JPH0336003A - Dicing device - Google Patents
Dicing deviceInfo
- Publication number
- JPH0336003A JPH0336003A JP1172312A JP17231289A JPH0336003A JP H0336003 A JPH0336003 A JP H0336003A JP 1172312 A JP1172312 A JP 1172312A JP 17231289 A JP17231289 A JP 17231289A JP H0336003 A JPH0336003 A JP H0336003A
- Authority
- JP
- Japan
- Prior art keywords
- spindle
- working
- spindles
- dicing
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はＬＳＩおよび工０の組立におけるダイシング方
法およびその装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a dicing method and apparatus for assembling LSI and process zero.
［従来の技術］
従来のダイシング装置はスピンドルが１本であり、時計
回りに回転した。そのためＤＯＷｎ Ｏｕｔによる良
好な加工状態を得るためには、第２図に示すようにスピ
ンドル・（ブレード）の動きは最初に２方向に下降する
■。次にＤＯＷｎ Ｏｕｔによる加工を行う■。セし
て２方向に上昇し■ブレードが加工を行わないでＸ方向
に移動する■。そして、Ｘ方向に設定された割出し量だ
け進む。以降は、上記動作を繰り返していた。[Prior Art] A conventional dicing device had one spindle and rotated clockwise. Therefore, in order to obtain a good machining condition by DOWn Out, the movement of the spindle (blade) first descends in two directions, as shown in FIG. Next, perform processing using DOWn Out (■). ■The blade moves in the X direction without processing■. Then, it advances by the set index amount in the X direction. After that, the above operation was repeated.
［発明が解決しようとする課題］
しかし、前述の従来技術では動作■の時に加工を行うと
ＵＰ ＯＵＴになるため、スピンドルは２方向に上昇
しＸ方向に移動するだけであり、加工時間のロスとなっ
ていた。[Problem to be solved by the invention] However, in the above-mentioned conventional technology, when machining is performed during operation ①, the spindle is UP OUT, so the spindle only moves up in two directions and moves in the X direction, resulting in a loss of machining time. It became.
そこで、本発明は従来のこのような問題点を解決するも
ので、その目的とするところは、加工時間のロスの少た
いダイシング装置及び加工方法を提供するところにある
。SUMMARY OF THE INVENTION The present invention is intended to solve these conventional problems, and its purpose is to provide a dicing apparatus and a processing method that reduce processing time loss.
［課題を解決するための手段］
本発明のダイシング装置は、スピンドルを２本備え、一
方のスピンドルが他方のスピンドルと逆回転するごとを
特徴とする特
［実施例］
以下に本発明の実施例を図面にもとづいて説明する。第
１図（α）において、ダイシング装置はスピンドル１．
スピンドル２０２本のスピンドルを備えている。その先
端にはそれぞれブレード３、ブレード４がブレード押工
５．ブレード押工６によってスピンドルに固定されてい
る。スピンドルの回転方向はスピンドル１が時計回りに
、スピンドル２は反時計回りに回転している。[Means for Solving the Problems] The dicing apparatus of the present invention is characterized in that it is equipped with two spindles, and one spindle rotates in the opposite direction to the other spindle. [Embodiments] Below are embodiments of the present invention. will be explained based on the drawings. In FIG. 1 (α), the dicing device has a spindle 1.
It is equipped with 202 spindles. A blade 3 and a blade 4 are respectively attached to the tip of the blade 5. It is fixed to the spindle by a blade presser 6. Regarding the rotation direction of the spindle, spindle 1 rotates clockwise, and spindle 2 rotates counterclockwise.
第１図（ｂ）は本発明のダイシング装置において加工を
行なった場合のスピンドル中心の軌跡を示したもので、
実線がスピンドル１の、破線がスピンドル２の軌跡を示
している。加工はスピンドルが２方向に下降し、Ｘ方向
に移動した時に行われる。FIG. 1(b) shows the locus of the spindle center when processing is performed using the dicing apparatus of the present invention.
The solid line shows the trajectory of spindle 1, and the broken line shows the trajectory of spindle 2. Machining is performed when the spindle descends in two directions and moves in the X direction.
ウェーハの加工方法は第１図（ｂ）に示すように、まず
、スピンドル１が２方向に下降する■。The wafer processing method is as shown in FIG. 1(b). First, the spindle 1 is lowered in two directions.
次に、スピンドル１が加工を行う■。その時、スピンド
ル２は上昇したままスピンドル１と供に移動する■′。Next, the spindle 1 performs processing. At that time, spindle 2 moves together with spindle 1 while remaining elevated.
そして、スピンドル１が２方向に上昇し■、Ｙ方向に設
定されたチップサイズだけ進む。次に、スピンドル２が
２方向に下降し■′スピンドル２が加工を行う■′。そ
の時スピンドル１は上昇したままスピンドル２と供に移
動する■。そして、スピンドル２が２方向に上昇し■′
Ｙ方向に設定されたチップサイズだけ進む。以降は上記
動作を繰り返して、加工を進める。Then, the spindle 1 moves up in two directions (1) and advances by the set chip size in the Y direction. Next, the spindle 2 descends in two directions and the spindle 2 performs machining. At that time, spindle 1 remains elevated and moves together with spindle 2■. Then, the spindle 2 moves up in two directions.■'
Move forward by the set chip size in the Y direction. Thereafter, the above operations are repeated to proceed with the processing.
以上のような実施例において、第２図に示すようなブレ
ードが加工を行わないでＸ方向に移動する動作は、スピ
ンドル２が反時計回りに回転してＤｏｗｎ Ｃｕｔ
を行うことによりなくなる。そのため装置の処理能力
は従来装置に比べて約３０％程向上する。In the embodiments described above, the operation of moving the blade in the X direction without performing any machining as shown in FIG.
It disappears by doing this. Therefore, the processing capacity of the device is improved by about 30% compared to the conventional device.
［発明の効果］
本発明のダイシング装置は、以上説明したように、スピ
ンドルを２本備え、一方のスピンドルが他方のスピンド
ルと逆回転するという構造によって、加工時間のロスを
少なくし、装置の処理能力を向上させるという効果があ
る。[Effects of the Invention] As explained above, the dicing apparatus of the present invention has a structure in which two spindles are provided, and one spindle rotates in the opposite direction to the other spindle, thereby reducing processing time loss and improving processing speed of the apparatus. It has the effect of improving abilities.
第１図（α）は、本発明のダイシング装置のスピンドル
部分の説明図。
第１図（ｂ）は、本発明のダイシング装置により加工を
行なった際のスピンドル中心の航跡を示す説明図。
第２図は、従来のダイシング装置により加工を行なった
際のスピンドル中心の軌跡を示す説明図１・・・・・・
・・スピンドル１
２・・・・・・・・・スピンドル２
３・・・・・・・・・ブレード１
４・・・・・・・・・ブレード２
５・・・・・・・・・ブレード押工
６・・・・・・・・・ブレード押エ
フ・・・・・・・・・ウェーハ
以
上FIG. 1 (α) is an explanatory diagram of the spindle portion of the dicing apparatus of the present invention. FIG. 1(b) is an explanatory diagram showing the trajectory of the center of the spindle when processing is performed using the dicing apparatus of the present invention. Figure 2 is an explanatory diagram 1 showing the locus of the spindle center when processing is performed using a conventional dicing machine.
...Spindle 1 2...Spindle 2 3...Blade 1 4...Blade 2 5...... Blade pressing 6・・・・・・Blade pressing F・・・・・・More than wafer
Claims (1)
ンドルと逆回転することを特徴とするダイシング装置。A dicing device comprising two spindles, one spindle rotating in the opposite direction to the other spindle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1172312A JPH0336003A (en) | 1989-07-04 | 1989-07-04 | Dicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1172312A JPH0336003A (en) | 1989-07-04 | 1989-07-04 | Dicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336003A true JPH0336003A (en) | 1991-02-15 |
Family
ID=15939582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1172312A Pending JPH0336003A (en) | 1989-07-04 | 1989-07-04 | Dicing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336003A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04314504A (en) * | 1991-04-12 | 1992-11-05 | Honda Motor Co Ltd | How to process small parts using a dicing saw |
| EP0824056A3 (en) * | 1996-08-13 | 1998-04-15 | Tokyo Seimitsu Co.,Ltd. | Dicing machine |
| US5876654A (en) * | 1995-10-16 | 1999-03-02 | The Boeing Company | Method for shaping honeycomb core |
| FR2845929A1 (en) * | 2002-10-19 | 2004-04-23 | Mann & Hummel Gmbh | Oil or fuel filter installation for internal combustion engine includes tightening installation having spring that is pressed against filter element and cover of filter housing |
-
1989
- 1989-07-04 JP JP1172312A patent/JPH0336003A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04314504A (en) * | 1991-04-12 | 1992-11-05 | Honda Motor Co Ltd | How to process small parts using a dicing saw |
| US5876654A (en) * | 1995-10-16 | 1999-03-02 | The Boeing Company | Method for shaping honeycomb core |
| EP0824056A3 (en) * | 1996-08-13 | 1998-04-15 | Tokyo Seimitsu Co.,Ltd. | Dicing machine |
| US5842461A (en) * | 1996-08-13 | 1998-12-01 | Tokyo Seimitsu Co., Ltd. | Dicing machine |
| FR2845929A1 (en) * | 2002-10-19 | 2004-04-23 | Mann & Hummel Gmbh | Oil or fuel filter installation for internal combustion engine includes tightening installation having spring that is pressed against filter element and cover of filter housing |
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