JPH04107900A - Method and device for cooling electronic devices - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to, for example, a method of cooling an electronic device mounted in an electronic device and an apparatus therefor.

[Conventional technology]

In recent years, electronic devices have become increasingly smaller and have advanced information processing capabilities. Along with this, opportunities for word processors, personal computers, etc. to be used in offices and homes have increased. It is generally known that as the processing speed of an electronic device increases, the amount of heat it generates also increases. Therefore, it is necessary to suppress the temperature rise of electronic devices by dissipating the generated heat to the outside. As a customary measure for heat dissipation in this type of equipment,
An example is a fan driven by a motor. Normally, a fan is used to cause sucked air to flow out of the housing. Since the air pressure inside the housing tends to be negative relative to the outside, air naturally flows in through gaps throughout the housing. The incoming air passes between the various heat generating devices inside the housing, absorbs the heat emitted from them and cools the heat generating devices, and then flows out to the outside via the fan.

[Problem to be solved by the invention]

However, this method mainly has the following two drawbacks. One of them is that the place where the air flows is not specified (or cannot be specified), so dirt and dust in the air will be absorbed into the housing.For example, the disk insertion slot of a floppy disk If it becomes an air inlet, its delicate mechanical functions will be disrupted, leading to malfunctions and breakdowns. Furthermore,
Since voltage is applied to electronic devices, dirt and dust can adhere to electrical contacts and metal contacts inside the housing due to static electricity, changing electrical conductivity and causing malfunctions and failures. It is also possible to become. Furthermore, if foreign matter gets into the path of light in an optical disk device, it will no longer be able to perform its functions to its full potential, resulting in performance deterioration6. Accordingly, the amount of heat generated by the electronic devices inside the housing increases. The second drawback is the problem of noise caused by the increased size or high speed of the fan. Particularly when electronic devices are used in offices or homes where there is relatively little noise, the noise generated by these devices can interfere with human thinking and cause mental instability. As described above, in this type of device, it is desirable to dissipate the heat generated inside while preventing dirt and dust from entering the device, and to do so with low noise. The present invention was developed in view of the related art, and it efficiently dissipates heat generated from electronic devices, etc., and reduces the risk of equipment malfunction or breakdown by reducing the intrusion of dirt, dust, etc. into the equipment. It is an object of the present invention to provide a method and apparatus for cooling an electronic device, which enables the cooling of electronic devices to be reduced. In addition to the above-mentioned effects, another object of the present invention is to provide a cooling method for a heat generating device and a cooling device thereof, which can be realized with low noise.

Means and Effects for Solving the Problems The method for cooling a heat generating device of the present invention which solves this problem has the following configuration. That is, in a method for cooling an electronic device mounted in an electronic device, the entire surface or a part of the surface of the electronic device is covered with a cover to isolate it from the outside, and the gap between the cover and the electronic device is closed. An inlet through which a fluid flows into the space and an outlet through which the fluid flows out are provided, the fluid flows in through the inlet, and the fluid absorbing heat from the electronic device flows out through the outflow port. I tried to let them do it.

【Example】

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The heat generating device cooling device of this embodiment is mainly incorporated into electronic equipment such as computers, word processors, and audio amplifiers.
Dissipates the heat generated by the current flowing through the device and suppresses the rise in temperature of the equipment. The cooling method and cooling device of this embodiment will be explained below regarding the dissipation of heat generated from integrated circuits, but they can also be used in almost the same manner for the dissipation of heat generated from other electronic equipment and devices. The present invention is not limited thereby. FIG. 1 shows a state in which the cooling method of the embodiment is applied to an integrated circuit. The package 1 of the heat generating device contains an integrated circuit, so when a voltage is applied to it and a current is applied to it to operate it, it generates heat. If the generated heat is not dissipated, the temperature of the heat-generating device may rise, interfering with the functionality of the device and potentially causing errors or destruction. Therefore, in the embodiment, a cooling cover 2 is attached over the package 1 of the heat generating device in order to dissipate the heat generated by the package 1. The cooling cover 2 is provided with an input section 3 for a cooling fluid (liquid or gas) and an output section 4 for outputting the cooling fluid. Then, the fluid flowing in from the input section 3 absorbs the heat generated from the package 1 of the heat generating device, and causes it to flow out from the output section 4 of the moving body. This fluid is actively and continuously supplied to the input unit 3 during the period when current is flowing through the bottle 7 to the heat generating device, that is, while the electronic device including the package 7 is in a power-on state. is caused to flow in, and the fluid after absorbing heat is caused to flow out from the output section 4. Since the temperature of the part of the heat generating device close to the surface of the package 1 is high, the fluid absorbs the heat generated in the heat generating device by passing through the part as close to the surface of the heat generating device package 1 as possible, thereby dissipating the heat. can do. Therefore, the temperature rise of the package 1 of the heat generating device is suppressed, so that the heat generating device can function normally, and it is possible to protect the heat generating device from malfunction and thermal damage. Figure 2 shows an overall view of a heat generating device installed in an electronics device.In the same figure, heat is generated from the heat generating device package 1, and there is heat generated by the heat generating device cooling cover 2 shown in Figure 1. Since the cooling fluid input section 3 and the cooling fluid output section 4 are arranged,
The heat generated from the package 1 is transferred to the housing 1 by the fluid.
4 is released to the outside. Inside the housing 14 in FIG.
A drive device 9 for actively causing the fluid to flow into the cover on the package 1, and a drive device 10 for actively flowing the fluid to the outside via the output section 4 are provided. . These allow the fluid to flow in from the outside of the casing 14 and to flow out of the casing 14, so that temperature rise due to heat generation can be efficiently suppressed. Note that an input opening 11 is provided inside the housing 14 to allow fluid to flow in from the outside. Input opening 11
The fluid taken in is passed through the input transport path 5 to 1. It is sent to a drive device 9 for flowing cooling fluid. The fluid whose temperature has increased (absorbed heat) passes through the output section 4 disposed inside the housing 14, and then via the output transport path 6 of the cooling fluid by the drive device 10 for moving the fluid. and is discharged to the outside from the output opening 12. In this example, the drive device 9 for moving the fluid in the input section and the drive device 10 for moving the fluid in the output section are arranged inside the housing 14 to increase the fluid movement efficiency. If the amount of heat radiation is low, it is sufficient to arrange either the drive device 9 for moving the fluid in the input section or the drive device 10 for moving the fluid in the output section. It is also clear from Figure 2. As you can see, there is a space 100 inside the housing 14 that is closed off from the outside. Since this volume of air 100 does not move, metal contacts and mechanical drive parts are not affected by dirt or dust. Easy equipment (or parts) can be installed. In other words, connectors, metal parts of wiring, bottles of heat-generating devices, etc. are not exposed to the cooling fluid directly. Therefore, dirt and dust flowing in from the outside can be prevented from accumulating on the conductor portion, resulting in poor contact and mechanical operation errors. In particular, the possibility of foreign matter such as dust adhering to the mechanical drive unit of the disk device or the floppy disk insertion slot, causing malfunction, is reduced. Next, FIG. 3 shows a method in which when there are a plurality of heat generating devices, the fluid flowing to cool them is cooled to approximately the same degree. Also in the cooling cover 2 for the heat generating device shown in the figure, a cooling fluid is supplied from the input section 3 and the fluid is discharged from the output section 4.In the cooling cover 2 for the heat generating device, a plurality of heat generating devices Therefore, the partition 8 for the cooling fluid is arranged so that the cooling effect of the fluid is equally applied to them, and each heat generating device is cooled almost equally. FIG. 4 shows the cooling direction when a plurality of heat generating devices 24 are placed on one printed circuit board. A plurality of heat generating devices 24 are surrounded by a heat generating device cooling cover 2, and all the heat generating devices 24 are mounted on the same printed circuit board 1.
It is located on 5. The printed circuit board 15 is the connector 1
It is held by 6. The cooling fluid flows in from the input section 3, passes around the heat generating devices 24 and removes heat from them, and then flows out from the output section 4. Since the fluid flows between the printed circuit board 15 and the cooling cover 2 of the heat generating device, the fluid flowing in from the outside does not come into contact with other metal parts. In particular, the connector 16 has metal terminals in contact with each other, and current flows between them. Since these metal parts are completely isolated from the inside of the cover 2 through which the fluid flows, they are protected from adverse effects such as malfunctions due to poor contacts due to dirt and dust being introduced from the outside. In addition, in FIG. 4, a plurality of heat generating devices 24 are covered with the same cooling cover 2, but a plurality of heat generating devices 24
may be covered by a cooling cover 2 of each individual heat generating device, and the cooling method in this case will be explained with reference to FIG. In the figure, a cooling fluid flows in from an input transport path 5, and is distributed and supplied to the cooling cover 2 of each heat generating device by a cooling fluid distribution device 21. Each transportation route 1
The fluid that has passed through the cooling fluid transport path 6 and absorbed heat is collected by the cooling fluid recovery device 20 and discharged to the outside from the cooling fluid transport path 6. According to this, since the region through which the fluid flows is limited, it is possible to prevent the fluid from coming into contact with the metal contact portion. Therefore, it is possible to place a metal part or the like that is adversely affected by dirt and dust in that part, and it is possible to configure an electronic device with fewer failures and malfunctions. Fig. 6 shows a drive device for moving the fluid (numeral 9 in Fig. 2).
(or corresponding to the reference numeral 10) 22, whereby the fluid 25 can be moved via the cooling fluid transport path 23. As shown in the figure, the drive device 22 has a propeller 22b driven by a motor 22a inside, and the motor 22a is fixed to an outer frame 22e by a support plate 22c. In the embodiment, the motor 22a and the propeller 22b are molded as shown in the figure in order to prevent noise and vibration caused by their rotation. Note that the motor is designed to be linked to the power switch of the electronic device. Further, as the driving principle of this driving device 22, in addition to the illustrated motor-driven fan, an ultrasonic fluid moving device can be used. Further, an input opening 11 for inflowing the fluid or an output opening 12 is connected to this drive device 22. Since both have almost the same structure, the output opening 12 is shown in FIG. Shown below. In the figure, the cooling fluid is discharged from the output transport path 6 to the outside of the housing 14 via the output opening 12. At this time, a dust filter 18 is added. The dust filter 18 blocks dirt and dust from entering the housing 14 from the outside. Furthermore, when the fluid flows, the noise generated in the drive device 22 for moving the fluid, the transport path 23 for the cooling fluid, etc. is sound-insulated from being emitted to the outside, and the noise generated from the entire electronic equipment is sound-insulated. It also has the effect of reducing Further, the output opening 12 is opened with an inclination so that the fluid flows naturally so that the fluid does not come into direct contact with the wall surface and generate noise. The dust filter 18 can be shaped like a net or a grid. Furthermore, in order to actively suppress noise from leaking to the outside, a sound insulating wall 17 is arranged inside the cooling fluid transport path 23 as shown in FIG. The fluid flows while curved between the sound insulation walls 17, but the noise generated by the drive bag N22 etc. is reflected by the sound insulation walls 17, and the noise leaking to the outside of the housing is reduced. Furthermore, in order to actively reduce the noise leaking to the outside of the housing 14, the ninth
As shown in the figure, the sound absorbing member 19 is connected to the cooling fluid transport path 2.
It may be interposed in the middle of step 3. The sound absorbing member 19 is a sound absorbing member made of fiber, cotton, or a fibrous material.
This prevents noise generated inside the housing 14 from leaking to the outside. Another embodiment will be described with reference to FIGS. 10 and 11. As shown in FIG. 10, a fluid is caused to flow inside the cooling cover 2 of the heat generating device that covers the package 1 of the heat generating device. The fluid flowing in from the input part 3 absorbs the heat generated by the package 1 of the heat generating device and flows out from the output part 4. In this case, since the fluid does not come into contact with the bottle 7 of the heat generating device, the contact portions are extremely unlikely to be affected by dirt or dust entering from the outside, causing malfunctions or failures. FIG. 11 shows a cooling device in which a plurality of transport channels 13 for cooling fluid are arranged in a cooling cover 2 of a heat generating device. The fluid flowing from the input section 3 flows through the transport channels 13. Heat generated from the package 1 of the heat generating device is absorbed and flows out from the output section 4. In this example, the package 1 for the heat generating device and the cooling cover 2 for the heat generating device are shown as being formally separated, but in this example, the package 1 for the heat generating device and the cooling cover 2 for the heat generating device are manufactured as one body. It also includes one in which the cooling fluid transport path 13 is in the shape of a vibrator.

【Effect of the invention】

As explained above, according to the method and apparatus of the present invention, the heat generated from electronic devices, etc. is efficiently dissipated, and the intrusion of dirt, dust, etc. into the equipment is reduced, thereby preventing equipment malfunctions and breakdowns. It becomes possible to reduce the risk. Furthermore, it becomes possible to realize the effect with low noise.

[Brief explanation of drawings]

Fig. 1 is a diagram showing an example of application of the heat generating device cooling method in the embodiment, Fig. 2 is a diagram showing the overall configuration of the cooling device of the embodiment, and Figs. 3 to 5 are adaptations of other heat generating device cooling methods. Figure 6 is a diagram showing the specific configuration of the drive device in the example. Figure 7 is a diagram showing the structure of the output opening in the example. Figure 8 is a diagram showing the structure of the output opening in the example. Figure 8 is a diagram showing the structure of the output opening in the example. FIG. 9 is a diagram illustrating an example in which a sound absorbing member is provided in a fluid conveyance path, and FIGS. 10 and 11 are diagrams illustrating adaptation examples of other heat generating device cooling methods. In the figure, l...Package of heat generating device, 2... Cooling cover, 3... Input section, 4... Output section, 5...
Input transport path, 6... Output transport path, 7... Bin of heat generating device, 8... Partition, 9. 10 and 22... Drive device, 11... Input opening, 12... Output opening, 13... Transport path, 14... Housing, 15... Printed circuit board, 16... Connector, 17... Sound insulation wall, 1
8... Dust filter, 19... Sound absorbing member, 20...
- Cooling fluid recovery device, 21... Cooling fluid distribution device, 23... Transportation path, 24... Heat generating device, 25.
...It is a fluid. Agent Patent attorney Yasunori Otsuka (1 other person) -, 1L, ? ″
゛-self・- 1;-゛-diagnosis Fig. 7 Fig. 9

Claims (28)

[Claims] (1) In a method for cooling an electronic device mounted in an electronic device, the entire surface or a part of the surface of the electronic device is covered with a cover to isolate it from the outside, and the distance between the cover and the electronic device is An inlet for allowing a fluid to flow into the closed space and an outlet for letting the fluid flow out are provided, the fluid is allowed to flow through the inlet, and the fluid that has absorbed heat from the electronic device is removed from the outlet. A method for cooling an electronic device, characterized in that the cooling is caused to flow out. (2) The method for cooling an electronics device according to claim 1, wherein the electronics device includes a printed circuit board on which a plurality of electronic elements such as integrated circuit elements are mounted. (3) The electronic device according to claim 1, wherein at least one of the inlet and the outlet is provided with a fluid moving device for actively moving the fluid. Cooling method. (4) The method for cooling an electronic device according to claim 3, wherein the fluid moving device and the inlet or outlet of the cover are connected by a hollow tube to move the fluid. (5) The method for cooling an electronic device according to claim 4, characterized in that a silencing means is provided in the tube. (6) Cooling of electronic devices according to claim 5, wherein the sound damping means attenuates the sound transmitted inside the tube by arranging plates smaller than the cross section of the tube at predetermined intervals. Method. (7) The method for cooling an electronic device according to claim 6, characterized in that a reflecting plate or a sound insulating plate is used as the plate. (8) The method for cooling an electronics device according to claim 5, wherein the silencing means comprises a sound collection member disposed within the tube. (9) The method for cooling an electronics device according to claim 1, further comprising providing a partition for the flow path of the fluid in a closed space between the cover and the electronics device. (10) Cooling of an electronic device according to claim 3 or 4, characterized in that a filter through which at least the fluid can pass is provided at the fluid inlet or outlet of the fluid moving device. Method. (11) A plurality of heat generation devices are covered with covers for cooling the plurality of heat generation devices, and each cover is provided with a distribution section that distributes fluid and a collection section that collects the fluid from each cover. A method for cooling an electronic device according to claim 1. (12) The intake or outlet of the fluid transfer device is
5. The method for cooling an electronic device according to claim 3, wherein the width is widened toward the outside. (13) The method for cooling an electronic device according to claim 1, wherein the electronic device and the cover are integrated. (14) In a cooling device for an electronic device mounted in an electronic device, the entire surface or a part of the surface of the electronic device is covered with a cover to isolate it from the outside, and the gap between the cover and the electronic device is covered. An inlet for allowing a fluid to flow into the closed space and an outlet for letting the fluid flow out are provided, the fluid is allowed to flow through the inlet, and the fluid that has absorbed heat from the electronic device is removed from the outlet. A cooling device for an electronic device, characterized in that the cooling device is configured to allow water to flow out. (15) The cooling device for an electronic device according to claim 14, wherein the electronic device includes a printed circuit board on which a plurality of electronic elements such as integrated circuit elements are mounted. (16) The electronic device according to claim 14, wherein at least one of the inlet and the outlet is provided with a fluid moving device for actively moving the fluid. Cooling system. (17) The cooling device for an electronic device according to claim 16, wherein the fluid moving device and the inlet or outlet of the cover are connected by a hollow tube to move the fluid. (18) The cooling device for an electronic device according to claim 17, further comprising a silencing means provided inside the tube. (19) Cooling of electronic devices according to claim 18, wherein the sound damping means attenuates the sound transmitted inside the tube by arranging plates smaller than the cross section of the tube at predetermined intervals. Device. (20) The cooling device for an electronics device according to claim 19, wherein a reflection plate or a sound insulating plate is used as the plate. (21) The cooling device for an electronics device according to claim 18, wherein the silencing means comprises a sound collection member disposed within the tube. (22) The cooling device for an electronics device according to claim 14, wherein a partition for the flow path of the fluid is provided in a closed space between the cover and the electronics device. (23) Claim 16 or 17, characterized in that a filter through which at least the fluid can pass is provided at the fluid inlet or outlet of the fluid moving device.
A cooling device for an electronic device according to paragraph 1. (24) A plurality of heat generation devices are covered with covers for cooling the plurality of heat generation devices, and each cover is provided with a distribution section that distributes fluid and a collection section that collects the fluid from each cover. A cooling device for an electronic device according to claim 14. (25) The intake or outlet of the fluid transfer device is
18. The cooling device for an electronic device according to claim 16 or 17, characterized in that the width becomes wider toward the outside. (26) The cooling device for an electronic device according to claim 14, wherein the electronic device and the cover are integrated. (27) In a cooling device for an electronic device mounted in an electronic device, a cover that covers the surface or a part of the surface of the electronic device in a substantially airtight manner, provided that the cover has a heat absorbing material in a part thereof. an inflow means for causing the fluid taken in from the outside of the electronic device to flow into the cover through the inflow port, comprising an inflow port through which a fluid flows in and an outflow port through which a heat-absorbed fluid flows out; A cooling device for an electronic device, comprising: a discharge means for discharging the fluid that has flowed into the cover by the inflow means to the outside of the electronic device from the outlet. (28) The cooling device for an electronics device according to claim 27, wherein the electronics device includes a printed circuit board on which a plurality of electronic elements such as integrated circuit elements are mounted.