【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ＩＣ力一ドなどの薄形半導体装置、特に機
能素子を一体に戒形した構造に関するものである．以下
ＩＣ力一ドについて説明する．〔従来の技術〕
従来のＩＣカードは第１５図に示すようにｔｒ４ｒ！ｉ
．されていた．即ち図において、１は上下のケース部材
ｌｏｔ， １０２が接合部１０３で嵌合，填合い．接着
剤または超音波による接着等によって結合されたＩＣカ
ードゲース、２はＩＣ力一ドゲース１内に収納されたガ
ラスエボキシプリント基板等の回路基板、３は回路基板
２に設けられた電極端子、４は電極端子３と回路基板２
を電気的に接続するために形成されたスルーホール、５
は回路基板２に配置され接続ビン５ｌを有するＩＣパッ
ケージである．この従来のものでは、ＩＣカードケース
１の一面に外部接続用の電極端子３を露出させ、ＩＣ力
−ドケース１の中に機能素子を搭載した回路基板２を収
納させるべく、一対のケース部材１０１， １０２を接
合部１０３において結合する構戒になっている．〔発明
が解決しようとする課題〕
このように組立てられたＩＣカードにおいては、カード
ゲース１と、８！能素子を搭載した回路基板２との間に
空間部分が生じ、カード表面から外力がかかった場合部
分的にへこむなどの問題があり、必要以上にケース１の
厚さを大きくするために力−ド全体の厚さを薄くできな
い．また回路基板２の電極端子３は、カードケース１の
一面に形成された窓部を介して露出させるために端子の
周囲に隙間を生じ、ＩＣカードの耐水性などの耐環境性
を低下させる．さらに組立に手間がかかると共にＩＣカ
ードとしての電極端子の位置精度が出ないなどの多くの
不都合があった．
この発明はかかる問題を解消し、ＩＣカードの機能部分
を完全にカード基体中に埋設し、効率良く、小形１薄形
の信頼性の高い薄形半導体装置を得るためになされたも
のである．
〔課題を解決するための手段〕
この発明に係る薄形半導体装置は、半導体素子が取付け
られた回路基板を基体の凹部に収納すると共に、この凹
部とこれの底面に形戒された複数個の開口部とに樹脂を
充填して回路基板と基体を一体に戒形するようにしたも
のである．〔作用〕
この発明による回路基板は、基体と一体に戒形されてい
るので、外部からの種々の圧力に対して強靭になると共
に、耐水性等の耐環境性に優れ、機能が向上する．
〔実施例〕
以下この発明の一実施例を第１図〜第９図にもとづいて
説明する．即ち第１図〜第９図において、６はＩＣパッ
ケージ５を搭載した回路基板２を収納する凹部６ｌおよ
び電極端子３を露出させる開口部゛６２および周辺に形
戒された複数個の開口部６３を有するカード基体、７は
回路基板２とカード基体６を一体成形する樹脂層、２ｌ
はカード基体６の開口部６３に対向して樹脂層７が入り
易いように回路基板２に形成された切欠きである．ここ
でカード基体６の開口部６２。６３はＩＣカードの外面
をなす方に大きな開口部をもち、ここに樹脂層７が充填
形成されたときにアンダーカットで抜けないよう構成さ
れている．
第１０図〜第１３図に示すようにカード基体６に回路基
板２との位置関係を精度よくするための位置ぎめ突出部
６４をここでは２個設け、回路基板２の位置ぎめ穴２２
に嵌合させることによって、ＩＣ力−ドの外形となるカ
ード基体６に対して回Ｐ！１基板２の電極端子３の位置
精度をよくしている．このようにカード基体６の凹部に
機能素子を搭載した回路基板２をセットしたのち、カー
ド基体６をＩＣカードの外形のキャビテーをもつ図示し
ない金型に納め、カード基体６の凹部６１を樹脂で機能
素子を埋設するように成形し、第１図に示すようなＩＣ
カードとして完成する．これらの戒形樹脂は埋設するガ
ラスエボキシ樹脂で構成された回路基板２に等しい熱膨
張係数をもつ樹脂を適用することが望ましく、この点で
サーモトロピック液晶ボリマー（ポリプラスチック社・
商品名「ベクトラＣ−１３０Ｊ ）が適しており、これ
によってＩＣカードを反りの発生なく得ることができる
．なおこれらの実施例では、カード外部に電極端子が露
出するものを示したが、第１４図に示すように外部接続
用の電極端子をもたない非接触タイプのＩＣカードに適
用してもよい．この場合、一体に成形した樹脂は、カー
ド基体６の凹部６！の周縁部の開口部６３に充填されて
、カード面に露出すると共に、一体に或形した樹脂は部
分的にカードの両面から、カード基体６，回路基板２を
挾むように楕戒され、しかもカード基体側はアンダーカ
ット状となっているので、両者は特に接着しなくても強
固に接合される．
以上のように、ＩＣ力一ドの回路基板をカードの片側を
なすカード基体に回路基板上に必要な素子を搭載したの
ちに収納し、もう一方回路基板を覆うように一体に戒形
し、カードとして完成させるので、機能素子の形状，個
数に関係なく、ＩＣカードの外形が同一であれば１つの
金型で戒形できる．
また従来の組立て方式のように繁雑な工程もなく、いわ
ばカードの外袋を成形する工程でカードの組立てが完成
するので、生産性もよく大量に供給できる．しかもＩＣ
カードの機能素子は、成形樹脂によって完全に密封され
るので、薬液や外部環境に耐性のあるカードを得ること
ができる．なお、戊形樹脂として、サーモトロピック液
晶ボリマーを使用した場合を示したが、他の熱可塑性樹
脂、無機繊維強化熱可塑性樹脂で戒形しても有効なこと
は勿論である．
〔発明の効果〕
上記のようにこの発明による薄形半導体装置は、回路基
板を基体に対して樹脂層によって一体に成形したので、
強靭で耐環境性に優れ、機能が向上する．[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thin semiconductor device such as an IC power supply, and particularly to a structure in which functional elements are integrally formed. The IC power supply will be explained below. [Prior Art] A conventional IC card is tr4r!, as shown in FIG. i
．． It had been. That is, in the figure, 1 is an upper and lower case member lot, 102 is fitted at a joint 103. 2 is a circuit board such as a glass epoxy printed board housed in the IC card gate 1, 3 is an electrode terminal provided on the circuit board 2, and 4 is an IC card gate connected by adhesive or ultrasonic bonding. Electrode terminal 3 and circuit board 2
a through hole formed to electrically connect the
is an IC package arranged on the circuit board 2 and having a connection pin 5l. In this conventional device, an electrode terminal 3 for external connection is exposed on one side of the IC card case 1, and a pair of case members 101 , 102 are joined at a joint 103. [Problem to be solved by the invention] In the IC cards assembled in this way, card games 1 and 8! A space is created between the card and the circuit board 2 on which the functional elements are mounted, and when an external force is applied from the surface of the card, there is a problem such as partial denting. It is not possible to reduce the overall thickness of the board. Further, since the electrode terminals 3 of the circuit board 2 are exposed through a window formed on one side of the card case 1, a gap is created around the terminals, which deteriorates the environmental resistance such as water resistance of the IC card. Furthermore, there were many other inconveniences, such as the time required for assembly and the lack of precision in the positioning of electrode terminals for IC cards. The present invention has been made in order to solve this problem, to completely embed the functional parts of an IC card in the card base, and to efficiently obtain a small, thin, and highly reliable thin semiconductor device. [Means for Solving the Problems] A thin semiconductor device according to the present invention stores a circuit board on which a semiconductor element is attached in a recess of a base body, and has a plurality of shaped parts formed on the recess and the bottom of the recess. The openings are filled with resin so that the circuit board and base are integrally shaped. [Function] Since the circuit board according to the present invention is integrally formed with the base body, it is strong against various external pressures, has excellent environmental resistance such as water resistance, and has improved functionality. [Embodiment] An embodiment of the present invention will be explained below based on FIGS. 1 to 9. That is, in FIGS. 1 to 9, reference numeral 6 denotes a recess 6l for housing the circuit board 2 on which the IC package 5 is mounted, an opening 62 for exposing the electrode terminal 3, and a plurality of openings 63 formed around the periphery. 7 is a resin layer for integrally molding the circuit board 2 and the card base 6; 2l;
is a notch formed in the circuit board 2 so that the resin layer 7 can easily enter the opening 63 of the card base 6. Here, the openings 62 and 63 of the card base 6 have large openings on the side forming the outer surface of the IC card, and are configured so that when the resin layer 7 is filled and formed therein, it will not come out due to an undercut. As shown in FIGS. 10 to 13, two positioning protrusions 64 are provided on the card base 6 in order to improve the positional relationship with the circuit board 2, and the positioning holes 22 of the circuit board 2 are provided here.
By fitting the card into the card body 6, which becomes the outer shape of the IC card, the number of times P! The positioning accuracy of the electrode terminals 3 on one substrate 2 is improved. After setting the circuit board 2 equipped with functional elements in the recess of the card base 6 in this way, the card base 6 is placed in a mold (not shown) having a cavity shaped like an IC card, and the recess 61 of the card base 6 is filled with resin. The IC is molded to embed functional elements, as shown in Figure 1.
Completed as a card. It is desirable to use a resin with a coefficient of thermal expansion equal to that of the embedded circuit board 2 made of glass epoxy resin.
The product name ``Vectra C-130J'' is suitable, and with this IC card can be obtained without warping.In addition, in these examples, the electrode terminals are exposed outside the card, but the 14th example As shown in the figure, it may also be applied to a non-contact type IC card that does not have electrode terminals for external connection.In this case, the integrally molded resin is used to form an opening at the periphery of the recess 6! of the card base 6. The resin that is filled in the portion 63 and exposed on the card surface and formed integrally is partially ovalized from both sides of the card so as to sandwich the card base 6 and the circuit board 2, and the card base side is undercut. Because of the shape, the two can be firmly joined without any special adhesive.As described above, the circuit board of the IC card is attached to the card base, which forms one side of the card, and the necessary elements are mounted on the circuit board. After mounting, the IC card is stored and molded into one piece to cover the other circuit board to complete the card, so regardless of the shape or number of functional elements, if the IC card has the same external shape, it can be made into one mold. In addition, there is no complicated process unlike the conventional assembly method, and the card assembly is completed in the process of forming the outer bag of the card, so productivity is high and large quantities can be supplied.
The functional elements of the card are completely sealed by the molded resin, making it possible to obtain a card that is resistant to chemicals and the external environment. Although the case where a thermotropic liquid crystal polymer was used as the molding resin is shown, it is of course effective to mold it with other thermoplastic resins or inorganic fiber-reinforced thermoplastic resins. [Effects of the Invention] As described above, the thin semiconductor device according to the present invention has the circuit board integrally formed with the base body using the resin layer.
It is tough, has excellent environmental resistance, and has improved functionality.
【図面の簡単な説明】[Brief explanation of drawings]
第１図〜第９図はいずれもこの発明の一実施例を示す図
で、第工図イ，口，ハは平面図，断面図および裏面図、
第２図は要部平面図、第３図は第２図ト１１！断面図、
第４図は第２図Ｆ／−ＩＶ線断面図、第５図は第２図■
−Ｖ線断面図、第６図は要部平面図、第７図は第６図■
一■線断面図、第８図は第６図■−■線断面図、第９図
は第６図■一■線断面図、第ｌＯ図〜第１３図はこの発
明の他の実施例を示す図で，第１０図は要部平面図、第
１１図は第１０図Ｍ一川線断面図、第１２図は第！Ｏ図
Ｍ−β線断面図、第１３図は第ｌＯ図ＸＩ−ＸＩ線断面
図、第１４図イ，ロ，ハはさらにこの売明の他の実施例
を示す平面図．Ｉｒ面図および裏面図、第１５図イ，口
は従来のこのｌＦＪｆｆ形半導体装置を示す平面図およ
び断面図である．1 to 9 are views showing an embodiment of the present invention, and the construction drawings A, C and C represent a plan view, a cross-sectional view, and a back view;
Figure 2 is a plan view of the main part, Figure 3 is Figure 2-11! cross section,
Figure 4 is a sectional view of Figure 2 F/-IV, Figure 5 is Figure 2 ■
-V line sectional view, Figure 6 is a plan view of the main part, Figure 7 is Figure 6 ■
8 is a sectional view taken along the line 6--2, FIG. 9 is a sectional view taken along the line 6-2 shown in FIG. 6, and FIGS. 10 is a plan view of the main part, FIG. 11 is a sectional view taken along the M Ichikawa line in FIG. 10, and FIG. 12 is a ! FIG. 13 is a sectional view taken along the line M--β in FIG. 1, FIG. 14 is a sectional view taken along the line XI--XI in FIG. Ir side view and back view, and Figure 15A and 15B are a plan view and a sectional view showing this conventional IFJff type semiconductor device.