JPH0359648U - - Google Patents
Info
- Publication number
- JPH0359648U JPH0359648U JP11978989U JP11978989U JPH0359648U JP H0359648 U JPH0359648 U JP H0359648U JP 11978989 U JP11978989 U JP 11978989U JP 11978989 U JP11978989 U JP 11978989U JP H0359648 U JPH0359648 U JP H0359648U
- Authority
- JP
- Japan
- Prior art keywords
- recessed portion
- view
- sectional
- circuit board
- package type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案ＩＣの一実施例を示す斜視図、
第２図は第１図の−線に沿うリード脚の縦断
面図、第３図は本考案ＩＣを回路基板に実装させ
た状態を示す一部断面側面図、第４図はリード脚
に設ける凹陥部の各種態様例を示す断面略図、第
５図は凹陥部への半田付着形態の他の例を示す断
面略図である。
１……フラツトパツケージ型ＩＣ、３……リー
ド脚、４……凹陥部、５……半田。
FIG. 1 is a perspective view showing an embodiment of the IC of the present invention;
Fig. 2 is a longitudinal cross-sectional view of the lead leg taken along the - line in Fig. 1, Fig. 3 is a partial cross-sectional side view showing the IC of the present invention mounted on a circuit board, and Fig. 4 is a longitudinal cross-sectional view of the lead leg provided on the lead leg. FIG. 5 is a schematic cross-sectional view showing various embodiments of the recessed portion, and FIG. 5 is a schematic cross-sectional view showing another example of the form of solder attachment to the recessed portion. 1...Flat package type IC, 3...Lead leg, 4...Concave portion, 5...Solder.
Claims (1)
を設けてなると共に該凹陥部内に半田を付着させ
てなるリード脚を備えていることを特徴とするフ
ラツトパツケージ型ＩＣ。 A flat package type IC characterized in that it has a recessed portion on a surface to be bonded to a circuit board for mounting, and has lead legs formed by adhering solder inside the recessed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989119789U JP2523512Y2 (en) | 1989-10-13 | 1989-10-13 | Flat package type IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989119789U JP2523512Y2 (en) | 1989-10-13 | 1989-10-13 | Flat package type IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0359648U true JPH0359648U (en) | 1991-06-12 |
| JP2523512Y2 JP2523512Y2 (en) | 1997-01-29 |
Family
ID=31667887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989119789U Expired - Lifetime JP2523512Y2 (en) | 1989-10-13 | 1989-10-13 | Flat package type IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2523512Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06270452A (en) * | 1993-03-19 | 1994-09-27 | Sharp Corp | Serial printer |
| JP2006260961A (en) * | 2005-03-17 | 2006-09-28 | D D K Ltd | Electronic component and its manufacturing method |
| JP2006278663A (en) * | 2005-03-29 | 2006-10-12 | Tokyo Coil Engineering Kk | Surface mounting component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01140647A (en) * | 1987-11-27 | 1989-06-01 | Hitachi Ltd | Surface mount semiconductor package |
-
1989
- 1989-10-13 JP JP1989119789U patent/JP2523512Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01140647A (en) * | 1987-11-27 | 1989-06-01 | Hitachi Ltd | Surface mount semiconductor package |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06270452A (en) * | 1993-03-19 | 1994-09-27 | Sharp Corp | Serial printer |
| JP2006260961A (en) * | 2005-03-17 | 2006-09-28 | D D K Ltd | Electronic component and its manufacturing method |
| JP2006278663A (en) * | 2005-03-29 | 2006-10-12 | Tokyo Coil Engineering Kk | Surface mounting component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2523512Y2 (en) | 1997-01-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |