JPH039893A - Printed wiring board for ic card - Google Patents
Printed wiring board for ic cardInfo
- Publication number
- JPH039893A JPH039893A JP1144428A JP14442889A JPH039893A JP H039893 A JPH039893 A JP H039893A JP 1144428 A JP1144428 A JP 1144428A JP 14442889 A JP14442889 A JP 14442889A JP H039893 A JPH039893 A JP H039893A
- Authority
- JP
- Japan
- Prior art keywords
- card
- wiring board
- printed wiring
- semiconductor
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 66
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 abstract description 29
- 238000007747 plating Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 10
- 238000005530 etching Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
Landscapes
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業−ヒの利用分野）
本発明は，キャラシュカード、クレジットカード、各種
認識カード、テレフォンカード，各種メモリーカード等
のＩＣカードに内蔵されるＩＣカード用プリント配線板
に関する。Detailed Description of the Invention (Field of Application in Industry) The present invention is a printed wiring board for IC cards built into IC cards such as carash cards, credit cards, various recognition cards, telephone cards, and various memory cards. Regarding.
（従来の技術》
ＩＣカードというものは，“カード”という表現からも
理解されるように非常に薄いものである．殊に．１５０
準拠タイプのＩＣカードは、「カード厚み０．７６ｍｍ
ｆｌＯ％」という規定のために、非常に薄いものとなっ
ている。従って、このようなＩＣカードに使用されるＩ
Ｃカード用プリント配線板は、０．７６ｍｍよりさらに
薄い極薄基板となるのである。(Prior art) As can be understood from the word "card," an IC card is a very thin card.
Compliant type IC cards have a card thickness of 0.76 mm.
Due to the regulation of "flO%", it is extremely thin. Therefore, the I
The printed wiring board for the C card is an extremely thin substrate that is even thinner than 0.76 mm.
従来．ＩＣカード用プリント配線板としては、第１２図
〜第１５図に示すような構造のものが一般的であり、ま
たこのようなＩＣカード用プリント配線板（１１Ｇ）を
内蔵したＩＣカード（１）は第１１図に示すような構造
となっていた。つまり、従来のＩＣカード用プリント配
線板（１１１１）は、極Ｓ基板でありながら、曲げ応力
に対する剛性が全面にわたってほぼ均一な略平面形状の
ものとして形成されており、第１６図に示すように曲げ
応力が加わると、全体が容易に湾曲してしまうという欠
点かあった。これは半導体（２０）を搭載してＩＣカー
ド（１）に内蔵した後でも同様であり１曲げ応力がＩＣ
カード（１）に加わり、ひいては内蔵されているＩＣカ
ード用プリント配線板（１１０）に加わると、ＩＣカー
ド用プリント配線板（１１０）全体が湾曲して搭載され
た半導体（２０）にクラックが発生したり、半導体（２
０）とＩＣカード用プリント配線板（１１０）とを電気
的に接続しているワイヤ（２１）が断線したりするとい
う、非常に信頼性の乏しいものとなっていた。Conventional. A printed wiring board for an IC card generally has a structure as shown in Figs. 12 to 15, and an IC card (1) with a built-in printed wiring board for an IC card (11G) like this is commonly used. had a structure as shown in Figure 11. In other words, although the conventional IC card printed wiring board (1111) is a polar S substrate, it is formed in a substantially planar shape with almost uniform rigidity against bending stress over the entire surface, as shown in FIG. One drawback was that the entire structure easily curved when bending stress was applied. This is the same even after the semiconductor (20) is mounted and built into the IC card (1), and one bending stress is applied to the IC card (1).
When the IC card printed wiring board (110) is applied to the card (1), and by extension the built-in IC card printed wiring board (110), the entire IC card printed wiring board (110) is bent and the mounted semiconductor (20) is cracked. or semiconductors (2
The wire (21) that electrically connects the IC card printed wiring board (110) and the IC card printed wiring board (110) may be disconnected, resulting in extremely poor reliability.
特にＩＳＯ準拠タイプのＩＣカード（１）にあっては、
ＩＣカード用プリント配線板（１１０）の内蔵される位
置が第１１図に示すようにＩＣカード（１）の左よりの
ほぼ中央であり、ＩＣカード（１）の左端部に図中矢印
で示すような上下方向より曲げ応力が加わった場合には
、ＩＣカード用プリント配線板（ＮＯ）で応力集中を起
こし、ＩＣカード用プリント配線板（■０）が特に大き
く湾曲してしまうため、半導体（２０）のクラック、及
びワイヤ（２１）の断線が頻繁に発生していた。Especially for ISO compliant type IC cards (1),
As shown in Fig. 11, the built-in position of the IC card printed wiring board (110) is approximately at the center from the left of the IC card (1), and is indicated by the arrow in the figure at the left end of the IC card (1). If bending stress is applied from above and below, stress concentration will occur on the printed wiring board for IC cards (NO), causing the printed wiring board for IC cards (■0) to curve particularly significantly. Cracks in the wire (20) and breaks in the wire (21) frequently occurred.
そこで従来、ＩＣカードに曲げ応力が加わってもＩＣカ
ード用プリント配線板が湾曲することがなく、半導体の
クラック、及びワイヤの断線が発生しないようにしたＩ
Ｃカードとして、以下に示すようなものが提案されてい
る。Therefore, conventionally, even if bending stress is applied to the IC card, the IC card printed wiring board does not bend, and the semiconductor cracks and wire breakage are prevented from occurring.
The following C cards have been proposed.
■第１７図に示すようにＩＣカード用プリント配線板（
１１０）の周囲に金属製のリング（１１２）を埋め込み
、ＩＣカード用プリント配線板（１■）の周囲の剛性を
高めたもの（ＩＣカード（１）に曲げ応力が加わると、
金属製のリング（１１２）の外側の部分のみが湾曲し、
ＩＣカード用プリント配線板（１１０）を含む金属製の
リング（１１２）の内側の部分は湾曲しない）。■As shown in Figure 17, the printed wiring board for IC cards (
A metal ring (112) is embedded around the IC card (110) to increase the rigidity around the IC card printed wiring board (1) (when bending stress is applied to the IC card (1),
Only the outer part of the metal ring (112) is curved,
The inner part of the metal ring (112) containing the IC card printed wiring board (110) is not curved).
■ＩＣカード用プリント配線板の基材として金属板を使
用し、ＩＣカード用プリント配線板自体の剛性を高めた
もの（曲げ応力が加わると、ＩＣカード用プリント配線
板以外の部分が湾曲し、ＩＣカード用プリント配線板は
湾曲しない）、■ＩＣカード用プリント配線板以外の部
分にスリット等を設けて剛性を低くしたもの（曲げ応力
が加わると、剛性の低い部分のみが湾曲し、ＩＣカード
用プリント配線板は湾曲しない）、■ＩＣカードの裏面
に金属板を貼り付け、ＩＣカード全体の剛性を高めたも
の（曲げ応力が少々加わっても、ＩＣカード全体が湾曲
しない）。- A metal plate is used as the base material of the IC card printed wiring board, and the rigidity of the IC card printed wiring board itself is increased (when bending stress is applied, parts other than the IC card printed wiring board will curve, (The printed wiring board for IC cards does not bend), ■The printed wiring board for IC cards has slits etc. in the parts other than the printed wiring board for lower rigidity (When bending stress is applied, only the parts with low rigidity bend, and the IC card (The printed wiring board for the IC card does not bend), ■ A metal plate is attached to the back of the IC card to increase the rigidity of the entire IC card (the entire IC card does not bend even if a small amount of bending stress is applied).
（発明が解決しようとする５１ｍ）
しかしながら、前記■〜＠のＩＣカードは、以下に示す
ような欠点を有するものてあった。(51m to be Solved by the Invention) However, the above-mentioned IC cards ① to ＠ had the following drawbacks.
■のＩＣカード（１）にあっては、非常に薄いＩＣカー
ド（１）に、金属製のリング（，１１２）を抜は外れる
ことがないように埋め込むのは非常に困難であり、コス
ト高となる欠点を有していた。In the IC card (1) of (1), it is very difficult to embed the metal ring (112) in the very thin IC card (1) so that it will not come off, and the cost is high. It had the following drawbacks.
■のＩＣカードにあっては、基材である金属板への回路
形Ｉ＆等が困難であり、コスト高となる欠点を有してい
た。The IC card (2) had the drawback that it was difficult to attach the circuit type I& to the metal plate as the base material, resulting in high cost.
■のＩＣカードにあっては、ＩＣカード用プリント配線
板以外の部分にスリッ１−等を設けて剛性を低くするた
めの加工が非常に困難であるばかりか、加工を施した部
分と施さない部分とにさほど剛性の差ができず、思った
ほど効果が得られないという欠点を有していたゆ
■のＩＣカードにあっては、金属板を貼り付ける分だけ
厚くなってしまうため、ＩＣカードをさらに薄くシなけ
ればならないばかりか、コスト高となる欠点を有してい
た。In the case of the IC card mentioned above, it is not only extremely difficult to process the parts other than the printed wiring board for the IC card to lower the rigidity by providing slits etc., but also it is difficult to process the parts that have been processed and the parts that have not been processed. The IC card of 2 had the disadvantage that there was not much difference in rigidity between the parts and the effect was not as expected. Not only does this require the card to be made even thinner, but it also has the drawback of increasing costs.
また、半導体のクラック及びワイヤの断線を防止するに
は半導体搭載部が湾曲しないようにすればよいのである
か、■〜＠のＩＣカードは、いずれも半導体搭載部のみ
でなく、ＩＣカード用プリント配線板全体或いはＩＣカ
ード全体の剛性な高めるようになつているため、半導体
のクラック。Also, in order to prevent semiconductor cracks and wire breaks, is it sufficient to prevent the semiconductor mounting part from curving? Semiconductor cracks occur due to increased rigidity of the entire wiring board or IC card.
及びワイヤの断線を効率良く防止するものではなかつた
。Also, it did not effectively prevent wire breakage.
第１請求項及び第２諸求項記載の発明は以上のような実
状に鑑みてなされたものであり、その目的は、ＩＣカー
ドに内蔵された後、このＩＣカードに曲げ応力が加わっ
ても、搭載した半導体にクラックが発生したり、ワイヤ
が断線することがない、信頼性の高いＩＣカード用プリ
ント配線板を簡単な構成により安価に提供することであ
る７（課題を解決するための手段）
以上のような課題を解決するために、第１請求項記藏の
発明の採った手段は、第１図〜第１Ｏ図に示すように。The invention described in the first claim and the second claims has been made in view of the above-mentioned circumstances, and its purpose is to prevent bending stress from being applied to the IC card after it is incorporated into the IC card. The purpose of the present invention is to provide a highly reliable printed wiring board for IC cards with a simple structure and at a low cost, without causing cracks in the mounted semiconductors or disconnection of wires7 (Means for solving the problem) ) In order to solve the above-mentioned problems, the means taken by the invention of the first claim are as shown in FIGS. 1 to 1O.
ｒ半導体（２０）が搭載され、ＩＣカード（１）に内蔵
されるＩＣカード用プリント配線板であって、半導体搭
載部（１１）の少なくとも両側部に、補強用の桟（１２
）を設けたことを特徴とするｔＣカード川用リント配線
＆（１０）１
である。r A printed wiring board for an IC card on which a semiconductor (20) is mounted and built into an IC card (1), which has reinforcing crosspieces (12) on at least both sides of the semiconductor mounting part (11).
) is the lint wiring for tC card river &(10)1.
すなわち、第１請求項記載の発明に係るＩＣカード用プ
リント配線板（１０）は、半導体搭載部（１１）の少な
くとも両側部に、半導体搭載部（ｌりの側辺に沿って上
下方向に延びる補強用の桟（１２）を設けることによっ
て、ＩＳＯ準拠タイプのＩＣカード（１）に内蔵した場
合等に特に問題となる、上下方向より加わる曲げ応力に
対する半導体搭載部（＋１）のみの剛性を高めたもので
ある。なお、半導体搭載部（１１）の両側部に加えて半
導体搭載部（１１）の上下部に、半導体搭載部の上底辺
に沿つて左右方向に延びる補強用の桟（１２）を設ける
ことによって、上下方向だけでなく左右方向より加わる
曲げ応力に対しても半導体搭載部（１１）の剛性を高め
るようにしてもよく、また半導体搭載部（１１）の両側
部に設ける補強用の桟（１２）と上下部に設ける補強用
の桟（１２）とを連結して枠体（１３）とし、あらゆる
方向より加わる曲げ応力に対しても半導体搭載部（１１
）の剛性を高めるようにしてもよい。That is, the printed wiring board (10) for an IC card according to the invention as set forth in claim 1 has a structure that extends in the vertical direction along the sides of the semiconductor mounting part (11) at least on both sides of the semiconductor mounting part (11). By providing the reinforcing crosspiece (12), the rigidity of only the semiconductor mounting part (+1) is increased against bending stress applied from the vertical direction, which is a problem especially when built into an ISO-compliant type IC card (1). In addition to the both sides of the semiconductor mounting section (11), reinforcing bars (12) are provided at the top and bottom of the semiconductor mounting section (11), extending in the left-right direction along the upper base of the semiconductor mounting section. The rigidity of the semiconductor mounting portion (11) may be increased by providing reinforcements on both sides of the semiconductor mounting portion (11) against bending stress applied not only from the vertical direction but also from the left and right directions. The crosspiece (12) and reinforcing crosspieces (12) provided at the upper and lower parts are connected to form a frame (13), and the semiconductor mounting portion (11) is resistant to bending stress applied from all directions.
) may be increased in rigidity.
また、特に第２請求項記載の発明の採った手段は、
ｒｉｉｉ記補強用の桟（１２）を金属により形成すると
ともに、補強用の桟（１２）の表面を絶縁層（１３）で
覆ったことを特徴とする特許請求の範囲第１項記載のＩ
Ｃカード用プリント配線板（１０）Ｊである。すなわち
、第２請求項記載の発明に係るＩＣカード用プリント配
線板（１０）は、補強用の桟（１２）をめっき法或いは
エツチング法等によって剛性の高い金属で形成すること
により、半導体搭載部（１１）の剛性をより効率良く高
めたものである。Further, in particular, the means taken by the invention described in claim 2 is that the reinforcing crosspiece (12) as described in (riii) is formed of metal, and the surface of the reinforcing crosspiece (12) is covered with an insulating layer (13). I according to claim 1, characterized in that
This is a printed wiring board (10) J for C card. That is, in the IC card printed wiring board (10) according to the second claim, the reinforcing crosspiece (12) is formed of a highly rigid metal by plating or etching, so that the semiconductor mounting portion is This is a more efficient way to increase the rigidity of (11).
また、補強用の桟（１２）は半導体搭載部（１１）に突
出するものであって、半導体（２０）とＩＣカード用プ
リント配線板（ｌＯ）とを電気的に接続しているワイヤ
（２１）が非常に接触し易くなっており、補強用の桟（
１２）を金属で形成することにより、ワイヤ（２１）が
接触した場合に電気的に支障を来す虞れがあるが、金属
からなる補強用の桟（１２）の表面を絶縁層（１３）で
覆ったことにより、ワイヤ（２１）が接触しても電気的
に支障を来さないようにしたものである。Further, the reinforcing crosspiece (12) protrudes into the semiconductor mounting portion (11), and the wire (21) electrically connects the semiconductor (20) and the IC card printed wiring board (lO). ) is very easy to contact, and the reinforcing crosspiece (
12) is made of metal, there is a risk of electrical problems if the wire (21) comes into contact with it. This prevents any electrical problems from occurring even if the wire (21) comes into contact with the wire (21).
（発明の作用）
第１諸求項記藏の発明か１述のような手段を採ることに
より、以下に示すような作用がある。(Actions of the invention) By adopting the invention as described in the first claims or the means described in 1, the following effects can be obtained.
半導体搭載部（１１）の少なくとも両側部に、補強用の
桟（Ｉ２）を設けたことにより、少なくとも上下方向よ
り加わる曲げ応力に対する半導体搭載部（ｌ １．）の
剛性が高められる。従って、ＩＣカード（１）に内蔵さ
れた後、このＩＣカード（１）に上下方向より曲げ応力
が加わ９ても、第１Ｏ図に示すように補強用の桟（１２
）に挟まれた半導体搭載部（ｌｌ）はほとんど湾曲する
ことがなく１曲げ応力は半導体搭載部（１１）以外の剛
性の低い部分が湾曲することにより吸収される。また、
半導体搭載部（，１１）の両側部に加えて半導体搭載部
（１１）の上下部に、半導体搭載部の上底辺に沿って左
右方向に延びる補強用の桟（１２）を設けることにより
、上下方向及び左右方向より加わる曲げ応力に対する半
導体搭載部（ＩＩ）の剛性が高められ、さらに半導体Ｍ
Ｒ部Ｈ）の両側部に設ける補強用の桟（１２）と」：下
部に設ける補強用の桟（１２）とを連結して枠体（１３
）とすることにより、あらゆる方向より加わる曲げ応力
に対する半導体搭載部（１１）の剛性が高められる。By providing reinforcing crosspieces (I2) on at least both sides of the semiconductor mounting section (11), the rigidity of the semiconductor mounting section (l1.) against bending stress applied from at least the vertical direction is increased. Therefore, even if bending stress is applied to the IC card (1) from above and below after it is incorporated into the IC card (1), the reinforcing crosspiece (12) shown in FIG.
The semiconductor mounting portion (ll) sandwiched between the semiconductor mounting portions (11) hardly bends, and one bending stress is absorbed by the bending of the portions with low rigidity other than the semiconductor mounting portion (11). Also,
In addition to both sides of the semiconductor mounting section (11), reinforcing bars (12) extending in the left-right direction along the upper base of the semiconductor mounting section (11) are provided at the top and bottom of the semiconductor mounting section (11). The rigidity of the semiconductor mounting portion (II) against bending stress applied from the direction and the left and right directions is increased, and the semiconductor M
The reinforcing bars (12) provided on both sides of the R part H) and the reinforcing bars (12) provided at the bottom are connected to form the frame (13).
), the rigidity of the semiconductor mounting portion (11) against bending stress applied from all directions is increased.
また、特に第２請求項記載の発明が上述のような手段を
採ることにより、以下に示すような作用がある。Further, especially by adopting the above-mentioned means, the invention as set forth in claim 2 has the following effects.
補強用の桟（１２）を金属により形成することにより、
半導体搭載部（１１）の剛性がより効率良く高められる
。また、補強用の桟（１２）を金属によって形成するこ
とにより、めっき法或いはエツチング法等によって補強
用の桟（１２）を容易に形成することができるようにな
っている。さらに、補強用の桟（１２）の表面を絶縁層
（１３）で司ったことにより、金属からなる補強用の桟
（１２）に、半導体（２０）とＩＣカード用プリント配
線板（１０）とを電気的に接続しているワイヤ（２１）
が接触しても電気的に支障を来さないようになっている
。By forming the reinforcing crosspiece (12) from metal,
The rigidity of the semiconductor mounting portion (11) can be increased more efficiently. Further, by forming the reinforcing bar (12) from metal, the reinforcing bar (12) can be easily formed by a plating method, an etching method, or the like. Furthermore, by controlling the surface of the reinforcing crosspiece (12) with an insulating layer (13), the semiconductor (20) and the IC card printed wiring board (10) can be attached to the reinforcing crosspiece (12) made of metal. The wire (21) electrically connecting the
It is designed so that it will not cause any electrical problems even if it comes into contact with it.
（実施例）
１ｉ貫」
０．１３ｍｍ厚さ（以下、ｍｍ厚さをｔと略す）の片面
０．０１８を銅箔（１５）・片面接着剤付ガラスエポキ
シ基板（１５）に金型を用いた打ち抜き加工により貫通
孔（１７）及びスルーホール用の貫通孔を形成し、０．
０７０ｔの電解銅箔０５）を接着剤面に熱圧着プレスに
より接着し、接着剤を完全硬化させた。(Example) One side of 1i-thickness 0.13 mm thick (hereinafter, mm thickness is abbreviated as t) was made using a mold on copper foil (15) and glass epoxy board with adhesive on one side (15). A through hole (17) and a through hole for a through hole were formed by punching.
070 t of electrolytic copper foil 05) was adhered to the adhesive surface using a thermocompression press, and the adhesive was completely cured.
この両面の銅箔（１５）に対してレジスト形成及びエツ
チングを施し、レジストを剥離後、部分的なメツキが可
能なスパージャ−メツキ装置を用いて半導体搭載部（１
１）の両側部（両側部及び上下部、周囲）に硫酸銅メツ
キ液にて１００Ａ／ｄｒｎ’て約３分間メツキを施すこ
とにより、半導体搭載部（ｌｌ）より約１１０ｇｍ突出
した補強用の桟（１２）（補強用の枠（１４））を形成
した。A resist is formed and etched on the copper foil (15) on both sides, and after the resist is peeled off, a sparger plating device capable of partial plating is used to form the semiconductor mounting portion (15).
By plating both sides (both sides, top and bottom, and surrounding areas) of 1) with a copper sulfate plating solution at 100A/drn' for about 3 minutes, a reinforcing crosspiece protruding by about 110g from the semiconductor mounting area (ll) is formed. (12) (Reinforcing frame (14)) was formed.
最後に、電解ニッケルメッキ３ｐ−ＩＴＳ、電解純金メ
ツキ０．３ｐｍを施すことにより、第８図に示すような
ＩＣカード用プリント配線板（１０）を得た。Finally, electrolytic nickel plating of 3 p-ITS and electrolytic pure gold plating of 0.3 pm were applied to obtain an IC card printed wiring board (10) as shown in FIG.
実施例２
０．１ｓｔ厚さの両面０．０１８を銅箔（ＩＳ）性基板
（１５）にドリリングによりスルホール用の貫通孔を形
成し、この貫通孔に無電解銅メツキを施すことによりス
ルーホール（１８）を形成した。また、テンティング法
により両面に導体パターンを形成した。Example 2 A through hole for a through hole is formed by drilling a copper foil (IS) substrate (15) with a thickness of 0.018 mm on both sides of 0.1st, and electroless copper plating is applied to this through hole to form a through hole. (18) was formed. Further, conductive patterns were formed on both sides by a tenting method.
その後、ポンディングサイドにメツキマスクを４枚重ね
てラミネートを施した。After that, I layered 4 sheets of Metsuki masks on the ponding side and laminated them.
その後、半導体搭載部（１１）の両側部（両側部及び上
下部１周囲）に補強用の桟（１２） （補強用の枠（１
４））を形成するのに必要なマスクを施し、露光機にて
３００ ｍ Ｊ ／ ｃ ｒｎ’で露光した後、現像し
て被メツキ部を露出させた。この被メウキ部に必要な前
処理を行なった後、硫酸銅メツキにて４Ａ／ｄｒｎ’で
約２時間メツキを施すことにより。After that, reinforcing bars (12) (reinforcing frames (1
4) A mask necessary to form) was applied, and after exposure at 300 mJ/crn' using an exposure machine, development was performed to expose the part to be plated. After carrying out the necessary pretreatment on the part to be coated, plating was performed using copper sulfate plating at 4A/drn' for about 2 hours.
半導体搭載部（１１）より約１００ｇｍ突出した補強用
の桟（１２） （補強用の枠（１４）’）を形成した。A reinforcing crosspiece (12) (reinforcing frame (14)') protruding by about 100 gm from the semiconductor mounting portion (11) was formed.
この補強用の桟（１２） （補強用の枠（１４））の表
面を絶縁性の樹脂で覆い、絶縁層（１３）を形成した。The surface of this reinforcing crosspiece (12) (reinforcing frame (14)) was covered with an insulating resin to form an insulating layer (13).
最後に、電解ニッケルメッキ３μｍ、電解純金メツキ０
．３ｐｍを施すことにより、第８図に示すようなＩＣカ
ード用プリント配線板（１０）を得た。Finally, electrolytic nickel plating 3 μm, electrolytic pure gold plating 0
．． By applying 3 pm, a printed wiring board (10) for IC cards as shown in FIG. 8 was obtained.
実施例３
０、！を厚さの片面０．０１８を銅箔付基板（１６）の
銅箔（１５）の付いていない面に接着剤シートを介して
１２０＃Ｌｍ厚さの銅プレート（１９）を熱圧着プレス
により接着し、接着剤を完全硬化させた。Example 3 0,! A copper plate (19) with a thickness of 120#Lm is attached to the surface of the substrate (16) with a copper foil (16) with a thickness of 0.018 mm on one side without the copper foil (15) using a thermocompression press. Glued and allowed the adhesive to completely cure.
その後、ドリリングによりスルーホール用の貫通孔を形
成し、この貫通孔に無電解銅メツキを施すことによりス
ルーホール（１８）を形成した。Thereafter, a through hole for a through hole was formed by drilling, and a through hole (18) was formed by applying electroless copper plating to this through hole.
その後１両面にドライフィルムを用いてラミネートを施
し、銅プレート（１９）面に補強用の桟（１２） （補
強用の枠（１４））に対応する形状にトライフィルムが
残るよう、不要なトライフィルムを取り除き、塩化鋼に
よりその他の部分が０．０１８ｔになるまでハーフエツ
チングを施した。この補強用の桟（１２） （補強用の
枠（１４））の表面を絶縁性の樹脂で覆い、絶縁層（１
３）を形成した。After that, laminate one side using dry film, and remove unnecessary try film so that it remains on the copper plate (19) side in a shape corresponding to the reinforcing crosspiece (12) (reinforcing frame (14)). The film was removed, and the remaining portions were half-etched with chloride steel until the thickness was 0.018t. The surface of this reinforcing crosspiece (12) (reinforcing frame (14)) is covered with an insulating resin, and the insulating layer (1
3) was formed.
その後、トライフィルムを除去し、液体レジストを塗布
して露光、現像した後、エツチングを施してレジストを
取り除き、導体パターンを形成した。Thereafter, the try film was removed, a liquid resist was applied, exposed and developed, and then etched to remove the resist to form a conductor pattern.
最後に、電解ニッケルメッキ３ｇｍ、電解純金メツキ０
．３ｐｍを施すことに、より、第８図に示すようなＩＣ
カード用プリント配線板（１０）を得た。Finally, electrolytic nickel plating 3 gm, electrolytic pure gold plating 0
．． By applying 3pm, an IC as shown in FIG.
A printed wiring board for cards (10) was obtained.
なお、第１請求項及び第２請求項記載の発明に係るＩＣ
カード用プリント配線板（１０）は、上記実施例１〜３
のいずれの方法によっても製造することができ、その製
造方法は特に限定されない、また基材及びパターン等の
材質も特に限定されない。Note that the IC according to the invention described in the first claim and the second claim
The printed wiring board (10) for cards is the one of Examples 1 to 3 above.
The manufacturing method is not particularly limited, and the materials of the base material, pattern, etc. are not particularly limited either.
（発明の効果）
以りのように第１請求項記載の発明に係るＩＣカード用
プリント配線板にあっては、ＩＳＯ準拠タイプのＩＣカ
ードに内蔵した場合等に特に問題となる。上下方向より
加、ねる曲げ応力に対する半導体搭載部の剛性を効率良
く高めることかでき。(Effects of the Invention) As described above, the printed wiring board for an IC card according to the invention described in claim 1 poses a problem particularly when it is built into an IC card of an ISO compliant type. It is possible to efficiently increase the rigidity of the semiconductor mounting part against bending stress applied from the vertical direction.
ＩＣカードに内蔵された後、このＩＣカードに上下方向
より曲げ応力が加わっても、補強用の桟に挟まれた半導
体搭載部はほとんど湾曲することがなく、曲げ応力は半
導体搭載部以外の剛性の低い部分が湾曲することにより
吸収されるようになっている。従つて、ＩＣカードに上
下方向より曲げ応力が加わっても、搭載した半導体にク
ラックが発生することがない、信頼性の高いＩＣカード
用プリント配線板とすることができる。また、半導体と
ＩＣカード用プリント配線板とを電気的に接続している
ワイヤは、一端が半導体に、もう一端が半導体搭載部近
傍のＩＣカード用プリント配線板に接続されるのが一般
的であり、半導体搭載部の剛性が高められることにより
、ワイヤが断線することがない信頼性の高いＩＣカード
用プリント配線板とすることができる。Even if bending stress is applied to the IC card from above and below after it is built into an IC card, the semiconductor mounting part sandwiched between reinforcing bars will hardly bend, and the bending stress will be absorbed by the rigidity of the parts other than the semiconductor mounting part. The lower part of the material is curved so that it can be absorbed. Therefore, even if bending stress is applied to the IC card from above and below, it is possible to obtain a highly reliable printed wiring board for an IC card that does not cause cracks in the mounted semiconductor. Additionally, the wire that electrically connects the semiconductor and the IC card printed wiring board is generally connected at one end to the semiconductor and the other end to the IC card printed wiring board near the semiconductor mounting area. By increasing the rigidity of the semiconductor mounting portion, it is possible to provide a highly reliable printed wiring board for IC cards in which wires do not break.
また、半導体搭載部の両側部に加えて半導体搭載部の上
下部に、半導体搭載部の上底辺に沿って左右方向に延び
る補強用の桟を設けることにより、上下方向及び左右方
向より加わる曲げ応力に対する半導体搭載部の剛性を高
めることができ、さらに半導体搭載部の両側部に設ける
補強用の桟と上下部に設ける補強用の桟とを連結して枠
体とすることにより、あらゆる方向より加わる曲げ応力
に対する半導体ｇ藏部の剛性を高めることができる。In addition, by providing reinforcing bars extending in the left-right direction along the upper base of the semiconductor mounting section at the top and bottom of the semiconductor mounting section in addition to both sides of the semiconductor mounting section, bending stress applied from the vertical and horizontal directions can be applied. It is possible to increase the rigidity of the semiconductor mounting section, and by connecting the reinforcing bars provided on both sides of the semiconductor mounting section and the reinforcing bars provided at the top and bottom to form a frame, it is possible to increase the rigidity of the semiconductor mounting section. The rigidity of the semiconductor grate against bending stress can be increased.
さらに、第２請求項記載の発明に係るＩＣカード用プリ
ント配線板にあっては、補強用の桟を金属により形成す
ることによって、半導体搭載部の剛性をより効率良く高
めることができる。また、補強用の桟を金属によって形
成することにより、めっき法或いはエツチング法等によ
って補強用の桟を容易に形成することができ、ＩＣカー
ド用プリント配線板をより安価に提供することができる
。さらに、補強用の桟の表面を絶縁層で覆ったことによ
り、金属からなる補強用の桟に、半導体とＩＣカード用
プリント配線板とを電気的に接続しているワイヤが接触
しても電気的に支障を来さないようにすることができる
。Further, in the IC card printed wiring board according to the second aspect of the present invention, by forming the reinforcing crosspieces from metal, the rigidity of the semiconductor mounting portion can be more efficiently increased. Further, by forming the reinforcing crosspiece from metal, the reinforcing crosspiece can be easily formed by a plating method, an etching method, or the like, and a printed wiring board for an IC card can be provided at a lower cost. Furthermore, by covering the surface of the reinforcing crosspiece with an insulating layer, even if the wire that electrically connects the semiconductor and the IC card printed wiring board comes into contact with the metal reinforcing crosspiece, there will be no electricity. This can be done in such a way that it does not cause any hindrance.
第１図は第１請求項及び第２請求項記載の発明に係るＩ
Ｃカード用プリト配線板を示す斜視図、第２図は第１図
のＩＣカード用ブリト配線板を示す平面図、第３図は第
１請求項及び第２請求項記載の発明に係る別のＩＣカー
ド用ブリト配線板を示す斜視図、第４図は第３図のＩＣ
カード用プリト配線板を示す平面図、第５図は第１請求
項及び第２請求項記載の発明に係るさらに別のｔＣカー
ド用ブリト配線板を示す斜視図、第６図は第５図のＩＣ
カード用ブリト配線板を示す平面図、第７図〜第９図は
第１ｇ＃求項及び第２請求項記藏の発明に係るＩＣカー
ド用プリト配線板を示す断面図、第１０図は第１請求項
及び＄２請求項記載の発す１に係るＩＣカード用プリト
配線板に曲げ応力を加えた状態を示す側面図、９１３１
１図はＩＣカードを示す斜視図、第１２図はを来のＩＣ
カード用プリト配線板を示す平面図、第１コ図〜第１５
図は従来のＩＣカード用プリト配線板を示す断面図、第
１６図は従来のＩＣカード用プリント配線板に曲げ応力
を加えた状態を示す側面図、第１７図は従来のＩＣカー
ドを示す斜視図である。
符号の説明
ｔｏ−ｉ ｃカード用プリント配線板、ｌ］−・・半導
体搭載部、１２・・・補強用の桟、１３−・・絶縁層、
１−ＩＣカード。
以 上FIG. 1 shows I according to the invention described in the first claim and the second claim.
FIG. 2 is a perspective view showing a printed circuit board for a C card, FIG. 2 is a plan view showing the printed wiring board for an IC card shown in FIG. 1, and FIG. A perspective view showing the Brito wiring board for IC cards, Figure 4 is the IC of Figure 3.
FIG. 5 is a plan view showing a printed wiring board for a card, FIG. IC
7 to 9 are cross-sectional views showing the printed circuit board for IC cards according to the inventions of the first and second claims. FIG. Side view showing a state where bending stress is applied to the IC card printed wiring board according to Claim 1 of Claim 1 and Claim 2, 9131
Figure 1 is a perspective view of the IC card, Figure 12 is the next IC card.
Plan views showing printed wiring boards for cards, Figures 1 to 15
The figure is a sectional view showing a conventional printed wiring board for IC cards, Fig. 16 is a side view showing a state in which bending stress is applied to the conventional printed wiring board for IC cards, and Fig. 17 is a perspective view showing a conventional IC card. It is a diagram. Explanation of symbols TO-IC card printed wiring board, l]--Semiconductor mounting section, 12--Reinforcing crosspiece, 13--Insulating layer,
1-IC card. that's all
Claims (1)
カード用プリント配線板であって， 半導体搭載部の少なくとも両側部に、補強用の桟を設け
たことを特徴とするＩＣカード用プリント配線板。 ２）．前記補強用の桟を金属により形成するとともに、
補強用の桟の表面を絶縁層で覆ったことを特徴とする第
１請求項記載のＩＣカード用プリント配線板。[Claims] 1). An IC equipped with a semiconductor and built into an IC card
1. A printed wiring board for IC cards, characterized in that reinforcing bars are provided on at least both sides of a semiconductor mounting section. 2). The reinforcing crosspiece is formed of metal, and
2. The printed wiring board for an IC card according to claim 1, wherein the surface of the reinforcing crosspiece is covered with an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1144428A JPH039893A (en) | 1989-06-07 | 1989-06-07 | Printed wiring board for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1144428A JPH039893A (en) | 1989-06-07 | 1989-06-07 | Printed wiring board for ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH039893A true JPH039893A (en) | 1991-01-17 |
Family
ID=15361966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1144428A Pending JPH039893A (en) | 1989-06-07 | 1989-06-07 | Printed wiring board for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2684235A1 (en) * | 1991-11-25 | 1993-05-28 | Gemplus Card Int | INTEGRATED CIRCUIT CARD COMPRISING MEANS OF PROTECTING THE INTEGRATED CIRCUIT. |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60209882A (en) * | 1984-04-02 | 1985-10-22 | Toshiba Corp | Ic card |
| JPS6480596A (en) * | 1987-09-24 | 1989-03-27 | Sumitomo Metal Ind | Vessel for incorporating ic of ic card |
| JPH01275197A (en) * | 1988-04-28 | 1989-11-02 | Asahi Chem Ind Co Ltd | Ic card and its manufacture |
| JPH01310994A (en) * | 1988-06-10 | 1989-12-15 | Citizen Watch Co Ltd | Ic card |
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1989
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60209882A (en) * | 1984-04-02 | 1985-10-22 | Toshiba Corp | Ic card |
| JPS6480596A (en) * | 1987-09-24 | 1989-03-27 | Sumitomo Metal Ind | Vessel for incorporating ic of ic card |
| JPH01275197A (en) * | 1988-04-28 | 1989-11-02 | Asahi Chem Ind Co Ltd | Ic card and its manufacture |
| JPH01310994A (en) * | 1988-06-10 | 1989-12-15 | Citizen Watch Co Ltd | Ic card |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2684235A1 (en) * | 1991-11-25 | 1993-05-28 | Gemplus Card Int | INTEGRATED CIRCUIT CARD COMPRISING MEANS OF PROTECTING THE INTEGRATED CIRCUIT. |
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