JPH0345397A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH0345397A JPH0345397A JP1179020A JP17902089A JPH0345397A JP H0345397 A JPH0345397 A JP H0345397A JP 1179020 A JP1179020 A JP 1179020A JP 17902089 A JP17902089 A JP 17902089A JP H0345397 A JPH0345397 A JP H0345397A
- Authority
- JP
- Japan
- Prior art keywords
- metal panel
- card
- main body
- protrusion
- projections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 43
- 230000005611 electricity Effects 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000035939 shock Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、コンピュータのデータ記憶媒体等に利用さ
れるＩＣカードに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card used as a data storage medium of a computer.
［従来の技術］
従来、おもて面と裏面の少なくとも一方に金属パネルが
設（゛）られたＩＣカードに！３いて番ｊ、金属パネル
とＩＣカード本体は接着剤あるいは粘着テープ等の接合
材によって接合されていた。[Prior Art] Conventionally, an IC card has a metal panel on at least one of the front and back surfaces! 3, the metal panel and the IC card body were bonded together using a bonding material such as adhesive or adhesive tape.
第４図は従来のＩＣカードの組立斜視図である。FIG. 4 is an assembled perspective view of a conventional IC card.
図に示されるように従来は、ＩＣカード本体（１）とそ
の上下両側の金属パネル（２）との間に接合剤もしくは
粘着テープ等からなる接合材く３）をそれぞれ挟み込ん
で、加圧あるいは加熱、もしくはその両方を行うことに
よって、ＩＣカード本体（１）と金属パネル（２）との
接合を得ていた。ＩＣカード本体（１）は半導体素子（
図示せず）を収納し、またその外部表面には半導体素子
の外部との接続を行うための端子（図示せず）が設けら
れている。半導体素子の収納方法、端子の種類および取
り付け方には様々な方法があり、またこれらのことはこ
の発明に特に関係しないので、詳細な説明は省略する。As shown in the figure, conventionally, a bonding material 3) made of a bonding agent or adhesive tape is sandwiched between the IC card body (1) and metal panels (2) on both upper and lower sides of the IC card body (1), and pressure or pressure is applied. The IC card body (1) and the metal panel (2) were bonded by heating or both. The IC card body (1) is a semiconductor element (
(not shown) is housed therein, and terminals (not shown) for connecting the semiconductor element to the outside are provided on its outer surface. There are various methods for storing semiconductor elements, types of terminals, and methods for attaching them, and since these are not particularly relevant to the present invention, detailed explanations thereof will be omitted.
［発明が解決しようとする課題］
従来のＩＣカートは以」二のように構成されているので
、組立作業時間、組立コストが掛がり、さらには接着剤
もしくは粘着テープ等の接合材を使用しているために、
組み立て作業の際の周囲の環境条件の変化等により、Ｉ
Ｃカード本体と金属パネルとの接合強度にバラツキが生
じる等の課題があった。[Problems to be Solved by the Invention] Conventional IC carts are constructed as shown below, which increases assembly work time and assembly costs, and furthermore requires the use of bonding materials such as adhesives or adhesive tapes. In order to
Due to changes in surrounding environmental conditions during assembly work, I
There were problems such as variations in the bonding strength between the C card body and the metal panel.
この発明は上記のような課題を解決するためになされた
もので、ＩＣカード本体と金属パネルの接合に接合材を
使用しない、本体と金属パネルとの接合強度かさらに安
定したＩＣカードを得ることを目的とする。This invention was made to solve the above-mentioned problems, and it is an object of the present invention to obtain an IC card that does not use a bonding material to bond the IC card body and the metal panel, and has a more stable bonding strength between the IC card body and the metal panel. With the goal.
［課題を解決するための手段］
」二記の目的を鑑み、この発明は、おもて面および裏面
をイｆする樹脂製のＩＣカード本体と、一方向の両側に
それぞれ少なくとも１つの、同一方向に突出した突起部
か形成された、外部からの衝撃および静電気等からの保
護のための少なくとも１枚の金属パネルとを備え、ＩＣ
カード本体のおもて面および裏面の少なくともいずれか
一方の面に金属パネルが、その突起部が該面に圧入され
て接合されたＩＣカードにある。[Means for Solving the Problems] In view of the above objects, the present invention provides a resin IC card body having a front surface and a back surface, and at least one identical IC card body on both sides in one direction. at least one metal panel formed with a protrusion protruding in the direction of the IC for protection from external shocks and static electricity, etc.;
The IC card has a metal panel on at least one of the front and back surfaces of the card body, and the protrusion of the metal panel is press-fitted into the surface and joined.
［作用］
この発明によるＩＣカードにおいては、ＩＣカード本体
に収納されている半導体素子を外部からの衝撃、あるい
は静電気から保護するためにの金属パネルが、これに形
成された突起部がＩＣカード本体の表面に圧入されてＩ
Ｃカード本体に金属パネルが接合される。[Function] In the IC card according to the present invention, the metal panel for protecting the semiconductor element housed in the IC card body from external impact or static electricity has a projection formed on the metal panel that protects the semiconductor element housed in the IC card body from external impact or static electricity. Press-fitted into the surface of I
A metal panel is bonded to the C card body.
［実施例］
以下、この発明の一実施例を図について説明する。第１
図はこの発明によるＩＣカードの一実施例の組立斜視図
であり、前述の従来のものと同一もしくは相当する部分
は同一符号で示す。金属パネル（２）の長手方向（長辺
方向）の両側には折り曲げ部（２ａ）が形成され、これ
らの折り曲げ部（２ａ）の先端には、突起部（７１）が
それぞれ形成されている。この突起部（４）の両側には
、この突起部（４）が本体（１）から抜けるのを防止す
る戻り止め部（４ａ）が形成されている。一方、ＩＣカ
ード本体（１）のおもて面および裏面のそれぞれの中央
部（１ａ）は、少なくとも金属パネル（２）の厚みの分
だけ周囲の枠部（１１））より低くなっている。また、
ＩＣカード本体（１）の長辺方向の両側の枠部（１ｂ）
の内側にはそれぞれ、金属パネル（２〉がＩＣカート本
体（１）に接合された時に、金属パネル（２）の折り曲
げ部（２ａ）を受は入れる＞Ｗ（Ｉｃ）が形成されてい
る。この溝（１ｃ）は、金属パネル（２）の折り曲げ部
（２ａ）が完全に受は入れられる寸法にされている。従
って、金属パネル（２）がＩＣカード本体（１）に圧入
された時には、金属パネル（２）が本体（１）の中央部
（１ａ）に嵌まり込み、金属パネル〈２）の表面と枠部
（１ｂ）の表面の高さは同じになる。さらにこの溝（１
ｃ）の底部には、金属パネル（２〉の突起部（４）の位
置に対応した位置に、金属パネル（２）が本体（１）に
圧入される時に、突起部（４）の圧入方向を規制する案
内溝（５）が形成されている。第２図には案内溝（５）
と突起部（４）との関係を断面図で示した。この案内溝
（５）の寸法は、突起部（４）の圧入方向を規制できる
ものであればよい。[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
The figure is an assembled perspective view of an embodiment of the IC card according to the present invention, and parts that are the same or corresponding to those of the conventional IC card described above are designated by the same reference numerals. Bent portions (2a) are formed on both sides of the metal panel (2) in the longitudinal direction (long side direction), and protrusions (71) are formed at the tips of these bent portions (2a), respectively. Detent portions (4a) are formed on both sides of the protrusion (4) to prevent the protrusion (4) from coming off the main body (1). On the other hand, the center portions (1a) of the front and back surfaces of the IC card body (1) are lower than the surrounding frame portion (11) by at least the thickness of the metal panel (2). Also,
Frames (1b) on both sides of the IC card body (1) in the long side direction
A >W (Ic) is formed on the inside of each of the metal panels (2) to receive the bent portion (2a) of the metal panel (2) when the metal panel (2) is joined to the IC cart main body (1). This groove (1c) is dimensioned so that the bent part (2a) of the metal panel (2) can be completely received.Therefore, when the metal panel (2) is press-fitted into the IC card body (1), , the metal panel (2) fits into the center part (1a) of the main body (1), and the heights of the surface of the metal panel (2) and the surface of the frame part (1b) become the same. Furthermore, this groove (1
At the bottom of c), when the metal panel (2) is press-fitted into the main body (1), the press-fitting direction of the protrusion (4) is shown at the position corresponding to the position of the protrusion (4) of the metal panel (2>). A guide groove (5) is formed to regulate the
The relationship between the and the protrusion (4) is shown in a cross-sectional view. The dimensions of this guide groove (5) may be any size as long as they can regulate the direction in which the protrusion (4) is press-fitted.
以上のように形成された金属パネル（２〉は、これの突
起部（４）がＩＣカート本体（１）に形成された案内溝
（５）に沿って圧入されることによってＩＣカード本体
（１）に接合される。The metal panel (2) formed as described above is formed by press-fitting the protrusion (4) of the metal panel (2) along the guide groove (5) formed in the IC card body (1). ).
なお、上記実施例では、金属パネル（２）の長辺方向の
両側に折りＩＩＩＩげ部（２ａ〉および突起部（４）を
形成する場合を示したが、短辺方向の両側に同様に折り
曲げ部（２ａ）および突起部（４）を形成してもよく、
さらに長短四辺のそれぞれにこれらを形成してもよい。In addition, in the above embodiment, the case where the fold III part (2a) and the protrusion part (4) are formed on both sides of the metal panel (2) in the long side direction is shown, but the folded part III (2a) and the protrusion part (4) are formed on both sides of the metal panel (2) in the short side direction. A portion (2a) and a protrusion (4) may be formed,
Furthermore, these may be formed on each of the four long and short sides.
そして、ＩＣカード本体〈］）の溝（１ｃ）および案内
溝（５）は、金属パネル（２）に形成される折り曲げ部
（２ａ）および突起部（４）の位置に合わせて形成ずれ
はよい。The groove (1c) and guide groove (5) of the IC card body (〈]) should be aligned with the positions of the bent portion (2a) and protrusion (4) formed on the metal panel (2). .
また、金属パネル（２）の折り曲げ部（２ａ）は突起部
〈４）に強度を持たせるために形成されたちのであり、
必要に応じて設ければよく、突起部（４）を金属パネル
（２）に直接、形成してもよい。この場合、ＩＣカード
本体（１）に溝（１ｃ）を形成する必要はない。In addition, the bent portion (2a) of the metal panel (2) is formed to give strength to the protruding portion (4).
The protrusion (4) may be provided as necessary, and the protrusion (4) may be formed directly on the metal panel (2). In this case, it is not necessary to form the groove (1c) in the IC card body (1).
さらに、ＩＣカート本体（１）に形成される案内溝（５
）も必要に応じて設ければよく、樹脂製のＩＣカード本
体（１）の表面に直接、突起部（４）を圧入してもよい
。Furthermore, the guide groove (5) formed in the IC cart body (1)
) may be provided as necessary, and the protrusion (4) may be press-fitted directly into the surface of the resin IC card body (1).
また、突起部をＩＣカード本体に圧入し易くするために
、第３図に示すように先を細くした突起部（４ｂ）を形
成し、またこれに従って小さい案内ｊＭ（５ａ）を形成
するようにしてもよい。Further, in order to make it easier to press-fit the protrusion into the IC card body, a tapered protrusion (4b) is formed as shown in Fig. 3, and a small guide jM (5a) is formed accordingly. You can.
また、突起部に形成される戻り止め部（４ａ）も必要に
応じて形成すればよい。Furthermore, the detent portion (4a) formed on the protrusion may be formed as necessary.
［発明の効果］
以上のようにこの発明によれば、金属パネルをＩＣカー
ト本体に圧入して取り付けるようにしたので、取り付は
作業が簡単になり、部品点数も削減され、さらにＣよ安
定した接合強度が得られる効果がある。[Effects of the Invention] As described above, according to the present invention, the metal panel is attached by press-fitting into the IC cart body, which simplifies the installation process, reduces the number of parts, and improves stability. This has the effect of providing high bonding strength.
第１図はこの発明による丁Ｃカードの組立斜視図、第２
図および第３図は第１図のＩＣカードの突起部と案内溝
の関係を示す断面図、第４図は従来の丁Ｃカードの組立
斜視図である。
図において、（１）はＩＣカード本体、（１ａ）は中央
部、（１ｂ）は枠部、（１ｃ）は溝、（２）は金属パネ
ル、（２ａ）は折り曲げ部、（４）は突起部、（４ａ）
は戻り止め部、（５）は案内溝である。
尚、図中、同一符号は同−又は相当部分を示す。FIG. 1 is an assembled perspective view of the C-card according to the present invention, and FIG.
3 and 3 are cross-sectional views showing the relationship between the protrusion and the guide groove of the IC card shown in FIG. 1, and FIG. 4 is an assembled perspective view of the conventional IC card. In the figure, (1) is the IC card body, (1a) is the center, (1b) is the frame, (1c) is the groove, (2) is the metal panel, (2a) is the folded part, and (4) is the protrusion. Part, (4a)
(5) is a detent portion, and (5) is a guide groove. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (2)
本体と、 一方向の両側にそれぞれ少なくとも１つの、同一方向に
突出した突起部が形成された、外部からの衝撃および静
電気等からの保護のための少なくとも１枚の金属パネル
と、 を備え、上記ＩＣカード本体のおもて面および裏面の少
なくともいずれか一方の面に上記金属パネルがその突起
部が上記面に圧入されて接合されたＩＣカード。(1) A resin IC card body having a front surface and a back surface, and at least one protrusion protruding in the same direction on both sides of one direction, which protects the card from external shocks and static electricity. at least one metal panel for protection, and the metal panel is bonded to at least one of the front surface and the back surface of the IC card body by having its protrusion press-fitted into the surface. IC card.
くとも一方の面の少なくとも一方向の両側の、上記金属
パネルの突起部に対応する位置にそれぞれ、上記突起部
の圧入方向を規制するための案内溝が形成された特許請
求の範囲第１項に記載のＩＣカード。(2) To regulate the press-fitting direction of the protrusions at positions corresponding to the protrusions of the metal panel on both sides in at least one direction of at least one of the front and back surfaces of the IC card body. The IC card according to claim 1, in which a guide groove is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1179020A JP2593221B2 (en) | 1989-07-13 | 1989-07-13 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1179020A JP2593221B2 (en) | 1989-07-13 | 1989-07-13 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0345397A true JPH0345397A (en) | 1991-02-26 |
| JP2593221B2 JP2593221B2 (en) | 1997-03-26 |
Family
ID=16058708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1179020A Expired - Lifetime JP2593221B2 (en) | 1989-07-13 | 1989-07-13 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2593221B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5926374A (en) * | 1997-11-17 | 1999-07-20 | Mitsubishi Denki Kabushiki Kaisha | IC card |
| US5994769A (en) * | 1995-12-19 | 1999-11-30 | Mitsubishi Denki Kabushiki Kaisha | IC card |
| US6824500B2 (en) | 2001-04-30 | 2004-11-30 | Nam-Young Park | Sphincter exerciser |
| GB2430082A (en) * | 2005-09-12 | 2007-03-14 | D & C Technology Co Ltd | Package structure for an interface card |
| AU2004201137B2 (en) * | 1998-12-17 | 2007-10-18 | Shigeo Takizawa | Lower Limb Function Training Device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4316722B2 (en) | 1999-04-13 | 2009-08-19 | 日本圧着端子製造株式会社 | IC card with antenna |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6475296A (en) * | 1987-09-17 | 1989-03-20 | Mitsubishi Electric Corp | Plastic package for memory medium built-in card |
| JPH0180472U (en) * | 1987-11-18 | 1989-05-30 |
-
1989
- 1989-07-13 JP JP1179020A patent/JP2593221B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6475296A (en) * | 1987-09-17 | 1989-03-20 | Mitsubishi Electric Corp | Plastic package for memory medium built-in card |
| JPH0180472U (en) * | 1987-11-18 | 1989-05-30 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5994769A (en) * | 1995-12-19 | 1999-11-30 | Mitsubishi Denki Kabushiki Kaisha | IC card |
| US5926374A (en) * | 1997-11-17 | 1999-07-20 | Mitsubishi Denki Kabushiki Kaisha | IC card |
| AU2004201137B2 (en) * | 1998-12-17 | 2007-10-18 | Shigeo Takizawa | Lower Limb Function Training Device |
| US6824500B2 (en) | 2001-04-30 | 2004-11-30 | Nam-Young Park | Sphincter exerciser |
| GB2430082A (en) * | 2005-09-12 | 2007-03-14 | D & C Technology Co Ltd | Package structure for an interface card |
| GB2430082B (en) * | 2005-09-12 | 2007-08-01 | D & C Technology Co Ltd | Package structure for an interface card |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2593221B2 (en) | 1997-03-26 |
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