JPH0357523A - Dividing device for base plate - Google Patents

Abstract

PURPOSE:To accumulate unit base plates in the arrangement at a division time by providing a containing part for unit base plates in a lower blanking die of a dividing device for the base plate and storing the unit base plates blanked by using vacuum suction in a tote container. CONSTITUTION:A multi-part layout plate 10 is divided by upper and lower blanking dies 22,30 into unit base plats 11 and scrap parts 15. A containing part 38 for unit base plates is provided in the lower blanking die 30 and the blanked unit base plates 11 are dropped in the arrangement of a multipart layout base plate 10 and contained by a vacuum suction means 68 into a tote box 90 in that arrangement. Consequently, plural unit base plates 11 can be accumulated without changing the arrangement at a division time.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a multi-panel board dividing device used in an electronic circuit board assembly process.

(B) Conventional Technology In the process of assembling electronic circuit boards, a method has traditionally been widely used in which electronic components are mounted on a multi-sided board and then the board is divided into a plurality of boards using a punching die. It is desirable that the punched unit substrates be automatically stacked up in an orderly manner. When it comes to stacking punched items in an orderly manner, the idea of the gods has already been achieved in common press machines. In the punching apparatus described in Japanese Patent Application Laid-Open No. 58-329, a magazine is arranged below the processing position of the press machine. An actuator is provided below the magazine to raise and lower the magazine. An empty magazine is located upstream of the magazine, and a pushing means for pushing the empty magazine downstream is arranged.

On the other hand, a conveyor is arranged downstream of the magazine to convey the magazine at an angle. Materials punched from a plate by a press machine are stored one by one in a magazine that is raised by an actuator. When the magazine is full, it is lowered and the ejecting means transport the empty magazine to the bottom of the press machine. At the same time, the magazine full of materials is transferred by a conveyor and sent to the next process.

(c) Problems to be Solved by the Invention The above-mentioned apparatus is designed to be suitable for the work of punching out identically shaped materials one by one and stacking them one by one starting from the punched area. However, when obtaining multiple unit boards from a multi-panel board, many unit boards are processed at once.
The above-mentioned device cannot be applied as is because it occurs in a geographically dispersed manner and the shape and circuit design of each unit board may be different. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an apparatus capable of stacking a plurality of unit substrates without changing their arrangement at the time of division.

(d) Means for Solving the Problems The present invention provides a support member for supporting a multi-panel board formed by partitioning a plurality of unit boards with punching lines in one board, and a multi-panel board on the support member. An upper punching die and a lower punching die are provided for dividing the multi-sided substrate into unit substrates and scrap parts by approaching the substrate from above and below.

The lower punching die is formed with a unit substrate storage portion into which the punched unit substrates are dropped and accommodated as they are arranged in the multi-thickness substrate. Further, a vacuum suction means is provided which approaches the unit substrate storage section, vacuum suctions the unit substrate groups all at once, and loads the unit substrate groups into the returnable box without disturbing the arrangement.

Further, in the present invention, when the vacuum suction means suctions the unit substrate, a push-up means is provided for pushing up the unit substrate from the unit substrate storage portion.

Further, in the present invention, a control means is provided for controlling the fall distance of the unit substrates so that they do not exceed a certain value when the unit substrates are loaded in the returnable box.

Further, in the present invention, there is provided a scrap transfer means that uses a three-dimensionally moving hand section to grasp and remove the scrap portion left on the support member.

(E) Operation When the upper punching die and the lower punching die approach the multi-sided board on the support member from above and below, respectively, and divide it into unit boards and scrap parts, the scrap parts are placed on the support member. The remainder is grabbed by the scrap transfer means and removed. On the other hand, the unit substrate falls into and is accommodated in the unit substrate accommodating section. The vacuum suction means vacuum suctions the unit substrates in the unit substrate storage section, and loads them into a returnable box while maintaining the arrangement in the multi-sided substrate.

The pushing-up means pushes up the unit substrate from the unit-substrate accommodating portion to facilitate suction by the vacuum suction means.

The control means limits the falling distance of the unit substrates to prevent the unit substrates from being scattered. The scrap transfer means removes scrap from the support member to enable reception of the next multi-sided board.

(C) Embodiment The outline of the substrate dividing apparatus 1 is shown in FIGS. 1 to 3. This board dividing apparatus 1 is composed of a unit board punching section 2, a unit board transfer section 3, a height detecting section 4, a returnable box positioning section 5, and a returnable box transport section 6.

The unit board punching section 2 will be explained based on FIGS. 1 to 4. In FIG. 4, numeral 10 is a multi-sided board, and four unit boards 11 are divided by punching lines l2. The punching line 12 consists of a through groove portion 13 and perforated connecting portions 14 left here and there. The connecting portion l4 is provided at the center of each side of the unit substrate 1l. The portion other than the unit substrate 11 becomes a square-shaped scrap portion 15.

The multi-sided board 11 has a pair of guide rail-shaped support members 1.
6.17 (one not shown in the figure). A notch 18 is formed near the center of one of the supporting members 16 in the extending direction (FIG. '8).

A hand portion 53 of a robot 50, which is a scrap transfer means to be described later, enters into this cutout portion 18, and grasps and lifts the scrap portion 15. A mounting deck l9 projects above the support members 16 and 17, and an upper punching die 22 is supported here by a pair of guide rods 20 and an air cylinder 21. The mounting deck 19 has an inverted L-shape, and its vertical portion is supported by the side edges of the base (FIG. 5). From the opposite side edge of the base 9 is a support wall 46.
is rising.

The deck vertical portion and the support wall 46 face each other and extend below the unit substrate transfer section 3. The rod 23 of the air cylinder 21 is a mold support plate 2 to which the upper punching mold 22 is fixed.
4 via a joint 25. Upper punching mold 2
2 includes nine suppressing parts 26 that press the scrap part 15 from above and 16 punches 27 that punch out the unit board 11.
is formed. The punches 27 protrude below the pushing part 26, and four punches 27 are arranged for each unit board 11 so as to be in contact with just inside the connecting part 14. The upper punching die 22 is raised or lowered using the air cylinder 21 as a driving source. On the other hand, below and facing the multi-sided substrate 10, a lower punching die 30 is supported on a mounting plate 31 by an air cylinder 32 and a pair of guide rods 33. The rod 34 of the air cylinder 32 is connected via a joint 35 to a mold support plate 36 to which the lower punching mold 30 is fixed. A support portion 37 that supports the scrap portion 15 from below is formed in the lower punching die 30. The support part 37 is in the shape of a box like the scrap part 15, and the recessed part surrounded by the support part 37 is a unit board storage part 38.
It becomes. The unit board accommodating portion 38 is formed slightly wider than the unit board 11. Inside the lower punching die 30, there is an air cylinder 4 that serves as a unit board pusher.
Two 0's are embedded in each unit board, that is, eight in total, and a protruding plate 42 fixed to the tip of the rod 41 of each air cylinder 40 is exposed on the bottom surface of the unit board accommodating portion 38. The mounting plate 31 supports the unit board punching part 2 and the unit board transfer part 3 while supporting the lower punching die 30.
Go back and forth between.

For this purpose, horizontal rails 45 are fixed facing each other on the vertical part of the mounting deck 19 and inward of the support wall 46, and the mounting plate 31 is supported by a slider 44 that slides on the rails 45 via a connecting block 43. ing. Mounting plate 3
1 is given power for movement by a drive source (not shown).

In FIGS. 8 and 9, 50 is a robot which is the scrap transfer means described above. The robot 50 is of a cylindrical coordinate type and is composed of a main body 51, an arm 52, and a hand part 53. After the hand part 53 grips the scrap part 15, the arm 52 rises, rotates 180, and places it in the scrap storage box 54. Drop in the scrap part 15.

Next, the unit substrate transfer section 3 will be explained based on FIGS. 1 to 3. 60 is a base, and a pair of mounting plates 61 and 62 extend vertically upward from both ends of the base 60. A rodless cylinder 63 is spanned between the mounting plates 61 and 62. Slider 6 of rodless cylinder 63
A mounting block 65 is fixed to 4. Bearing portions of a pair of guide rods 66 and an air cylinder 67 are fixed to the upper surface of the mounting block 65. Guide rod 6
At the lower end of the vacuum suction unit 68 is a support block 71.
is supported. The vacuum suction unit 68 includes a guide rod 66, an air cylinder 67, a mounting block 65, a support block 71, . It is composed of a vacuum pad 72. The rod 69 of the air cylinder 67 is connected to a support block 71 via a joint 70. Eight vacuum pads 72 are attached to the lower surface of the support block 71, and each vacuum pad 72 is connected to a vacuum source via a vacuum suction hose (not shown). Two vacuum pads 72 are arranged on each unit board. The vacuum adsorption unit 68 uses the rodless cylinder 63 as a driving source,
It slides from right above the lower punching die 30 to right above the returnable box lifting unit 101 of the returnable box positioning section 5.

Next, the height detection section 4 will be explained. In Figure 3,
76 is a mounting angle provided on the base 6o. An air cylinder 77 and bearing portions of a pair of guide rods 78 are horizontally attached to the mounting angle 76. Guide rod 78 supports mounting block 82 via connecting block 81 . The rod 79 of the air cylinder 77 is connected to a connecting block 81 via a joint 80. As shown in FIG. 1, a rod 83 having a detection plate 85 fixed to its lower end is supported on the lower surface of the mounting block 82 so as to be movable up and down. The rod 83 is urged downward by a spring 84. A block 86 is installed on the bottom surface of the mounting block 82.
SI1 is attached, and a switch 87 is attached to this. The above-mentioned mounting angle 76, air cylinder 77, guide rod 78, connection block 8L mounting block 82,
The rod 83, the spring 84, the detection plate 85, the block 86, and the switch 87 constitute a height detection unit 88.

Next, the returnable box positioning section 5 will be explained. Reference numeral 92 denotes a base on which a pair of guide rods 94 are erected and a collennire heater 91 is attached. Elevator 91 is base 92
It is raised and lowered by the upper jack screw 93. A nut 95 is fixed to the lower surface of the elevator 91, and a jack screw 93 is hinged to this nut. A motor 98 is attached to the base 92 via a mounting angle 97. A belt 100 is stretched around a pulley 99 fixed to the shaft of the motor 98 and a pulley 96 of the jack screw 93. When the shaft of the motor 98 rotates, the jack screw 93 also rotates, and the elevator 91 moves up and down. The elevator 91 has a conveyor 89, which carries returnable boxes 9o.
support. Conveyor 89, elevator 91, base 92, jack screw 93, guide rod 94, nut 95, boobies 96 and 99, motor 98, belt 1oO
Thus, a returnable box lifting unit 101 is configured.

Next, the returnable box transport section 6 will be explained. Here are the top and bottom 2
Stage conveyors 105 and 106 are provided to feed empty reusable containers v90 to the reusable box positioning section 5, and to transport unit substrates l1.
Transport the returnable box 9o full of products to the next process.

FIG. 10 shows the connection configuration of each element. The substrate dividing apparatus 1 of the present invention is controlled by a control device 8.

A unit board punching section 2 , a unit board transfer section 3 , a height detection section 4 , and a returnable box positioning section 5 are connected to the control device 8 via an input/output interface 7 .

Next, the operation will be explained. Initially, the lower punching die 30 is below the upper punching die 22, the upper punching die 22 is in the raised position, and the lower punching die 30 is in the lowered position. The multi-panel board 10 with electronic components mounted thereon arrives after being pushed by a transport member (not shown), and is positioned by a positioning member (FIG. 5). Next, as shown in Figure 6, the lower punching die 3
0 rises, lifting the multi-sided substrate 10 from the stepped portions of the supporting members 16 and 17. Next, as shown in FIG. 7, the upper punching die 22 descends, and the pressing part 26 pinches the scrap part 15 between it and the supporting part 37, and the bunch 27 pushes the unit board 11 to push the connecting part 14. break. The punched unit board 11 falls and is accommodated in the unit board accommodating portion 38. After this, the upper punching die 22 and the lower punching die 30
moves up and down and returns to its original position (the position shown in Figure 5).

A scrap portion 15 remains on the support members 16 and 17. The scrap portion 15 is stored in a scrap storage box 54 by the robot 50 as shown in FIGS. 8 and 9. The lower punching die 30 slides in the horizontal direction and arrives directly below the vacuum suction unit 68 waiting at the unit substrate transfer section 3. After the lower punching die 30 stops at a predetermined position, the air cylinder 40
The unit substrate 11 is pushed up by the protrusion plate 42 above the upper level of the lower punching die 30. In the unit substrate transfer section 3, the air cylinder 67 extends the rod 69 to lower the support block 71, and the vacuum pad 72 moves the unit substrate 11.
Vacuum adsorption. After vacuum suctioning the unit substrate 11, the support block 7l rises to its original position. In the elongation and height detection section 4, an air cylinder 77 extends a rod 79, and a height detection unit 88 is positioned directly above the returnable box 90. When the elevator 91 is raised by the drive of the motor 98, the bottom surface of the returnable box 90 or a certain unit plate 11 stacked on the bottom surface comes into contact with the detection plate 85. When the detection plate 85 is pushed up a little and the switch 87 is activated, the motor 98 is stopped. The height data of the elevator 91 at this time is stored in the control device 8. Next, when the elevator 91 descends, the air cylinder 77 retracts the rod 79 and the height detection unit 88 disappears from above the returnable box 90. The elevator 91 ascends based on the data stored by the control device 8. Next, the rodless cylinder 63
The vacuum suction unit 68 moves directly above the returnable box 90.

When the air cylinder 67 extends the rod 69, the support block 71 descends to a certain height.

The unit substrate 11 attracted to the vacuum pad 72 and the bottom surface of the returnable box 90 or are dropped into the returnable box 90 while stacked on the bottom surface. Since the falling IFIIt is small, 4
The number of substrates 11 will not be disturbed during or after falling. Repeat the following steps in the same way. Every time the work of storing unit boards in the returnable box 90 is completed, the height detection unit 4 advances the mounting block 82 to the top of the elevator 91 in place of the vacuum suction unit 68, and in response, the elevator 91 also rises. , check the stacking height of the unit substrate 11. Based on this, the height of the elevator 91 when receiving the next unit board 11 is determined.

The stacking height inspection of the unit substrates 11 does not necessarily have to be carried out every time, but may be carried out once every time a number of unit substrates 11 are stacked up, and during that time the elevator 91 is lowered at a constant pitch. . When the pile of unit boards 11 in the returnable box 90 reaches a predetermined height, the conveyor 89
The heights of the boxes are adjusted to the conveyor 105, and the returnable boxes 90 are pulled from the conveyor 89 to the conveyor 105. After that, the elevator 91 descends and the conveyor 89 is placed on the conveyor 106, and the returnable box 90 is transferred from the conveyor 106 to the conveyor 89.
receive.

(G) Effects of the Invention In the present invention, a unit board storage part is provided in the lower punched metal willow, the punched unit board is stored in the unit board storage part as it is in the multi-paneled board, and the unit board is vacuum-adsorbed from there. Since it is stored in a returnable box, a plurality of unit boards can be stacked without changing the arrangement at the time of division.

Further, since the pushing-up means for pushing up the unit substrate from the unit-substrate accommodating part is provided, there is no need for the vacuum suction means to enter the unit-substrate accommodating part. This means that unit substrates of various shapes can be accommodated simply by arranging the vacuum pads in a flat manner.

In addition, when loading unit boards into a returnable box, we controlled the fall distance of the unit boards so that they do not exceed a certain value, so it is possible to pile up a pile of unit boards without scattering the unit boards inside the returnable box. be able to.

Further, since the scrap part is removed by the three-dimensionally moving hand part, there is no need to set a special scrap part discharge route.

[Brief explanation of drawings]

The figures show one embodiment of the present invention, and FIGS. 1 and 2 are partial cross-sectional side views of the substrate cutting device, each showing different states. FIG. 3 is a plan view of the substrate cutting device, and FIG. Figure 4 is a perspective view of the unit board punching section, Figures 5 to 7 are partially sectional side views showing a series of operations, viewed from a different angle from Figures 1 and 2, and Figure 8. - Figure 9 is a plan view and side view showing the scrap transfer means, and Figure 10 is a block diagram showing the electrical configuration. DESCRIPTION OF SYMBOLS 1... Board dividing device, 12... Punching line, 11.
・・Unit board, 10・゜・Multi-sided board, 16, 17・
...Supporting member, 15...Scrap part, 22...Upper punching die, 30...Lower punching die, 38...Unit board storage section, 90...Returnable box, 68... ... Vacuum adsorption unit (vacuum adsorption means), 40 ... Air cylinder (push-up 1,000 p.), 8 ... Control device (control means), 53.
...Hand part, 50...Robot (scrap transfer means).

Claims (4)

[Claims] (1) A multi-panel board formed by dividing a plurality of unit boards into one board with punching lines, a support member for the multi-panel board, and a multi-panel board on the support member from above and below. An upper punching die and a lower punching die are formed in the lower punching die to divide the multi-sided board into a unit board and a scrap part by approaching each other, and the punched unit board is formed into a multi-sided die. A unit board accommodating part for dropping and accommodating the board as arranged in the board, and a unit board accommodating part for approaching the unit board accommodating part and vacuum suctioning a group of unit boards at once, and loading these unit board groups into a returnable box without changing the arrangement. A substrate dividing device comprising vacuum suction means. (2) The substrate dividing apparatus according to claim 1, further comprising push-up means for pushing up the unit substrate from the unit-substrate accommodating portion when the vacuum suction means sucks the unit substrate. (3) The substrate dividing apparatus according to claim 1, further comprising a control means for controlling the fall distance of the unit substrates so as not to exceed a certain value when the unit substrates are loaded in the returnable box. (4) The substrate dividing apparatus according to claim 1, further comprising a scrap transfer means for grasping and removing the scrap portion left on the support member by a three-dimensionally moving hand portion.