JPH0338952Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a conductive connector suitable for use, for example, in electrically connecting each pattern of a printed circuit board to an electrode of another component.

[Summary of the idea]

The present invention is a press-contact type conductive connector that has a structure in which a laminated striped conductive foil layer coated with a rubber elastic body, a pressure-sensitive adhesive, and a precious metal is bent 180 degrees and fixed. It has advantages such as low resistance, easy connection and high connection reliability, easy attachment and detachment, and low cost.

[Conventional technology]

For example, each pattern of a printed circuit board and the electrodes of other parts (liquid crystal panel, flexible circuit board, LSI,
There is a pressure contact type connector as a conductive connector for electrically connecting LSI chips, etc. Conventional press-contact type connectors generally include those in which metal particles are dispersed in a resin binder, or those in which silicone rubber and conductive rubber are laminated. There are also silicone rubber with a large number of gold-plated thin wires arranged in it.

[Problem that the invention attempts to solve]

However, as is well known, the conductor resistance of and is large, and the fields in which it can be used are narrow. Furthermore, since a pressure jig is required for pressure-welding, the thickness of the connector increases. In addition, although the conductor resistance is low, the amount of gold used is enormous and the cost is high.

The present invention proposes a new conductive connector that eliminates these conventional drawbacks.

[Means for solving problems]

In the present invention, a pressure-sensitive adhesive layer 2 is arranged on an insulating rubber elastic body 1, and on this pressure-sensitive adhesive layer 2, a striped conductive foil layer coated with a noble metal such as gold is formed. 3 is arranged, and the conductor arrangement part is bent and fixed by 180 degrees so that the conductive foil layer 3 is on the outside.

[Effect]

When electrically connecting, for example, each pattern of a printed circuit board to the electrodes of other components using the conductive connector configured as described above, the conductive foil layer 3 coated with noble metal
Since conduction is established by , the contact resistance becomes extremely small. Further, since the pressure-sensitive adhesive layer 2 exists under the conductive foil layer 3 and the rubber elastic body 1 exists under the pressure-sensitive adhesive layer 2, contact pressure is applied to the electrodes, so connection is easy. The connection becomes more reliable. Furthermore, since the connection is made by pressure welding, attachment and detachment are easy. In addition, the amount of precious metal used is relatively small and the price is low.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to FIG.

In the figure, 1 is an insulating rubber elastic body made of a rubber coating agent or a sheet. As a rubber-based coating agent, for example, a polyurethane-based elastic insulator (Mitsui Toatsu's Millex
SP series [SP-1000, SP-2000, SP-4000,
SP-6000]) may be used.

Further, on this rubber elastic body 1, a pressure-sensitive adhesive layer 2 made of a hot melt adhesive, an acrylic adhesive, or the like is arranged. As the hot melt adhesive, for example, Aronmelt manufactured by Toagosei is used.

Moreover, on the pressure-sensitive adhesive layer 2, a plurality of striped conductive foils are formed by plating a metal foil such as copper or aluminum with a noble metal such as gold, silver, an alloy of gold and silver, or an alloy of gold and nickel. Layer 3 is placed.

Further, as described above, the laminated structure of the rubber elastic body 1, the pressure-sensitive adhesive layer 2, and the conductive foil layer 3 is bent by 180 degrees so that the conductive foil layer 3 is on the outside.
The opposing rubber elastic bodies 1 are adhesively fixed with an adhesive layer 4 made of epoxy, hot melt, or the like.

The conductive connector shown in FIG. 1 is manufactured, for example, by the following steps.

First, as shown in FIG. 2A, a rubber elastic body 1,
A laminate of a pressure sensitive adhesive layer 2, a metal foil 3A such as copper or aluminum, and an adhesive layer 4 is formed. In this case, the rubber elastic body 1 has, for example, 5 to
The pressure sensitive adhesive layer 2 is formed with a thickness of 5 to 50 μm, for example, the adhesive layer 4 is formed with a thickness of 5 to 30 μm, and the metal foil 3A is plated or rolled. For example, it is formed with a thickness of 5 to 50 μm.

Next, as shown in FIG. 3B, a portion of the metal foil 3A is pattern etched to form a striped pattern 3B having a pattern width and a pattern gap width of 30 to 200 μm, for example. Etching is performed using, for example, ferric chloride or copper chloride. In this case, a pattern 3C that electrically connects all of the striped patterns 3B is also formed. This pattern 3C is provided for the convenience of voltage application during plating, which will be described later.

Next, as shown in FIG. 3C, the pattern 3B is plated with a noble metal such as gold to form a striped conductive foil layer 3 coated with a noble metal.

Next, as shown in FIG. D, unnecessary portions at the ends are removed by, for example, punching press processing.

Finally, as shown in Figure E, the conductive foil layer 3 is bent 180 degrees to the outside and fixed with an adhesive layer 4.

FIG. 3 shows each pattern 11a to 11 of a printed circuit board 11 using the conductive connector 10 of this example.
This is an example in which the terminal c and each electrode 12a to 12c of the liquid crystal panel 12 are connected. First, as shown in FIG.
c and each electrode 12a to 12c of the liquid crystal panel 12 are opposed to each other, and a conductive connector 1 is placed between them.
0 is assigned. Next, as shown in FIG. B, the printed circuit board 11 and the liquid crystal panel 12 are brought close together,
Pressure is applied to the conductive connector 10 to create a pressure connection. This pressure bonding is performed at a temperature of, for example, 80 to 120°C. At this time, each pattern 11a to 11c of the printed circuit board 11 and each electrode 12a to 12c of the liquid crystal panel 12 are electrically connected via the conductive foil layer 3 of the conductive connector 10, and the pressure sensitive adhesive of the conductive connector 10 The liquid crystal panel 12 is adhesively fixed to the printed circuit board 11 by the agent layer 2 .

Incidentally, using the conductive connector of this example, for example, connections between each pattern of a printed board and each pattern of a flexible board can be made in the same way.

According to the present example described above, since the conductive foil layer 3 is plated with a noble metal such as gold, the contact resistance is extremely low, and the contact resistance is extremely low, and the contact resistance can be used in connection areas where current flow is a problem or connection areas where signal processing speed is required. Suitable for use in high frequency circuit connections. Furthermore, since the pressure-sensitive adhesive layer 2 exists under the conductive foil layer 3 and the rubber elastic body 1 exists under the pressure-sensitive adhesive layer 2, contact pressure is applied to the electrodes, so connection is easy. Highly reliable connection. Further, a pressure welding jig is not required, and the connector can be made smaller. Furthermore, since the connection is made by pressure welding, attachment and detachment are easy. Furthermore, since connection can be made at relatively low temperatures (80 to 120 degrees Celsius), heat resistance is not particularly required. In addition, the amount of precious metals such as gold used is relatively small, and it can be manufactured at low cost.

In addition, if a through hole 5 is provided as shown in the example in FIG. 1, and two objects to be connected (for example, the above-mentioned printed circuit board 11 and liquid crystal panel 12) are screwed together through this through hole 5, it will be more stable and reliable. Connection is now possible.

Next, FIG. 4 shows another embodiment of the present invention. The example shown in FIG. 4 differs only in shape from the example shown in FIG. 1, and parts corresponding to those in the example shown in FIG.

The conductive connector shown in FIG.
Manufactured by the process shown in the figure. In FIG. 5, parts corresponding to those in FIG. 2 are designated by the same reference numerals.

First, as shown in FIG. 1A, a laminate of a rubber elastic body 1, a pressure-sensitive adhesive layer 2, a metal foil 3A such as copper or aluminum, and an adhesive layer 4 is formed.

Next, as shown in Figure B, the metal foil 3A is pattern etched to form a striped pattern 3B in four directions. In this case, pattern 3 electrically connects all of patterns 3B.
C is also formed. This pattern 3C is provided for the convenience of voltage application during plating, which will be described later.

Next, as shown in FIG. 3C, the pattern 3B is plated with a noble metal such as gold to form a striped conductive foil layer 3 coated with a noble metal.

Next, as shown in FIG. D, unnecessary portions at the ends are removed by, for example, punching press processing.

Finally, as shown in Figure E, the conductor arrangement portions in the four directions are bent by 180 degrees so that the conductive foil layer 3 is on the outside, and adhesively fixed with the adhesive layer 4.

Further, in FIG. 4, 13 is, for example, a printed circuit board, and 14 is an LSI chip. Each pattern 13a of the printed circuit board 13 and the LSI chip 14
In order to connect the electrodes 14a of the printed circuit board 13 to the electrodes 14a of the LSI chip 14, each pattern 13a of the printed circuit board 13 is opposed to each electrode 14a of the LSI chip 14, and a conductive connector 20 is placed between them. Next, although not shown, the printed circuit board 13 and the LSI chip 14 are brought close to each other, and pressure is applied to the conductive connector 20 to establish pressure contact. This pressure welding can also be done, for example.
It is carried out at a temperature of 80-120°C. At this time, each pattern 13a of the printed circuit board 13 and each electrode 14a of the LSI chip 14 are electrically connected via the conductive foil layer 3 of the conductive connector 20, and the pressure sensitive adhesive layer 2 of the conductive connector 20 is connected to the conductive foil layer 3 of the conductive connector 20. Thus, the LSI chip 14 is adhesively fixed to the printed circuit board 13.

Since the electrically conductive connector in the example in FIG. 4 has the same structure as the electrically conductive connector in the example in FIG. 1, the same effects as in the example in FIG. 1 can be obtained in this example as well.

Note that the shape of the above-mentioned embodiment is an example and is not limited thereto, and it goes without saying that it can take any shape suitable for the place of use.

[Effect of idea]

According to the present invention described above, the structure is such that the laminated striped conductor coated with a rubber elastic body, a pressure-sensitive adhesive layer, and a precious metal is bent and fixed at 180 degrees, so the contact resistance is low. Various effects such as easy connection and high reliability, easy attachment and detachment, and low cost can be obtained.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing one embodiment of the present invention;
3 is a diagram showing a connection example using the example in FIG. 1, FIG. 4 is a configuration diagram showing another embodiment of the present invention, and FIG. 5 is a diagram of its manufacturing process. . 1 is a rubber elastic body, 2 is a pressure-sensitive adhesive layer, 3 is a conductive foil layer, and 4 is an adhesive layer.

Claims (1)

[Claims for Utility Model Registration] A pressure-sensitive adhesive layer is placed on an insulating rubber elastic body, and a striped conductive foil layer coated with a noble metal is placed on this pressure-sensitive adhesive layer. , A conductive connector in which the conductive foil layer arrangement portion is bent and fixed by 180 degrees so that the conductive foil layer is on the outside.