JPH0365254U - - Google Patents
Info
- Publication number
- JPH0365254U JPH0365254U JP12605889U JP12605889U JPH0365254U JP H0365254 U JPH0365254 U JP H0365254U JP 12605889 U JP12605889 U JP 12605889U JP 12605889 U JP12605889 U JP 12605889U JP H0365254 U JPH0365254 U JP H0365254U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- terminal
- flat plate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000006378 damage Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案第一実施例の半導体装置の断面
図、第２図は本考案第二実施例の半導体装置の断
面図、第３図は従来の基板を二段重ねした半導体
装置の断面図、第４図は同じく一枚の基板のみを
利用した半導体の断面図、第５図は同じく一般的
な半導体装置を示す断面図である。
２０……外装、２１，２２……回路基板、２３
……半導体素子、２４……電極取り出し用端子、
２６……平板部、２７……ばね機構、２８……破
壊防止用突起。
FIG. 1 is a cross-sectional view of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a semiconductor device according to a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a semiconductor device made by stacking two conventional substrates. FIG. 4 is a sectional view of a semiconductor using only one substrate, and FIG. 5 is a sectional view of a general semiconductor device. 20... Exterior, 21, 22... Circuit board, 23
...Semiconductor element, 24...Terminal for electrode extraction,
26... Flat plate portion, 27... Spring mechanism, 28... Destruction prevention protrusion.
Claims (1)
取り出し用端子が外装により封止される半導体装
置において、前記電極取り出し用端子は、外部に
熱を放熱する平板部と、前記外装の膨張、収縮時
に加わる応力を吸収するばね機構とを備え、前記
平板部の半導体装置を搭載する回路基板側に、半
導体素子の破壊防止用突起がばね機構の収縮方向
に突出形成されたことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor element mounted on a circuit board and a terminal for taking out an electrode are sealed by an outer case, the terminal for taking out an electrode has a flat plate part that radiates heat to the outside, and a part that is applied when the outer case expands or contracts. 1. A semiconductor device comprising: a spring mechanism for absorbing stress; and a protrusion for preventing destruction of a semiconductor element is formed on a circuit board side of the flat plate part on which the semiconductor device is mounted, protruding in a direction in which the spring mechanism contracts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989126058U JPH0727639Y2 (en) | 1989-10-27 | 1989-10-27 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989126058U JPH0727639Y2 (en) | 1989-10-27 | 1989-10-27 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0365254U true JPH0365254U (en) | 1991-06-25 |
| JPH0727639Y2 JPH0727639Y2 (en) | 1995-06-21 |
Family
ID=31673897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989126058U Expired - Fee Related JPH0727639Y2 (en) | 1989-10-27 | 1989-10-27 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727639Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165499A (en) * | 2004-06-08 | 2006-06-22 | Fuji Electric Device Technology Co Ltd | Semiconductor device |
| DE102011085313B4 (en) * | 2010-11-11 | 2020-12-24 | Mitsubishi Electric Corporation | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01302753A (en) * | 1988-05-30 | 1989-12-06 | Sansha Electric Mfg Co Ltd | Resin-sealed semiconductor device |
-
1989
- 1989-10-27 JP JP1989126058U patent/JPH0727639Y2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01302753A (en) * | 1988-05-30 | 1989-12-06 | Sansha Electric Mfg Co Ltd | Resin-sealed semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165499A (en) * | 2004-06-08 | 2006-06-22 | Fuji Electric Device Technology Co Ltd | Semiconductor device |
| DE102011085313B4 (en) * | 2010-11-11 | 2020-12-24 | Mitsubishi Electric Corporation | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727639Y2 (en) | 1995-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |