JPH04100252A - Sample mounting mechanism of electron beam tester - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Table of Contents] Overview Industrial Application Fields Conventional Technology Means for Solving the Problems the Invention Aims to Solve Examples of Actions Embodiments Configuration Examples of Main Parts (Figure 1) etc. Configuration example (Fig. 2) Effect of the invention [Summary] Regarding the sample mounting mechanism of an electron beam tester, it is possible to easily and efficiently set integrated circuits and semiconductor chips in various forms at predetermined positions of the electron beam tester. In order to increase versatility as an electron beam tester and improve productivity, we irradiate an electron beam onto a powered sample located in a vacuum region, and collect secondary electrons emitted from the electron beam irradiation point. A sample mounting mechanism of an electron beam tester that detects and verifies the characteristics of a sample, and is provided with a plurality of probe pins whose sharpened tips are positioned corresponding to each external connection terminal of the sample. a probe card in which an electrode part connected to the probe pin is formed on the peripheral part of one side of the tip side of the probe pin; a means for mounting a sample with its external connection terminal exposed; means that can be detachably attached so as to correspond to and come into contact with each external connection terminal of the sample, and a means that is located externally and connected to the electrode section provided around the probe card when the probe card is attached. It consists of a sample fixing stand equipped with means for connecting to a power supply control section, and the sample is composed of a single semiconductor chip.

Further, it is a sample mounting mechanism of an electron beam tester that irradiates an electrically supplied sample located in a vacuum region with an electron beam, detects secondary electrons emitted from the electron beam irradiation point, and verifies the characteristics of the sample. A plurality of contact probe pins are arranged so that their movable tips correspond to each input/output terminal of the sample, and an electrode portion connected to each contact probe pin is located around one side of the sample opposite to the electron beam irradiation surface. A printed circuit board having a sample mounting means formed thereon, and a means for connecting to the electrode section provided around the printed circuit board when the printed circuit board is mounted to a power supply control section located outside. The sample is made up of a chip with a TAB terminal.

[Industrial application field]

The present invention relates to the structure of a sample mounting part of an electron beam tester, and particularly relates to a structure of a sample mounting part of an electron beam tester, and in particular to a packaged integrated circuit, a single semiconductor chip as a fabrication tool, and a TAB (Tape Automation).
The versatility of the electron beam tester is increased by configuring the sample mounting section so that integrated circuits and semiconductor chips in various forms, such as semiconductor chips with terminals (ted bonding), can be easily and efficiently set in the specified position of the electron beam tester. This article relates to a sample mounting mechanism for an electron beam tester that aims to improve productivity.

In order to perform operation tests and failure diagnosis (hereinafter referred to as verification) of packaged integrated circuits and semiconductor chips (hereinafter simply referred to as chips), a predetermined signal is sent from an external control unit to a test sample in a vacuum area. A so-called electron beam tester is usually used, which irradiates the test area with an electron beam while adding a signal, and detects the secondary electrons emitted from the test area using a detector inside the electron beam column. For each of the above-mentioned types of test samples, the sample mounting mechanism must be replaced according to the test sample, and an improvement in productivity cannot be expected, so a solution to this problem is desired.

[Conventional technology]

FIG. 3, which shows a side cross section, is a conceptual diagram for explaining an integrated circuit verification method, and FIG. 4 is a conceptual diagram for explaining an example of a chip verification method as a wafer. A test sample (hereinafter referred to as a sample) 1 is attached to an IC socket 3 mounted on a printed circuit board 2, and the area along the periphery of the back (lower surface) side of the board 2 has various terminals of the socket 3, and furthermore, Electrode portions 2a electrically connected to each input/output terminal 1a of sample 1 are arranged in alignment.

Further, the sample fixing table 5 for fixing the printed circuit board 2 is composed of a cylindrical case 6 with a bottom and a cylindrical board support stand 7 that can be inserted into the case 6 along the inner wall of the case 6.

Particularly, the board support stand 7 in this case has a flange 7a protruding inwardly formed around its upper end, and an upper surface 7b of the flange 7a is provided with the electrode portions of the printed circuit board 2.
A plurality of electrodes 7c in contact with the respective electrode portions 2a are formed insulated from the substrate support 7 at positions corresponding to the electrodes 2a, and furthermore, signal lines 8 connected to the respective electrodes 7c are connected to the bottom surface 6a of the casing 6. It is connected to a power supply control unit 10 located outside via, for example, a hermetic connector 9 that passes through it.

Therefore, the electrode part 2a of the printed circuit board 2 and the board support stand 7
When the electrodes 7C of the IC socket 3 and the input/output terminals 1a of the sample 1 and the electrodes 7c of the substrate support 7 corresponding to the terminals 1a are connected by soldering or other means, The controller 10 can be connected to the controller 10 .

Note that 11 in the figure is a main body wall that holds the casing 6 in an airtight manner at its outer periphery, and 12 is an O-ring for airtightness.

On the other hand, an O-ring 14 is attached to the lowermost surface of the electron beam lens barrel 13, which can be moved up and down by a mechanism (not shown).
By lowering the lens barrel 13, airtightness against the main body wall 11 can be maintained.

Note that an electron gun and a secondary electron detector (not shown), which are movable up and down with respect to the lens barrel 13, are mounted inside the lens barrel 13.

Therefore, after connecting the printed circuit board 2 on which the sample 1 is set to the substrate support stand 7 as described above, the electron beam column 1
3 is lowered and hermetically mounted on the main body wall 11, and the inside of the lens barrel 13 is depressurized from an exhaust port (not shown), thereby making it possible to evacuate the area up to the inside of the sample fixing stage 5 to a small extent.

Next, when the surface of the sample L is irradiated with an electron beam from above the electron beam column 13 in the direction of arrow B while a required signal is applied to the sample L from the power supply control unit 10, the irradiated point of the sample L is Since secondary electrons corresponding to the signal from the power supply control unit 10 jump out as shown by the broken line B', the secondary electrons are detected by a detector (not shown) to verify the operation of the sample 1, failure diagnosis, etc. It can be performed.

The electron beam focal position can be aligned with respect to the sample 1 by vertically moving the electron beam column, electrically correcting the focus of the electron beam, and horizontally moving the electron beam column using an X-Y stage mechanism. Therefore, the condition of the entire surface of the sample 1 can be easily known.

In FIG. 4, which shows the case where the sample to be tested is a wafer, numeral 11 indicates the main body wall, and numeral 13 indicates the electron beam column, which is the same as in FIG. 3.

Further, the sample fixing table 15 which is hermetically fixed to the main body wall 11 as in FIG. The test sample is a wafer on which multiple chip patterns are formed, so each chip is This is because it is necessary to sequentially move the wafer in the two-dimensional direction inside the sample fixing table 15 for verification.

Further, 19 represents a probe card.

In particular, the probe card 19 in this case has probe pins arranged near the inner side of the insulating substrate 19a, which is shaped like a "mouth" in plan view, so that the sharpened tips correspond to each input/output terminal of the chip to be tested. 19b are arranged in a reverse radial pattern, and electrode portions 19c that are electrically connected to each of the pins 19b are patterned at positions corresponding to the electrodes 7c of the substrate support 7 described in FIG. 3 near the periphery of one side. It is something that

Note that IO is the power supply control unit explained in FIG. 3, and 20a
is a control unit 20 that moves the table 18 in a desired direction.
This is the signal line that connects to.

Therefore, after connecting the probe card 19 to the substrate support stand 7, the necessary machining is performed on the mounting stand 17 of the table 18.
After setting the electron beam column 13 and lowering it and sealingly attaching it to the main body wall I4, the inside of the column 13 is depressurized in the same manner as described above, and the electron beam is irradiated as shown by arrow B. As explained in FIG. 4, this chip can be verified.

Note that the wafer 16 is lowered by the operation of the table 18 →
By moving and then raising, all the chips on the wafer 16 can be made to correspond to the probe pins 19b of the probe card 19.

However, as shown in FIGS. 3 and 4, there is a drawback that the large and heavy sample fixing table 15 must be replaced for each type of sample to be tested.

[Problem to be solved by the invention]

With conventional verification methods, productivity cannot be expected to improve because the large and heavy sample fixing table must be replaced together with the sample mounting section for each type of sample to be tested, and it takes man-hours to repair when a failure occurs. There was a problem.

[Means to solve the problem]

The above problem is caused by the sample mounting mechanism of an electron beam tester, which irradiates an electrically powered sample located in a vacuum region with an electron beam, detects secondary electrons emitted from the electron beam irradiation point, and verifies the characteristics of the sample. A plurality of probe pins are arranged, the sharpened tips of which are positioned corresponding to each external connection terminal of the sample, and an electrode portion connected to each probe pin is located in a peripheral portion of one side of the tip side of the probe pin. a probe card formed on the substrate, a means for mounting the sample with its external connection terminals exposed; and a means for attaching and detaching the probe card so that the tip of each probe pin corresponds to and contacts each external connection terminal of the sample. A sample fixing table comprising a means for freely attaching the probe card and a means for connecting to the electrode section provided around the probe card when the probe card is attached to a power supply control section located outside, This problem is solved by the sample mounting mechanism of the electron beam tester, where the sample is a single semiconductor chip.

Further, it is a sample mounting mechanism of an electron beam tester that irradiates an electrically supplied sample located in a vacuum region with an electron beam, detects secondary electrons emitted from the electron beam irradiation point, and verifies the characteristics of the sample. A plurality of contact probe pins are arranged so that their movable tips correspond to each input/output terminal of the sample, and an electrode portion connected to each contact probe pin is located around one side of the sample opposite to the electron beam irradiation surface. A printed circuit board having a sample mounting means formed thereon, and a means for connecting to the electrode section provided around the printed circuit board when the printed circuit board is mounted to a power supply control section located outside. This problem is solved by a sample mounting mechanism of an electron beam tester, which consists of a sample fixing table and a sample having a TAB terminal.

[For production]

The x-y-z-θ table in the sample fixing stage is necessary only when verifying the chip in the wafer state.

Therefore, in the present invention, the chip verification in the wafer state is replaced with the verification of the cut chip alone, and the chip verification is carried out in the form of a single chip, a packaged integrated circuit made up of a single chip, a semiconductor chip with a TAB terminal, etc. The sample fixing table and the sample mounting section are configured so that even objects of the above configuration can be easily and efficiently set at a predetermined position of the electron beam tester.

Therefore, it is possible to increase the versatility of the electron beam tester, and also to reduce the number of man-hours required for repair when a failure occurs, so it is possible to expect an improvement in productivity.

〔Example〕

FIG. 1 is a diagram illustrating an example of the configuration of the main parts of an apparatus according to the present invention, and FIG. 2 is a diagram showing another example of the configuration.

In the figure, the same objects as in FIGS. 3 and 4 are denoted by the same numbers.

The first example shows the case where the test sample is a single chip that has been cut.
In the figure, a test sample (chip) 32 is positioned and placed at a predetermined position on a sample mounting table 31.

The cylindrical casing 22 constituting the sample fixing table 21 that fixes the sample placing table 31 is formed near its upper opening so that the probe card 19 explained in FIG. 4 can be inserted up to the stepped portion 22a. Furthermore, each electrode portion 19c of the probe card 19 is located at a predetermined position deep inside the stepped portion 22a.
A ring-shaped insulating substrate 24 through which a contact probe pin 23 is disposed at a position corresponding to the housing 22 is fixed perpendicularly to the central axis of the housing 22 .

In this case, the insulating substrate 24 is such that when the probe card 19 is inserted as shown by arrow A up to the stepped portion 22a of the housing 22, the movable pin 23a located at the upper end of the contact probe pin 23 is inserted into the probe card 19. Contact is made by pressing each electrode portion 19c with a predetermined contact pressure.

Further, at a predetermined position inside the housing 22, there is a relay terminal plate 26 made of metal or the like, on which a terminal 26a connected to the other end of the contact probe pin 23 is fixed so as to protrude from both sides while maintaining mutual insulation. 0-ring 2 attached around it
7, the guide pins 2 are fixed to the inner wall surface of the housing 22 while maintaining airtightness, and the guide pins 26b are provided at predetermined positions on the surface (upper surface) of the relay terminal board 26.
The sample mounting table 31 has a hole 31a that fits into the sample mounting table 6b.
is now positioned.

In this case, the height of the sample mounting table 31 to the surface of the chip to be mounted is determined by placing the probe card 19 on the step of the housing 22 after placing the required test sample (chip) 32 on the sample mounting table 31. When the probe pin 1 is inserted up to the part 22a,
The tip of the tip 9b and the external connection terminal of the test sample (chip) 32 are set to be in contact with each other with a predetermined contact pressure.

Note that 25 is a ring with a claw that presses and fixes the probe card 19 inserted into the stepped portion 22a to the housing 22.

On the other hand, the lower opening of the housing 22 is provided with the relay terminal plate 26.
A terminal plate 29 is fixed to which a plug pin 28 is fixed, which is connected to a terminal 26a passing through the terminal 26a via a coaxial cord 28a.

Note that 10 is a power supply control unit connected to the signal line 30 connected to the other end of each of the plug pins 28, and 11 is the sample fixing table 2.
The main body wall holds 1 in an airtight manner with O-IJ song 2,
The electron beam column is equipped with an O-ring 14 or 13 indicated by a broken line, as in the case of FIGS. 3 and 4.

Then, the sample mounting table 31 on which the test sample 32 is mounted is set at a predetermined position on the relay terminal board 26, and the probe card 19 is inserted from the upper opening of the housing 22 up to the stepped portion 22a in the direction of arrow A. When the probe card 19 is fixed to the housing 22 with the claw ring 25, the probe pins 19b and the contact between each external connection terminal of the test sample 32 and the plug pin 28 corresponding to each terminal, that is, the power supply control unit 10, are connected. It will be connected via the probe pin 23.

Therefore, as explained in FIG. 4, the electron beam lens barrel 13 is lowered and hermetically mounted on the main body wall 11, and the pressure inside the lens barrel 13 is reduced from the exhaust port (not shown), thereby creating a vacuum at least in the area up to the relay terminal plate 26. Therefore, by irradiating the surface of the sample 32 with an electron beam from above the electron beam column I3 while applying a necessary signal to the sample 32 from the power supply control unit IO, the surface of the sample 32 can be What can be verified is as explained in FIG.

Particularly in this case, since the probe card 19 itself can be easily attached and detached, there is an advantage that when a failure occurs due to the probe card 19, repair can be easily performed.

FIG. 2, which shows another implementation configuration example, takes as an example a case where a chip with a TAB terminal is used as a test sample, and the electron beam column 13 and sample fixing table 2I are both the same as those explained in FIG. 1. It is.

Widely used as a device that can be easily automatically mounted on circuit boards, etc.
The used chip 41 with a TAB terminal, as shown in (2-1) when viewed from the back (bottom) side, consists of, for example, a single chip 42 and a flexible "mouth" made of polyimide resin or the like in plan view. The shape board has an electrode 43a connected to each output terminal near the inner side of the chip 42 at a position corresponding to each input/output terminal of the chip 42, and an input/output terminal 43b connected to the electrode 43a near the periphery. TAB (Tape Automat) with radial pattern formation
(ed bonding) terminal 43 by, for example, thermocompression bonding or the like.

In the figure, 44 indicates a jig for mounting the chip 41 with a TAB terminal, and 48 indicates the chip 4 mounted on the jig 44.
1 to the jig 44 and is shaped like a "mouth" in plan view.

In particular, the jig 44 in this case has movable pins 4 at positions corresponding to each input/output terminal 43b of the chip 41 with the TAB terminal.
An insulator 46 has a contact probe pin 45 fixed thereto with 5a facing upward, and one end is connected to each probe pin 45.
It is integrated with a printed circuit board 47 which is connected to the sample fixing table 21 and has an electrode section 47a patterned at a position corresponding to the contact probe pin 23 of the sample fixing table 21. In particular, the printed circuit board 47 is shown in FIG. It is set to the same size as the probe card 19 described above.

Therefore, the chip 41 with the TAB terminal is connected to the TAB terminal 4.
The TAB terminal 43 is placed at a corresponding position on the jig 44 so that the electrode forming surface of the contact probe pin 45 faces the contact probe pin 45, and the area of the TAB terminal 43 is pressed and fixed with the holding plate 48.
The input/output terminal 43b of the AB terminal 43 and the movable pin 45a of the contact probe pin 45 can be brought into contact, and as a result, each terminal of the test sample (chip) 42 and the contact probe pin 23 of the sample fixing table 21 can be brought into contact with each other. Furthermore, it is possible to connect with the power supply control section 10.

Therefore, the TAB terminal equipped chip 41 can be verified using the procedure explained in FIG.

Particularly in this case, since the printed circuit board 47 itself can be easily attached and detached, there is an advantage that repairs can be easily carried out in the event of a failure involving the circuit board 47.

In the case of a verification method based on such a configuration, FIGS.
As explained in the figure, there is no need to replace the sample fixing table 21 (
Since it can be used, chips of different shapes can be verified easily and efficiently.

〔Effect of the invention〕

As described above, according to the present invention, integrated circuits and semiconductor chips in the form of stacks, such as single semiconductor chips or semiconductor chips with TAB terminals, can be easily and efficiently set in a predetermined position in an electron beam tester, and repair work can be performed in the event of a failure. It is possible to provide a sample mounting mechanism for an electron beam tester that increases the versatility of the electron beam tester and improves productivity by reducing the number of samples.

[Brief explanation of the drawing]

Figure 1 is a diagram illustrating an example of the configuration of the main parts of the device according to the present invention, Figure 2 is a diagram illustrating another example of the configuration, Figure 3 is a conceptual diagram explaining an integrated circuit verification method, and Figure 4 is a wafer This is a conceptual diagram illustrating a method for verifying a chip. In the figure, 10 is the power control unit, II is the main body wall, 12, 14, 27 is the O-ring, 13 is the electron beam column, 19 is the probe card, 21 is the sample fixing table, 19b is the probe pin, 22 is the housing 22a is a stepped portion, 23 and 45 are contact probe pins, 23a and 45a are movable pins, 24 is an insulating board, 25 is a ring with a claw, 26 is a relay terminal board, 26a is a terminal, 26b is a guide pin,
28 is a plug pin, 28a is a coaxial cord, 29 is a terminal board, 30 is a signal line, 31 is a sample mounting table,
31a is a hole, 32 and 42 are test samples (chips), 41 is a chip with a TAB terminal, 43 is a TAB terminal, 43a is an electrode, 43b is an input/output terminal, 44 is a jig, 46 is an insulator, 48 is a presser The board and represent respectively. Misfire Sun Moon 1 Nii Ito Wataku Chief Vertical Pull θ A1 Payta) 1
E in the two-way fly β river] 11 Responsibility

Claims (2)

[Claims] (1) A sample mounting mechanism for an electron beam tester that irradiates an electrically supplied sample located in a vacuum region with an electron beam, detects secondary electrons emitted from the electron beam irradiation point, and verifies the characteristics of the sample. A plurality of probe pins (19b) with sharpened tips located corresponding to each external connection terminal of the sample are arranged, and an electrode part (19c) connected to each probe pin (19b) is connected to the probe pin. A probe card (19) formed on the peripheral portion of one side of the tip end side of the probe card (19b), means for mounting the sample with its external connection terminal exposed, and the probe card (19) is attached to each probe pin (19b). a means for detachably attaching the probe card so that the tip thereof corresponds to and contacts each external connection terminal of the sample; and the probe card (19).
A sample fixing stand (2) equipped with a means for connecting to the electrode part (19c) provided around the probe card (19) when the probe card (19) is attached to the power supply control part (10) located outside.
1) A sample mounting mechanism for an electron beam tester, characterized in that the sample is a single semiconductor chip. (2) A sample mounting mechanism for an electron beam tester that irradiates an electrically supplied sample located in a vacuum region with an electron beam, detects secondary electrons emitted from the electron beam irradiation point, and verifies the characteristics of the sample. A plurality of contact probe pins (45) are arranged so that the movable tips correspond to each input/output terminal of the sample, and an electrode part (4) connected to each contact probe pin (45) is arranged.
7a) is a printed circuit board (
47), and a means for connecting the electrode section (47a) provided around the printed circuit board (47) when the printed circuit board (47) is mounted to the power supply control section (10) located outside. A sample mounting mechanism for an electron beam tester, characterized in that the sample is a chip with a TAB terminal.