JPH04115513A - Method for constituting semiconductor manufacturing line - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for configuring a mass production line for microfabrication workplaces with repetitive work, and in particular, to
Concerning a method for configuring a semiconductor manufacturing line that can enable production of semiconductors with a high turn around time (QTAT) [Conventional technology] Until now, regarding the configuration of a mass production line for semiconductor manufacturing,
For example, as shown in Fig. 2 of “Wafer Automatic Transfer System” (Factory Automation” 86.2),
A so-called job shop method is used in which equipment that performs the same process is placed together, but although this method has a high equipment utilization rate, it tends to take a long time to produce. Also, “Challenge to FA in Semiconductor Layer LSI Factory” (Monthly Sem1conductor World 1986)
．． 6) As shown in Figure 2, IM with advanced automation
Similarly, the job shop method was also used on lines for manufacturing DRAMs and the like.

[Problem to be solved by the invention]

However, in the case of the job shop method, as mentioned above, the production period tends to be longer, and at the same time, a management method is adopted that prioritizes equipment utilization rate, so for example, there is a demand for short delivery times. It was not possible to respond immediately to the situation, and there was a tendency to rely on Fourdrinier.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for configuring a semiconductor manufacturing line that can solve the problems of the above-mentioned prior art and enable short-term production.

[Means to solve the problem]

The above purpose is to construct a module with a consistent flow that combines equipment of different types of processing contents by means such as mechanical handling, in accordance with the basic flow of product processing, and to configure the module according to the production scale. This can be achieved by installing as many as possible and configuring a semiconductor manufacturing line as a pseudo-flow shop.

[Effect]

By configuring the semiconductor manufacturing line as a pseudo-flow shop as described above, it is possible to configure the mass production line with the required number of modules depending on the production scale, resulting in a significant process reduction compared to the job shop method. This makes it possible to achieve short lead time production.

〔Example〕

Hereinafter, a method for configuring a semiconductor manufacturing line according to the present invention will be specifically explained using examples.

FIG. 1 is a diagram showing an example of a mechanical single module configuration constructed in accordance with the basic flow of semiconductor manufacturing. Processing equipment (A) 2, processing equipment (B)
)3. Processing equipment (C) 4, processing equipment (D) 5, mechanical handling unit 6 that connects each processing equipment
and a workpiece delivery unit 7. Here, the above processing equipment (A), (B) (C), (D)
Examples thereof include oxidation/diffusion treatment equipment, photoresist treatment equipment, etching and/or resist removal treatment equipment, ion implantation and/or ozone removal treatment equipment, and the like. Workpieces are input from a workpiece input unit 1, buffered by a mechanical handling unit and a stocker built in this unit, and sent to a processing stage @(A) according to a request. The processed workpiece is transferred to the next processing equipment (B) via the mechanical handling unit 6.
sent to. Similarly, the workpiece is further processed with processing equipment (
It is processed in steps C) and (D), and is finally transferred from the workpiece delivery unit to the next module, buffered if necessary.

In the case of such a configuration, there is a possibility that the capacity balance among the processing equipment cannot be maintained due to differences in the number of sheets processed and the processing speed of the processing equipment. In that case, it is necessary to provide some buffer between each processing equipment, or to match the processing speed to the processing speed of the slowest equipment of the processing equipment that makes up the module. In comparison, the number of equipment would have to be increased. Further, if trouble occurs in the equipment that makes up the module, the entire module may stop. One way to deal with this is to configure two pieces of equipment of the same type in parallel to reduce the need for the entire module to stop.

FIG. 2 is a diagram showing a mechanical double module configuration. In this case, since there are multiple processing equipment, double module input unit 8. Mechanical handling unit for double module9. It is important for the double module dispensing unit 10 to buffer or transfer the workpiece by determining the status of the processing equipment before and after it.

Figure 3 is a diagram showing an example of the configuration of a single module that applies means such as mechanical handling to the conveyance system, and includes processing equipment 3, 4.5, etc., as well as workpiece receiving and buffering functions. A receiving/paying unit II having a function of sending out workpieces according to requests, and a conveyance system 12. It shows that it consists of an intermediate buffer unit 13. In this configuration, the workpieces sent out from the receiving and paying unit II are transported by the linear transport system 12 to each processing facility in accordance with the processing order. Furthermore, at the stage where each process is completed, the intermediate buffer unit 13 is used in order to balance the number of sheets to be processed and the processing speed of each processing facility, and to utilize the transport system efficiently.

When all the processing is completed, the workpiece is returned to the receiving/paying unit 11 and transferred to the next module.

FIG. 4 is a diagram showing a double module configuration using a transport system, in which similar processing equipment is arranged in pairs, and each processing equipment is connected using a loop-type transport system 14. show.

FIG. 5 is a diagram showing an example of a mass production line configuration using a transport system application double module. In this case, a plurality of transport system application double modules, a workpiece input unit 15 that inputs workpieces into the line, an inter-module transport system 16 that transports the workpiece to each module in accordance with the process order;
It is shown that the machine is comprised of a workpiece delivery unit 17 that sends processed workpieces out of the line. Here, a unidirectional flow without backtracking is ensured within each module, but between modules, the number of times that flowback occurs can be reduced depending on the arrangement of the modules.

By creating a pseudo flow shop within and between modules in this way, it is possible to significantly shorten the process.

In order to operate this module effectively, a management system that can track workpieces in real time and ensure the flow of materials while monitoring the status of processing equipment and transportation systems is required. It is effective to take the following.

Next, the connections between the processing equipment constituting the module and the module management system will be explained with reference to FIGS. 6 to 10.

FIG. 6 is a diagram showing an example in which a telescopic arm type unit 18 is used to connect the processing equipment 2 and the processing equipment 3. The telescoping arm unit [18] is a retractable arm 20 . It is equipped with a vacuum suction chuck 21, and the retractable arm 20 is extended and contracted as necessary to move the vacuum chuck 21 to a predetermined position in the processing equipment, grip the workpiece (wafer) 22, and move it to the next process. Supply equipment. In this case, a telescoping arm 18 may be provided for each processing facility.

FIG. 7 is a diagram showing an example in which a rotary arm type unit 23 is used to connect processing equipment.

In this case, as shown in FIG. 2B, after the wafer 22 is moved to a predetermined position by the wafer moving unit 24 provided in the processing equipment 3, the dedicated robot 19
The wafer 22 is gripped and rotated by an arm 25 with a mechanical chuck provided above and moved to the next predetermined position, for example, the processing equipment 2 .

FIG. 8 is a diagram illustrating an example in which the connection between processing equipment is configured by loop-type conveyance system handling. In this case, as shown in FIG. 2(a), a loop conveyance path 26 is provided between the processing equipment 2 and 3, and a loop conveyance unit 27 that can move along the conveyance path 26 is used to move the wafer to a predetermined position. move it. That is, as shown in FIG. 3B (enlarged view), when the loop transport unit 27 reaches a predetermined position, the wafer is gripped by the telescoping arm unit 18,
The wafer is rotated and placed on the table of the unit 27, moved on the conveyance path 26, and when it reaches the next predetermined position, the telescopic arm picks up the wafer from the table and supplies it to the next processing equipment.

9th C is a diagram illustrating an example in which a two-stage bending arm type unit 28 is used to connect processing equipment. Here, the arm unit 28, as shown in FIG.
It is a method that connects predetermined processing equipment while rotating around a unit support 31 that supports the whole.
As shown in Figure (C) (enlarged view), an air current is formed from the transport air outlet 29 toward the transport air suction unit 30, and the wafer 22 flows on the air flow without contacting the arm. will be transported in this condition.

The configurations shown in Figures 6 to 8 above can be applied whether there is one or more processing equipment, and
Telescopic arm type unit 189 rotating arm type unit)
23. Roof conveyance unit 1-27. A plurality of two-stage bending arm type units 28 and the like can be constructed.

Further, although the object to be transported is basically a wafer, it can also be transported to a cartridge mW containing a wafer.

Furthermore, a continuous conveyance system such as a conveyor can also be used to convey a large quantity of goods. Furthermore, there is also a method in which a self-propelled robot that integrates the loop transport unit 27 and the telescopic arm unit 18 shown in FIG. 8 is moved on the loop transport path 26. Magnetic automatic guideway vehicle (Aut
omaticGuideway Vehicle：AG
V) can also be run.

FIG. 1O is a diagram showing a management system for a manufacturing line configured as a module. In particular, real-time timing control is important for equipment management and intra-module transport management that configure modules.

〔Effect of the invention〕

As described above, by using the method of configuring a semiconductor manufacturing line according to the present invention, the problems of the prior art can be solved and the process can be shortened.

It was possible to provide a method for configuring a semiconductor manufacturing line that enables short-term production.

In addition, by shortening the process, feedback on product quality becomes faster, so an improvement in yield can be expected.

[Brief explanation of drawings]

Figure 1 shows an example of a mechanical single module configuration, Figure 2 shows an example of a mechanical double module configuration, Figure 3 shows an example of a single module configuration for transport system applications, and Figure 4 is a diagram showing an example of a transport system double module configuration, FIG. 5 is a diagram showing an example of a mass production line configuration using a transport system application double module, and FIG. 6 is a diagram showing an example of a telescoping arm type handling configuration. Fig. 7 is a diagram showing an example of a fixed arm type handling configuration, Fig. 8 is a diagram showing an example of a loop type transfer system handling configuration, and Fig. 9 is a diagram showing an example of a fixed arm type handling configuration.
FIG. 10 shows an example of a stepped folding arm type handling configuration.
The figure shows a modular production line management system. l... Workpiece input unit 2.2'... Processing equipment (A) 3.3'... Processing equipment (B) 4.4'... Processing equipment (C) 5.5'. ...Processing equipment (D) 6...Mechanical hydration unit 7...Workpiece delivery unit 8...Double module input unit 9...Double module mechanical unit 10...Double module delivery unit 11・・・Receipt/Payment Unit 12・
...Linear transport system 13...Intermediate buffer unit 14...Loop type transport system 15...Line input unit 16...Inter-module transport system 17...Line output unit 18...Extendable arm type Unit 19... Dedicated robot 20... Refraction arm 2
1... Vacuum suction chuck 22... Wafer 23... Rotating arm type unit 24... Wafer moving unit 25... Mechanical chuck type arm 26... Loop type transfer path 27... Loop transfer unit 28...
Two-stage bending arm type unit 29...Transporting air outlet 30...Transporting air suction port (Q-) (b) No. 7 diagram (α) (b) No. 7 diagram (b) (C)

Claims (1)

[Claims] 1. A method of configuring a mass production line for micro-processing workplaces with repetitive work, following the basic flow of product processing.
By constructing a module with a consistent flow that combines equipment with different processing contents by means such as mechanical handling, and installing the required number of modules according to the production scale to create a pseudo flow shop. Quick Turn Around Tim
A method for configuring a semiconductor manufacturing line, which is characterized by making it possible to produce e:QTAT).