JPH04125979A - Light-emitting element - Google Patents
Light-emitting elementInfo
- Publication number
- JPH04125979A JPH04125979A JP2246705A JP24670590A JPH04125979A JP H04125979 A JPH04125979 A JP H04125979A JP 2246705 A JP2246705 A JP 2246705A JP 24670590 A JP24670590 A JP 24670590A JP H04125979 A JPH04125979 A JP H04125979A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting element
- optical fiber
- fixing groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 description 12
- 238000010168 coupling process Methods 0.000 description 12
- 238000005859 coupling reaction Methods 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
- G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、光通信用光源や光通信用モジュール等に用い
られる発光ダイオードやレーザダイオード等を用いた発
光素子に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a light emitting element using a light emitting diode, a laser diode, etc. used in a light source for optical communication, a module for optical communication, etc.
従来この種の用途に用いられる発光素子では、ダイオー
ドチップから放射される光を、レンズ等により集光して
光ファイバへの結合効率を高めると共に、光ファイバと
の光軸合わせを精度良く行うため種々の工夫がなされて
いる。Conventionally, in light emitting elements used for this type of application, the light emitted from the diode chip is focused by a lens, etc. to increase the coupling efficiency to the optical fiber and to precisely align the optical axis with the optical fiber. Various efforts have been made.
第3図は、光ファイバとの光軸合わせを精度良く行うた
めのLEDコリメータ(発光素子)の従来技術を示すも
のである。FIG. 3 shows a conventional technology of an LED collimator (light emitting element) for accurately aligning the optical axis with an optical fiber.
このものは、発光ダイオード31が搭載されたステム3
2と、この発光ダイオード31を封止するようにステム
32に接着される段付スリーブ33とから構成されてい
る。そして、段付スリーブ33の中間部に球レンズ34
が装着されると共に、前部に絞り35が取り付けられ、
この絞り35部分に光ファイバFか挿入固定されるよう
になっている。This one has a stem 3 equipped with a light emitting diode 31.
2, and a stepped sleeve 33 adhered to the stem 32 so as to seal the light emitting diode 31. A ball lens 34 is attached to the middle part of the stepped sleeve 33.
is attached, and an aperture 35 is attached to the front,
An optical fiber F is inserted and fixed into this aperture 35 portion.
一方、第4図(特開昭62−73786号公報)は、光
ファイバへの結合効率を高めるための発光素子の従来技
術を示すものである。On the other hand, FIG. 4 (Japanese Unexamined Patent Publication No. 62-73786) shows a conventional technology of a light emitting element for increasing coupling efficiency to an optical fiber.
このものは、フレーム41のヘッド部42がアルミニウ
ム等の金属で構成されており、その中央に凹溝42aが
形成され、この凹溝42aに発光ダイオード43がマウ
ントされている。凹溝42aの周壁は曲面となっており
、この曲面が発光ダイオード43の放射光を前方へ反射
する反射面42bとなっている。そして、これらが樹脂
モールドされて一体に形成されている。このため、通常
は損失光となるような発光ダイオード43から斜め横方
向に放射される光が、この反射面42bで前方に反射さ
れる。In this device, a head portion 42 of a frame 41 is made of metal such as aluminum, and a groove 42a is formed in the center of the head portion 42, and a light emitting diode 43 is mounted in this groove 42a. The peripheral wall of the groove 42a is a curved surface, and this curved surface serves as a reflective surface 42b that reflects the light emitted from the light emitting diode 43 forward. These are resin molded and integrally formed. Therefore, light emitted obliquely and laterally from the light emitting diode 43, which would normally be lost light, is reflected forward by the reflecting surface 42b.
モールド樹脂44の射出面部分44aは、レンズ作用を
持たせるように半球形に形成され、放射光がこの部分で
収束されるようになっている。The exit surface portion 44a of the molded resin 44 is formed into a hemispherical shape so as to have a lens effect, and the emitted light is converged at this portion.
このように、反射面42bで光のロスを少なくして輝度
ムラを解消し、射出面部分44aで光を積極的に集光す
るようになっている。In this way, the reflective surface 42b reduces light loss and eliminates uneven brightness, and the exit surface portion 44a actively focuses the light.
このように前者の発光素子では、光ファイバF固定用の
絞り35部分を持つ段付スリーブ33を発光ダイオード
31か搭載されたステム32に接着する場合、結合効率
を高めるためには、発光ダイオード31の光軸と光ファ
イバFの端面の中心とを精度良く合致させる必要がある
。これはステム32に段付スリーブ33をはんだ付けす
る際の位置合せ精度により決定される。したがって、か
なりの精度が要求され、発光素子の製造工程が複雑とな
り、結局、製品のコスト高を招いていた。In this way, in the former light emitting element, when the stepped sleeve 33 having the aperture 35 portion for fixing the optical fiber F is bonded to the light emitting diode 31 or the stem 32 mounted thereon, in order to increase the coupling efficiency, it is necessary to attach the light emitting diode 31 It is necessary to align the optical axis of the optical fiber F with the center of the end face of the optical fiber F with high accuracy. This is determined by the alignment accuracy when soldering the stepped sleeve 33 to the stem 32. Therefore, considerable precision is required, and the manufacturing process of the light emitting element becomes complicated, resulting in an increase in the cost of the product.
一方、後者の発光素子では、光のロスを解消する部分と
光を積極的に集光する部分とが別体で構成されており、
その分、構造が複雑となり、また製造工程も複雑となっ
ていた。また、反射面42bが構成されるフレーム41
のヘッド部42は、発光ダイオード43をダイボンドす
る際に加熱されるため、この反射面42bが荒れ易く反
射効率が低下する不具合があった。On the other hand, in the latter light-emitting element, the part that eliminates light loss and the part that actively focuses light are constructed as separate bodies.
As a result, the structure has become more complicated, and the manufacturing process has also become more complicated. Further, the frame 41 in which the reflective surface 42b is configured
Since the head portion 42 is heated when the light emitting diode 43 is die-bonded, the reflective surface 42b tends to become rough, resulting in a reduction in reflection efficiency.
本発明は、このような事情を考慮してなされたもので、
光ファイバとの一定の結合精度を保持しつつ接続が容易
で、かつ構造が簡単な集光度の優れた発光素子を提供す
ることをその目的とする。The present invention was made in consideration of such circumstances, and
It is an object of the present invention to provide a light emitting element that is easy to connect while maintaining a certain coupling accuracy with an optical fiber, has a simple structure, and has an excellent light condensing power.
本発明は上記目的を達成すべく、発光素子チップを透光
性樹脂のモールドにより一体成型して成る発光素子にお
いて、発光素子チップの発光面側のモールド樹脂に形成
された凸面部と、凸面部の表面に形成された発光面の光
を反射する反射層と、光ファイバの先端部が挿入固定さ
れ、反射層で反射した発光面の光の集光点またはその近
傍に、底面の略中心を合致させた光ファイバ用の固定溝
とを備えていることを特徴とする。In order to achieve the above-mentioned object, the present invention provides a light-emitting element in which a light-emitting element chip is integrally molded with a light-transmitting resin mold. The tip of the optical fiber is inserted and fixed into the reflective layer that reflects the light from the light emitting surface formed on the surface of the board, and the approximate center of the bottom surface is placed at or near the convergence point of the light reflected by the reflective layer. and a matching fixing groove for the optical fiber.
この場合、凸面部の表面が楕円球面で形成されており、
楕円球の第1の焦点位置に発光面の略中央か合致し、第
2の焦点位置に固定溝の底面の略中心が合致しているこ
とが好ましい。In this case, the surface of the convex portion is formed as an ellipsoidal surface,
It is preferable that the first focal point of the elliptical sphere coincides with the approximate center of the light emitting surface, and the second focal position coincides with the approximate center of the bottom surface of the fixing groove.
発光素子チップの発光面から放射された光は、凸面部の
表面の反射層で反射されて収束される。Light emitted from the light emitting surface of the light emitting element chip is reflected by the reflective layer on the surface of the convex portion and converged.
この収束された光は、光ファイバの先端部が挿入固定さ
れる光ファイバ用の固定溝の略中心に集光される。凸面
部にはその表面に反射層が形成され、この両者が相俟っ
て凹面鏡の作用を為す。また、固定溝は、光ファイバの
先端部の挿入固定を可能とすると共に、この挿入固定に
より、発光素子チップの発光面から放射された光の集合
点またはその近傍に、光ファイバの端面の中心を自動的
に臨ませる。さらに、凸面部や固定溝は発光素子チップ
のモールドの際に一体に形成さる。This converged light is focused approximately at the center of the optical fiber fixing groove into which the tip of the optical fiber is inserted and fixed. A reflective layer is formed on the surface of the convex portion, and both act together as a concave mirror. In addition, the fixing groove allows the tip of the optical fiber to be inserted and fixed, and by this insertion and fixation, the center of the end surface of the optical fiber is placed at or near the gathering point of the light emitted from the light emitting surface of the light emitting element chip. automatically appear. Furthermore, the convex surface portion and the fixing groove are integrally formed during molding of the light emitting element chip.
また、凸面部の表面が楕円球面で形成され、この楕円球
の第1の焦点位置に発光面の略中央を合致させ、第2の
焦点位置に固定溝の底面の略中心を合致させているので
、発光素子チップから放射されたすべての拡散光は、固
定溝の底面の略中心に確実に集光され、すなわち光ファ
イバの先端位置に集光される(像点を結ぶ)こととなる
。Further, the surface of the convex portion is formed as an ellipsoidal surface, and the approximate center of the light emitting surface is aligned with the first focal point position of the ellipsoidal sphere, and the approximate center of the bottom surface of the fixing groove is aligned with the second focal point position. Therefore, all the diffused light emitted from the light emitting element chip is reliably focused approximately at the center of the bottom surface of the fixing groove, that is, the light is focused (focuses on the image point) at the tip position of the optical fiber.
を実施例〕
第1図を参照して本発明の発光素子の第1の実施例につ
いて説明する。Example] A first example of the light emitting device of the present invention will be described with reference to FIG.
第1図は発光素子1の裁断側面図であり、この発光素子
1は、フレーム2上にマウントした発光ダイオード3を
透明の樹脂4でモールドして、楕円球形に一体成型して
いる。FIG. 1 is a cut side view of a light emitting element 1, which is integrally formed into an elliptical spherical shape by molding a light emitting diode 3 mounted on a frame 2 with a transparent resin 4.
発光ダイオード3は、カソードリード5のヘッド部5a
にダイボンドされ、アノードリード6の先端部6aとの
間に渡したワイヤ7によりワイヤボンドされている。発
光ダイオード3は、その発光面3aの中心が楕円球の第
1の焦点A(一方の焦点)位置と合致するように、モー
ルド樹脂4に埋め込まれており、その発光面3aの向き
、すなわち光軸りの方向はフレーム2に直交する方向と
なっている。The light emitting diode 3 is connected to the head portion 5a of the cathode lead 5.
It is die-bonded to the anode lead 6 and is wire-bonded to the tip 6a of the anode lead 6 by a wire 7 passed between the anode lead 6 and the tip 6a. The light emitting diode 3 is embedded in a molded resin 4 such that the center of its light emitting surface 3a coincides with the first focal point A (one focal point) position of the elliptical sphere, and the direction of the light emitting surface 3a, that is, the light The direction of the axis is perpendicular to the frame 2.
発光ダイオード3の発光面3a側は、所望の凸面部4a
となっており、すなわち、楕円球形の曲率の大きい部分
を利用しており、また凸面部4aの表面に、発光面3a
からの光が反射されるような反射層8が形成され、凹面
鏡を構成している。The light emitting surface 3a side of the light emitting diode 3 has a desired convex surface portion 4a.
In other words, the large curvature portion of the elliptical sphere is used, and the light emitting surface 3a is provided on the surface of the convex portion 4a.
A reflective layer 8 is formed to reflect light from the mirror, forming a concave mirror.
この反射層8は、凸面部4aの表面に添って形成される
ため、その反射面8aが楕円球面となっていて、この部
分で反射した発光ダイオード3からのすべての拡散光が
、モールド樹脂4内の第2の焦点B(他人の焦点)位置
に集光する。なお、反射層8は、モールド樹脂4の凸面
部4aの表面にAl(アルミニウム)やAg(銀)等の
金属を蒸着するか、あるいはAIやAg等の金属をメツ
キすることにより形成される。このため、反射面8aの
形成がきわめて容易で、反射効率の良好なものとなって
いる。Since this reflective layer 8 is formed along the surface of the convex surface portion 4a, the reflective surface 8a is an ellipsoidal surface, and all the diffused light from the light emitting diode 3 reflected at this portion is transferred to the molded resin 4. The light is focused on the second focal point B (other person's focal point) within the camera. The reflective layer 8 is formed by depositing a metal such as Al (aluminum) or Ag (silver) on the surface of the convex portion 4a of the molded resin 4, or by plating a metal such as AI or Ag. Therefore, the reflective surface 8a is extremely easy to form and has good reflection efficiency.
一方、モールド樹脂4の内の第2の焦点B位置には、発
光ダイオード3と同一光軸り上(実際には反射光の光軸
上)に位置させて、光ファイバFの先端部が挿入固定さ
れる固定溝9が一体形成されている。また、固定溝9の
底面の中心、すなわちこれに臨む光ファイバF端面の中
心のコア部分は、第2の焦点B位置と合致するようにな
っている。したかって、発光ダイオード3の発光面3a
から放射した拡散光は、反射層8の反射面8aて反射収
束され、この固定溝9の底面9aの中央に集光される(
像点を結ぶ)。すなわち、固定溝9に光ファイバFの先
端が差し込まれ固定されるようになっているので、差し
込まれた光ファイバF端面のコア位置が、ちょうどこの
第2の焦点Bの位置となり、かつ発光ダイオード3の光
軸りと光ファイバFの光軸りとが合致する。このため、
発光ダイオード3から照射されるすべての光は集光され
て光ファイバFに入射することになり、発光素子1と光
ファイバFの結合効率が極めて高いものとなる。また、
固定溝9の挿入口部分9bはロート状に拡開形成されて
おり、光ファイバFを円滑に挿入できるようになってい
る。なお、固定溝9に挿入された光ファイバFは、接着
剤で固定される。On the other hand, the tip of the optical fiber F is inserted into the second focal point B position in the molded resin 4 so as to be located on the same optical axis as the light emitting diode 3 (actually on the optical axis of the reflected light). A fixing groove 9 to be fixed is integrally formed. Further, the center of the bottom surface of the fixing groove 9, that is, the core portion at the center of the end surface of the optical fiber F facing this, is arranged to coincide with the second focal point B position. Therefore, the light emitting surface 3a of the light emitting diode 3
The diffused light emitted from the reflective layer 8 is reflected and converged by the reflective surface 8a of the reflective layer 8, and is focused at the center of the bottom surface 9a of the fixing groove 9 (
connect the image points). That is, since the tip of the optical fiber F is inserted into the fixing groove 9 and fixed, the core position of the end face of the inserted optical fiber F is exactly at the position of this second focal point B, and the light emitting diode The optical axis of No. 3 and the optical axis of optical fiber F match. For this reason,
All the light emitted from the light emitting diode 3 is condensed and enters the optical fiber F, and the coupling efficiency between the light emitting element 1 and the optical fiber F becomes extremely high. Also,
The insertion opening portion 9b of the fixing groove 9 is expanded into a funnel shape so that the optical fiber F can be inserted smoothly. Note that the optical fiber F inserted into the fixing groove 9 is fixed with an adhesive.
このように、楕円球の一部を利用した凸面部4aと反射
層8て構成される凹面鏡で、発光ダイオード3からの放
射光の無駄のない集光が行われるので、集光度の高い発
光素子1を得ることができ、コア径の小さいファイバと
の結合でも高い結合効率を得ることができる。また、発
光素子1がこれに接続される光ファイバFの固定溝9と
一体形成されるので、製造が容易でかつ製品のバラツキ
を少なくすることかできる。しかも、発光素子1の形状
はそれが利用される装置や機器の取付部分等により自由
に変更できる。また、発光ダイオード3と光ファイバF
の光軸り合わせが自動的になされ、光ファイバFの結合
が容易でその結合効率も向上する。したがって、製造コ
ストも安くなり、特に、プラスチックファイバ等の口径
の大きいファイバを用いたセンサや光通信には有用とな
る。In this way, the concave mirror composed of the convex surface portion 4a and the reflective layer 8, which utilize a part of an elliptical sphere, efficiently condenses the light emitted from the light emitting diode 3. 1 can be obtained, and high coupling efficiency can be obtained even when coupling with a fiber having a small core diameter. Furthermore, since the light emitting element 1 is integrally formed with the fixing groove 9 of the optical fiber F connected thereto, manufacturing is easy and product variations can be reduced. Furthermore, the shape of the light emitting element 1 can be freely changed depending on the installation part of the device or equipment in which it is used. In addition, the light emitting diode 3 and the optical fiber F
The optical axes of the optical fibers F are automatically aligned, and the coupling of the optical fibers F is facilitated and the coupling efficiency is improved. Therefore, the manufacturing cost is also reduced, and it is particularly useful for sensors and optical communications using large diameter fibers such as plastic fibers.
第2図は、本発明の第2の実施例に係る発光素子の裁断
側面図である。この発光素子1では、全体を楕円球形に
一体成型することなく、所望の凸面部4a部分のみ楕円
球形の一部を含んで一体に形成されている。すなわち、
発光ダイオード3の発光面3aの中心と、固定溝9の底
面9aの中心とが、それぞれ第1の焦点A位置と第2の
焦点B位置となっており、また、発光面3aからの光か
照射される範囲が楕円球面および反射層8となっている
。この実施例は、樹脂モールド4が発光素子1を任意の
形状に形成できることに着目したもので、場合によって
は機器への取付フランジ等を一体に形成してもよい。ま
た、モールド樹脂4には、その側面と固定溝9とを連通
する小穴10を形成され、光ファイバFを接着する際に
この小穴10を通して接着剤を注入できるようになって
いる。FIG. 2 is a cut side view of a light emitting device according to a second embodiment of the present invention. In this light emitting element 1, the whole is not integrally molded into an elliptical spherical shape, but only the desired convex surface portion 4a is integrally formed including a part of the elliptical spherical shape. That is,
The center of the light emitting surface 3a of the light emitting diode 3 and the center of the bottom surface 9a of the fixing groove 9 are the first focal point A position and the second focal point B position, respectively. The irradiated area is the ellipsoidal surface and the reflective layer 8. This embodiment focuses on the fact that the resin mold 4 can form the light emitting element 1 into any shape, and depending on the case, a flange for attaching to a device may be formed integrally with the light emitting element 1. Further, a small hole 10 is formed in the mold resin 4 to communicate the side surface thereof with the fixing groove 9, so that an adhesive can be injected through the small hole 10 when bonding the optical fiber F.
このように構成されるので、光ファイバFとの結合効率
を高めた発光素子1を、これが用いられる通信モジュー
ル等への組み込み位置に対応させて、適宜所望の形状に
形成できる。With this configuration, the light emitting element 1 with improved coupling efficiency with the optical fiber F can be appropriately formed into a desired shape in accordance with the position where it is installed in a communication module or the like in which it is used.
以上のように本発明によれば、発光素子チップを一体成
型する際に、凸面部を形成すると共に、凸面部に反射層
を形成し、これらにより構成される凹面鏡の集光点また
はその近傍に、固定溝の底面の中心を合致させているの
で、発光素子チップからの拡散光を固定溝に挿入固定さ
れる光ファイバの端面に効率良く集光させることができ
、光フフイハとの結合効率を高めることかできる。しか
も、これら固定溝等は、透光性の樹脂でモールドして一
体成型して形成されるので、容易に製造することかでき
、製造コストを低減し得る効果を有する。As described above, according to the present invention, when integrally molding a light emitting element chip, a convex surface portion is formed, a reflective layer is formed on the convex surface portion, and the concave mirror formed of these is formed at or near the condensing point. Since the centers of the bottom surfaces of the fixing grooves are aligned, the diffused light from the light emitting element chip can be efficiently focused on the end face of the optical fiber inserted and fixed in the fixing groove, increasing the coupling efficiency with the optical fiber. It can be improved. Moreover, since these fixing grooves and the like are integrally formed by molding with a light-transmitting resin, they can be easily manufactured and have the effect of reducing manufacturing costs.
また、凸面部の表面を楕円球面とし、この楕円球の2つ
の焦点位置に、発光素子チップの発光面の中心と固定溝
の底面の中心とをそれぞれ合致させているので、発光面
からの光が極めて効率良く集光され、より一層光ファイ
バとの結合効率を高めることができる効果を有する。In addition, the surface of the convex portion is an elliptical sphere, and the two focal points of this elliptical sphere are aligned with the center of the light emitting surface of the light emitting element chip and the center of the bottom surface of the fixing groove, so that light from the light emitting surface is This has the effect of condensing the light extremely efficiently and further increasing the coupling efficiency with the optical fiber.
第1図は本発明の第1実施例に係る発光ダイオードの縦
断面図、第2図は第2実施例に係る発光ダイオードの縦
断面図、第3図および第4図は従来の発光′ダイオード
の縦断面図である。
1・・・発光素子、2・・・フレーム、3・・・発光ダ
イオード、3a・・・発光面、4・・・モールド樹脂、
4a・・・凸面部、8・・・反射層、8a・・・反射面
、9・・・固定溝、9a・・・底面、L・・・光軸、F
・・・光ファイバ、A・・・第1の焦点、B・・・第2
の焦点。FIG. 1 is a vertical cross-sectional view of a light emitting diode according to a first embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a light emitting diode according to a second embodiment, and FIGS. 3 and 4 are cross-sectional views of a conventional light emitting diode. FIG. DESCRIPTION OF SYMBOLS 1... Light emitting element, 2... Frame, 3... Light emitting diode, 3a... Light emitting surface, 4... Mold resin,
4a... Convex surface portion, 8... Reflective layer, 8a... Reflective surface, 9... Fixing groove, 9a... Bottom surface, L... Optical axis, F
...Optical fiber, A...First focal point, B...Second focus
focus of.
Claims (1)
成型して成る発光素子において、前記発光素子チップの
発光面側のモールド樹脂に形成された凸面部と、 当該凸面部の表面に形成された前記発光面の光を反射す
る反射層と、 光ファイバの先端部が挿入固定され、前記反射層で反射
した前記発光面の光の集光点またはその近傍に、底面の
略中心を合致させた光ファイバ用の固定溝とを備えてい
ることを特徴とする発光素子。 2、前記凸面部の表面が楕円球面で形成されており、当
該楕円球の第1の焦点位置に前記発光面の略中央が合致
し、第2の焦点位置に前記固定溝の底面の略中心が合致
していることを特徴とする請求項1記載の発光素子。[Scope of Claims] 1. In a light-emitting element formed by integrally molding a light-emitting element chip with a light-transmitting resin mold, a convex part formed in the molded resin on the light-emitting surface side of the light-emitting element chip, and the convex part A reflective layer is formed on the surface of the light emitting surface to reflect the light from the light emitting surface, and a tip of an optical fiber is inserted and fixed, and a reflective layer on the bottom surface is formed at or near a convergence point of the light from the light emitting surface reflected by the reflective layer. 1. A light emitting element comprising: a fixing groove for an optical fiber whose centers are substantially coincident with each other. 2. The surface of the convex surface portion is formed as an elliptical sphere, and the approximate center of the light emitting surface coincides with the first focal point of the elliptical sphere, and the approximate center of the bottom surface of the fixing groove coincides with the second focal position. 2. The light emitting device according to claim 1, wherein:
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2246705A JPH04125979A (en) | 1990-09-17 | 1990-09-17 | Light-emitting element |
EP91105169A EP0450560B1 (en) | 1990-04-03 | 1991-04-02 | An optical device |
DE69129817T DE69129817T2 (en) | 1990-04-03 | 1991-04-02 | Optical device |
US07/680,236 US5175783A (en) | 1990-04-03 | 1991-04-03 | Optical molded device including two lenses and active element integrally |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2246705A JPH04125979A (en) | 1990-09-17 | 1990-09-17 | Light-emitting element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04125979A true JPH04125979A (en) | 1992-04-27 |
Family
ID=17152412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2246705A Pending JPH04125979A (en) | 1990-04-03 | 1990-09-17 | Light-emitting element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04125979A (en) |
-
1990
- 1990-09-17 JP JP2246705A patent/JPH04125979A/en active Pending
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