JPH0343172A - Detection of designated hole of matrix board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Table of contents] Overview Industrial field of application Prior art (Figs. 6, 7, and 8) Problems to be solved by the invention Examples of means and actions for solving the problems (Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5) Effects of the Invention [Summary] The present invention provides a method for specifying a matrix board (MB>) that is attached to the side surface of a housing. Regarding the method for detecting designated holes on matrix boards, which automatically extracts designated holes in MBs, we have automated the method of determining and connecting telephone lines, which was previously done manually, and making stations unmanned. For the purpose of localization, the matrix board contains the pin matrix area, robot coordinate system, reference hole and MB.
It is composed of a two-dimensional x-y axis orthogonal robot mechanism, and a position measurement unit consisting of a laser and a -dimensional laser sensor attached to the head of the orthogonal robot. Furthermore, the head part includes a gripping mechanism and a Z-axis moving mechanism, detects the center and distance of three reference holes on the MB, corrects the deviation between the MB and the robot coordinate system, and moves the difference point hole in the Y-axis and X-axis directions. count,
This is the method of reaching the target designated hole.

[Industrial application field]

The present invention relates to a method for connecting telephone lines, etc., through a matrix board inside the shell, and more specifically, it includes an orthogonal robot and a one-dimensional laser sensor, and a plurality of panels on the side of the housing. The attached matrix board (
The present invention relates to a method for detecting a designated hole in a matrix board, which automatically extracts a designated hole (designated hole) in a designated MB (MB).

[Conventional technology]

Conventionally, the method of determining telephone lines and connecting them is to short-circuit specified holes in a matrix board (MB) using conductive connection pins.
All of these conventional methods were often performed manually. In other words, a predetermined pattern is printed on the matrix board, and such an MB has a two-layer structure, and when pins are connected to predetermined designated holes, predetermined telephone lines are connected. By removing the pin and inserting it into another designated hole, the previous telephone line will be disconnected and the newly inserted telephone line will be connected.

FIG. 6 is a schematic diagram of the pattern arrangement on such a matrix board, in which a predetermined pattern 1 having through holes 3 on a matrix board (MB) 4 is illustrated. The dimensions of the matrix board are approximately 180
mm X I O 5 mm, and the pattern and designated holes may shift due to the matrix board being bent, bent, or warped due to changes in the matrix board itself over time or temperature changes.

FIG. 7 is a practical arrangement diagram of such a matrix board 4, in which approximately 300 MB4 having dimensions of 180 mm x 105 mm are similarly arranged in a matrix. In order to clarify the relationship with the present invention, Fig. 7 shows a two-dimensional X-Y axis robo robot arrangement that can move at high speed in the X-axis and Y-axis directions and can perform highly accurate positioning. has been done. Conventionally, connection between telephone lines via MB, which often required manual intervention, was achieved by placing a predetermined marking pattern on both sides of the desired pattern, called the marker method, and tracking the predetermined pattern while measuring the markers. Automated tracking methods are also being attempted.

FIG. 8 shows the robot mechanism including the connecting pin 2 and the position measuring unit 22 attached to the head of the two-dimensional X-Y axis robot robot, and the multiple matrix boards (MB) 4 attached to the housing 6 on the side. It is a schematic diagram seen from.

The approximately 300 matrix boards illustrated in FIG. 7 are accessed by a robotic mechanism with connecting pins 2, as illustrated in FIG.

The conventional method of manually short-circuiting the target designation hole in the MB using a connecting pin has the problems of being labor-intensive, expensive, and time-consuming. On the other hand, in order to automate the work of inserting and removing pins, a method is required to automatically track a matrix board (MB) that has a predetermined designated hole and has a predetermined pattern printed on it, but conventional marking methods cannot be used. In order to solve this problem, the same applicant and the same inventor have proposed a "tracking method" which automatically detects pattern separation and has a feedback function.

However, this was related to a tracking method that tracks a predetermined pattern.

The matrix board (MB) itself is susceptible to bending, bending, and warping due to aging and temperature changes depending on the material it is made of.Therefore, the predetermined pattern, target designation holes, and reference holes may become misaligned. Since these problems are likely to occur, it is important to understand the correct position and make corrections for them, and it is also important to perform such work automatically.

[Problem to be solved by the invention]

The present invention is equipped with a two-dimensional X-Y-axis orthogonal robot and a one-dimensional laser sensor, and is equipped with a two-dimensional X-Y axis orthogonal robot and a one-dimensional laser sensor. ) is intended to provide a method for automatically extracting the specified size of a matrix board.

[Means to solve the problem]

The present invention includes a two-dimensional X-Y axis robot mechanism,
It is composed of a position measuring section mainly composed of a laser such as a semiconductor laser and a laser sensor such as a -dimensional laser sensor attached to the robot mechanism, and a grip for gripping a conductive connection pin is provided in the head portion of the robot mechanism. The specified MB is selected from among the multiple matrix boards attached to the housing, and includes the MB mechanism, compliance mechanism, self-alignment mechanism, and Z-axis movement mechanism, In order to automatically detect holes (designated holes), three predetermined reference holes A, B, and C are set on the matrix board, and the center position of the reference holes is sequentially detected by a distance signal and a light intensity signal in a laser sensor. The edge is detected while moving in the X-axis direction and Y-axis direction.The rotation and inclination of each axis are determined from the distance between the three center positions of this reference hole and the laser sensor, and the matrix board ( MB) and the robot mechanism, and based on the data of these three reference holes, move from the center of the predetermined reference hole to the designated hole while counting in the Y-axis and X-axis directions, and specify the target. It includes a means for checking whether the hole detection has been performed normally by comparing the distance traveled at this time and the number of holes passed through when reaching a hole, and further converting the center position of the target designated hole to the center position of the reference hole. and includes means for inserting a connecting bottle into the target designated hole.

[For production]

By moving the robot mechanism in the X-axis direction and Y-axis direction as described above using the distance signal and light intensity signal from the laser sensor to the center position of the predetermined reference holes A, B, and C, the edge of the approximately circular hole can be adjusted. Measure the position as coordinates on the X and Y axes, calculate and determine the center coordinate from the midpoint of these coordinates, and calculate the rotation and tilt of each axis from the distance between the center position of these three reference holes and the laser sensor. Therefore, the deviation of the coordinate system between the desired matrix board (MB) and the robot mechanism can be corrected, and based on the data of the three reference holes, the robot moves while counting the designated holes from the center of the predetermined reference hole. When the target designated hole is reached, the distance traveled is compared with the number of holes passed through to check that the hole detection has been performed normally.The position detection of the target designated hole is performed in the same way as when measuring the reference hole. The center is found and precise positioning is performed using the method described above, and the robot mechanism is then operated to insert or extract the conductive pin into the target designated hole.

〔Example〕

FIG. 1 is an explanatory diagram of the format of the matrix board (MB>4) used in the target designation large detection method according to the present invention. It is composed of a reference hole 10A, IOB, and IOC for complementing the coordinate system, and a connector 11 for connecting each matrix board.As is clear in FIG. A pin matrix area 12 is arranged on the matrix board (MB) 4 using the coordinate system as a reference, and reference holes 10A, IOB, and IOC are arranged in parts of three corners of these pin matrix areas 12. Reference holes for OA, IO
B. Distance measurement patterns (a) and (b) are placed at coordinate positions passing through the center coordinates on the X and Y axes near the IOC, respectively.
) is provided.

The reference hole 10A is a hole for positioning with rough accuracy for the specified matrix bow J' (MB)4.
, IOB, IOC, especially the reference holes 10A and 10B.
The diameter of the circular hole is designed to be approximately 4.2 mmφ. This diameter dimension is determined by taking into account the aging, displacement, deflection, and inclination of the matrix board (MB>4), as well as the accuracy of the robot mechanism itself. In other words,
If the dimension of the reference hole is 4.2 mmφ, the sensor is considered to be able to fit into the reference hole even if there is a change in the matrix board as described above.

Further, as is clear from FIG. 1, the diameter of the reference hole 10G is set equal to the diameter of the holes in the bin matrix area 12 including the normal designated hole and the target designated hole 13, and the diameter is, for example, 900 μm. It is about 960 μm. In the Y-axis direction with respect to the reference hole 10G, a row of holes with the same dimensions as the designated hole is provided in parallel with the pin matrix area 12 by one extra row, and the position of the target designated hole 13 in the Y-axis direction is It is used as a means of measurement. Similarly, once the position in the Y-axis direction is determined, the position in the X-axis direction can also be moved on the X-axis to reach the target designation hole 13. Regarding the tracking method for finding the designated hole 13 of this target, refer to the above-mentioned target designated hole 1.
Tracking is performed while creating a laser trajectory on a predetermined pattern including No. In particular, a feedback mechanism is used that detects a light intensity signal at an intermediate level, immediately returns to the previous hole position, measures the center position of the hole using an edge detection method in the X and Y axis directions, and restarts the above tracking again. For example, a tracking method may be used.

FIG. 2 shows a structural diagram of the head portion of the robot mechanism of the two-dimensional XY-axis orthogonal robot schematically illustrated in FIGS. 7 and 8 from the front, top, and side. The head portion of the robot mechanism includes a gripping mechanism 20 for holding the conductive connection pin, a Z-axis movement mechanism 21 for inserting and pulling out the connection pin into the target designation hole 13, and a position measurement unit 22 for measuring the position. The 0-position measuring section 22, which is indispensable from the above, includes a laser such as a semiconductor laser and a laser sensor, and is therefore sometimes called a sensor section. Furthermore, the gripping mechanism 20 is provided with a compliance mechanism 23 and a self-aligning mechanism 24 for providing compliance and tracing control functions when inserting the connecting bottle into the hole.

After moving the head part of such a robot mechanism onto the designated matrix board (MB) 4, the reference hole 10 is
Move to the distance measurement pattern (al) near A, detect the light reflected from this pattern, and connect it to the matrix board (MB
) Measure the distance between the substrate surface of step 4 and the sensor section or the robot head section.

Next, while moving in the X-axis direction, edges at both left and right ends of the reference hole 10A are detected using two signals, a distance signal and a light intensity signal, from the laser sensor. The coordinates of this edge are
, X2, and the coordinates (X1+X2)/2 of the midpoint thereof are measured as the center in the X-axis direction. Furthermore, after moving to another distance measurement position and measuring the distance, upper and lower edges are detected while moving downward on the Y axis. The coordinate of this edge is Y
l.

If it is Y2, the coordinates (Y1+Y2)/2 of the midpoint are measured as the midpoint in the Y-axis direction. For a method of measuring the center position of a circular hole such as the reference hole 10, refer to the explanatory diagram shown in FIG. 3. That is, the two-dimensional X-Y axis orthogonal robot is moved in the X-axis direction and the Y-axis direction in the vicinity of a position considered to be the center with respect to the hole 10. The laser sensor of the position measurement unit measures the position of the laser trajectory from two signals, a distance signal and a light intensity signal, and determines the coordinates Xi, X2, and X2 of the edge of the circular reference hole 10. Yl and Y2 are measured respectively, and therefore the center coordinates of the circular hole in the X-axis and Y-axis directions are (X1+X2)/2. (Y10Y2)/2 are respectively found.

After measuring the distance to the center of the reference hole 10A, use the same method to measure the distance to the reference hole 10B using the measurement pattern (a
), (b) to measure the center and distance of the hole, and also measure the center and distance of the reference hole 10C. In this way, the reference hole 10A, IOB,
The rotation and tilt regarding each x, y, and z axis are determined from the distance between the center position of the IOC and the sensor unit (position measurement unit), and the deviation in the coordinates of the specified matrix board (MB) and robot mechanism is corrected. Let's do it.

Based on the center coordinates and distance data of the three reference holes 10A, IOB, and IOC, as shown in FIG. Move to the specified position in the axial direction. In this case, in parallel to the pin matrix area 12 including the target designation hole 13, including the reference hole 10C, one extra row of dummy rows of standard designation holes of the same size is provided. Y
The designated position in the axial direction can be determined on this row of dummy holes. Next, it can similarly move in the X-axis direction and reach the target designation hole 13.

At this time, the distance traveled and the number of holes passed are compared to check whether the target designation hole 13 has been detected normally. To detect the position of the specified hole, use the reference hole 10A, IOB.
, the center position is measured in the same manner as when measuring the IOC, and precise positioning is performed. In this case, for example, a 4-split photodiode or the like is used as a laser sensor,
The image of the target designation hole 13 is projected onto this 4-split photodiode, and the sum and difference of the area of the amount of light irradiated to the photodiode are calculated in the X-axis direction and the Y-axis direction, respectively. Position errors can be detected. That is, for example, FIG. 4 is an explanatory diagram of a method for determining the center position of a target designation hole using a four-part photodiode. That is, in Fig. 4, A, B, C, D
1 shows a four-part photodiode, and the shadow of the target designation hole 13 is shown projected onto these four-part photodiodes. Depending on the amount of light incident on each photodiode, for example, a shift in the Y-axis direction can be detected by (C+D)-(A+B), and a shift in the X-axis direction can be detected by (B+D)-(A+C). Therefore, in this way, it is possible to accurately detect the correction value from the center of the target designated hole,
Accurate positioning of connection pins, etc. becomes possible.

On the other hand, regarding insertion of the connecting pin into the target designating hole 13, as shown in FIG. The tracing control mechanism operates in response to the pressure exerted on the pin at the edge 14 portion. That is, the fifth
In the figure, the tip of the connecting pin 2 is the edge 1 of the target designation hole 13.
4 is a schematic enlarged view of the state in contact with FIG. As shown in FIG. 2, in the head portion of the robot, the connecting pin grasping mechanism 20 has a connecting pin 2 that moves in the The operating mechanism is such that the compliance mechanism 23 and the self-aligning mechanism 24 operate in order to carry out tracing control when more pressure is applied. It is possible to insert the connecting pin into the target designated hole with sufficient precision if the distance is within ±350 μm.

Embodiments of the invention are described below. The present invention is composed of a robot mechanism and a position measurement unit including a laser and a laser sensor attached to the robot mechanism, and includes a plurality of matrix boards (M
Select the specified matrix board from B),
In order to automatically detect a specified designated hole among them, three predetermined reference holes A, B, and C are set on the matrix board, and the center position of the reference hole is sequentially determined by the distance signal and the light beam in the laser sensor. X-axis direction due to intensity signal.

The edge is detected while moving in the Y-axis direction, and the rotation and inclination of each axis is determined from the distance between the three center positions of this reference hole and the laser sensor, and the matrix board (MB) and robot mechanism A matrix that corrects the deviation of the coordinate system between the two points and moves from the center of the predetermined reference hole while counting the specified holes in the Y-axis and X-axis directions based on the data of these three reference holes to reach the target specified hole. The present invention relates to a method for detecting designated holes in a board.

〔Effect of the invention〕

According to the method for detecting a specified hole in a matrix board according to the present invention, it is possible to automatically detect a specified hole in a specified matrix board (MB) among a plurality of matrix boards (MB) attached to the side surface of a housing. can. Therefore, if such technology is used, there is an advantage that it is possible to automate the connection between telephone lines by short-circuiting a designated hole in the MB using a connecting pin, which was conventionally done manually. Therefore, it is possible to make telephone offices for this purpose unmanned, which has advantages such as lower cost, shorter turnaround time, and unmanned automation compared to conventional manual methods, and is extremely useful in industry. It provides high value technology.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of a matrix format for explaining an embodiment of the method for detecting designated holes in a matrix board according to the present invention, and FIG. 2 is an explanatory diagram of a two-dimensional X-Y axis orthogonal robot used in the present invention. A structural diagram of the head part is shown, Fig. 3 is an explanatory diagram of the method for measuring the center position of the hole, and Fig. 4 is an explanatory diagram of the method for determining the center position of the target designated hole using a 4-part photodiode as a laser sensor. FIG. 5 shows a schematic enlarged view of the state in which the tip of the connecting pin is in contact with the edge of the target designation hole, FIG. 6 is a schematic diagram of the pattern arrangement on the matrix board, and FIG. FIG. 8 is a diagram showing the arrangement and configuration of matrix boards, and FIG. 8 is a side view schematically showing how a robot mechanism accesses a plurality of matrix boards attached to a housing. 1... Pattern 2... Pin, connection pin 3... Hole, through hole (through hole) 4... Matrix board (MB) 5... Two-dimensional X-Y axis orthogonal robot 6...・Housing 10, IOA, IOB, IOC...Reference hole 12...
Pin matrix area 13...Target designated hole, designated hole 14...Target designated hole edge 20! - Gripping mechanism 21... 2-axis movement mechanism 22... Position measurement section (sensor section) 23... Compliance mechanism 24... Self-aligning mechanism

Claims (1)

[Claims] A designated matrix board is selected from among a plurality of matrix boards (MB) that are composed of a robot mechanism and a position measurement unit that includes a laser and a laser sensor that are attached to the robot mechanism, and that are attached to a predetermined housing. The matrix board has three predetermined reference holes A in order to automatically detect the specified designated hole therein.
. The rotation and inclination of each axis is determined from the distance between the center position of the three reference holes and the laser sensor, and the deviation of the coordinate system between the matrix board and the robot mechanism is corrected, and based on the data of these three reference holes. A designated hole detection method for a matrix board in which the designated holes are moved from the center of a predetermined reference hole in the Y-axis and X-axis directions while counting, and the target designated hole is reached.