JPH0397296A - Surface mounting package - Google Patents

Abstract

PURPOSE:To easily position a surface mounting package against a substrate by forming at least one tab for positioning on the rear of the package. CONSTITUTION:A square pole-like tab 15 for positioning is formed at the center on the rear of this surface mounting package 14 and a square hole 16 for positioning into which the tab 15 can be inserted tightly is provided at the central part on the upper surface of a substrate 11. When the tab 15 is inserted into the hole 16, the rear surface section of the tip of a lead 13 coming out from the side face of the package 14 comes into contact with a wiring pattern 12 on the substrate 11. Therefore, the lead 13 can be surely brought into contact with the pattern 12 and the time required for positioning the package 14 can be reduced. In addition, since the tab 15 has a square cross section, the tab 15 is tightly fixed to the hole 16, accordingly, the package 14 is fixed to the substrate 11, with no positional deviation between the wiring pattern 12 and lead 13.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to surface mount packages.

[Conventional technology]

FIGS. 3(a) and 3(b) are a plan view and a sectional view of a conventional surface mount type package mounted on a substrate.

When this surface mount type package 34 is mounted on the board 31, the wiring pattern 32 and the leads 33 are brought into contact with each other to position the package 34, and then the wiring pattern 32 and the leads 33 are bonded together using solder or the like. By doing so, they were electrically connected and fixed on the substrate 1.

(Problem to be Solved by the Invention) In the conventional surface mount package described above, when mounting on the board 31, the package 34 is positioned by bringing the wiring pattern 32 and the leads 33 into contact with each other individually. Therefore, there is a drawback that positioning on the board 31 takes time, and after the above-mentioned positioning, the wiring pattern 32 and the lead 33 are electrically connected using solder etc. until they are fixed on the board 31. Since there is nothing to fix the pattern 32 and the lead 33, there is a disadvantage that the pattern 32 and the lead 33 may be displaced from the substrate 31 by force from other sources.

An object of the present invention is to provide a surface mounting method that allows easy positioning with respect to the board, and that does not cause misalignment with respect to the board until the wiring pattern and the lead are electrically connected using solder or the like after positioning and fixed on the board. It is to provide a type package.

[Means to solve the problem]

The surface mount package of the present invention has at least one positioning protrusion on the back surface of the package.

[For production]

Therefore, positioning of the package becomes easy, the time required for positioning is shortened, and positional deviation with respect to the substrate does not occur.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1(a) is a plan view of a surface mount package according to an embodiment of the present invention, and FIG. 1(b) is a sectional view taken along the line AA.

A positioning projection 15 shaped like a square prism is provided at the center of the back surface of the package 14, and a positioning hole 16 shaped like a square prism into which the positioning projection 15 can be inserted is provided at the center of the surface of the substrate 11. The positioning protrusion 15 is inserted into the positioning hole l.
6, the wiring pattern 1 on the board 11
2 and the rear surface of the tip of the lead 13 protruding from the side surface of the package 14.

In this embodiment, when positioning the package 14 with respect to the substrate 11, the wiring pattern 12 and the leads 13 are not individually aligned, but only by inserting the positioning protrusion 15 into the positioning hole 16. The wiring pattern 12 and the lead 13 can be brought into contact with each other reliably, and the time required for positioning can be shortened. Further, since the positioning projection 15 has a rectangular cross section, the positioning projection 15 is fixed in the positioning hole 16, and the package 14
Since the wiring patterns 12 and the leads 13 are fixed, no misalignment occurs between the wiring patterns 12 and the leads 13.

In this embodiment, two or more positioning protrusions 15 and two or more positioning holes 16 are provided, and the package 14 is attached to the substrate 1.
By giving directionality to 1, package 1
4 on the substrate 11, the package 14 can be mounted on the substrate 11 without making a mistake in the direction of the package 14.

FIG. 2(a) is a plan view of a surface mount type package according to a second embodiment of the present invention, and FIG. 2(b) is a sectional view thereof taken along line B--B.

In the second embodiment, the positioning protrusion 2 of the package 24
5 is in the shape of a triangular prism, and the positioning hole 26 of the substrate 21 is also correspondingly triangular prism-shaped.

In this embodiment, the positioning protrusion 25 has a triangular prism shape, so its cross section is triangular, and the package 2
4 can be given direction. Therefore, when positioning the package 24 with respect to the substrate 2l, the wiring pattern 22 and the leads 2 can be aligned without making a mistake in the direction of the package 24.
There is an advantage that the package 24 can be mounted on the substrate 21 by bringing the package 24 into contact with the substrate 21.

〔Effect of the invention〕

As explained above, the present invention has the effect of facilitating the positioning of the package and shortening the time required for positioning by providing a positioning protrusion on the back surface of the package and inserting the protrusion into the positioning six on the board. Furthermore, by inserting and fixing the positioning protrusion into the positioning hole on the board, it is possible to prevent misalignment between the package leads and the wiring pattern. This has the effect of preventing lead deformation and wiring pattern deformation due to misalignment.

[Brief explanation of drawings]

FIG. 1(a) is a plan view of a surface mount type package according to the first embodiment of the present invention, and FIG. 1(b) is an A-A in FIG. 1(a).
2(a) is a plan view of a surface mount type package according to the second embodiment of the present invention, and FIG. 2(b) is a line sectional view of FIG. 2(a).
), FIG. 3(a) is a plan view of the conventional example,
FIG. 3(b) is a sectional view taken along the line CC in FIG. 3(a). 11.21...Substrate, 12.22--
...Wiring pattern 13.23...Lead,
14.24 ・・・・・・Buckage, 15.25
...Positioning protrusion, 16.26...
Positioning hole.

Claims (1)

[Claims] 1. A surface mount type package, characterized in that the package has at least one positioning protrusion on the back surface thereof.