JPH04101491A - Mounting method for chip component - Google Patents
Mounting method for chip componentInfo
- Publication number
- JPH04101491A JPH04101491A JP21884790A JP21884790A JPH04101491A JP H04101491 A JPH04101491 A JP H04101491A JP 21884790 A JP21884790 A JP 21884790A JP 21884790 A JP21884790 A JP 21884790A JP H04101491 A JPH04101491 A JP H04101491A
- Authority
- JP
- Japan
- Prior art keywords
- hic
- chip
- chip components
- components
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はチップ部品（リードレス部品）をＨＩＣ（ハイ
ブリッド集積回路）基板に効率よく実装するチップ部品
の実装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip component mounting method for efficiently mounting a chip component (leadless component) on a HIC (hybrid integrated circuit) board.
電子機器回路を構成するＨ Ｉ Ｃ基板に於いて、従来
は第３図に示すように、チップ部品２をＨＩＣ基板６の
片面あるいは両面の表面上に実装を行なっていたため、
第４図に示すように、基板どうしを重ね合わせる場合に
、ある程度の隙間を有する外枠７ａ、７ｂを用いて重ね
合わせていた。Conventionally, in the HIC board constituting an electronic device circuit, the chip components 2 were mounted on one or both surfaces of the HIC board 6, as shown in FIG.
As shown in FIG. 4, when overlapping substrates, outer frames 7a and 7b having a certain amount of gap are used for overlapping.
上述した従来のＨＩＣ基板へのチップ部品の実装方法は
、チップ部品をＨＩＣ基板の片面あるいは両面の表面上
に搭載するために、基板を重ね合せる時に多くの隙間を
要するという欠点かある。The above-described conventional method for mounting chip components on a HIC board has the disadvantage that a large gap is required when the boards are stacked because the chip components are mounted on one or both surfaces of the HIC board.
本発明の目的は、上記従来の欠点を除去したＨＩＣ基板
へのチップ部品の実装方法および基板の重ね合わせ方法
を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for mounting chip components on an HIC board and a method for stacking the boards, which eliminates the above-mentioned conventional drawbacks.
本発明のチップ部品の実装方法は、チップ部品（リード
レス部品）を両面実装するＨＩＣ両面実装基板の表面お
よび裏面に前記チップ部品を挿入する複数の挿入孔を穿
設し、前記表面および裏面にそれぞれ少なくとも１個の
前記チップ部品を挿入するようにしている。The chip component mounting method of the present invention includes forming a plurality of insertion holes into the front and back surfaces of an HIC double-sided mounting board on which chip components (leadless components) are mounted on both sides, and inserting the chip components into the front and back surfaces. At least one of the chip parts is inserted into each of the parts.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の断面図、第２図は本実施例
を重ね合わせた状態を示す断面図である。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view showing the embodiment in a superimposed state.
本実施例はＨＩＣ両面実装基板１の表面および裏面にチ
ップ部品２を挿入する複数の挿入孔３を穿設し、この表
面および裏面にそれぞれ少なくとも１個のチップ部品２
を挿入するようにしたものである。In this embodiment, a plurality of insertion holes 3 into which chip components 2 are inserted are formed on the front and back surfaces of a HIC double-sided mounting board 1, and at least one chip component 2 is inserted into each of the front and back surfaces.
It is designed to insert .
即ち第１図に示すように、ＨＩＣＩＣ両面実装基板衣面
及び裏面にチップ部品２が挿入できる挿入孔３を複数個
設けである。もちろん挿入孔３にもパターンがあり、挿
入されたチップ部品の電極２ａ、２ｂとはんだ付けされ
電気的に接続される。このようにチップ部品を両面実装
した基板を重ね合わせる方法として、第２図に示すよう
に、絶縁シート４を挟んでＨＩＣ両面実装基板１を重ね
、外枠５ａ、５ｂによって固定することができ、無駄な
隙間を設ける必要がない。That is, as shown in FIG. 1, a plurality of insertion holes 3 into which chip components 2 can be inserted are provided on the upper and lower surfaces of the HICIC double-sided mounting board. Of course, the insertion hole 3 also has a pattern, and is electrically connected to the electrodes 2a and 2b of the inserted chip component by soldering. As a method for stacking boards on which chip components are mounted on both sides in this way, as shown in FIG. 2, HIC double-sided mounting boards 1 can be stacked with an insulating sheet 4 in between and fixed by outer frames 5a and 5b. There is no need to create unnecessary gaps.
〔発明の効果〕
以上説明したように本発明は、電子回路を構成するＨＩ
Ｃ基板の両面にチップ部品挿入孔を設け、チップ部品を
基板の板厚内に実装することにより、基板の間に絶縁シ
ートを介して重ねることが可能となるため、部品を効率
よく実装でき且つ製品そのものを小型化できる効果があ
る。またチップ部品が挿入孔に格納されるために、外力
による破損を受けにくいという効果かある。[Effects of the Invention] As explained above, the present invention provides an HI
By providing chip component insertion holes on both sides of the C board and mounting the chip components within the thickness of the board, it becomes possible to overlap the boards with an insulating sheet interposed between them, allowing for efficient mounting of components. This has the effect of making the product itself smaller. Furthermore, since the chip component is stored in the insertion hole, it has the effect of being less susceptible to damage due to external force.
第１図は本発明の一実施例の断面図、第２図は本実施例
を重ね合わせな状態を示す断面図、第３図は従来のチッ
プ部品の表面実装の一例を示す断面図、第４図は従来例
を重ね合わせた状態の断面図である。
１．６・・ＨＩＣ両面実装基板、２・・・チップ部品、
２ａ、２ｂ・・・チップ部品の電極、３・・・挿入孔、
４・・・絶縁シート、５ａ、５ｂ、７ａ、７ｂ、−・外
枠。FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view showing this embodiment in an overlapping state, FIG. 3 is a cross-sectional view showing an example of surface mounting of conventional chip components, and FIG. FIG. 4 is a sectional view of the conventional example in a superimposed state. 1.6...HIC double-sided mounting board, 2...chip components,
2a, 2b...electrodes of chip components, 3...insertion holes,
4... Insulating sheet, 5a, 5b, 7a, 7b, --- Outer frame.
Claims (1)
両面実装基板の表面および裏面に前記チップ部品を挿入
する複数の挿入孔を穿設し、前記表面および裏面にそれ
ぞれ少なくとも１個の前記チップ部品を挿入するように
したことを特徴とするチップ部品の実装方法。HIC with double-sided mounting of chip components (leadless components)
A chip component characterized in that a plurality of insertion holes into which the chip components are inserted are formed on the front and back surfaces of a double-sided mounting board, and at least one of the chip components is inserted into each of the front and back surfaces. How to implement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21884790A JPH04101491A (en) | 1990-08-20 | 1990-08-20 | Mounting method for chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21884790A JPH04101491A (en) | 1990-08-20 | 1990-08-20 | Mounting method for chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04101491A true JPH04101491A (en) | 1992-04-02 |
Family
ID=16726275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21884790A Pending JPH04101491A (en) | 1990-08-20 | 1990-08-20 | Mounting method for chip component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04101491A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5943213A (en) * | 1997-11-03 | 1999-08-24 | R-Amtech International, Inc. | Three-dimensional electronic module |
| WO2000002246A1 (en) * | 1998-07-07 | 2000-01-13 | R-Amtech International, Inc. | Double-sided electronic device |
| JP2008034782A (en) * | 2006-06-29 | 2008-02-14 | Kyocera Corp | Electronic component storage package and electronic device |
| US7845116B2 (en) | 2005-03-23 | 2010-12-07 | Sugatsune Kogyo Co., Ltd. | Guide apparatus for sliding door |
| JP2014175998A (en) * | 2013-03-12 | 2014-09-22 | Kyocera Crystal Device Corp | Crystal oscillator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53125307A (en) * | 1977-04-08 | 1978-11-01 | Seiji Nakazono | Method of placing caisson into water |
| JPS63147392A (en) * | 1986-12-10 | 1988-06-20 | ニツカン工業株式会社 | Mounting printed wiring board and manufacture of the same |
-
1990
- 1990-08-20 JP JP21884790A patent/JPH04101491A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53125307A (en) * | 1977-04-08 | 1978-11-01 | Seiji Nakazono | Method of placing caisson into water |
| JPS63147392A (en) * | 1986-12-10 | 1988-06-20 | ニツカン工業株式会社 | Mounting printed wiring board and manufacture of the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5943213A (en) * | 1997-11-03 | 1999-08-24 | R-Amtech International, Inc. | Three-dimensional electronic module |
| WO2000002246A1 (en) * | 1998-07-07 | 2000-01-13 | R-Amtech International, Inc. | Double-sided electronic device |
| US7845116B2 (en) | 2005-03-23 | 2010-12-07 | Sugatsune Kogyo Co., Ltd. | Guide apparatus for sliding door |
| JP2008034782A (en) * | 2006-06-29 | 2008-02-14 | Kyocera Corp | Electronic component storage package and electronic device |
| JP2014175998A (en) * | 2013-03-12 | 2014-09-22 | Kyocera Crystal Device Corp | Crystal oscillator |
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