JPH0349240U

JPH0349240U -

Info

Publication number: JPH0349240U
Application number: JP11027389U
Authority: JP
Priority date: 1989-09-22
Filing date: 1989-09-22
Publication date: 1991-05-14

Description

[Brief explanation of drawings]

第１図ないし第３図は本考案の一実施例を示す
もので、第１図は要部を示す図、第２図は気相成
長装置の概略的構成図、第３図はウエハチヤツキ
ング装置の動作を示す説明図、第４図は従来装置
の主要部の構成を示す平面図、第５図は第４図の
−線に沿う断面図である。９…平板（サセプタ）、１５…ウエハ押上部材
（押上ピン）、１７…押上部材変位手段（ピン変
位手段）、２０…ウエハチヤツキング装置、２３
…爪部材、Ｗ…ウエハ。 Figures 1 to 3 show an embodiment of the present invention, with Figure 1 showing the main parts, Figure 2 a schematic diagram of the vapor phase growth apparatus, and Figure 3 showing the wafer structure. FIG. 4 is a plan view showing the configuration of the main parts of the conventional device, and FIG. 5 is a sectional view taken along the line - in FIG. 4. 9... Flat plate (susceptor), 15... Wafer push-up member (push-up pin), 17... Push-up member displacement means (pin displacement means), 20... Wafer chucking device, 23
...claw member, W...wafer.

Claims

[Claims for Utility Model Registration] A wafer chucking device that clamps and transports a wafer placed on a flat plate, which is embedded in the flat plate and is movable up and down so that its upper end protrudes and sinks from the upper surface of the flat plate. a wafer push-up member made of a magnetic material; and a push-up provided on the upper surface side of the wafer at a position corresponding to the wafer push-up member, which magnetically attracts the wafer push-up member and displaces it upward to push up the wafer on a flat plate. A wafer chucking device comprising: a member displacement means; and a claw member that clamps a wafer pushed up by the push-up member displacement means.