JPH0378220A - Inductor element and its manufacture - Google Patents
Inductor element and its manufactureInfo
- Publication number
- JPH0378220A JPH0378220A JP21448989A JP21448989A JPH0378220A JP H0378220 A JPH0378220 A JP H0378220A JP 21448989 A JP21448989 A JP 21448989A JP 21448989 A JP21448989 A JP 21448989A JP H0378220 A JPH0378220 A JP H0378220A
- Authority
- JP
- Japan
- Prior art keywords
- inductor
- internal conductor
- magnetic
- magnetic material
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000004020 conductor Substances 0.000 claims abstract description 58
- 239000011230 binding agent Substances 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 239000010953 base metal Substances 0.000 claims abstract description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract 3
- 229910052751 metal Inorganic materials 0.000 claims abstract 3
- 229910018605 Ni—Zn Inorganic materials 0.000 claims abstract 2
- 229910007565 Zn—Cu Inorganic materials 0.000 claims abstract 2
- 239000000696 magnetic material Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 7
- 239000012298 atmosphere Substances 0.000 claims description 5
- 238000010344 co-firing Methods 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims 4
- 239000007789 gas Substances 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 238000010304 firing Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000011946 reduction process Methods 0.000 description 4
- 239000007858 starting material Substances 0.000 description 4
- 239000005751 Copper oxide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910052596 spinel Inorganic materials 0.000 description 3
- 239000011029 spinel Substances 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 229960002380 dibutyl phthalate Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は 磁性体と内部導体とを同時焼成して製造され
る積層型インダクタおよび、その製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a multilayer inductor manufactured by co-firing a magnetic material and an internal conductor, and a method for manufacturing the same.
従来の技術
近年、電子部品の表面実装への要望が高まり、各種電子
部品の小型化、軽量化、低コスト化がつよく望まれてい
る。インダクタにおいてもその例外ではなく、インダク
タのチップ化も進んでいる。BACKGROUND OF THE INVENTION In recent years, there has been an increasing demand for surface mounting of electronic components, and there is a strong desire for various electronic components to be smaller, lighter, and lower in cost. Inductors are no exception, and inductors are increasingly being made into chips.
インダクタの小型チップ化の方法として注目されている
ものに、印刷、積層法がある。この方法は、磁性体グリ
ーンシート上に導電パターンと磁性体パターンをスクリ
ーン印刷法で形成し、これを連続的に繰り返すことによ
って磁性体内部にコイル状の導電パターンを形成し、そ
の後、上記の内部導体と磁性体とを同時焼成することに
よりインダクタを製造するものである（例えば、特開昭
５５３６９５４号公報、特開昭５７−３９５２１号公報
）。印刷、積層法を用いることにより、表面実装に適し
た小型のチップインダクタが製造可能であり、またチッ
プインダクタは完全モノリシック構造を有するため、信
顛性が高く、磁気シールド効果も良好である。Printing and lamination methods are attracting attention as methods for making inductors into smaller chips. In this method, a conductive pattern and a magnetic material pattern are formed on a magnetic green sheet by screen printing, and this process is continuously repeated to form a coil-shaped conductive pattern inside the magnetic material. An inductor is manufactured by simultaneously firing a conductor and a magnetic material (for example, Japanese Patent Laid-Open No. 5536954 and Japanese Patent Laid-open No. 57-39521). By using printing and lamination methods, it is possible to manufacture small chip inductors suitable for surface mounting, and since chip inductors have a completely monolithic structure, they have high reliability and good magnetic shielding effects.
発明が解決しようとする課題
しかしながら上記の印刷、積層法で製造したモノリシッ
ク型チップインダクタの使用において、次のような解決
すべき問題点が明らかになった。Problems to be Solved by the Invention However, in using the monolithic chip inductor manufactured by the printing and laminating method described above, the following problems to be solved have become apparent.
つまり、従来のモノリシック型チップインダクタは、内
部導体にパラジウム、銀−パラジウム合金等の貴金属を
用いていたため、内部導体のコストが高くなるという問
題がある。また、それらの導体材料の抵抗率が比較的高
いため（パラジウム９．７７Ｘ１０４ （Ω・ｃｌ）
、銀−パラジウム合金（Ａｇ／Ｐｄ重看比＝ ７０／３
０ ） １５．７ Ｘ１０４（Ω・Ｃ１１））、インダ
クタにとって重要な特性である品質係数（Ｑ）の大きい
ものが得られないといった問題や、また、抵抗率が高い
ため大きな電流が流せない（直流重畳特性）といった問
題が生じた。このような視点から、モノシリツク型チッ
プインダクタにおいて内部導体材料の低コスト化及び低
インピーダンス特性が更に求められるようになった。In other words, since the conventional monolithic chip inductor uses a noble metal such as palladium or a silver-palladium alloy for the internal conductor, there is a problem in that the cost of the internal conductor increases. In addition, because the resistivity of those conductor materials is relatively high (palladium 9.77X104 (Ω・cl)
, silver-palladium alloy (Ag/Pd weight ratio = 70/3
0) 15.7 Problems such as superposition characteristics) arose. From this point of view, there has been a growing demand for lower cost and lower impedance characteristics of internal conductor materials in monolithic chip inductors.
本発明は上記課題に鑑み、モノリシック型チップインダ
クタにおいて内部導体材料の低コスト化及び低インピー
ダンスなものを提供するものである。In view of the above-mentioned problems, the present invention provides a monolithic chip inductor with low cost internal conductor material and low impedance.
課題を解決するための手段
上記課題を解決するために本発明のインダクタは、内部
導体材料に低コストでコスト変動も小さく、また抵抗率
も小さい銅やニッケル等の卑金属（抵抗率 銅 １．７
２Ｘ１０４ （Ω・Ｃ璽）、ニッケル？、２Ｘ１０４
（Ω・ｃｍ））を使用するものである。Means for Solving the Problems In order to solve the above problems, the inductor of the present invention uses base metals such as copper and nickel (resistivity copper 1.7
2X104 (Ω・C), nickel? , 2X104
(Ω・cm)).
また、内部導体の出発原料に酸化銅または、酸化ニッケ
ルを用い、磁性体材料にフェライトを用い、インダクタ
のグリーンチップを作る工程と、空気中での熱処理によ
って有機バインダを除去する工程、及び還元処理によっ
て内部電極を金属化する工程、そして中性雰囲気中で磁
性体と内部導体とを同時焼成する工程より成るインダク
タの製造方法を考案し、その各工程条件を詳細に検討す
ることにより、銅またはニッケルを内部導体とするチッ
プインダクタの作製に成功したものである。In addition, there is a process of making a green chip for an inductor by using copper oxide or nickel oxide as the starting material for the internal conductor and ferrite as the magnetic material, a process of removing the organic binder by heat treatment in air, and a reduction process. We devised an inductor manufacturing method that consists of a process of metallizing the internal electrodes by metallizing the internal electrodes, and a process of co-firing the magnetic material and the internal conductor in a neutral atmosphere, and by studying the conditions of each process in detail, We have successfully created a chip inductor using nickel as an internal conductor.
作用
本発明は、上記した構成によって、磁性体と内部導体と
を同時焼成して製造される積層型インダクタにおいて、
内部導体に銅やニッケル等の卑金属を使用することによ
ってチップインダクタの大幅な低コスト化を達成するも
のである。また、内部導体のインピーダンスが低下する
ためインダクタのＱ値も向上させるものである。Function The present invention provides a multilayer inductor manufactured by co-firing a magnetic material and an internal conductor with the above-described configuration,
By using base metals such as copper and nickel for the internal conductor, the cost of the chip inductor can be significantly reduced. Furthermore, since the impedance of the internal conductor is reduced, the Q value of the inductor is also improved.
次に、本発明の卑金属内部導体チップインダクタの製造
方法について述べる。これは内部導体の出発原料に酸化
銅または、酸化ニッケルを用いることにより脱バインダ
時の内部導体の収縮、酸化を考慮せずに空気中で充分に
有機バインダを除去でき、脱バインダニ程後の水素もし
くは水素、窒素混合雰囲気中での還元工程、さらに窒素
雰囲気中での焼成工程を組み合わせることにより、優れ
た特性および信頼性を存する卑金属内部導体チップイン
ダクタの製造が可能になったものである。Next, a method for manufacturing the base metal internal conductor chip inductor of the present invention will be described. By using copper oxide or nickel oxide as the starting material for the internal conductor, the organic binder can be sufficiently removed in air without worrying about shrinkage or oxidation of the internal conductor during binder removal, and the hydrogen Alternatively, by combining a reduction process in a hydrogen and nitrogen mixed atmosphere and a firing process in a nitrogen atmosphere, it has become possible to manufacture a base metal internal conductor chip inductor with excellent characteristics and reliability.
併せて、上記の新しいプロセスにより還元焼成を必要と
せず、適度な窒素雰囲気で卑金属がメタライズできるこ
とを実証するものである。This study also demonstrates that base metals can be metallized in an appropriate nitrogen atmosphere using the new process described above without requiring reduction firing.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
実施例１
以下本発明の一実施例として、銅を内部導体に用いたチ
ップインダクタについて、図面を参照しながら説明する
。Embodiment 1 As an embodiment of the present invention, a chip inductor using copper as an internal conductor will be described below with reference to the drawings.
磁性体材料にはＮｉｏ、 ｘ４ｚｎｏ、 ｈａｃｕｏ、
＋ ５ｕｅｔ、 ９０Ｇ４． ＋１゜Ｆｅ＋、＊。０
４．。。を用いた。Magnetic materials include Nio, x4zno, hacuo,
+ 5uet, 90G4. +1°Fe+, *. 0
4. . . was used.
磁性体材料の出発原料として、工業用のＮｉｐ。Industrial NIP is used as a starting material for magnetic materials.
ＺｎＯ，Ｃｕｂ、Ｆｅ２０ａを用意した。上記金属酸化
物を上記磁性体材料組成になるよう秤量。ZnO, Cub, and Fe20a were prepared. The above metal oxide is weighed so as to have the above magnetic material composition.
配合した。配合は、ライカイ機を用いた乾式混合を２時
間行った。配合後、上記金属酸化物の混合物を磁器ルツ
ボに入れ、空気中で８００℃−２時間の仮焼を行い磁性
体材料を合成した。It was blended. For the formulation, dry mixing was performed using a Raikai machine for 2 hours. After blending, the mixture of metal oxides was placed in a porcelain crucible and calcined in air at 800°C for 2 hours to synthesize a magnetic material.
仮焼後、磁性体材料はボールミルを用い湿式粉砕し、そ
の後乾燥した０合成された磁性体材料は、Ｘ線回折測定
の結果スピネル構造を有するＮｉＺｎ−Ｃｕフェライト
であった。次に、この磁性体材料を無機成分とし、有機
バインダとしてブチーラール樹脂、可塑剤としてジ−ｎ
−ブチルフタレート、溶剤としてトルエンを第１表の組
成で混合し、スラリーを調製した。After calcination, the magnetic material was wet-pulverized using a ball mill, and then dried.The result of X-ray diffraction measurement revealed that the synthesized magnetic material was NiZn-Cu ferrite having a spinel structure. Next, this magnetic material is used as an inorganic component, butyral resin is used as an organic binder, and di-n is used as a plasticizer.
-Butyl phthalate and toluene as a solvent were mixed in the composition shown in Table 1 to prepare a slurry.
（以 下 余 白）
第１表 スラリー組成
このスラリーをドクターブレード法で、有機フィルム上
に造膜し、磁性体グリーンシートを作製した。乾燥後の
グリーンシート厚みは約１００μｍであった。次に、導
体ペーストは、ＣｕＯ粉を無機成分とし、エチルセルロ
ース（５ｗｔ％）をターピネオールに溶かしたビヒクル
を加え、三段ロールにより適度な粘度になるよう混練し
たものを用いた。この導体ペーストを前記グリーンシー
ト上にスクリーン印刷し、第１図に示すように内部導体
パターンを形成した。第１図において、■は磁性体グリ
ーンシート、２は内部導体パターンである６次に、内部
導体パターンを印刷した磁性体グリーンシートを、磁性
体グリーンシートより作製したコアに巻き付け、第２図
に示すようなコイル状の内部導体パターンを存するグリ
ーンチップを作製した。第２図において、３は磁性体コ
ア、４は外部電極への取り出し部である。磁性体コアは
、上記の磁性体グリーンシートを積層、圧着。(Margins below) Table 1 Slurry Composition This slurry was formed into a film on an organic film using a doctor blade method to produce a magnetic green sheet. The thickness of the green sheet after drying was about 100 μm. Next, a conductor paste was used in which CuO powder was used as an inorganic component, a vehicle in which ethyl cellulose (5 wt %) was dissolved in terpineol was added, and the mixture was kneaded with a three-stage roll to an appropriate viscosity. This conductor paste was screen printed on the green sheet to form an internal conductor pattern as shown in FIG. In Figure 1, ■ is a magnetic green sheet, and 2 is an internal conductor pattern. 6 Next, the magnetic green sheet with the internal conductor pattern printed on it is wrapped around a core made from the magnetic green sheet, and as shown in Figure 2. A green chip with a coil-shaped internal conductor pattern as shown was fabricated. In FIG. 2, 3 is a magnetic core, and 4 is a lead-out portion to an external electrode. The magnetic core is made by laminating and crimping the above magnetic green sheets.
切断し約１ｍφの円柱状に加工したものを用いた。A piece cut and processed into a cylindrical shape with a diameter of about 1 m was used.
上記のインダクタグリーンチップは、静水圧プレスを用
い１０００ ｋｇ／ｃｄの圧力で常温でプレスされた。The above inductor green chip was pressed at room temperature using a hydrostatic press at a pressure of 1000 kg/cd.
次に、このグリーンチップの脱バインダを、空気中５５
０℃で第３図に示す条件で行った。Next, the binder from this green chip was removed in air for 55 minutes.
The test was carried out at 0° C. under the conditions shown in FIG.
脱バインダ温度は予め有機バインダの熱分析を行い、そ
の結果に基づき決定される。脱バインダ温度は、バイン
ダが分解する温度以上であればよいが、必要以上に高温
で熱処理を行うと導体材料の磁性体材料への不必要な拡
散が生じるため、約８００℃以下で行うのが望ましい。The binder removal temperature is determined based on the thermal analysis of the organic binder in advance. The debinding temperature should be at least the temperature at which the binder decomposes, but if heat treatment is performed at an unnecessarily high temperature, unnecessary diffusion of the conductive material into the magnetic material will occur, so it is recommended to perform the debinding at a temperature of about 800°C or lower. desirable.
なお、この脱バインダによって、酸化銅を主成分とする
導体ペーストは大きな体積変化を生じず、バインダが飛
散したのみであった。Note that this removal of the binder did not cause a large volume change in the conductive paste containing copper oxide as a main component, and only the binder was scattered.
バインダを完全に除去した未焼結インダクタは、水素ガ
スを０．５リットル／分の流量で流入させたアルミナ炉
芯管状炉中で、第４図に示す昇降温常条件を用い、３０
０″Ｃの温度で熱処理し、導体材料のＣｕへの還元を行
った。ここで、還元温度が低すぎるとＣｕＯのＣｕへの
還元が充分行われず、また反対に還元温度が高すぎると
磁性体材料も還元され特性が劣化するため、還元温度は
そのようなことが起こらないように設定すべきである。The unsintered inductor from which the binder has been completely removed is heated in an alumina core tube furnace into which hydrogen gas is introduced at a flow rate of 0.5 liters/min using the normal temperature raising and lowering conditions shown in Figure 4.
Heat treatment was performed at a temperature of 0''C to reduce the conductor material to Cu.Here, if the reduction temperature is too low, the reduction of CuO to Cu will not be carried out sufficiently, and on the other hand, if the reduction temperature is too high, the magnetic Since the body material is also reduced and the properties deteriorate, the reduction temperature should be set to prevent this from occurring.
このとき、磁性材料はあらかじめ仮焼処理されているの
で完全なスピネル構造を有しており４００ ℃までの還
元で、磁性材料そのものが還元されることはない。At this time, since the magnetic material has been calcined in advance, it has a complete spinel structure, and the magnetic material itself is not reduced even when the temperature is reduced to 400°C.
つぎに還元工程を終えたチップインダクタは、第５図に
示す昇降温条件で９８０℃の温度で窒素雰囲気中で焼成
された。なお、焼成温度は内部導体の融点より低く、か
つ、磁性体が充分に焼結する温度に設定した。この焼成
工程には、還元工程で用いたものと同様の管状炉を用い
た。以上のようにして作製したチップインダクタの両端
に外部電極として金属銅ペーストを６００℃の窒素雰囲
気で焼付け、コイルのインダクタンスを取り出した。Next, the chip inductor that had undergone the reduction process was fired in a nitrogen atmosphere at a temperature of 980° C. under the temperature increasing and decreasing conditions shown in FIG. The firing temperature was set to be lower than the melting point of the internal conductor and at which the magnetic material was sufficiently sintered. In this firing step, a tubular furnace similar to that used in the reduction step was used. Metallic copper paste was baked as external electrodes on both ends of the chip inductor produced as described above in a nitrogen atmosphere at 600° C., and the inductance of the coil was taken out.
第６図に、外部電極を取り付けたチップインダクタの断
面図を示す、５は内部導体、６は及び７は、外部電極で
ある。なお、本実施例では外部電極に銅電極を用いたが
、その他の外部電極を用いてももちろん問題はない。FIG. 6 shows a cross-sectional view of a chip inductor with external electrodes attached. 5 is an internal conductor, and 6 and 7 are external electrodes. Note that although copper electrodes were used as the external electrodes in this embodiment, there is of course no problem in using other external electrodes.
以上の方法で作製されたチップインダクタは、外寸が直
径２．２ｍ＋＊、長さ４．０−であり、内部導体のター
ン数は１０であった。チップインダクタの特性を測定し
その結果を第２表にしめした。The chip inductor manufactured by the above method had an outer dimension of 2.2 m+* in diameter and 4.0 m in length, and the number of turns of the internal conductor was 10. The characteristics of the chip inductor were measured and the results are shown in Table 2.
第２表 測定結果
測定周波数、ＩＭ）仕
表からも明らかなように実用上充分な性能を示した。特
にＱ値は、ｉｍ／パラジウムを内部導体に用いた従来品
に比べ、大変大きな値を示した（銀／パラジウムを内部
導体に用いた場合、Ｑ値は２２）。Table 2 Measurement Results (Measurement Frequency, IM) As is clear from the table, it showed sufficient performance for practical use. In particular, the Q value was much larger than that of conventional products using im/palladium as the internal conductor (when silver/palladium was used as the internal conductor, the Q value was 22).
また、得られたチップインダクタは、完全モノリシック
構造のため、信鯨性、磁気シールド効果も良好であった
。In addition, the obtained chip inductor had a completely monolithic structure, so it had good reliability and magnetic shielding effect.
この結果を磁性材料の初透磁率に換算するとμが約２０
０となり、上記磁性材料の空気中での結果とほぼ同様の
性能かえられていることがわかる。When converting this result into the initial permeability of the magnetic material, μ is approximately 20
0, and it can be seen that the performance is almost the same as the result of the above magnetic material in air.
実施例２
以下本発明の第二の一実施例として、二・７ケルを内部
導体に用いたチップインダクタについて説明する。Embodiment 2 As a second embodiment of the present invention, a chip inductor using 2.7 Kel as an internal conductor will be described below.
磁性体材料にはＮ ｉ ０．３６ Ｚ ｎ ｏ、 ｂａ
Ｆｅｔ、 ｏｏｏ ａ、 ｏ。The magnetic material has N i 0.36 Z no, ba
Fet, ooo a, o.
を用いた。磁性体材料の出発原料として、工業用のＮｉ
ｐ、ＺｎＯ，Ｆｅ２Ｏ，を用意した。６Ｉ性体材料の合
成は、実施例１に述べた方法で行った。was used. Industrial Ni is used as a starting material for magnetic materials.
p, ZnO, and Fe2O were prepared. The 6I material was synthesized by the method described in Example 1.
得られた磁性体材料は、Ｘ線回折測定の結果スピネル構
造を有するＮｉ−Ｚｎフェライトであった。The obtained magnetic material was found to be Ni--Zn ferrite having a spinel structure as a result of X-ray diffraction measurement.
磁性体材料からの磁性体グリーンシートの作製は、実施
例１に述べた方法で行った。乾燥後のグリーンシート厚
みは約１２０μｍであった。導体ペーストは、実施例１
に述べた方法と同様の方法で、Ｎｉｐ粉を無機成分とし
て作製した。磁性体グリーンシートと導体ペーストから
、磁性体内部にコイル状の内部導体を有するグリーンチ
ップインダクタを作製し、空気中での有機バインダの除
去、窒素、水素混合雰囲気中でのＮｉＯのＮｉへの還元
、窒素雰囲気中での焼成、外部電極の焼付けを行いチッ
プインダクタを作製した。グリーンチップの作製からチ
ップインダクタまでの作製手順は、実施例１で述べた方
法に従った。ただし、ＮｉＯのＮｉへの還元は、窒素ガ
スを０．２リットル／分、水素ガスを１．８リットル／
分の流量で、第７図に示す昇降温常条件を用い４００℃
の温度で行った。また、焼成工程では、第８図に示す昇
降温常条件を用い１２５０℃の温度で、磁性体とニンケ
ル内部導体とを同時焼成した。A magnetic green sheet was produced from a magnetic material by the method described in Example 1. The thickness of the green sheet after drying was about 120 μm. The conductor paste is Example 1
Nip powder was prepared as an inorganic component using a method similar to that described in . A green chip inductor with a coiled internal conductor inside the magnetic material was fabricated from a magnetic green sheet and a conductive paste, and the organic binder was removed in air and NiO was reduced to Ni in a nitrogen and hydrogen mixed atmosphere. A chip inductor was fabricated by firing in a nitrogen atmosphere and baking the external electrodes. The manufacturing procedure from the green chip to the chip inductor followed the method described in Example 1. However, to reduce NiO to Ni, use nitrogen gas at 0.2 liters/minute and hydrogen gas at 1.8 liters/minute.
With a flow rate of
It was carried out at a temperature of Further, in the firing process, the magnetic material and the Ninkel internal conductor were simultaneously fired at a temperature of 1250° C. using the normal temperature raising and lowering conditions shown in FIG.
以上の方法で作製されたチップインダクタは、外寸が直
径２．３ｍｍ、長さ３．８ｍ＋＊であり、内部導体のタ
ーン数は９．５であった。チップインダクタの特性を測
定しその結果を第３表にしめした。The chip inductor manufactured by the above method had an outer diameter of 2.3 mm, a length of 3.8 m+*, and the number of turns of the internal conductor was 9.5. The characteristics of the chip inductor were measured and the results are shown in Table 3.
第３表
測定周波数１１Ｍ１ｌｚ
第３表より明らかなように、本実施例で得られたチップ
インダクタは実用上充分な特性を示した。Table 3 Measurement Frequency 11M1lz As is clear from Table 3, the chip inductor obtained in this example exhibited practically sufficient characteristics.
また・得られたチップインダクタは、信乾性、磁気シー
ルド効果も良好であった。In addition, the obtained chip inductor had good reliability and magnetic shielding effect.
以上本発明の実施例として、銅及びニッケルを内部導体
に用いたチップインダクタについて説明した。なお、前
記の実施例では、内部導体を印刷した磁性体グリーンシ
ートを磁性体コアに巻き付け、内部導体をコイル状に形
成したが、例えば、磁性体グリーンシート上にコイル状
のＲＴｉパターン層と磁性体パターン層の印刷を行い、
これを連続的に繰り返し内部導体コイルを形成する方法
などを用いても、本実施例と同様のチップインダクタが
作製可能なことは言うまでもない。As an example of the present invention, a chip inductor using copper and nickel for the internal conductor has been described above. In the above embodiment, a magnetic green sheet with an internal conductor printed thereon was wound around a magnetic core to form the internal conductor in a coil shape. However, for example, a coiled RTi pattern layer and a magnetic Print the body pattern layer,
It goes without saying that a chip inductor similar to this example can also be produced by continuously repeating this process to form an internal conductor coil.
発明の効果
以上のように本発明は、磁性体と同時焼成する内部導体
材料に銅やニッケルなどの卑金属を用い、チップインダ
クタの低コスト化、高性能化を可能にするものである。Effects of the Invention As described above, the present invention uses a base metal such as copper or nickel as the internal conductor material that is co-fired with the magnetic material, thereby making it possible to reduce the cost and improve the performance of a chip inductor.
また、本発明のインダクタの製造方法においては、脱バ
インダ、還元、焼成の各工程を前記の構成条件で行うこ
とにより、低コスト、高性能、高信幀性を有するチップ
インダクタが製造可能となるものである。Furthermore, in the inductor manufacturing method of the present invention, by performing the binder removal, reduction, and firing steps under the above-mentioned configuration conditions, it is possible to manufacture a chip inductor with low cost, high performance, and high reliability. It is something.
図は本発明の一実施例におけるチップインダクタの巻回
時の斜視図、第３図、第４図、第５図は、本発明のチッ
プインダクタの製造方法における脱パインダニ程、還元
工程、焼成工程の温度プロファイルの一例を示すグラフ
、第６図は本発明の一実施例におけるチップインダクタ
の断面図、第７図、第８図は、本発明のチップインダク
タの製造方法における還元工程、焼成工程の温度プロフ
ァイルの一例を示すグラフである。
１・・・・・・磁性体グリーンシート、２・・・・・・
内部導体パターン、３・・・・・・磁性体コア、４・・
・・・・外部電極への取り出し部、５・・・・・・内部
導体、６，７・・・・・・外部電極。The figure is a perspective view of a chip inductor during winding according to an embodiment of the present invention, and FIGS. 3, 4, and 5 show a depine mite removal process, a reduction process, and a firing process in the method for manufacturing a chip inductor of the present invention. FIG. 6 is a cross-sectional view of a chip inductor in an embodiment of the present invention, and FIGS. 7 and 8 are graphs showing an example of the temperature profile of the chip inductor of the present invention. It is a graph showing an example of a temperature profile. 1...Magnetic green sheet, 2...
Internal conductor pattern, 3...Magnetic core, 4...
. . . Output portion to external electrode, 5 . . . Internal conductor, 6, 7 . . . External electrode.
Claims (13)
るコイル状の内部導体を有し、内部導体の両端に接続さ
れるインダクタンス取り出しのための１対の外部電極を
備えるインダクタであって、前記内部導体は卑金属であ
り、前記磁性体はフェライトであることを特徴とするイ
ンダクタ素子。(1) An inductor having a coil-shaped internal conductor formed by co-firing with the magnetic material inside a magnetic material, and a pair of external electrodes connected to both ends of the internal conductor for taking out inductance. The inductor element is characterized in that the internal conductor is a base metal and the magnetic material is ferrite.
クタ素子。(2) The inductor element according to claim (1), wherein the internal conductor is made of copper.
インダクタ素子。(3) The inductor element according to claim (1), wherein the internal conductor is made of nickel.
フェライトを主成分とすることを特徴とする請求項（１
）記載のインダクタ素子。(4) The internal conductor is copper and the magnetic material is Ni-Zn-Cu.
Claim (1) characterized in that the main component is ferrite.
) described inductor element.
フェライトを主成分とすることを特徴とする請求項（１
）記載のインダクタ素子。(5) The internal conductor is nickel and the magnetic material is Ni-Zn.
Claim (1) characterized in that the main component is ferrite.
) described inductor element.
る無機成分と、有機ビヒクルから成る導体ペーストを印
刷し、しかる後、前記磁性体グリーンシートもしくは、
前記磁性体による磁性体ペーストで積層することにより
磁性体内部にコイル状の内部導体を有する未焼結インダ
クタを作製する工程と、この未焼結インダクタを空気中
で熱処理し有機バインダの除去を行う工程と、しかる後
、水素もしくは水素と窒素の混合ガス雰囲気中で熱処理
して前記未焼結インダクタ内部のＣｕＯを金属Ｃｕに還
元する工程と、さらにこの還元済み未焼結インダクタを
窒素雰囲気中で焼結させる工程から成ることを特徴とす
るインダクタの製造方法。(6) Print a conductor paste consisting of an inorganic component mainly composed of CuO and an organic vehicle on a magnetic green sheet, and then print the magnetic green sheet or
A step of producing an unsintered inductor having a coil-shaped internal conductor inside the magnetic material by laminating magnetic paste made of the magnetic material, and heat-treating the unsintered inductor in air to remove the organic binder. a step of reducing the CuO inside the unsintered inductor to metal Cu by heat treatment in a hydrogen or a mixed gas atmosphere of hydrogen and nitrogen, and further heating the reduced unsintered inductor in a nitrogen atmosphere. A method for manufacturing an inductor, comprising a sintering step.
範囲であることを特徴とする請求項（６）記載のインダ
クタの製造方法。(7) The method for manufacturing an inductor according to claim (6), wherein the heat treatment temperature in air is in the range of 300°C to 800°C.
とを特徴とする請求項（６）記載のインダクタの製造方
法。(8) The method for manufacturing an inductor according to claim (6), wherein the reduction temperature is in the range of 100°C to 500°C.
ることを特徴とする請求項（６）記載のインダクタの製
造方法。(9) The method for manufacturing an inductor according to claim (6), wherein the sintering temperature is in the range of 850°C to 1050°C.
する無機成分と、有機ビヒクルから成る導体ペーストを
印刷し、しかる後、前記磁性体グリーンシートもしくは
、前記磁性体による磁性体ペーストで積層することによ
り磁性体内部に磁性体内部にコイル状の内部導体を有す
る未焼結インダクタを作製する工程と、この未焼結イン
ダクタを空気中で熱処理し有機バインダの除去を行う工
程と、しかる後、水素もしくは水素と窒素の混合ガス雰
囲気中で熱処理して前記未焼結インダクタ内部のＮｉＯ
を金属Ｎｉに還元する工程と、さらにこの還元済み未焼
結インダクタを窒素雰囲気中で焼結させる工程から成る
ことを特徴とするインダクタの製造方法。(10) A conductive paste consisting of an inorganic component mainly composed of NiO and an organic vehicle is printed on a magnetic green sheet, and then laminated with the magnetic green sheet or the magnetic paste made of the magnetic material. A step of fabricating a green inductor having a coil-shaped internal conductor inside the magnetic body by doing so, a step of heat-treating the green inductor in air to remove the organic binder, and then, The NiO inside the unsintered inductor is heat-treated in a hydrogen or hydrogen/nitrogen mixed gas atmosphere.
A method for manufacturing an inductor, comprising the steps of reducing Ni to metal Ni, and further sintering the reduced unsintered inductor in a nitrogen atmosphere.
の範囲であることを特徴とする請求項（１０）記載のイ
ンダクタの製造方法。(11) Heat treatment temperature in air is 300℃ to 900℃
11. The method of manufacturing an inductor according to claim 10, wherein the inductor is within the range of .
ことを特徴とする請求項（１０）記載のインダクタの製
造方法。(12) The method for manufacturing an inductor according to claim (10), wherein the reduction temperature is in the range of 200°C to 500°C.
あることを特徴とする請求項（１０）記載のインダクタ
の製造方法。(13) The method for manufacturing an inductor according to claim (10), wherein the sintering temperature is in the range of 1100°C to 1400°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21448989A JPH0378220A (en) | 1989-08-21 | 1989-08-21 | Inductor element and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21448989A JPH0378220A (en) | 1989-08-21 | 1989-08-21 | Inductor element and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0378220A true JPH0378220A (en) | 1991-04-03 |
Family
ID=16656563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21448989A Pending JPH0378220A (en) | 1989-08-21 | 1989-08-21 | Inductor element and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0378220A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010093061A (en) * | 2008-10-08 | 2010-04-22 | Murata Mfg Co Ltd | Method of manufacturing electronic component |
| WO2011093489A1 (en) * | 2010-02-01 | 2011-08-04 | 株式会社村田製作所 | Process for producing electronic component |
-
1989
- 1989-08-21 JP JP21448989A patent/JPH0378220A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010093061A (en) * | 2008-10-08 | 2010-04-22 | Murata Mfg Co Ltd | Method of manufacturing electronic component |
| WO2011093489A1 (en) * | 2010-02-01 | 2011-08-04 | 株式会社村田製作所 | Process for producing electronic component |
| CN102741956A (en) * | 2010-02-01 | 2012-10-17 | 株式会社村田制作所 | Method for manufacturing electronic component |
| US8590123B2 (en) | 2010-02-01 | 2013-11-26 | Murata Manufacturing Co., Ltd. | Method for producing electronic component |
| JP5382144B2 (en) * | 2010-02-01 | 2014-01-08 | 株式会社村田製作所 | Manufacturing method of electronic parts |
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