JPH0390457U - - Google Patents
Info
- Publication number
- JPH0390457U JPH0390457U JP15295289U JP15295289U JPH0390457U JP H0390457 U JPH0390457 U JP H0390457U JP 15295289 U JP15295289 U JP 15295289U JP 15295289 U JP15295289 U JP 15295289U JP H0390457 U JPH0390457 U JP H0390457U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- island
- leads
- semiconductor
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図及び第２図は、本考案の実施例を示す側
断面図、第３図及び第４図は、本考案による半導
体装置の製造に用いられるリードフレームの一例
を示す要部平面図、第５図は従来の半導体装置の
一例を示す平断面図を示す。
７ａ，７ｂ……アイランド、８ａ，８ｂ……半
導体ペレツト、９ａ，９ｂ……リード、１１ａ，
１１ｂ……配線体、１３……樹脂、１４ａ，１４
ｂ……リードフレーム枠、１５ａ，１５ｂ……リ
ードフレーム。
1 and 2 are side sectional views showing an embodiment of the present invention, and FIGS. 3 and 4 are principal part plan views showing an example of a lead frame used in manufacturing a semiconductor device according to the present invention. FIG. 5 shows a plan sectional view showing an example of a conventional semiconductor device. 7a, 7b...Island, 8a, 8b...Semiconductor pellet, 9a, 9b...Lead, 11a,
11b... Wiring body, 13... Resin, 14a, 14
b... Lead frame frame, 15a, 15b... Lead frame.
Claims (1)
側方に多数本一組のリード一端部を配置し、半導
体ペレツト上の電極とリードとを電気的に接続し
た一対の配線体をそれぞれのリードの引き出し方
向を異ならせて各アイランド裏面を重合させ、各
ペレツトを含む主要部分を封止したことを特徴と
する半導体装置。 One end of a set of multiple leads is placed on one side of the island on which the semiconductor pellet is mounted, and a pair of wiring bodies in which the electrodes on the semiconductor pellet and the leads are electrically connected are drawn out in different directions. 1. A semiconductor device characterized in that the back surface of each island is polymerized to seal the main part including each pellet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15295289U JPH0390457U (en) | 1989-12-28 | 1989-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15295289U JPH0390457U (en) | 1989-12-28 | 1989-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390457U true JPH0390457U (en) | 1991-09-13 |
Family
ID=31699188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15295289U Pending JPH0390457U (en) | 1989-12-28 | 1989-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390457U (en) |
-
1989
- 1989-12-28 JP JP15295289U patent/JPH0390457U/ja active Pending