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JPH04120481A - Test clip device - Google Patents

Test clip device

Info

Publication number
JPH04120481A
JPH04120481A JP2240893A JP24089390A JPH04120481A JP H04120481 A JPH04120481 A JP H04120481A JP 2240893 A JP2240893 A JP 2240893A JP 24089390 A JP24089390 A JP 24089390A JP H04120481 A JPH04120481 A JP H04120481A
Authority
JP
Japan
Prior art keywords
heating
component
tested
wire
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2240893A
Other languages
Japanese (ja)
Inventor
Kazuya Miyama
深山 一弥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2240893A priority Critical patent/JPH04120481A/en
Publication of JPH04120481A publication Critical patent/JPH04120481A/en
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

PURPOSE:To execute effective heating while measuring only the temperature of a component to be tested which necessitates the heating, and also to enable simultaneous measurement of an electrical characteristic, by a method wherein a heating pad PD having a heating means and a temperature control means is brought into close contact with the component to be tested. CONSTITUTION:Heating PD 5 is fitted removably to a shaft 2 by a connecting rod 6 and connected with a wire 7 for heating and a Chromel wire 8a and an Alumel wire 8b for temperature measurement. Main bodies 1a and 1b of a test clip are joined by a shaft 2 and so actuated outward by a spring 4 as to hold a component to be tested, and electrode terminals 3a and 3b are embedded therein. The main bodies 1a and 1b of the clip thus prepared hold the component to be tested therebetween and the connecting rod 6 brings the PD 5 into pressure contact with the component. An electric signal from an electrode terminal 19 for observation is measured by a logic analyzer 25 and a controller 26 connected with a heating wire 22 and a thermocouple 21 controls the temperature of PD 23. By bringing the heating pad into direct pressure contact with the component to be tested, in this way, effective heating and measurement of an electrical characteristic are enabled while only the component is controlled to be at a set temperature.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、被試験部品を加熱しながら被試験部品の電気
特性を測定することができる加熱パッドを備えたテスト
クリップ装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a test clip device equipped with a heating pad capable of measuring the electrical characteristics of a component under test while heating the component.

従来の技術 一般に、プリント基板とこれに実装されたICなどのす
べての電子部品に対して加熱試験を行なう場合には、従
来では恒温槽などの環境試験機を用いてプリント基板全
体について行なわれていた。しかし第7図に示すように
、従来の部分的な加熱試験を行なうには、プリント基板
41上に実装された電子部品42aに対する加熱試験を
行なう場合には、恒温槽を用いることができず、電気ド
ライヤ43のような温風を用いた局部加熱による疑似的
な加熱手段により試験されていた。
Conventional technology Generally, when performing a heating test on a printed circuit board and all electronic components such as ICs mounted on it, conventionally, the entire printed circuit board is tested using an environmental testing machine such as a constant temperature oven. Ta. However, as shown in FIG. 7, when performing a conventional partial heating test on an electronic component 42a mounted on a printed circuit board 41, a constant temperature oven cannot be used. The test was conducted using a pseudo heating means such as an electric dryer 43 that locally heats the area using hot air.

発明が解決しようとする課題 ところが、このような温風を用いた従来の加熱手段では
、実際は、加熱を必要とする被試験部品42aだけでな
く、その周囲に実装された加熱する必要のない部品42
bをも加熱してしまう。このため、試験結果に周囲の部
品42bの影響が現れることがあり、被試験部品42a
のみを加熱試験した結果を正しく得ることが困難になる
。また、被試験部品42aの周囲の部品42bが熱に弱
い場合には、前記部品42bを破壊してしまうことがあ
る。
Problems to be Solved by the Invention However, in the conventional heating means using hot air, in reality, not only the test component 42a that requires heating but also the components mounted around it that do not need to be heated 42
b will also be heated. Therefore, the influence of the surrounding parts 42b may appear on the test results, and the test results may be affected by the surrounding parts 42b.
It becomes difficult to obtain accurate results from a heating test. Furthermore, if the parts 42b around the part to be tested 42a are sensitive to heat, the parts 42b may be destroyed.

本発明は、このような従来の課題を解決するもので、I
Cなどの加熱を必要とする被試験部品のみに密着し、温
度測定をしながら効果的に加熱することが可能で、しか
も同時に電気特性の測定が可能なテストクリップを提供
することを目的とするものである。
The present invention solves such conventional problems, and
The purpose of the present invention is to provide a test clip that can closely contact only the parts to be tested that require heating, such as C, to effectively heat them while measuring temperature, and at the same time measure electrical characteristics. It is something.

課題を解決するための手段 この課題を解決するために本発明は、シャフトにより回
動自在に連結された2枚のテストクリップ本体と、前記
テストクリップ本体上部を外方に付勢するバネと、上端
は前記シャフトに着脱自在に支持され、下端には加熱手
段と温度制御手段とを備えた加熱パッドを装着した伸縮
自在の連結棒とを有し、前記加熱パッドを伸縮自在の前
記連結棒により下方に付勢して、電子部品に当接させる
ようにしたものである。
Means for Solving the Problem In order to solve this problem, the present invention provides two test clip bodies rotatably connected by a shaft, a spring that biases the upper part of the test clip body outward, The upper end is detachably supported by the shaft, and the lower end has a retractable connecting rod equipped with a heating pad having heating means and temperature control means, and the heating pad is connected to the retractable connecting rod by the retractable connecting rod. It is configured to be biased downward and brought into contact with electronic components.

作用 この構成によって、テストクリップ本体で被試験部品を
挟み、部品加熱手段と温度測定手段を有する加熱パッド
を被試験部品に直接押しあて密着させて加熱することが
できる。その結果、被試験部品のみを温度測定を行ない
ながら同時に選択的に加熱できるので、被試験部品以外
の部品が加熱されて測定結果へ影響することもなく、正
確に加熱試験を行なうことが可能となる。
Function: With this configuration, the part to be tested can be sandwiched between the test clip main bodies, and the heating pad having the part heating means and the temperature measuring means can be directly pressed against the part to be tested and brought into close contact with the part to heat it. As a result, only the part under test can be selectively heated while simultaneously measuring the temperature, allowing accurate heating tests to be performed without heating parts other than the part under test and affecting the measurement results. Become.

実施例 以下本発明の一実施例のテストクリップについて図面を
参照しながら説明する。
EXAMPLE A test clip according to an example of the present invention will be described below with reference to the drawings.

第1図および第2図に本実施例のテストクリ、。FIG. 1 and FIG. 2 show the test results of this embodiment.

プの構成を示す。第1図に示すように、テストクリップ
本体1a、lbはシャフト2で連結され、バネ4により
被試験部品を挟むように外向きに付勢されている。また
テストクリップ本体1a、lbの内部には電気的に連結
されている電極端子3a。
The configuration of the group is shown below. As shown in FIG. 1, the test clip bodies 1a and lb are connected by a shaft 2, and are urged outward by a spring 4 so as to sandwich the part to be tested. Moreover, electrode terminals 3a are electrically connected inside the test clip bodies 1a and lb.

3bが埋設されている。加熱パッド5は、連結棒6によ
ってシャフト2に着脱自在に嵌合されていて、電熱線1
5.加熱用の電線7と温度測定用のクロメル電線8a、
アルメル電線8bが連結されている。第2図は連結棒6
と加熱ノ(ラド5の詳細な構成を示す。図に示すように
、連結棒9,10はバネ11により付勢され、伸縮自在
に構成されており、シャフト2との結合部12のAの幅
がシャフト2の直径よりわずかに狭(形成されていて、
シャフト2に着脱自在に嵌合されている。加熱パッド5
は、シリコーンゴムなどの電気絶縁性と熱安定性に優れ
た弾性体13a、13b、13cを積層して構成された
ものであり、最下層の弾性体13cは薄(形成しである
。また、電熱線15に電力を供給する電線16は結合部
17で電熱線15と連結されていて、電線16およびク
ロメル線14a、アルメル線14bは、耐熱性の皮膜1
8で覆われている。第3図は弾性体13aと弾性体13
bとの眉間の断面図であり、加熱パッド5を均一に加熱
できるように部品加熱手段としての電熱線15が配設さ
れている。第4図は弾性体13bと弾性体13cとの眉
間の断面図であり、中央部に温度測定手段としての熱電
対19を構成するクロメル線14aとアルメル線14b
を配線した構成となっている。
3b is buried. The heating pad 5 is removably fitted to the shaft 2 by a connecting rod 6, and is connected to the heating wire 1.
5. An electric wire 7 for heating and a chromel electric wire 8a for temperature measurement,
Alumel electric wire 8b is connected. Figure 2 shows connecting rod 6
The detailed configuration of the heating rod 5 is shown. As shown in the figure, the connecting rods 9 and 10 are urged by a spring 11 and are configured to be expandable and retractable. The width is slightly narrower than the diameter of shaft 2 (formed,
It is removably fitted to the shaft 2. heating pad 5
is constructed by laminating elastic bodies 13a, 13b, and 13c such as silicone rubber with excellent electrical insulation and thermal stability, and the bottom layer elastic body 13c is thin (formed). An electric wire 16 that supplies power to the heating wire 15 is connected to the heating wire 15 at a joint 17, and the electric wire 16, the chromel wire 14a, and the alumel wire 14b are coated with a heat-resistant coating 1.
Covered by 8. FIG. 3 shows the elastic body 13a and the elastic body 13.
It is a cross-sectional view of the glabella shown in FIG. FIG. 4 is a sectional view between the eyebrows of the elastic body 13b and the elastic body 13c, and shows a chromel wire 14a and an alumel wire 14b forming a thermocouple 19 as a temperature measuring means in the center.
It has a configuration in which it is wired.

以上のように構成されたテストクリップを用いた加熱試
験装置の構成を、第5図および第6図に示す。
The configuration of a heating test apparatus using the test clip configured as described above is shown in FIGS. 5 and 6.

第5図は加熱試験装置の回路プロ、ツク図であり、26
は熱電対21で温度を測定しながら電熱線22の温度を
調節して、加熱パッド23を常に一定温度に保つ機能を
有する制御器である。
Figure 5 is a circuit diagram of the heating test device, 26
is a controller that has the function of adjusting the temperature of the heating wire 22 while measuring the temperature with a thermocouple 21, and keeping the heating pad 23 at a constant temperature at all times.

第6図は本発明の一実施例のテストクリ、ツブを用いた
加熱試験装置の構成を示す。図に示すように、テストク
リップ本体1a、lbは被試験部品31を挟み、また加
熱パッド5は、伸縮する連結棒6によって被試験部品3
1に圧着されている。
FIG. 6 shows the configuration of a heating test apparatus using test chests and tubes according to an embodiment of the present invention. As shown in the figure, the test clip bodies 1a and lb sandwich the part under test 31, and the heating pad 5 connects the part under test to the part 31 by means of an expandable connecting rod 6.
1 is crimped.

つぎに、以上のような構成の加熱試験装置を用いた加熱
試験について説明する。
Next, a heating test using the heating test apparatus configured as above will be explained.

第5図に示す、電極端子20によって観測された電気信
号は、ロジックアナライザ25で計測される。また、制
御器26は電熱線22および熱電対21に連結されてい
て、加熱パッド23の温度制御を行なっている。また、
第6図に示すように、加熱パッド5が接している被測定
物の表面の凹凸に応じて、第2図で示した弾性体13a
The electrical signal observed by the electrode terminal 20 shown in FIG. 5 is measured by a logic analyzer 25. Further, the controller 26 is connected to the heating wire 22 and the thermocouple 21, and controls the temperature of the heating pad 23. Also,
As shown in FIG. 6, the elastic body 13a shown in FIG.
.

13b、13cが変形し、被試験部品31に密着して、
均一に加熱することができる。
13b and 13c are deformed and come into close contact with the component under test 31,
Can be heated evenly.

このように、本実施例では、加熱パッド5を被試験部品
31に直接圧接して密着させ、被試験部品31のみを定
められた温度に制御しながら効果的に加熱することがで
きる。また、加熱を必要としない部品32を加熱するこ
とがないので、周囲の部品32が加熱されて試験結果へ
影響がでることもなく、正しく被試験部品31のみの加
熱試験をできる。また、周囲の部品32が加熱されて破
壊することもないのはいうまでもない。
In this manner, in this embodiment, the heating pad 5 is brought into close contact with the component under test 31 by direct pressure, and only the component under test 31 can be effectively heated while being controlled to a predetermined temperature. In addition, since the component 32 that does not require heating is not heated, the test results are not affected by heating of the surrounding components 32, and only the component 31 to be tested can be correctly heated. Further, it goes without saying that the surrounding parts 32 will not be heated and destroyed.

発明の効果 以上の実施例の説明からも明らかなように、本発明のテ
ストクリップによれば、部品加熱手段と温度測定手段と
を有し、被測定部品に密着して加熱する加熱パッドを備
えており、この加熱パッドを被試験部品に直接押しあて
密着させることにより、周囲の部品を加熱することなく
被試験部品のみを効果的に加熱することができ、周囲の
部品の加熱による破壊や測定結果への影響もなく正しく
加熱試験をすることができる。
Effects of the Invention As is clear from the above description of the embodiments, the test clip of the present invention has a component heating means and a temperature measuring means, and is equipped with a heating pad that heats the component to be measured in close contact with it. By pressing this heating pad directly against the part under test and bringing it into close contact with the part under test, it is possible to effectively heat only the part under test without heating the surrounding parts. Heating tests can be performed correctly without affecting the results.

また、加熱パッドをテストクリップ本体から取り外した
ときは、従来のテストクリップと全く同様に使用するこ
とができるなどの効果が得られる。
Further, when the heating pad is removed from the test clip main body, it can be used in exactly the same way as a conventional test clip.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例のテストクリップの斜視図、
第2図は同テストクリップの要部断面図、第3図は同加
熱パッド内の電熱対の平面図、第4図は同加熱パッド内
の熱電熱の平面図、第5図は同加熱試験装置の回路ブロ
ック図、第6図は同加熱試験装置の斜視図、第7図は従
来の加熱試験装置の構成を示す斜視図である。 la、lb・・・・・・テストクリップ本体、2・・・
・・・シャフト、4・・・・・・バネ、5・・・・・・
加熱パッド、6・・・・・・連結棒、7・・・・・・電
線、8a・・・・・・クロメル電線、8b・・・・・・
アルメル電線、9,10・・・・・・連結棒、11・・
・・・・バネ、12・・・・・・シャフトとの結合部、
13a、13b、13c・・・・・・弾性体、14a・
・・・・・クロメル線、14b・・・・・・アルメル線
、15・・・・・・電熱線、19・・・・・・熱電対、
21・・・・・・熱電対、22・・・・・・電熱線、 23・・・・・・加熱バラ ド、 24・・・・・・テストク リップ。
FIG. 1 is a perspective view of a test clip according to an embodiment of the present invention;
Figure 2 is a sectional view of the main parts of the test clip, Figure 3 is a plan view of the electrothermal pair in the heating pad, Figure 4 is a plan view of the thermoelectric heating in the heating pad, and Figure 5 is the heating test. A circuit block diagram of the apparatus, FIG. 6 is a perspective view of the heating test apparatus, and FIG. 7 is a perspective view showing the configuration of a conventional heating test apparatus. la, lb...Test clip body, 2...
...Shaft, 4...Spring, 5...
Heating pad, 6... Connecting rod, 7... Electric wire, 8a... Chromel electric wire, 8b...
Alumel electric wire, 9, 10...Connecting rod, 11...
...Spring, 12...Connection part with shaft,
13a, 13b, 13c...Elastic body, 14a.
...Chromel wire, 14b...Alumel wire, 15...Heating wire, 19...Thermocouple,
21...Thermocouple, 22...Heating wire, 23...Heating barad, 24...Test clip.

Claims (1)

【特許請求の範囲】[Claims] シャフトにより回動自在に連結された2枚のテストクリ
ップ本体と、前記テストクリップ本体上部を外方に付勢
するバネと、上端は前記シャフトに着脱自在に支持され
、下端には加熱手段と温度制御手段とを備えた加熱パッ
ドを装着した伸縮自在の連結棒とを有し、前記加熱パッ
ドを伸縮自在の前記連結棒により下方に付勢して、電子
部品に当接させるテストクリップ装置。
Two test clip bodies are rotatably connected by a shaft, a spring biases the upper part of the test clip body outward, the upper end is detachably supported by the shaft, and the lower end is provided with a heating means and a temperature control member. 1. A test clip device comprising: a retractable connecting rod equipped with a heating pad having a control means; the heating pad is biased downward by the retractable connecting rod to bring it into contact with an electronic component.
JP2240893A 1990-09-10 1990-09-10 Test clip device Pending JPH04120481A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2240893A JPH04120481A (en) 1990-09-10 1990-09-10 Test clip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2240893A JPH04120481A (en) 1990-09-10 1990-09-10 Test clip device

Publications (1)

Publication Number Publication Date
JPH04120481A true JPH04120481A (en) 1992-04-21

Family

ID=17066255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2240893A Pending JPH04120481A (en) 1990-09-10 1990-09-10 Test clip device

Country Status (1)

Country Link
JP (1) JPH04120481A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7283931B2 (en) 2003-06-23 2007-10-16 Samsung Electronics Co., Ltd. Inspecting apparatus for semiconductor device
CN109030878A (en) * 2018-07-23 2018-12-18 全球能源互联网研究院有限公司 A kind of test module of hydraulic installalion structure and its composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7283931B2 (en) 2003-06-23 2007-10-16 Samsung Electronics Co., Ltd. Inspecting apparatus for semiconductor device
CN109030878A (en) * 2018-07-23 2018-12-18 全球能源互联网研究院有限公司 A kind of test module of hydraulic installalion structure and its composition

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