JPH0398271A - Connector material - Google Patents
Connector materialInfo
- Publication number
- JPH0398271A JPH0398271A JP23540589A JP23540589A JPH0398271A JP H0398271 A JPH0398271 A JP H0398271A JP 23540589 A JP23540589 A JP 23540589A JP 23540589 A JP23540589 A JP 23540589A JP H0398271 A JPH0398271 A JP H0398271A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- contact
- alloy
- reflow treatment
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 24
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 229910020816 Sn Pb Inorganic materials 0.000 claims abstract description 12
- 229910020922 Sn-Pb Inorganic materials 0.000 claims abstract description 12
- 229910008783 Sn—Pb Inorganic materials 0.000 claims abstract description 12
- 229910052718 tin Inorganic materials 0.000 claims abstract description 12
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 abstract description 29
- 229910001369 Brass Inorganic materials 0.000 abstract description 4
- 239000010951 brass Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 229910000906 Bronze Inorganic materials 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010974 bronze Substances 0.000 abstract description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011574 phosphorus Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910000978 Pb alloy Inorganic materials 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気、電子機器部品に使用されるコネクタ材料
、特にピン材として優れたコネクタ材料に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connector material used in electrical and electronic equipment parts, and particularly to a connector material excellent as a pin material.
従来より、導電性およびはんだ付け性の良さから、金、
錫合金など各種めっき付き銅合金線材料が電気、電子機
器部品のコネクタ材料として使用されている（特開昭６
１−２３１１９５号）。Traditionally, gold, gold, and
Various plated copper alloy wire materials such as tin alloys are used as connector materials for electrical and electronic equipment parts (Japanese Patent Laid-Open No. 6
1-231195).
一方、電気、電子機器部品の高密度化、ならびに品質の
向上の点から、接点としての信頼性に優れた材料が求め
られている。さらに、近年強くなっている低コスト化要
求から、高信頼性を有し、かつ低コストの電気、電子機
器部品のコネクタ用ピン材料が求められている。このた
め、めっき付き銅合金線材料に対しても従来以上の高信
頼性および低コスト化が要求されている。On the other hand, in order to increase the density of electrical and electronic equipment components and to improve their quality, materials with excellent reliability as contacts are required. Furthermore, due to the demand for lower costs that has become stronger in recent years, there is a demand for highly reliable and low-cost connector pin materials for electrical and electronic equipment parts. For this reason, plated copper alloy wire materials are also required to have higher reliability and lower cost than ever before.
しかしながら、上記のような高信頼性および低コスト化
の要求に応えるには、従来の材料では対応できない。例
えば接点としての高信頼性を得るために、金を銅合金表
面にめっきしているが、金は高価なためコストが高くな
る。逆に、安価な錫やはんだめっきを用いた場合、めっ
き膜が柔らかく、金に比較して酸化されやすいので、ピ
ンとソケットとの挿抜時の摩擦によるめっき剥離粉が酸
化されて接触不良の原因となる。また、組立加工前にめ
っきした場合、組立加工時に摩擦によるめっきカスが発
生し、加工の妨げとなるなどの問題点があった。However, conventional materials cannot meet the above demands for high reliability and low cost. For example, in order to obtain high reliability as a contact, the surface of a copper alloy is plated with gold, but gold is expensive, which increases the cost. On the other hand, when cheap tin or solder plating is used, the plating film is soft and oxidizes more easily than gold, so the friction when inserting and removing the pin and socket can oxidize the plating flakes and cause poor contact. Become. Furthermore, when plating is performed before assembly, there is a problem in that plating scum is generated due to friction during assembly, which hinders processing.
本発明は上記のような問題点を解消するもので、高信頼
性を有し、かつ低コストに製造できるコネクタ材料を提
供することを目的とする。The present invention solves the above-mentioned problems, and aims to provide a connector material that has high reliability and can be manufactured at low cost.
本発明のコネクタ材料は、電気、電子機器部品に使用さ
れるコネクタ材料において、銅合金異形線にＳｎまたは
Ｓｎ − Ｐｂ合金の電気めっきを施した後に、リフロ
ー処理を行い、リフロー処理後のＳｎまたはＳｎ−Ｐｂ
合金層の厚さを０．３〜２ｐとするものである。The connector material of the present invention is a connector material used for electrical and electronic equipment parts, in which a copper alloy deformed wire is electroplated with Sn or Sn-Pb alloy, and then subjected to a reflow treatment. Sn-Pb
The thickness of the alloy layer is 0.3 to 2p.
銅合金異形線の材質としては黄銅、リン青銅など、従来
よりコネクタ材料として使用されているものが使用でき
る。また異形線の断面形状は正方形、長方形その他任意
の形状のものが使用できる。As the material of the copper alloy deformed wire, materials conventionally used as connector materials, such as brass and phosphor bronze, can be used. Further, the cross-sectional shape of the irregularly shaped wire can be square, rectangular, or any other shape.
リフロー処理後のＳｎまたはＳｎ−Ｐｂ合金層の厚さは
、リフロー処理の際の拡散により生或するＣｕ − Ｓ
ｎ合金層の厚さを除く。The thickness of the Sn or Sn-Pb alloy layer after reflow treatment is determined by Cu-S produced by diffusion during reflow treatment.
Excluding the thickness of the n-alloy layer.
ＳｎまたはＳｎ−Ｐｂ合金を接点金属とする線材（丸線
）では、安定した接触を得るためには、コンタクト面に
垂直の方向の接触力が通常１００ ｇ以上必要であり、
このためピンとソケッ１−との揮抜時の摩擦力が大きく
なり、めっき剥離粉が発生して、接触不良の原因となる
が、異形線は通マ：（の線材（九線）と比較して接点の
接触面積を大きくでき、かつ真直性に優れているので、
安定した接触を低接触力で得ることができる。このため
揮抜時の摩擦力を小さくでき、めっき剥離粉を抑制する
。For wire rods (round wires) that use Sn or Sn-Pb alloy as the contact metal, a contact force of 100 g or more in the direction perpendicular to the contact surface is usually required to obtain stable contact.
For this reason, the frictional force during volatilization between the pin and socket 1- increases, generating plating peeling powder and causing poor contact. The contact area of the contact point can be increased by using the contact point, and the straightness is excellent.
Stable contact can be obtained with low contact force. Therefore, the frictional force during volatilization can be reduced, and plating peeling powder can be suppressed.
またリフロー処理を行った場合、めっきピンホール防止
などの信頼性確保のためには、通常３ＩＩｎ以上のめっ
き厚が必要であるのに対し，異形線の場合はめっき厚を
０．３〜２州で同等の信頼性を得ることができる。この
ため、めっき厚を薄くでき、挿抜時の摩擦によるめっき
剥離粉を抑制する。In addition, when reflow processing is performed, a plating thickness of 3IIn or more is usually required to ensure reliability such as preventing plating pinholes, whereas in the case of irregular shaped wires, the plating thickness is 0.3 to 2I It is possible to obtain equivalent reliability with Therefore, the plating thickness can be reduced, and the generation of plating peeling powder due to friction during insertion and removal can be suppressed.
本発明では、銅合金異形線にリフロー処理を行ったＳｎ
またはＳｎ−Ｐｂ合金を接点金属として使用するため、
低接触力かつ薄いめっき厚で安定した接触を得ることが
できるため、ピンとソケツ１−との挿抜時の摩擦による
めっき剥離粉を極少量に抑制３ー
でき、高信頼性でかつ低コストのコネクタ材料を得るこ
とができる。In the present invention, Sn
Or to use Sn-Pb alloy as contact metal,
Since stable contact can be achieved with low contact force and thin plating thickness, plating peeling powder due to friction when inserting and removing pins and sockets can be suppressed to a minimum amount3, making it a highly reliable and low-cost connector. materials can be obtained.
異形線の接点として使用される面の線幅は、接点の接触
面積が大きくないと効果が現れにくいため、０．３ｎｔ
ｎ以上とするのが好ましい。The line width of the surface used as the contact point of the irregularly shaped wire is 0.3 nt because the effect is difficult to appear unless the contact area of the contact point is large.
It is preferable to set it to n or more.
また、リフロー処理後のＳｎまたはＳｎ − Ｐｂ合金
のめっき層の厚さは、厚すぎるとめっき剥離粉の抑制効
果が現れず、薄すぎるとはんだ付け性が低下するので、
０．３〜２戸とする。In addition, if the thickness of the Sn or Sn-Pb alloy plating layer after reflow treatment is too thick, the effect of suppressing plating peeling powder will not appear, and if it is too thin, solderability will decrease.
0.3 to 2 units.
さらに本発明では、めっき厚を薄くするため、組立加工
時のめっき粉の発生を抑制できる。Furthermore, in the present invention, since the plating thickness is reduced, generation of plating powder during assembly can be suppressed.
以下、本発明の実施例について説明する。 Examples of the present invention will be described below.
実施例ｌ、２
一辺が０。６ＩＩＩＩ１の黄銅製の正方形異形線の表面
に、Ｓｎめっき（実施例１），Ｓｎ−１０％ｐｂ合金め
っき（実施例２）を施した後、リフロー処理を行って、
リフロー処理により生或するＳｎ − Ｃｕ合金層を除
くめっき厚が１．０ｐのピンを得た。Examples 1 and 2 After applying Sn plating (Example 1) and Sn-10% PB alloy plating (Example 2) to the surface of a brass square shaped wire with a side of 0.6III1, reflow treatment was performed. hand,
A pin with a plating thickness of 1.0p excluding the Sn-Cu alloy layer formed by reflow treatment was obtained.
比較例１ないし４
４
リフロー処理後のめっき厚が３．０ｐ（比較例１、２）
、またはりフロー処理を施さない（比較例３、４）他は
実施例１、２と同様にピンを得た。Comparative Examples 1 to 4 4 Plating thickness after reflow treatment is 3.0p (Comparative Examples 1 and 2)
, or pins were obtained in the same manner as in Examples 1 and 2, except that no flow treatment was performed (Comparative Examples 3 and 4).
比較例５ないし８
一辺が０．２ｍｎの黄銅製の正方形異形線（比較例５、
６），または直径０．６ｍｍの九線（比較例７、８）を
用いた他は実施例ｌ、２と同様にピンを得た。Comparative Examples 5 to 8 Brass square irregular shaped wire with a side of 0.2 mm (Comparative Example 5,
6), or a pin with a diameter of 0.6 mm (Comparative Examples 7 and 8) was used, but pins were obtained in the same manner as in Examples 1 and 2.
」二記のようにして得た製造直後のピン、ならびに適合
するソケットに３０回挿抜をくり返した後のピンについ
て次の接触信頼性試験を行った。The following contact reliability test was conducted on the pins immediately after manufacture obtained as described in Section 2 above, and on the pins after they had been inserted and removed 30 times into a suitable socket.
接触信頼性試験
各実施例および比較例により得られたピンを各２０個使
用して、−４０℃、３０分問および１２５℃、３０分間
の温度サイクルを１０サイクル負荷した後、接触抵抗値
を測定した。結果を表ｌに示す。Contact Reliability Test Using 20 pins obtained in each example and comparative example, the contact resistance was measured after 10 cycles of temperature cycles of -40°C for 30 minutes and 125°C for 30 minutes. It was measured. The results are shown in Table 1.
表１の結果より、挿抜回数がＯでは、実施例ならびに比
較例に大きな差異は認められず、全て良好な接触抵抗値
を示した。しかし、挿抜回数３０回のものでは、本実施
例のものが安定した接触抵抗値を示したのに対して、比
較例のものは温度サイクル試験後に著しい接触抵抗値の
上昇が認められた。またリフロー処理を施したものでも
、ピン形状が０．２＋ｎｍ角や九線である場合や、Ｓｎ
またはＳｎ−Ｐｂ合金めっき厚が３Ｉｔｎｌと厚い場合
では、接触不良が多く発生している。From the results in Table 1, when the number of insertions and removals was O, no major difference was observed between the Examples and Comparative Examples, and all showed good contact resistance values. However, when the number of insertions and removals was 30, the one of the present example showed a stable contact resistance value, whereas the one of the comparative example showed a significant increase in the contact resistance value after the temperature cycle test. Also, even if the reflow treatment is applied, the pin shape may be 0.2+nm square or nine-wire, or Sn
Alternatively, when the Sn--Pb alloy plating thickness is as thick as 3 Itnl, many contact failures occur.
この実施例では、ＣｕやＮｉなどの下地めっきが施され
ないものについて説明したが、下地めっきが施された場
合にも同等の効果を得られる。In this embodiment, a case has been described in which no base plating such as Cu or Ni is applied, but the same effect can be obtained even when base plating is applied.
本発明によれば、リフロー処理をしたＳｎまたはＳｎ−
Ｐｂ合金めっきを銅合金異形線に施すことより、従来の
材料では得られない接点としての高信頼性を有し、かつ
低コストに製造できるコネクタ材料が得られる。According to the present invention, Sn or Sn-
By applying Pb alloy plating to a copper alloy deformed wire, a connector material that has high reliability as a contact that cannot be obtained with conventional materials and can be manufactured at low cost can be obtained.
Claims (1)
おいて、銅合金異形線にＳｎまたはＳｎ−Ｐｂ合金の電
気めっきを施した後に、リフロー処理を行い、リフロー
処理後のＳｎまたはＳｎ−Ｐｂ合金層の厚さを０．３〜
２μｍとすることを特徴とするコネクタ材料。(1) In connector materials used for electrical and electronic equipment parts, copper alloy deformed wires are electroplated with Sn or Sn-Pb alloy, then reflow treated, and Sn or Sn-Pb alloy after reflow treatment is used. Layer thickness 0.3~
A connector material characterized by having a thickness of 2 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23540589A JPH0398271A (en) | 1989-09-11 | 1989-09-11 | Connector material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23540589A JPH0398271A (en) | 1989-09-11 | 1989-09-11 | Connector material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0398271A true JPH0398271A (en) | 1991-04-23 |
Family
ID=16985609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23540589A Pending JPH0398271A (en) | 1989-09-11 | 1989-09-11 | Connector material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0398271A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62281206A (en) * | 1986-05-29 | 1987-12-07 | 古河電気工業株式会社 | Material for electronic/electric equipment |
-
1989
- 1989-09-11 JP JP23540589A patent/JPH0398271A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62281206A (en) * | 1986-05-29 | 1987-12-07 | 古河電気工業株式会社 | Material for electronic/electric equipment |
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