JPH0368514B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC extraction mechanism in an IC socket that facilitates IC extraction.

Conventional technology and problems Conventionally, so-called zero-insertion sockets are well-known, in which an IC socket is equipped with a contact release mechanism for the contacts in contact with the IC lead so that the IC can be ejected without any load. In the case of a chip, even if the contact resistance is in an open state, there is no clue and it is difficult to remove it, and if tweezers or the like are used to remove the contact, there is a risk of accidentally damaging the contact and it is inefficient.

As an IC ejecting device such as the one described above, one is known in which, for example, a socket is provided with a floating stand for mounting an IC that is supported by a spring and the IC is pushed up. Since push-up force is constantly applied, even if the IC is held down with the presser cover, there is a risk that it will tend to float and the contact will become unstable.Also, there is a limit to the amount of push-up, and the spring design It is also difficult.

In addition, there are some cases in which a suction cup is attached to the cover that holds the IC, and the IC is suctioned to the top surface of the IC so that the IC can be removed when the cover is opened. There is a risk that it may fall off or the suction cup may deteriorate and become unable to suction.

Structure of the invention The present invention does not cause the above problems, and
This device is designed to easily and reliably push up a certain amount of IC for removal, and as a means of this, the
A seesaw lever used for taking out the IC and a means for operating the seesaw lever are provided, and by pushing down the operating means, rotation of the seesaw lever at the inner bottom of the IC storage section is caused.
The operating means is configured to be pushed up from within the storage section for the removal, and the operating means applies rotational force to an IC storage frame disposed above the IC storage and to the seesaw lever that is lowered from the frame. By pressing down the IC housing frame body, the seesaw lever is rotated and the IC is
It is designed to push up the

Example Embodiments of the present invention will be described in detail below with reference to the drawings.

1 to 12 show a first embodiment, and FIG. 13 shows a second embodiment.

First embodiment (see Figures 1 to 12) In this embodiment, 1 is a socket board, and 2 is an IC.
The storage frame body, 3 is a seesaw lever, and 4 is an IC mounting stand.

Figures 3 to 5 are diagrams showing the structure of the socket base 1, Figures 6 to 9 are diagrams showing the structure of the IC housing frame 2, and Figures 10 and 11 are diagrams showing the structure of the seesaw lever 3 and the IC mounting frame. It is a diagram showing the structure of the stand 4, and FIG.
FIG. 2 is a diagram showing the assembled structure of each of the above elements.

The socket base 1 has a substantially rectangular IC accommodating portion 1a in its center, and has a large number of contacts 1b for contacting IC leads 5a planted along four or two sides of the inner periphery of the IC accommodating portion 1a. The seesaw lever 3 is installed in a seesaw manner at a corner of the IC accommodating portion 1a where the contact rows on each side are interrupted.

The seesaw lever 3 includes an IC push-up lever part 3b having a push-up part extending to an inner area along a side forming a corner of the IC housing part 1a, and a push-down lever part 3c extending from the corner toward an outer area. The protrusion 3a provided at the center is slidably fitted into the engagement groove 1c formed at the corner of the IC accommodating part, and the push-up lever part 3b and the push-down lever part 3c are alternately moved using the sliding part as a fulcrum. make a seesaw movement.

IC housing part 1 where the seesaw lever 3 is installed
A seesaw lever guide groove 1d running approximately diagonally from the corner towards the outer area is formed in the corner of a, and the push-down lever part 3c is formed in the guide groove 1d.
The bottom surface of the groove is sloped downward from the engagement groove 1c which is the fulcrum part toward the outer end, and the push-down lever part 3 is fitted.
The configuration allows pressing down of c.

A pair of the above seesaw levers 3 is constructed, and each
They are respectively installed at a pair of diagonal corners of the IC housing portion 1a. A partition wall 1i that partitions both seesaw levers 3 is provided on the bottom surface of the IC accommodating part 1a to prevent each seesaw lever 3 from moving freely inside the IC accommodating part 1a.

In the IC accommodating part 1a in which the seesaw lever 3 is installed as described above, the above-mentioned IC having substantially the same shape as the IC accommodating part 1a is placed.
The mounting table 4 is placed, and its corner portion is stacked on the push-up lever portion 3b. As a result, one of the seesaw levers 3 has its push-up lever portion 3b at the IC.
The other seesaw lever 3 supports an area along one diagonal corner forming side of the IC mounting table 4, and its push-up lever portion 3b supports an area along the other diagonal corner forming side of the IC mounting table 4. Then, with the seesaw movement of the seesaw lever 3, the IC mounting base 4
can be pushed up and down.

That is, the push-down lever portion 3c of the seesaw lever 3
By pushing down, the push-up lever part 3b is flipped up, and the pair of diagonal corners of the IC mounting base 4 and the IC 5 mounted thereon are pushed up and brought to the contact release position (see Fig. 12A). , the IC platform 4 is lowered by pushing down the IC 5, and as the IC platform 4 is lowered, the push-up lever section 3b is rotated downward, and the push-down lever section 3c is flipped up and brought to the contact position. (See Figure 12B).

In order to smoothly move the IC mounting table 4 up and down,
A guide groove 1 in which guide pieces 4a protruding from a pair of diagonal corners of the IC mounting table 4 are formed from the other diagonal corner of the IC accommodating portion 1a toward the outer area.
Slip onto e.

Also, a plurality of legs 4b are vertically lowered from the IC mounting base 4,
A window 1 in which the leg 4b is bored in the center of the IC housing part 1a
Insert it along the inner wall of f, and when the IC mounting table 4 rises, the legs 4
A hook 4c formed at the tip of b is engaged with the edge of the window defining wall to define the amount of rise and to prevent the window from slipping out.

The above IC is attached to the socket base 1 formed as above.
The housing frame 2 is attached.

The IC accommodating frame 2 has an IC accommodating part 2a opened right above the IC accommodating part 1a of the socket base 1,
The IC storage section 2a is placed on four or two sides of the IC storage section 2a.
A large number of open contact housing grooves 2b are formed in the IC housing part 1 by attaching the IC housing frame 2.
A and the IC housing portion 2a are made to correspond vertically, and the contact 1b is inserted into the contact housing groove 2b.

In order to form the corresponding state of the IC housing frame 2,
A guide piece 2c is formed on the side wall of the housing frame 2,
The guide piece 2c is slid into a guide groove 1g formed on the side wall of the socket base 1 to set the attachment position and to move vertically up and down using this as a guide.

In addition, a plurality of legs 2d are vertically lowered from the IC housing frame 2, and the legs 2d are inserted into guide holes 1h drilled in the socket base 1 to guide vertical movement, and a plurality of legs 2d are formed at the tips of the legs 2d when rising. The hook 2e is engaged with the hole wall to set the raised position and to prevent the hook from coming off.

Further, the push-down lever portion 3 of the seesaw lever 3
As a means for applying a downward force to the IC housing frame 2, the pusher 2f is lowered from the IC housing frame 2 and brought into contact with the upper surface of the end of the push lever 3c.

As shown in FIG. 12A, the IC housing frame 2 is in a depressed state when the IC is attached or detached, and as a result, the pusher 2f is moved to the push-down lever portion 3c of the seesaw lever 3.
is pressed and rotated to flip up the push-up lever part 3b from the inner bottom of the IC housing part, thereby forming a state in which the IC mounting table 4 is raised to a high position.

In the same state, the IC 5 is mounted on the IC mounting base 4 and a downward force is applied to it. As a result, as shown in FIG. 12B, the IC mounting table 4 rotates the push-up lever part 3b of the seesaw lever 3 downward at the inner bottom of the IC housing part, and as a reaction, flips up the push-down lever part 3c and at the same time Pusher 2f of accommodation frame 2
is pushed up to form a state in which the frame body 2 is pushed up to a high position.

In this state, the leads 5a disposed on each side of the IC 5 are elastically captured from both sides by the contacts 1b to obtain contact pressure. In other words, they come into contact.

When the IC housing frame 2 is pushed down from this state, the seesaw lever 3 moves as described above, and the IC
The mounting table 4 and the IC 5 placed thereon are placed on the 12th table again.
As shown in Figure A, push up to a high position to form a contact released state. In the same state, IC5 can be easily extracted and mounted.

Second Embodiment (See FIG. 13) In this embodiment, the push-up lever portion 3 of the seesaw lever 3 is used without using the IC mounting base 4 in the first embodiment.
This figure shows a case in which the IC 5 is directly supported on the upper surface of the IC 5, and the lower contact position shown in FIG. 13A and the IC pushed-up state shown in FIG.

In the above embodiment, the pusher 2f and the end of the push-down lever portion 3c of the seesaw lever 3 are brought into contact with each other as described above, but as another example, they may be linked together by a shaft.

Effects of the Invention As explained above, the present invention provides a seesaw lever for taking out an IC housed in an IC housing section, and a seesaw lever provided on an IC socket and a seesaw lever that is movable up and down. Equipped with operating means. By pressing down on the operating means, the seesaw lever is rotated in conjunction with this, and the IC can be pushed up reliably, making it effective as a means for ejecting the IC from the above-mentioned IC socket. can be implemented.

In particular, the present invention provides a method for removing an IC when the IC is accommodated in the IC housing part of the IC socket and is in contact with the IC socket.
That is, by pressing down on the operating means from the outside to remove the IC that is hard to remove from the IC housing, a seesaw lever is rotated at the inner bottom of the IC housing, allowing the IC to be easily and reliably pushed up and removed from within the IC housing. It can be served as a stool.

Further, as described above, the present invention is an IC ejecting mechanism for an IC socket with an internal IC, and has a rational and simple structure in which the operating means is pushed down and a seesaw lever is rotated at the inner bottom of the IC accommodating part. A take-out mechanism can be configured.

Further, in the present invention, the operating means is formed of an IC housing frame and a pusher lowered from the IC housing frame, and the IC housing frame is arranged so as to form an IC housing section above the IC housing section. By pushing down the frame on the four sides around the accommodating part (IC accommodating part), the seesaw lever can be rotated and the IC can be pushed up, so the IC extraction operation can be performed extremely easily. , it is possible to effectively cope with the automation of IC extraction in which the IC accommodation frame is pushed down by a robot to take out the IC accommodated in the IC accommodation section.

[Brief explanation of drawings]

1 to 12 show a first embodiment of the present invention, FIG. 1 is a plan view of an IC socket, and FIG. 2A is a plan view of an IC socket.
Figure 1 is a cross-sectional view taken along the line A-A showing the pushed up state, Figure B is the same cross-sectional view showing the IC pushed down state, and Figure C is the cross-sectional view taken along the line B-B in Figure 1 showing the pushed up state of the IC storage frame. FIG. 3 is a plan view of the socket base, FIG. 4 is a sectional view taken along line C-C in FIG. 3, and FIG. 6 is a plan view of the IC housing frame, FIG. 7 is a side view of the same, FIG. 8 is a sectional view taken along the line E-E of FIG. 6, and FIG.
The figure is a rear view of the same, Figure 10 is an exploded perspective view of the IC mounting base and seesaw lever, Figure 11 is an assembled perspective view of the same, Figure 12A is a sectional view of the socket showing the IC pushed up state,
Figure B is the same cross-sectional view showing the IC pressed down state, No. 13
The figures show a second embodiment, in which Figure A is a sectional view of the socket showing the IC pushed up state, and Figure B is the same sectional view showing the IC pushed down state. 1...Socket base, 1a...IC housing section, 2
...IC housing frame body, 2f...Pushing element, 3...Seesaw lever, 3b...Pushing lever part, 3c...
...Push lever part, 4...IC mounting stand, 5...IC.

Claims (1)

[Scope of Claims] 1. The IC socket is provided with a seesaw lever for taking out the IC accommodated in the IC storage portion, and the IC socket is also provided with a seesaw lever operating means that is movable up and down, The seesaw lever operating means and the seesaw lever are arranged so that when the operating means is pressed down, the seesaw lever is rotated at the inner bottom of the IC accommodating part and the IC is pushed up from inside the IC accommodating part. The device is characterized in that it has an IC storage frame that forms an IC storage section that opens above the IC storage section, and a pusher that applies the rotational force to a seesaw lever that is lowered from the IC storage frame.
IC extraction mechanism in IC socket. 2. The IC ejecting mechanism in the IC socket according to claim 1, wherein the IC accommodating frame has a contact accommodating groove planted on the inner periphery of the IC accommodating portion.