JPH0353549Y2 - - Google Patents

Description

[Detailed Description of the Invention] Purpose of the Invention [Industrial Field of Application] The present invention relates to an assembly structure of laminated busbar wiring boards housed inside an electrical junction box used for wiring electrical circuits of automobiles, for example.

[Prior Art] A busbar wiring board is generally constructed by disposing a plurality of busbars punched into a desired pattern from a single thin sheet metal and disposed on an insulating substrate, and is usually used in a plurality of stacked layers.

In order to prevent the generation of leakage current between the busbars in such a laminated busbar wiring board, the applicant has previously developed an assembly structure as shown in FIG. This is the insulating substrate a for each layer.
A busbar mounting groove c deeper than the thickness of the busbar b is provided on the front surface of the busbar b, and a corresponding protrusion d is provided on the back surface of the busbar b, so that the busbar b is sandwiched between the upper and lower insulating substrates.

[Problems to be Solved by the Invention] In the assembly structure described above, it is necessary to provide a clearance as shown by the symbol S in FIG. 4B for dimensional accuracy. If the dimensional accuracy is not sufficient (clearance S is too large), or if warpage occurs in insulating substrate a or bus bar b as shown in Figure 5, make sure that bus bar b is firmly sandwiched between upper and lower insulating substrates a. Therefore, there is a risk that leakage may occur between the bus bar and other bus bars due to water intrusion. In addition, the bus bar b is connected to the upper and lower insulating substrates a.
Because they are not completely held in place, air enters the gap, forming a kind of heat insulating layer and hindering the heat dissipation of the busbar.

SUMMARY OF THE INVENTION An object of the present invention is to provide a laminated busbar wiring board assembly structure that can solve the above problems, reliably prevent leakage between busbars, and improve heat dissipation characteristics of busbars.

Structure of the Invention [Means for Solving Problems] Explaining with reference to the drawings, the assembly structure of the laminated busbar wiring board of the present invention is as shown in FIGS. 1 to 3, in which a desired pattern is formed. In a laminated busbar wiring board in which a plurality of wiring boards A each having a busbar 1 arranged on an insulating substrate 2 are laminated in a plurality of layers, opposing arrangements are made to partition the arrangement path 3 of the busbar 1 on the surface of the insulating substrate 2 of each layer. Installation ribs 4, 4 are provided in a protruding manner, and fixing ribs 5, 5, which fit into the installation ribs 4, 4, are provided on the back surface of the upper insulating substrate ₂₂ facing the lower insulating substrate ₂₁ . In addition, fitting grooves 6, 6 are provided on the opposing surfaces of the upper and lower insulating substrates 2, _{2 1} , 2 ₂ to engage with the mounting ribs 4 , 4 and the fixing ribs 5 , 5 , respectively. It is characterized by

In FIG. 1, reference numeral 7 denotes a tab terminal that is connected to the end of the bus bar 1 and is connected to an external female terminal (not shown). The upper layer insulating substrate 2 ₂ has
A through hole 8 for the tab terminal 7 is provided.

The distance between the mounting ribs 4, 4 that partition the arrangement path 3 of the bus bar 1 can be freely changed depending on the width of the bus bar 1 (which varies depending on the current capacity). The height h of the rib 4 is set to be sufficiently larger than the thickness t of the bus bar 1 so that the bus bar 1 can be accommodated in the arrangement path 3.

As shown in FIG.
A sufficient clearance S _p is provided so that the upper and lower insulating substrates 2 ₁ and 2 ₂ can be held without any gap.

Note that when the insulating substrate ₂₂ is located at the top of the laminated bus bar wiring board, the fixing ribs 5, 5 corresponding to the wiring ribs 4, 4 are attached to the case of an electrical connection box (not shown) or to another insulating board. All you have to do is set it up.

[Function] Bus bar 1 is installed in the arrangement path 3 of each insulating board 2 ₁ , 2 ₂ .
are placed to form the wiring board A, and when these are laminated one after another, the busbar 1 is closely held between upper and lower insulating substrates 2 ₁ and 2 ₂ . That is, mutual positioning of the upper and lower wiring boards A and fixing of the bus bar 1 are achieved simultaneously.

As shown in FIG. 3, the bus bar 1 has a fitting groove 6.
Due to the clearance S _p in the arrangement path 3, the upper and lower insulating substrates 21 and 22 are tightly sandwiched without any gaps. In addition, on the same insulating substrate, a rib 4 for arrangement and a rib 5 for fixing are provided which protrude between adjacent bus bars 1. the result,
It is difficult for water to enter between the insulating substrates, and since the presence of the ribs 4 and 5 increases the creeping distance between the bus bars, the generation of leakage current can be suppressed. By bringing the bus bar 1 into close contact with the upper and lower insulating substrates 2 ₁ and 2 ₂ , its heat dissipation characteristics are improved.

Since the upper and lower insulating substrates 2 ₁ and 2 ₂ have a structure in which they fit into each other, warping after the laminated busbar wiring board is assembled is prevented. Moreover, even if the bus bar 1 or the insulating substrates 2 ₁ and 2 ₂ have some warpage before assembly, the above fitting structure allows the bus bar to be tightly held.

Effects of the invention As explained above, according to the assembly structure of the laminated busbar wiring board of the invention, leakage current between busbars is prevented, heat dissipation is improved, and warping of the insulating substrate and busbars is prevented. .

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the main parts in a separated state showing one embodiment of the assembled structure of the laminated busbar wiring board of the present invention, Fig. 2 is a sectional view of the same assembled state, and Fig. 3 is the same as Fig. 2. It is an enlarged sectional view of B part. FIGS. 4A and 4B are a cross-sectional view of a main part of a conventional example; FIG. 4 is an enlarged cross-sectional view of a portion C thereof; and FIG. 1... bus bar, 2, 2 ₁ , 2 ₂ ... insulating substrate,
3... Arrangement path, 4... Arrangement rib, 5... Fixing rib, 6... Fitting groove.

Claims (1)

[Scope of utility model registration request] In a laminated busbar wiring board in which a plurality of wiring boards are stacked in which busbars having a desired pattern are arranged on an insulating substrate, busbar arrangement paths are divided on the surface of the insulating substrate of each layer for opposing placement. A fixing rib is provided on the back surface of the upper insulating substrate facing the lower insulating substrate to protrude and engage with the mounting rib, and a fixing rib is provided on the opposite surface of the upper and lower insulating substrates. An assembly structure for a laminated busbar wiring board, characterized in that a fitting groove is provided to engage with the arrangement rib and the fixing rib, respectively.