JPH04115412A - insulated wire - Google Patents
insulated wireInfo
- Publication number
- JPH04115412A JPH04115412A JP23634890A JP23634890A JPH04115412A JP H04115412 A JPH04115412 A JP H04115412A JP 23634890 A JP23634890 A JP 23634890A JP 23634890 A JP23634890 A JP 23634890A JP H04115412 A JPH04115412 A JP H04115412A
- Authority
- JP
- Japan
- Prior art keywords
- insulated wire
- aromatic polyamide
- aromatic
- processing
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004760 aramid Substances 0.000 claims abstract description 14
- 229920003235 aromatic polyamide Polymers 0.000 claims abstract description 14
- 239000003973 paint Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 abstract description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 5
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 abstract description 4
- 125000003118 aryl group Chemical group 0.000 abstract description 4
- 238000006116 polymerization reaction Methods 0.000 abstract description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract description 3
- 229910017053 inorganic salt Inorganic materials 0.000 abstract description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 abstract 1
- 239000002798 polar solvent Substances 0.000 abstract 1
- 238000003756 stirring Methods 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- YCGKJPVUGMBDDS-UHFFFAOYSA-N 3-(6-azabicyclo[3.1.1]hepta-1(7),2,4-triene-6-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2C=3C=C2C=CC=3)=C1 YCGKJPVUGMBDDS-UHFFFAOYSA-N 0.000 description 1
- WRDNCFQZLUCIRH-UHFFFAOYSA-N 4-(7-azabicyclo[2.2.1]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=C1C=C2 WRDNCFQZLUCIRH-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001408 amides Chemical group 0.000 description 1
- -1 aromatic acid chlorides Chemical class 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 1
- NZZGQZMNFCTNAM-UHFFFAOYSA-N naphthalene-2,6-dicarbonyl chloride Chemical compound C1=C(C(Cl)=O)C=CC2=CC(C(=O)Cl)=CC=C21 NZZGQZMNFCTNAM-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
（１）産業上の利用分野
本発明は優れた捲線加工性をもつ絶縁電線に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION (1) Industrial Application Field The present invention relates to an insulated wire with excellent winding properties.
（２）従来技術とその問題点
絶縁電線を用いてコイルを製造する場合、高速自動捲線
機が使用される様になってきている。絶縁電線は捲線加
工時にニードル、プーリー等によって傷つけられ、レヤ
ーショートやアース不良等の不良を起す事が有り、捲線
速度が向上するにつれ不良率も増加するため、その対策
が問題となっている。このような問題に対し、従来より
絶縁電線に潤滑性を付与し、摩擦係数を下げ、機械的損
傷を出来る限り小さくする試みがなされ、効果を上げて
いる。しかし、不良が完全になくなったわけではなく、
絶縁電線に潤滑性を付与するだけでは限界がある事が明
らかになってきた。さらに、最近では、モータの効率化
、小型化にともない、絶縁電線をよりせまいスロット内
に押し入れるようになってきた。そのため、従来にも増
して、加工時にキズの入りにくい、耐マモウ性に優れた
絶縁電線が要求されるようになっている。(2) Prior art and its problems When manufacturing coils using insulated wires, high-speed automatic winding machines have come to be used. Insulated wires can be damaged by needles, pulleys, etc. during the winding process, resulting in defects such as layer shorts and ground failures.As the winding speed increases, the defective rate also increases, so countermeasures have become a problem. To address these problems, attempts have been made to provide lubricity to insulated wires, lower the coefficient of friction, and minimize mechanical damage, and these attempts have been successful. However, defects have not completely disappeared,
It has become clear that there are limits to simply adding lubricity to insulated wires. Furthermore, in recent years, as motors have become more efficient and smaller, insulated wires have come to be forced into narrower slots. For this reason, there is an increasing demand for insulated wires that are less susceptible to scratches during processing and have excellent resistance to marring than ever before.
絶縁電線に潤滑性を付与し、摩擦係数を下げただけでは
、絶縁電線にかかる力を逃がすだけであり力が直接かか
ってきた時には皮膜が損傷を受ける事をさける事が出来
ない。従って皮膜自体を加工に対して強くする必要が生
じている。Simply adding lubricity to the insulated wire and lowering the coefficient of friction will only release the force applied to the insulated wire, and will not prevent the coating from being damaged when force is directly applied. Therefore, there is a need to make the film itself resistant to processing.
本発明は、絶縁電線に潤滑性を付与するだけでなく、皮
膜自体の耐摩耗性を向上させ、耐加工性に優れた絶縁電
線を提供するものである。The present invention provides an insulated wire that not only provides lubricity to the insulated wire but also improves the wear resistance of the coating itself and has excellent processing resistance.
（３）発明の構成
本発明は全芳香族ポリアミド塗料を導体上に直接又は他
の絶縁材料を介して塗布・焼付した事を特徴とする絶縁
電線に関するものである。(3) Structure of the Invention The present invention relates to an insulated wire characterized in that a wholly aromatic polyamide paint is coated and baked onto a conductor either directly or via another insulating material.
本発明において全芳香族ポリアミドとは芳香族残基をア
ミド結合でつないだポリマーで通常は芳香族の酸クロラ
イドと芳香族のジアミンより合成される。代表的な合成
方法としては低温溶液重縮合法がある。低温溶液重縮合
法はジメチルアセトアミド、ヘキサメチルホスホルアミ
ド、Ｎ−メチルピロリドン、ジメチルイミダシリン、Ｎ
−メチルカプロラクタム、テトラメチル尿素等の有機極
性溶媒中で室温以下の温度で反応させる方法で、上記溶
媒中に塩化リチウム、塩化カルシウム、塩化マグネシウ
ム、炭酸マグネシウム、炭酸リチウム、炭酸カルシウム
、臭化リチウム、水酸化リチウム等の無機塩を添加する
とより重合度の高いものが得られる。In the present invention, fully aromatic polyamide is a polymer in which aromatic residues are connected through amide bonds, and is usually synthesized from aromatic acid chloride and aromatic diamine. A typical synthesis method is a low temperature solution polycondensation method. The low temperature solution polycondensation method uses dimethylacetamide, hexamethylphosphoramide, N-methylpyrrolidone, dimethylimidacyline, N
- A method in which lithium chloride, calcium chloride, magnesium chloride, magnesium carbonate, lithium carbonate, calcium carbonate, lithium bromide, When an inorganic salt such as lithium hydroxide is added, a product with a higher degree of polymerization can be obtained.
他の重合方法としては界面重合法、固相重合法、低温懸
濁法、アミド交換法等がある。Other polymerization methods include interfacial polymerization, solid phase polymerization, low-temperature suspension method, and amide exchange method.
芳香族酸クロライドとしては、テレフタル酸クロライド
、イソフタル酸クロライ・ド、４４′−ジフェニルジカ
ルボン酸クロライド、２．６−ナフタレンジカルボン酸
クロライド、ヤ、以上のクロライドの芳香族にアルキル
基、ハロゲン基をもつものが使用出来、芳香族ジアミン
としては、ｐ−フェニレンジアミン、ｍ−７エニレンジ
アミン、４．４’ジアミノジフエニルエーテル、４．４
’−ジアミノジフェニルメタン、４．４’−ジアミノジ
フェニルスルホン、４．４′−ジアミノジフェニルエー
テル、３３′−ジアミノジフエニルスルホン、４．４′
−ジアミノベンズアニリド、３．４１−ジアミノベンズ
アニリド、ナフタレンジアミン、や、以上のジアミンの
芳香族にアルキル基、ハロゲン基をもつものが使用出来
る。上記の材料を２種以上組み合せて使用する事も可能
である。Examples of aromatic acid chlorides include terephthalic acid chloride, isophthalic acid chloride, 44'-diphenyldicarboxylic acid chloride, 2,6-naphthalenedicarboxylic acid chloride, and the above chlorides having an alkyl group or a halogen group in the aromatic group. Examples of aromatic diamines include p-phenylene diamine, m-7 enylene diamine, 4.4'diaminodiphenyl ether, and 4.4'diaminodiphenyl ether.
'-Diaminodiphenylmethane, 4.4'-Diaminodiphenyl sulfone, 4.4'-Diaminodiphenyl ether, 33'-Diaminodiphenyl sulfone, 4.4'
-diaminobenzanilide, 3,41-diaminobenzanilide, naphthalenediamine, and the above diamines having an alkyl group or a halogen group in the aromatic group can be used. It is also possible to use a combination of two or more of the above materials.
これら全芳香族ポリアミドは、皮膜の耐摩耗性を向上さ
せ、耐加工性を改善する。These wholly aromatic polyamides improve the abrasion resistance and processing resistance of the coating.
以上の全芳香族ポリアミドの中では、溶媒に溶解した時
液晶性を有するものが機械強度がより大きく、特に好ま
しい。Among the above-mentioned wholly aromatic polyamides, those having liquid crystallinity when dissolved in a solvent are particularly preferred because they have higher mechanical strength.
本発明においては、全芳香族ポリアミドを絶縁物を介し
て塗布・焼付する事もよい。In the present invention, it is also possible to apply and bake the wholly aromatic polyamide through an insulator.
絶縁材料としては、通常使用されるものであればいかな
るものでもよいが、例えば、ポリビニルホルマール、エ
ポキシ、ウレタン、ポリエステル、ポリエステルイミ
ド、ポリアミ トイ ミ ド、ポリイミド、ポリエステ
ルアミドイミド、ポリパラバン酸、ポリヒダントイン等
がある。Any commonly used insulating material may be used, but examples include polyvinyl formal, epoxy, urethane, polyester, and polyesterimide.
Examples include polyamide, polyamideimide, polyimide, polyesteramideimide, polyparabanic acid, and polyhydantoin.
又、本発明の絶縁電線に固形パラフィン、シリコン等を
塗布したり、ワックス類を水分散させ、熱硬化性樹脂の
バインダーを加えた焼付型潤滑剤を塗布・焼付したり、
全芳香族ポリアミド塗料にワックス、ＰＴＦＥ、シリコ
ンを加え絶縁皮膜に潤滑性を持たせる等して、絶縁電線
の潤滑性を向上させる事も可能である。Furthermore, the insulated wire of the present invention may be coated with solid paraffin, silicone, etc., or a baking type lubricant prepared by dispersing wax in water and adding a thermosetting resin binder may be coated and baked.
It is also possible to improve the lubricity of the insulated wire by adding wax, PTFE, or silicone to the wholly aromatic polyamide paint to impart lubricity to the insulating film.
以ドの実施例にて本発明の詳細な説明するが、本発明は
以下の実施例に限定されるものではない。The present invention will be explained in detail in the following examples, but the present invention is not limited to the following examples.
（比較例１）
ポリアミドイミド塗料（日立化成社製商品名Ｈ１−４０
６）を１． Ｏｍｍ ＄の銅導体上に皮膜厚０．０３５
ｍｍ（比較例１〕、皮膜厚０．０２０ ｍｍ （比較例
２）となるように塗布・焼付した。(Comparative Example 1) Polyamide-imide paint (trade name: H1-40 manufactured by Hitachi Chemical Co., Ltd.
6) to 1. Coating thickness 0.035 on copper conductor of Omm $
mm (Comparative Example 1) and 0.020 mm (Comparative Example 2).
得られたポリアミドイミド絶縁電線の特性を測定した結
果を表１に示した。Table 1 shows the results of measuring the characteristics of the obtained polyamide-imide insulated wire.
〔実施例１〕
ｐ−フェニレンジアミン５４．１ ／ （０，５モル）
、塩化リチウム７８／、をＮメチルピロリドン１Ｂ２０
Ｐに溶解し、温度的０°Ｃまで冷却した。[Example 1] p-phenylenediamine 54.1 / (0.5 mol)
, lithium chloride 78/, N-methylpyrrolidone 1B20
P and cooled to a temperature of 0°C.
テレフタル酸クロライド１０１．５７（０，５モル）を
反応温度が２０°Ｃ以下になるように冷却しながら徐々
に加えた。101.57 (0.5 mol) of terephthalic acid chloride was gradually added with cooling so that the reaction temperature was below 20°C.
テレフタル酸クロライドを添加完了した後約２時間混合
した後、多量の水に注ぎ、濾過する事によりｐ−フェニ
レンテレフタルアミド樹脂ヲ得り。After completing the addition of terephthalic acid chloride, the mixture was mixed for about 2 hours, poured into a large amount of water, and filtered to obtain p-phenylene terephthalamide resin.
得られた樹脂を硫酸に濃度１５％に溶解したところ、溶
液は不透明で、攪拌によりしま模様の光沢が発生し液晶
性を示した。When the obtained resin was dissolved in sulfuric acid to a concentration of 15%, the solution was opaque, and when stirred, a striped gloss appeared and exhibited liquid crystallinity.
上記溶液を１．０ ｍｍ ｐｆの銅導体上に皮膜厚０．
０２０ｍｍとなるように塗布・焼付した。The above solution was applied to a 1.0 mm pf copper conductor in a film thickness of 0.0 mm.
It was coated and baked to a thickness of 0.020 mm.
得られた芳香族ポリアミド絶縁電線の特性を表１に示し
た。Table 1 shows the characteristics of the obtained aromatic polyamide insulated wire.
（実施例２）
ｐ−フェニレンジアミンの代すにｍ−フェニレンジアミ
ン、テレフタル酸クロライドの代りにイソフタル酸クロ
ライドを用いたほかは実施例１と同様にして、ｍ−フニ
ーレンイソフタルアミド樹脂を合成した。(Example 2) An m-phenylene isophthalamide resin was synthesized in the same manner as in Example 1, except that m-phenylene diamine was used instead of p-phenylene diamine, and isophthaloyl chloride was used instead of terephthaloyl chloride. .
得られた樹脂を実施例１と同様に硫酸に濃度１５％に溶
解したが、溶液は液晶性を示さなかった。The obtained resin was dissolved in sulfuric acid to a concentration of 15% in the same manner as in Example 1, but the solution did not exhibit liquid crystallinity.
上記溶液を実施例１と同様にして絶縁電線を作製した。An insulated wire was produced using the above solution in the same manner as in Example 1.
得られた芳香族ポリアミド絶縁電線の特性を表１に示し
た。Table 1 shows the characteristics of the obtained aromatic polyamide insulated wire.
（４）発明の効果
実施例で示されるように、本発明の全芳香族ポリアミド
を塗布・焼付した絶縁電線は機械強度に優れ、従来のも
のより耐加工性が向上する事が期待され、その工業的価
値は大きい。(4) Effects of the Invention As shown in the examples, the insulated wire coated and baked with the fully aromatic polyamide of the present invention is expected to have excellent mechanical strength and improved workability compared to conventional wires. It has great industrial value.
Claims (2)
絶縁材料を介して塗布・焼付した事を特徴とする絶縁電
線。(1) An insulated wire characterized by applying and baking a wholly aromatic polyamide paint directly onto a conductor or through another insulating material.
求の範囲第１項記載の絶縁電線。(2) The insulated wire according to claim 1, wherein the wholly aromatic polyamide paint has liquid crystallinity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23634890A JPH04115412A (en) | 1990-09-05 | 1990-09-05 | insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23634890A JPH04115412A (en) | 1990-09-05 | 1990-09-05 | insulated wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04115412A true JPH04115412A (en) | 1992-04-16 |
Family
ID=16999480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23634890A Pending JPH04115412A (en) | 1990-09-05 | 1990-09-05 | insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04115412A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196025A (en) * | 1992-12-22 | 1994-07-15 | Sumitomo Electric Ind Ltd | Insulated wire |
| WO2011007575A1 (en) * | 2009-07-16 | 2011-01-20 | 日本化薬株式会社 | Resin composition, and optical fiber and electric wire each comprising same |
-
1990
- 1990-09-05 JP JP23634890A patent/JPH04115412A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196025A (en) * | 1992-12-22 | 1994-07-15 | Sumitomo Electric Ind Ltd | Insulated wire |
| WO2011007575A1 (en) * | 2009-07-16 | 2011-01-20 | 日本化薬株式会社 | Resin composition, and optical fiber and electric wire each comprising same |
| JP5860282B2 (en) * | 2009-07-16 | 2016-02-16 | 日本化薬株式会社 | Resin composition and optical fiber and electric wire using the same |
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