JPH0337779U - - Google Patents
Info
- Publication number
- JPH0337779U JPH0337779U JP9861289U JP9861289U JPH0337779U JP H0337779 U JPH0337779 U JP H0337779U JP 9861289 U JP9861289 U JP 9861289U JP 9861289 U JP9861289 U JP 9861289U JP H0337779 U JPH0337779 U JP H0337779U
- Authority
- JP
- Japan
- Prior art keywords
- type
- terminal insertion
- terminal
- sop
- dip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
同実施例の平面図、第３図は同実施例にＳＯＰ型
ＩＣを実装した場合の第２図のＡ−Ａ断面図、第
４図は従来例の斜視図、第５図は同例の平面図、
第６図は第５図のＡ−Ａ断面図である。
１……接続端子、２……ＩＣソケツト端子、３
……ＳＯＰ接触部、４……ＤＩＰ接触部、６……
ＳＯＰ型ＩＣ、７……ＳＯＰ端子、８……絶縁部
、１０……ＳＯＰ挿入部。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a plan view of the embodiment, and Fig. 3 is a sectional view taken along line A-A in Fig. 2 when an SOP type IC is mounted on the embodiment. , FIG. 4 is a perspective view of the conventional example, and FIG. 5 is a plan view of the same example.
FIG. 6 is a sectional view taken along the line AA in FIG. 5. 1... Connection terminal, 2... IC socket terminal, 3
...SOP contact part, 4...DIP contact part, 6...
SOP type IC, 7...SOP terminal, 8...Insulation part, 10...SOP insertion part.
Claims (1)
縁部の上面に平行配置されたＤＩＰ型ＩＣ端子挿
入口と、該ＤＩＰ型ＩＣ端子挿入口に対応して設
けられたＤＩＰ型ＩＣ端子挿入部と、該ＤＩＰ型
ＩＣ端子挿入部の内部に配置されたＤＩＰ型ＩＣ
端子接触部を有するＩＣソケツト端子とを備えた
ＩＣソケツトにおいて、 前記絶縁部の凹部に設けられたＳＯＰ型ＩＣ端
子挿入部と、該ＳＯＰ型ＩＣ端子挿入部と対応し
てその内部に配置されたＳＯＰ型ＩＣ端子接触部
とを備え、該ＳＯＰ型ＩＣ端子接触部と前記ＤＩ
Ｐ型ＩＣ端子接触部とが電気的に接続しているこ
とを特徴とするＩＣソケツト。[Scope of Claim for Utility Model Registration] An insulating part formed of an insulating material with a concave cross section, a DIP type IC terminal insertion hole arranged in parallel on the upper surface of the insulating part, and a DIP type IC terminal insertion hole corresponding to the DIP type IC terminal insertion hole. A provided DIP type IC terminal insertion part and a DIP type IC arranged inside the DIP type IC terminal insertion part.
In an IC socket equipped with an IC socket terminal having a terminal contact portion, an SOP type IC terminal insertion portion provided in a recess of the insulating portion, and an SOP type IC terminal insertion portion arranged inside the SOP type IC terminal insertion portion in correspondence with the SOP type IC terminal insertion portion. an SOP type IC terminal contact part, and the SOP type IC terminal contact part and the DI
An IC socket characterized in that a P-type IC terminal contact portion is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9861289U JPH0337779U (en) | 1989-08-23 | 1989-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9861289U JPH0337779U (en) | 1989-08-23 | 1989-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0337779U true JPH0337779U (en) | 1991-04-11 |
Family
ID=31647695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9861289U Pending JPH0337779U (en) | 1989-08-23 | 1989-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337779U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346452A (en) * | 2013-06-17 | 2013-10-09 | 陕西理工学院 | SOP to DIP conversion chip carrier socket |
-
1989
- 1989-08-23 JP JP9861289U patent/JPH0337779U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346452A (en) * | 2013-06-17 | 2013-10-09 | 陕西理工学院 | SOP to DIP conversion chip carrier socket |