JPH04109568A - Electric circuit member - Google Patents

Abstract

PURPOSE:To make possible junction with a pitch narrower than that of junction with only an anisotropic conductive film and achieve connection with a small resistance value and small floating capacitance by laying semiconductor elements one over the other in such a manner as being electrically connected together via the conductive members of an electrical connecting member and the conductive particles of an anisotropic conductive film. CONSTITUTION:An electrical connecting member 1 has plural gold conductive members 102 electrically insulated from one another and held in a holder 101 made of polyimide and one end 103 of each of the conductive members 102 is exposed on the semiconductor element 300 side and the other end 104 on the circuit substrate 300 side. One face of an anisotropic conductive film 2 is exposed on the other end 104 side of each of the conductive members 102 of the connecting member 1 and the other face on the circuit substrate 300 side. The recessed connecting portion 202 of the Al of the semiconductor element 200 is electrically connected to one exposed end 103 of each of the conductive members 102 of the connecting member 1 and one end 104 of each of the conductive members 102 of the connecting member 1 which end is exposed on the conductive film 2 side is electrically connected to metal particles 4 dispersed in the electrically insulating adhesive 3 of the anisotropic conductive film 2 and the metal particles 4 are electrically connected to a connecting portion 301 of gold-plated copper pattern of the circuit substrate 300.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical circuit member in which electrical circuit components are connected using an electrical connecting member and an anisotropic conductive film.

[Conventional technology] Conventionally, circuit boards, lead frames, semiconductor devices, circuit boards and lead frames, circuit boards and semiconductor devices, and lead frames and semiconductor devices have been connected using connectors, crimp terminals, and soldering. method, wire bonding method, TAB (Tape Automated B
onding) method, CCB (Control 1.
edCollapsed Bonding) method, etc. are well known. However, with these methods, the minimum pitch required to prevent adjacent connection parts from coming into contact with each other is relatively large, so there is a problem that they cannot be used when a small pitch between connection parts is required. was there.

Furthermore, this method has problems in terms of electrical characteristics since the length of the wiring becomes long, leading to an increase in resistance value and stray capacitance. This problem was particularly noticeable in high frequency electrical circuits.

In addition, as a method for joining the above-mentioned parts, a method using an anisotropic conductive film is known (Japanese Patent Application Laid-Open No. 60-216411, JP-A No. 61-78069, JP-A No. 61-17).
(See Publication No. 4643, etc.).

The anisotropic conductive film is a sheet-like material in which metal particles are dispersed in an electrically insulating adhesive, and the anisotropic conductive film can be interposed between substrates having a joint portion to electrically connect them.

FIG. 5 is a schematic diagram showing electrical connections between electrical circuit components using one such anisotropic conductive film, and in the figure, 21
is an anisotropic conductive film, and 100 and 110 are electrical circuit components to be connected, which in this example are circuit boards. The anisotropic conductive film includes metal particles 15 such as Ni and solder in an electrically insulating adhesive 150.
It is a sheet-like material having a structure in which 1 is dispersed therein. The circuit board 100 has a conductor pattern 101 and a resist 102.
is formed, and has a plurality of joint parts 103. Similarly, the circuit board 110 also has a conductive pattern 111,
It has a resist 112 and a bonding portion 113. FIG. 5(a) is a diagram showing the state before joining. Then, by pressurizing and heating the circuit boards 100 and 110, the connecting portion 103 of the electric circuit component 100 and the electric circuit component 1. I O
(Fig. 5(b))
.

Further, an electrical connection in which a plurality of conductive members are held insulated from each other in an insulating holder, and both ends of the conductive members are on both sides of the holder and are aligned with or protrude from the holder surface. It has been proposed to electrically connect electrical circuit components using materials (Japanese Patent Application Laid-Open No. 1983-1999).
222437, JP-A-63-224235, etc.).

FIG. 6 is a schematic diagram showing electrical connections between electrical circuit components using one such electrical connection member.
1 indicates an electrical connection member, and 32 and 33 indicate electrical circuit components to be connected. The electrical connection member 31 connects a plurality of rod-shaped conductive members 34 made of metal or alloy to each conductive member 34.
The conductive member 3 is electrically insulated from each other and held by a thin plate-shaped maintenance member 35 made of an electrically insulating material.
Both ends of 4 are protruded toward the electric circuit components 32 and 33 as bumps 38 and 39, respectively (FIG. 6(a)). Then, the connection portion 36 of one electric circuit component 32 and the bump 38 of the conductive member 34 are connected to the other electric circuit component 33.
The connecting portion 37 of the conductive member 34 and the bump 39 of the conductive member 34 are connected by metallization and/or alloying, for example, by thermocompression bonding, ultrasonic heating, etc., and the electric circuit components 32 and 33 are electrically connected to each other. (Figure 6(b)).

As a method for manufacturing the electrical connection member 31, a method shown in FIG. 7 has been proposed (Japanese Patent Laid-Open No. 2-49385).

First, a photosensitive resin 35a that will become the holder 35 is applied onto a copper foil 40 made of a conductive material (FIG. 7(a)).

Next, in a post-process, a predetermined position where the conductive member 34 is to be buried is exposed and developed to form a hole 3 in the photosensitive resin 35a.
5b to expose the copper foil 40, and then raise the temperature to harden the photosensitive resin 35a (FIG. 7(b)).

Then, the copper foil 40 near the hole 35b is etched to form a recess 41 below the hole 35b (FIG. 7(C)).

Thereafter, by plating the copper foil 40 with gold or the like, the conductive member 34 is filled into the recess 41 and the hole 35b, the bump 39 is formed in the recess 41, and the upper surface of the photosensitive resin 35a is form a bump 38 (see Fig. 7(d)
)).

Thereafter, the electrical connection member 31 is obtained by removing the copper foil 40 by metal etching (see FIG. 7).
e)).

[Problems to be Solved by the Invention] The above-mentioned anisotropic conductive film utilizes the fact that when compressed, adjacent metal particles are brought into contact with each other and the electrical resistance value is lowered.

This bonding method using an anisotropic conductive film is characterized in that it can be bonded at a relatively low temperature and can be bonded easily, but narrow pitch bonding is not possible. In other words, since the metal particles in the anisotropic conductive film are approximately spherical, they cannot be dispersed sufficiently uniformly.
Furthermore, since there is a restriction on the amount of dispersion, narrow pitch multi-bin joining is not possible. Furthermore, because the bonding is between metal particles, the bonding area becomes smaller, the number of bonding points increases, and the area of the connection between the metal particles and the electric circuit component becomes smaller, resulting in higher electrical resistance, etc. , poor electrical characteristics. In addition, if the joints of electrical circuit components are concave (
(See FIG. 5), the electric resistance value of the peripheral portion 106 is low and the electric resistance value of the joint portion 107 is high, resulting in poor electrical characteristics. Therefore, the electric circuit component cannot be used unless the joint portion has a convex shape. If the joint is concave, it is necessary to place bumps or the like on the joint to create a convex electric circuit component.

On the other hand, in the bonding method using the electrical connection member described above, since the thickness of the electrical connection member is thin, thermal stress becomes large when the thermal expansion coefficients of the electrical circuit components are large, resulting in quality reliability problems. For this purpose, a method of increasing the thickness of the electrical connection member has been proposed, but this method is expensive.

The present invention was made in view of the above circumstances, and enables narrow pitch connections, has good electrical characteristics (does not depend on the uneven structure of the electrodes, does not depend on the thermal expansion coefficient of the electric circuit components, and can be easily manufactured). The purpose is to provide an electric circuit member that is easy, inexpensive, and has good reliability.

[Means for Solving the Problems] According to the present invention, the above objects are achieved by: a holder made of an electrically insulating material; an electrically conductive member, wherein both ends of each of the conductive members protrude and are exposed from the surface of the holder on both sides of the holder, and conductive particles are placed in an electrically insulating adhesive. an anisotropic conductive film formed by dispersion, and are superimposed so that an electrical connection is made through the conductive member of the electrical connection member and the conductive particles of the anisotropic conductive film, One surface of the stack is made of the electrical connection member, and the other surface is made of the anisotropic conductive film or the electrical connection member, and at least one
an electrical circuit component electrically connected to at least one of the conductive members exposed on the holder surface of the electrical connection member; is arranged on the other surface side and has at least one connection part, and in the connection part, is exposed to at least a part of the conductive particles on the anisotropic conductive film surface or on the holder surface of the electrical connection member. Provided is an electrical circuit member comprising: at least one of the electrically conductive members that is connected to the electrically conductive member; and another electrical circuit component that is electrically connected to the electrically conductive member.

In the present invention, there is an embodiment in which the electrical connection member and the anisotropic conductive film are stacked together to consist of one electrical connection member and one anisotropic conductive film.

In the present invention, there is an embodiment in which the electrical connection member and the anisotropic conductive film are stacked together such that one anisotropic conductive film is placed between the two electrical connection members.

In the present invention, there is a mode in which the holders of the two electrical connection members are connected and integrated at the periphery of the overlapping portion, so that the two electrical connection members are integrated.

In the present invention, there is an embodiment in which the anisotropic conductive film is bonded to an adjacent member.

In the present invention, at least a part of the surface having the connecting portion of at least one of the electric circuit components and the holder are bonded together with an adhesive made of an electrically insulating material interposed therebetween. There are ways in which this is the case.

In the present invention, there is an embodiment in which the electrically conductive member of the electrical connection member and the connection portion of the electrical circuit component are connected by metallization and/or alloying.

Further, in the present invention, there is an embodiment in which the electric circuit component and other electric circuit components are each a circuit board, a lead frame, or a semiconductor element.

In the present invention, the number of electrical connection members constituting the overlapping of the electrical connection member and the anisotropic conductive film may be one or more. However, when using a plurality of electrical connection members, An anisotropic conductive film may be interposed between adjacent electrical connection members, or the electrical connection members may be directly connected to each other without intervening. Further, the number of the anisotropic conductive films may be one or more.

Furthermore, in the present invention, only one electric circuit component and other electric circuit components may exist, or a plurality of them may exist.

[Function] The electric circuit member of the present invention has at least one electrical connection member and at least one anisotropic conductive film, one surface of which is the electrical connection member and the other surface of which is the anisotropic conductive film. The membranes or the electrical connection members are stacked one on top of the other, and electrical circuit components having connection parts are placed on both sides of the stack, and the connection parts of these electrical circuit parts are electrically connected to each other. It is something.

In the case of the present invention, not only is it possible to connect with a narrower pitch than when using only an anisotropic conductive film, but also when the connection part of one electric circuit component is concave, it is adjacent to the electric circuit component side. By arranging the electrical connection member,
Since the conductive member of the electrical connection member has a convex shape that protrudes from the surface of the holder, it can be easily connected even if the connection part of the electric circuit component is concave, and the leakage current can be reduced with a low resistance value, and stray capacitance can be reduced. Electrical properties are also improved, such as by reducing the In addition, when the difference in thermal expansion coefficient between electrical circuit components is large, the distance between the electrical circuit components will be larger when using both the electrical connection member and the anisotropic conductive film than when using one. Since the oriented conductive film is flexible against expansion and contraction, thermal stress is alleviated and quality reliability is further improved.

In the present invention, in order to connect the conductive member of the electrical connection member and the connection part of the electric circuit component, at least a part other than the connection part is bonded, and the conductive member and the connection part of the electric circuit component are connected by the adhesive force. By doing so, electrical circuit components with low heat resistance can be easily connected by adhesion at a relatively low temperature, and the range of selection of electrical circuit components is expanded, and the range of applications is widened.

In the present invention, by connecting the conductive member of the electrical connection member and the connection part of the electric circuit component by metallization and/or alloying, the connection strength is increased and the connection resistance value is low (and the connection reliability is increased). .

In the present invention, an electrical connection member is connected to a connection part of an electric circuit component, and an anisotropic conductive film is interposed between these two electrical connection members, so that both electrical circuit components can be connected to each other. Even when the connection portion is concave, it not only has the effect of improving the connection, but also increases the distance between the electrical circuit components, which alleviates thermal stress and increases quality reliability.

In the present invention, by connecting the connection portion of the electric circuit component and the conductive member of the electrical connection member by metallization and/or alloying, the connection strength increases and the connection resistance value becomes low.

The present invention relates to the connection of electrical circuit components having connecting portions, particularly electrical circuit members that require narrow pitch connections, and those that require good electrical characteristics, such as connections with low resistance values to allow current to flow. It is extremely effective for electrical circuit members, electrical circuit members that require the connection of electrical circuit components with concave connecting parts, and electrical circuit members that require the connection of electrical circuit components that require a low connection temperature during bonding. It can be applied to semiconductor parts, semiconductor devices, thermal recording parts and devices such as inkjet heads and thermal heads that use the bubble jet method proposed by Canon Corporation, as well as LED arrays, contact sensors, and liquid crystal display parts and devices.

[Example] Hereinafter, an example of the present invention will be specifically described based on the drawings.

(First Embodiment) FIGS. 1(a) and 1(b) show an embodiment of the present invention in which one electrical connection member and one anisotropic conductive film are interposed between electrical circuit components to achieve electrical connection. FIG. 2 is a schematic diagram showing a first example.

Figure 1 (a) shows the state before electrical connection, Figure 1 (b)
indicates the state after electrical connection.

In the figure, 1 is an electrical connection member, 2 is an anisotropic conductive film, 2.0
0 indicates a semiconductor element which is an electric circuit component, and 300 indicates a circuit board which is an electric circuit component.

Here, although the electrical connection member 1 is the same as the conventional one, a detailed manufacturing method of the electrical connection member 1 used in the first embodiment will be explained with reference to FIG.

That is, a copper plate 40 as a base was prepared, an adhesion auxiliary agent was applied onto the copper plate 40 using a spinner, a negative type polyimide resin 35a as a photosensitive resin was applied using a spinner, and then a pre-baking process was performed. 7 (a,)), here, taking into consideration the decrease in film thickness due to the scattering of the solvent and the hardening of the resin itself, the film thickness of the polyimide resin 35a to be applied is determined to be the desired film of the holder to be manufactured. I left it thicker than thick.

Next, the polyimide resin 35a was irradiated (exposed) with light through a photomask (not shown) having a predetermined pattern, and then developed. At this time, the energy density of the irradiated light is 100 to 10. OOOmJ/cm2 can be set, and the development time can be 4 to 30 minutes. In this example, the polyimide resin 35a remains in the exposed portion,
The areas that are not exposed to light are made of polyimide resin 35 through development processing.
A was removed to form a hole 35b with a diameter of about 10 to 20 μm. After that, the temperature is raised and the polyimide resin 35a is
(Fig. 7(b)).

Incidentally, even when appropriate exposure conditions and development conditions are set, residues (not shown) of the polyimide resin 35a may remain on the surface of the copper foil 40 at the bottom of the hole 35b. In such a case, dry etching is performed to completely expose the copper plate 40. As dry etching,
For example, 02 plasma etching can be used, and an example of the etching conditions at this time is as follows.

High frequency type crab 200w ~ 400vl' 0 □ Flow rate + 200SCCM Pressure crab 1 Torr Etching time = 5 minutes to 10 minutes Next, the copper plate 40 treated as above was immersed in an etching solution to perform etching. . A part of the copper plate 40 near the hole 35b is etched away, and the hole 35b is removed.
A recess 41 communicating with the copper plate 40 was formed in the copper plate 40 (see Fig. 7).
C)).

Next, the recess 4 is plated with gold using the copper plate 4o as a common electrode.
1. Place gold 34, which is a conductive member, into the hole 35b using polyimide resin 3.
Gold 34 was buried in a convex shape to protrude from the surface of 5a (FIG. 7(d)).

Finally, the copper plate 40 was removed by metal etching using an etchant that removes copper but not gold, producing the electrical connection member 1 as shown in FIG. 7(f).

In this example, in the manufactured electrical connection member 1, the conductive member 34 is made of gold, and the holder 35a is made of polyimide resin.

In addition to the above-mentioned 02 plasma etching, examples of dry etching include electron cyclotron resonance (ECR).
Plasma etching or laser etching by irradiation with excimer laser light may also be used.

Although all of the copper 40 was removed by metal etching in the process described above, some copper may be left in areas other than those in contact with gold and used for reinforcing the holder.

In this example, gold (conductive member) is filled by gold plating, but it may be filled by other methods, such as vapor deposition.

In the example, gold was used as the material of the conductive member, but in addition to the gold (Au) used in the example, Cu and Ag were used.

Be, Ca, Mg, Mo, Ni, W, Fe
, Ti, In, Ta, Zn, Al, Sn,
Metals or alloys such as Pb-3n can be used. The conductive member may be made of one kind of metal or alloy, or may be made of a mixture of several kinds of metals and alloys. Alternatively, a metal material containing one or both of an organic material and an inorganic material may be used. Note that the cross-sectional shape of the conductive member can be circular, square, or other shapes, but a shape without corners is desirable in order to avoid excessive concentration of stress. Further, the conductive member does not need to be arranged vertically in the holder 35, but may be obliquely arranged from one surface of the holder to the other surface of the holder.

In the examples, polyimide resin was used as the photosensitive resin, but there is no particular limitation as long as it is a photosensitive resin. In addition, one or more of inorganic materials, metal materials, and alloy materials are dispersed in the photosensitive resin in a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies. It may be contained. Specifically, the metal materials and alloy materials contained include Au, Ag, Cu, l, Be, Ca,
Mg, Mo, Fe, Ni, Co, Mn,
W, Cr, Nb.

Zr, Ti, Ta, Zn, Sn, Pb-3
n, etc., and the contained inorganic materials include 5iOa
, B20i, Al2O5, Na, aO, 20. CaO
, ZnO, Bad, PbO, 5bJi, Asdl
h, LazOa, ZrCh, P2O5, T
iO2, MgO, SiC, Bed, BP, BN,
Ceramics such as AIN, B4C, TaC, TiBz, CrB2゜TiN, 5iaN+, Ta5ks,
Examples include diamond, glass, carbon, and boron.

In this example, a copper plate was used as the substrate, but the substrate is not limited to this, and may also be Au, Ag, Be, Ca, Mg, Mo, N.
i, W, Fe, Ti, In, Ta.

A thin plate of metal or alloy such as Zn, Al, Sn, Pb-3n, etc. can be used. However, since only the base is selectively etched away in the final step, the material of the conductive member and the material used for the base must be different.

Further, in this embodiment, the holes were formed using photolithography when obtaining the electrical connection member, but the holes may also be formed using a high energy beam, for example, an excimer laser. in this case,
There is no need to use photosensitive resin. Furthermore, the resin hole and the copper foil recess may be formed by irradiating the resin surface with an excimer laser.

Next, in this example, as the anisotropic conductive film 2, a commercially available one manufactured by Sony Chemical Company Ltd. and one manufactured by Hitachi Chemical Company Ltd.
I used one made by

By adhering the anisotropic conductive film to an adjacent member, the bonding strength is improved.

Furthermore, the conductive particles constituting the anisotropic conductive film include:
Metal particles or particles having a gold particle layer on the surface of electrically insulating particles can be used.

Returning to FIG. 1, the electrical connection member 1 is constructed by including a plurality of conductive members 102 made of gold in a holder 101 made of polyimide with the conductive members 102 electrically insulated from each other, One end 103 of the conductive member 102 is exposed to the semiconductor element 200 side, which is an electric circuit component, and the conductive member 1
The other end 104 of 02 is exposed to the side of a circuit board 300 which is an electric circuit component. Further, one surface of the anisotropic conductive film 2 is on the other end 104 side of the conductive member 102 of the electrical connection member 1, and the other surface of the anisotropic conductive film 2 is on the circuit board 30, which is an electric circuit component.
It is exposed on the 0 side.

Then, the passivation film 201 of the semiconductor element 200
The concave connection portion 202 of Au2 that is not covered by the Au2 and the Au of the electrical connection member 1 exposed to the semiconductor element 200 side
The one end 104 of the conductive member 102 made of Au of the electrical connection member 1 is electrically connected to the one end 103 of the conductive member 102 which is Au, and the anisotropic conductive film is further exposed to the anisotropic conductive film 2 side. Ni dispersed in the electrically insulating liquid @ agent 3 of 2
The metal particles 4 that are powder are electrically connected, and the metal particles 4 that are Ni powder of the anisotropic conductive film 2 are connected to the circuit board 30.
The gold-plated connection portion 301 was electrically connected to the copper pattern 0 (FIG. 1(b)). In this embodiment, electrical connection was achieved using screws and spring pressure, but pressure may be achieved using other known methods.

Although it is necessary to position the semiconductor element 200 and the circuit board 300, this is because the conductive member 102 of the electrical connection member 1 is smaller than the bit of the connection part 202 of the semiconductor element 200, and because the metal of the anisotropic conductive film 2 Since the particles 4 are uniformly dispersed, the positioning of the electrical connection member 1 and the anisotropic conductive film 2 may be rough.

In the case of this embodiment, the semiconductor element 200 and the circuit board 300 were connected at once using the electrical connection member 1 and the anisotropic conductive film 2, but the semiconductor element 200 and the electrical connection member 1 were Alternatively, after connecting the circuit board 300 and the anisotropic conductive film 2, the electrical connection member 1 and the anisotropic conductive film 2 may be connected.

According to this example as described above, an electric circuit member with good connection reliability and low cost was obtained.

(Second Embodiment) FIGS. 2(a) and 2(b) show a second embodiment of the present invention in which electrical connection is achieved by interposing an electrical connection member and an anisotropic conductive film between electrical circuit components. It is a schematic diagram showing an example. Figure 2 (
2(a) shows the state before electrical connection, and FIG. 2(b) shows the state after electrical connection.

In this second embodiment, a semiconductor element 200 and an electrical connection member 1 are bonded together using an adhesive 205.
The second embodiment is the same as the first embodiment except that the electrical connection between the connecting portion 202 and the conductive member 102 of the electrical connecting member 1 is established.

The following method was used to bond the semiconductor element 200 and the electrical connection member 1 and to establish an electrical connection between the connection portion 202 of the semiconductor element 200 and the conductive member 102 of the electrical connection member 1.

That is, the passivation film 20 of the semiconductor element 200
The epoxy adhesive 205 was applied to the entire surface or part of the connecting portion 1 and the connecting portion 202 using a dispenser. The electrical connection member 1 is placed on top of the electrical connection member 1, and the electrical connection member is pressed with a flat glass (not shown) and heated to 100 to 200°C.
to harden the epoxy adhesive 205 and bond the semiconductor element 200 and the electrical connection member 1. At the same time, the adhesive part 202 of the semiconductor element 200 and one end 103 of the conductive member 102 of the electrical connection member 1 are connected with electricity. I made a connection. As a result, the adhesive resin contracts when it hardens, so even if the glass is removed, the same state as pressing can be obtained, contributing to maintaining electrical connection. After that, the other end 104 of the conductive member 102 of the electrical connection member 1 and the circuit board 300
The anisotropic conductive film 2 was interposed between them, and the connecting portion 202 of the semiconductor element 200 and the connecting portion 301 of the circuit board 300 were electrically connected by applying pressure and heating.

In this example, an epoxy adhesive was used as the adhesive, but the adhesive is not limited to this, and can include polyurethane, phenol, polyester, resorcinol, melamine, urea, and polyaromatic adhesives. You may use a thermosetting adhesive such as. In addition to thermosetting adhesives, thermoplastic adhesives include vinyl acetate, polyvinyl alcohol, polyvinyl acetal, vinyl chloride, acrylic, polyamide, polyethylene, cellulose, and other polyisobutylene and polyvinyl ether. Alternatively, a synthetic rubber adhesive may be used.

Further, in this example, the adhesive was cured by heat, but it may be cured by light using a photosensitive adhesive.

In this embodiment, the amount of adhesive applied was greater than the volume of the gap between the semiconductor element 200 and the electrical connection member 1, and the gap was sufficiently filled and excess adhesive spilled out, but the amount of adhesive applied was greater than the volume of the gap between the semiconductor element 200 and the electrical connection member 1. A smaller amount may be applied.

Further, in this embodiment, the semiconductor element 200 and the electrical connection member 1 are bonded together, and the adhesive portion 202 of the semiconductor element 200 and the conductive member 102 of the electrical connection member 1 are electrically connected, and then the circuit board 300 is bonded. Although the anisotropic conductive film 2 was interposed between the circuit board 300 and the anisotropic conductive film 2,
, the electrical connection member 1 and the semiconductor element 200 may be connected after the anisotropic conductive film 2 and the electrical connection member 1 are connected, or they may all be connected at the same time. may be in any order. Also, the adhesive application method is
Any known method such as spacing or using a spinner may be used.

According to this embodiment as described above, an electric circuit member with good connection reliability and low cost was obtained.

(Third Embodiment) The third embodiment differs from the second embodiment only in the following points, and the rest is the same as the second embodiment.

That is, the conductive member 102 of the electrical connection member 1 is made of a solder material. The material of the connecting portion 202 of the semiconductor element 200 is composed of AJ2 with Cr, Cu, and Au materials attached, and the exposed surface is Au.

Connection temperature should be 200-280°C.

The electrical connection member 1 and the anisotropic conductive film 2 are simultaneously pressurized and heated to melt the solder, thereby forming the connection portion 2 of the semiconductor element 200.
02 and the Ni particles of the anisotropic conductive film 2.

(Fourth Embodiment) FIGS. 3(a) and 3(b) show an embodiment of the present invention in which two electrical connection members and one anisotropic conductive film are interposed between electrical circuit components to achieve electrical connection. FIG. 7 is a schematic diagram showing a fourth example. Figure 3(a) shows the state before electrical connection; Figure 3(a) shows the state before electrical connection;
b) shows the state after electrical connection.

In this embodiment, the semiconductor element 200 and a semiconductor element 400 of a different type are bonded to each other, which are also electric circuit parts, similar to the semiconductor element 200 which is an electric circuit part.

In the semiconductor element 200, a part of the peripheral part of the connecting part 202 is covered with a passivation film 201, and the peripheral part of the connecting part 202 has a convex shape and the connecting part has a concave shape.

Similarly, in the semiconductor element 400, a part of the peripheral part of the connecting part 402 is covered with a passivation film 401, and the peripheral part of the connecting part 402 has a convex shape, and the connecting part has a concave shape.

An electrical connection member 1 is arranged on the semiconductor element 200 side, an electrical connection member 5 similar to the electrical connection member 1 is arranged on the semiconductor element 400 side, and anisotropic conduction is established between the electrical connection members 1.5. The connecting portion 202 of the semiconductor element 200 and the connecting portion 402 of the semiconductor element 400 were electrically connected by interposing the membrane 2 and pressing the same as in the first embodiment.

In addition, in the electrical connection member 5, 501 is a holding body;
2 is a conductive member, 503 is one end of the conductive member, and 504 is the other end of the conductive member.

According to this example, although the connecting portions of the semiconductor elements 200 and 400 are concave, a semiconductor device with good quality reliability was obtained.

(Fifth Embodiment) FIGS. 4(a) and 4(b) show an embodiment of the present invention in which two electrical connection members and one anisotropic conductive film are interposed between electrical circuit components to achieve electrical connection. FIG. 7 is a schematic diagram showing a fifth example.

Figure 4(a) shows the state before electrical connection, Figure 4(b)
indicates the state after electrical connection.

In this embodiment, the same electrical connection member used in the first embodiment is used as the electrical connection member 1, and the same electrical connection member used in the third embodiment is used as the electrical connection member 6. As the anisotropic conductive film 2, the same anisotropic conductive film as used in the fourth example was used. Further, as the semiconductor element 200, which is an electric circuit component, the same one as used in the fourth embodiment was used, and as the semiconductor element 400, the same one as used in the third embodiment was used.

In addition, in the electrical connection member 6, 601 is a holding body;
2 is a conductive member, 603 is one end of the conductive member, and 604 is the other end of the conductive member.

Using the same method used in the second example, epoxy adhesive 2
05 on almost the entire surface of the semiconductor element 200, an electrical connection member] is interposed between the semiconductor element 200 and a glass plate (not shown), and the semiconductor element 200 and the electrical connection member 1 are heated under pressure. The connecting portion 202 of the semiconductor element 200 and one end 103 of the conductive member 102 of the electrical connecting member 1 were electrically connected by adhering them.

On the other hand, an electrical connection member 6 is interposed between the semiconductor element 400 and a glass plate (not shown) with a flat surface, and the connection part 402 of the semiconductor element 400 and the electrical connection member 6 are electrically conductive by applying pressure and heating. One end 603 of the member 602 was soldered.

After that, the glass plate is removed and the electrical connection member].

The anisotropic conductive film 2 is interposed between the connecting portions 202 of the semiconductor element 200 and the connecting portions 4 of the semiconductor element 400 by applying pressure and heating.
02 was electrically connected.

In this example, the semiconductor elements 200 and 400 are connected to the electrical connection members 1 and 6, respectively, and then the anisotropic conductive film 2 is interposed between the electrical connection members 1 and 6 to connect them, but all the connections are made at the same time. The connections may be made in any order.

According to this example, although the connecting portions 202 and 402 of the semiconductor elements 200 and 400 are concave, a high quality and reliable electric circuit member was obtained.

In the above-described fourth embodiment, the holders 101 and 501 of the two electrical connection members 1 and 5 are connected to each other at a part of the periphery of the anisotropic conductive member 2 to be integrated. By using this, the two electrical connection members 1 and 5 can be integrated. Similarly, in the fifth embodiment, the holders 101 and 601 of the two electrical connection members 1 and 6
The two electrical connection members 1 and 6 can be integrated by using an anisotropic conductive member 2 that is connected and integrated at a part of the periphery of the anisotropic conductive member 2.

[Effects of the Invention] According to the present invention as described above, it is possible to bond a large number of bins with a narrower pitch than the conventional bonding using an anisotropic conductive film, and also to connect with a low resistance value and with less stray capacitance. Furthermore, leakage current between wiring lines is reduced, which improves electrical characteristics. Furthermore, it becomes easy to connect electrical circuit components having concave connecting portions. Furthermore, the thermal stress is more relaxed than in conventional electrical connection member bonding, and electrical circuit components with large differences in thermal expansion coefficients can be used, which improves quality reliability and expands the range of selection.

Furthermore, according to the present invention, it is possible to perform bonding at low temperatures, which facilitates bonding, expands the selection range of electrical circuit components, and provides inexpensive electrical circuit members.

Further, according to the present invention, the connection strength can be increased, and thereby an electric circuit member having characteristics of low connection resistance can be obtained.

Further, according to the present invention, electric circuit components having concave connecting portions can be connected well.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are schematic diagrams showing a first embodiment of the present invention. FIGS. 2(a) and 2(b) are schematic diagrams showing a second embodiment of the present invention. FIGS. 3(a) and 3(b) are schematic diagrams showing a fourth embodiment of the present invention. FIGS. 4(a) and 4(b) are schematic diagrams showing a fifth embodiment of the present invention. FIGS. 5(a), fb) and FIGS. 6(a) and 6(b) are schematic diagrams showing conventional examples. FIG. 7 is a sectional view showing an example of the manufacturing process of the electrical connection member. 1.5.6+electrical connection member, 2: anisotropic conductive film, 3: electrically insulating adhesive, 4: metal particles, 101.501,601: holder, 102.502,602: conductive member, 200 .400
: Semiconductor element, 202.301,402 : Connection part, 205 : Adhesive, 300 : Circuit board. Agent Patent Attorney Minoru Yamashita Children 1 Figure 2 Figure 3 Figure 4 Figure 5 +06 107 Figure 6 Figure 7

Claims (8)

[Claims] (1) It has a holder made of an electrically insulating material and a plurality of conductive members installed in the holder in a mutually insulated state, and both ends of each of the conductive members are connected to each other on both sides of the holder. The electrically connecting member protruding from the surface of the holder and the anisotropic conductive film formed by dispersing conductive particles in an electrically insulating adhesive are the electrically conductive members of the electrically connecting member. The electrically conductive particles of the anisotropic conductive film are stacked so that an electrical connection is made between them, and one surface of this superposition is made of the electrical connection member, and the other surface is made of the electrical connection member. It is made of a directional conductive film or the electrical connection member, is disposed on one side of the stack, has at least one connection part, and in the connection part is exposed on the holder surface of the electrical connection member. an electrical circuit component that is electrically connected to at least one of the conductive members that are connected to the conductive member; Other electricity electrically connected to at least a portion of the conductive particles on the surface of the anisotropic conductive film or to at least one of the conductive members exposed on the holder surface of the electrical connection member. An electric circuit member characterized by having a circuit component. (2) The electric circuit member according to claim 1, wherein the electrical connection member and the anisotropic conductive film are stacked together to form one electrical connection member and one anisotropic conductive film. (3) The electric circuit member according to claim 1, wherein the overlapping of the electrical connection member and the anisotropic conductive film comprises one anisotropic conductive film arranged between two electrical connection members. . (4) The holders of the two electrical connection members are connected and integrated at the periphery of the overlapping part, and the two
The electric circuit member according to claim 3, wherein the two electric connection members are integrated. (5) The electric circuit member according to claim 1, wherein the anisotropic conductive film is bonded to an adjacent member. (6) At least a part of the surface of at least one electrical circuit component having a connecting portion and the holder are bonded together with an adhesive made of an electrically insulating material interposed therebetween. The electric circuit member according to claim 1. (7) The electrical circuit member according to claim 1, wherein the electrically conductive member of the electrical connection member and the connecting portion of the electrical circuit component are connected by metallization and/or alloying. (8) The electric circuit member according to claim 1, wherein the electric circuit component and the other electric circuit component are each a circuit board, a lead frame, or a semiconductor element.