールノボラック型エポキシ樹
脂（エポキシ当量１９５．軟化温度７５〜８０℃）１０
０重量部、硬化剤としてフェノールノボラック樹脂（水
酸基当量１０６．軟化温度６５℃）５８重量部、硬化促
進剤としてトリフェニルホスフィン１重量部、充填剤と
して平均粒径１５μｍの球形の溶融シリカ４８０重量部
、カップリング剤としてエポキシシラン３重量部、離型
剤としてモンタン酸エステルロウ１０重量部、着色剤と
してカーボンブラックを１重量部を上記実施例と同様に
二軸ロールを用いて混練し、可撓化剤としてシリコーン
化合物を配合してないエポキシ樹脂系成形材料を作製し
た。この成形材料を用いて上記と同様にＳＯ２型の半導
体装置を樹脂封止し、上記と同様に市販のシリコーン系
及び非シリコーン系粘着剤テープと接着し接着強度を測
定した。また、これらの試料を４０℃で３０日。As a resin component, 0-talesol novolak type epoxy resin (epoxy equivalent: 195. Softening temperature: 75-80°C) 10
0 parts by weight, 58 parts by weight of phenol novolac resin (hydroxyl equivalent: 106, softening temperature 65°C) as a curing agent, 1 part by weight of triphenylphosphine as a curing accelerator, 480 parts by weight of spherical fused silica with an average particle size of 15 μm as a filler. , 3 parts by weight of epoxy silane as a coupling agent, 10 parts by weight of montanic acid ester wax as a mold release agent, and 1 part by weight of carbon black as a coloring agent were kneaded using a biaxial roll in the same manner as in the above example, and a flexible An epoxy resin molding material containing no silicone compound as a curing agent was prepared. Using this molding material, an SO2 type semiconductor device was resin-sealed in the same manner as above, and was adhered to commercially available silicone and non-silicone adhesive tapes to measure adhesive strength in the same manner as above. In addition, these samples were incubated at 40°C for 30 days.
６０日、９０日放置した場合の接着力の経時変化も調べ
た。結果を第１表に纏めて示す。Changes in adhesive strength over time were also investigated after being left for 60 and 90 days. The results are summarized in Table 1.
本発明によ、れば、可撓化剤としてシリコーン系化合物
を添加したエポキシ樹脂系封止材料で封止した部品をシ
リコーン系化合物を含む接着剤と接着した試料は非シリ
コーン系接着剤と接着した場合に比べて極めて高い接着
力をもち、その接着力は長期間の放置試験においても低
下しない。すなわち、可撓化剤としてシリコーン系化合
物を添加していない従来の封止品と同様の接着性が得ら
れる。従って、実装作業でも部品の剥離、脱落などの問
題を解決することが出来る。According to the present invention, a sample in which a component sealed with an epoxy resin sealing material containing a silicone compound as a flexibilizing agent is bonded with an adhesive containing a silicone compound is bonded with a non-silicone adhesive. It has extremely high adhesion strength compared to the conventional adhesive, and its adhesive strength does not decrease even in long-term storage tests. In other words, adhesiveness similar to that of conventional sealed products to which no silicone compound is added as a flexibilizing agent can be obtained. Therefore, it is possible to solve problems such as peeling and falling off of parts during mounting work.
第１図は本発明の一実施例の面実装型電子部品を接着剤
を用いてプリント回路基板に仮止めした状態を示す断面
図、第２図は面実装型電子部品並びにプリント回路基板
の上のはんだを溶融（リフロー）し、部品を基板に実装
した状態を示す断面図、第３図は面実装型電子部品と接
着剤の接着性の試験方法を示す断面図である。
第
図
第
図
第
図
↑FIG. 1 is a sectional view showing a surface-mounted electronic component according to an embodiment of the present invention temporarily attached to a printed circuit board using an adhesive, and FIG. FIG. 3 is a cross-sectional view showing a state in which the solder is melted (reflowed) and the component is mounted on a board. FIG. Figure Figure Figure ↑
Claims (1)
着剤を用いて仮止めした後、はんだ付けする実装工程を
経て組み立て製造される電子装置において、 前記樹脂封止された半導体装置の表面実装型電子部品は
シリコーン化合物を必須成分とするエポキシ樹脂系材料
で封止され、かつ、前記樹脂封止された表面実装型電子
部品を回路基板に仮止めする接着剤としてシリコーン化
合物を必須成分とする接着剤を用いることを特徴とする
電子装置。1. Surface mounting of the resin-sealed semiconductor device in an electronic device that is assembled and manufactured through a mounting process in which a resin-sealed surface-mounted electronic component is temporarily fixed to a circuit board using an adhesive and then soldered. The molded electronic component is sealed with an epoxy resin material containing a silicone compound as an essential component, and the silicone compound is used as an essential component as an adhesive for temporarily fixing the resin-sealed surface-mounted electronic component to a circuit board. An electronic device characterized by using adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24702990A JPH04127493A (en) | 1990-09-19 | 1990-09-19 | Electronic device on which surface mounting type electronic component is mounted |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24702990A JPH04127493A (en) | 1990-09-19 | 1990-09-19 | Electronic device on which surface mounting type electronic component is mounted |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04127493A true JPH04127493A (en) | 1992-04-28 |
Family
ID=17157348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24702990A Pending JPH04127493A (en) | 1990-09-19 | 1990-09-19 | Electronic device on which surface mounting type electronic component is mounted |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04127493A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5677045A (en) * | 1993-09-14 | 1997-10-14 | Hitachi, Ltd. | Laminate and multilayer printed circuit board |
-
1990
- 1990-09-19 JP JP24702990A patent/JPH04127493A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5677045A (en) * | 1993-09-14 | 1997-10-14 | Hitachi, Ltd. | Laminate and multilayer printed circuit board |
| US6114005A (en) * | 1993-09-14 | 2000-09-05 | Hitachi, Ltd. | Laminate and multilayer printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3111450B2 (en) | Adhesive tape and lead frame tape | |
| JP3947296B2 (en) | Sheet-like sealing material and method of manufacturing semiconductor device using the same | |
| JP2001081438A (en) | Connecting material | |
| KR20000011640A (en) | Method of preparing an electronic package by co-curing adhesive and encapsulant | |
| JPH06232186A (en) | Adhesion of electronic parts | |
| JP2830681B2 (en) | IC chip mounting method | |
| EP1026217B1 (en) | Method of producing adhesive tape for electronic parts | |
| JP2000154361A (en) | Adhesive, adhesive member, wiring board equipped with the adhesive member for semiconductor, and semiconductor equipment | |
| JP2001223227A (en) | Resin composition for sealing semiconductor material and semiconductor device | |
| JP3911088B2 (en) | Semiconductor device | |
| JPH04127493A (en) | Electronic device on which surface mounting type electronic component is mounted | |
| JP3417247B2 (en) | Method for manufacturing resin-encapsulated electronic device | |
| JPH03105932A (en) | Sheet-shaped adhesive and semiconductor device using same adhesive | |
| JP2000154360A (en) | Adhesive, adhesive member, wiring board equipped with the adhesive member for semiconductor, and semiconductor equipment | |
| JPH02288019A (en) | Anisotropic conductive film | |
| JPH11297904A (en) | Semiconductor device | |
| JPH10324795A (en) | Epoxy resin composition for sealing semiconductor and semiconductor apparatus | |
| EP0893823A1 (en) | Semiconductor bonding and sealing structure | |
| KR100635053B1 (en) | Adhesive tape for electronic parts | |
| JPH1046114A (en) | Low-stress filmy adhesive, and lead frame and semiconductor device obtained by using the same | |
| JPH05218107A (en) | Resin-sealed semiconductor device | |
| JPS63245484A (en) | Adhesive composition | |
| JP2007141956A5 (en) | ||
| JPH0364387A (en) | Adhesive tape for electronic component and liquid adhesive | |
| KR100646481B1 (en) | Adhesive composition for semiconductor and adhesive film using same |