JPH0392074U - - Google Patents
Info
- Publication number
- JPH0392074U JPH0392074U JP15278689U JP15278689U JPH0392074U JP H0392074 U JPH0392074 U JP H0392074U JP 15278689 U JP15278689 U JP 15278689U JP 15278689 U JP15278689 U JP 15278689U JP H0392074 U JPH0392074 U JP H0392074U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- semiconductor integrated
- bead core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のプリント基板の断面図である
。第２図は本考案のプリント基板に半導体集積回
路を搭載した時の断面図、第３図は他の実施例図
、第４図は搭載断面図である。
１……プリント基板、２……スルーホール、３
……フエライトビーズコア、４……プリント配線
。
FIG. 1 is a sectional view of the printed circuit board of the present invention. FIG. 2 is a sectional view of a semiconductor integrated circuit mounted on a printed circuit board according to the present invention, FIG. 3 is a diagram of another embodiment, and FIG. 4 is a sectional view of the mounting. 1...Printed circuit board, 2...Through hole, 3
...Ferrite bead core, 4...Printed wiring.
Claims (1)
おいて、フエライトビーズコアと金属製リングと
を接続してスルーホールを形成し、前記金属製リ
ングとプリント配線を接続することを特徴とした
プリント基板。 (2) 半導体集積回路を搭載するプリント基板に
おいて、金属からなる２つのリングにより、フエ
ライトビーズコアを両側からはさんだ三層構造の
スルーホールを、プリント配線上に設けることを
特徴とするプリント基板。[Claims for Utility Model Registration] (1) In a printed circuit board on which a semiconductor integrated circuit is mounted, a ferrite bead core and a metal ring are connected to form a through hole, and the metal ring and printed wiring are connected. A printed circuit board featuring (2) A printed circuit board on which a semiconductor integrated circuit is mounted, characterized in that a through hole with a three-layer structure in which a ferrite bead core is sandwiched from both sides by two metal rings is provided on the printed wiring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15278689U JPH0392074U (en) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15278689U JPH0392074U (en) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392074U true JPH0392074U (en) | 1991-09-19 |
Family
ID=31699028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15278689U Pending JPH0392074U (en) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392074U (en) |
-
1989
- 1989-12-29 JP JP15278689U patent/JPH0392074U/ja active Pending