JPH0332537A - Universal chuck table - Google Patents
Universal chuck tableInfo
- Publication number
- JPH0332537A JPH0332537A JP16583589A JP16583589A JPH0332537A JP H0332537 A JPH0332537 A JP H0332537A JP 16583589 A JP16583589 A JP 16583589A JP 16583589 A JP16583589 A JP 16583589A JP H0332537 A JPH0332537 A JP H0332537A
- Authority
- JP
- Japan
- Prior art keywords
- partition
- ringlike
- ring
- air suction
- ventilation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 6
- 230000035699 permeability Effects 0.000 claims description 8
- 238000000638 solvent extraction Methods 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 238000009423 ventilation Methods 0.000 abstract 3
- 239000000919 ceramic Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003818 cinder Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Abstract
Description
【発明の詳細な説明】
【産業上の利用分野1
本発明tよ、サイズの異なる半導体ウェーハ等の被加工
物を選択的に載置し、該被加工物のサイズに夫々対応し
て適切にバキューム手段により吸着保持させ、その表面
を例えば研磨加工(グラインダー)又は研削加工を行う
ためのユニバー1ナルチヤツクテーブルに関するもので
ある。
(従来技術]
この種のチャックテーブルどしては、例えば特開昭61
〜182738号公報に開示された構成のものが従来例
として周知である。この従来例におけるチi・ツク機構
の構成は、被加工物のサイズに対応したテーブル、即ち
ポーラスセラミックが同心円状に複数段配設され、各ポ
ーラスセラミックのV4設部にリング状の仕切り部が表
面に存在する構成になっている。
[発明が解決しようとする課題1
前記従来例においては、特にサイズの大きい被加工物を
載置吸着させてクラインダー加工を施した場合、テーブ
ル上に各サイズに対応するリング状の仕切り部が表出し
た構成になっているため、被加工物をバキュームにより
吸着保持し、且つその表面を適宜のグラインダーにより
所定の押圧ノノをもってFA磨した際に、その押圧力と
前記バキューム吸着とにより、被加工物が強力にテーブ
ル面上に押し付けられることになり、それによって前記
仕切り部とテーブル而、即ちポーラスセラミックとの間
における材質の相違又は僅かな段差により、研磨された
被加工物の表面に前記仕切り部の形状、即ち同心円状の
模様が写し出される。このような現象を一般に「転写」
と称され、その転写された模様が目視できるばかりでな
く、模様部分の段差が数ミクロンに及ぶことがある。従
って、この種のフリーサイズ又はユニバーサルテーブル
において、前記「転写」の問題が解決しなければならな
い課題になっている。
【課題を解決するための手段】
前記従来例における課題を解決する具体的手段として本
発明は、サイズの異なる被処理物に対応してリング状の
仕切り部で吸引領域が複数に区画され、その仕切り部が
被処理物の載置表面に露出しないように構成したことを
特徴とするユニバーサルチャックテーブルを提供するも
のであり、更に具体的には、リング状の仕切り部を有し
且つ通気性を有する吸引領域の区画部材と、表面が平坦
で且つ通気性を有する表面部材とを重ねて配設し、前記
吸引領域の区画部材を無機材料で形成し、リング状の仕
切り部をより細かいメツシュの粉末で形成して結合材で
結合又は一体焼結したものが使用されるのであり、それ
によって、被処理物に1転写現象が全く生じなくなるの
である。
【実施例1
次に本発明を図示の実施例により、更に詳しく説明する
と、1はチ17ツクテーブル全体を示すものであり、該
チャックテーブルは円板状のフレーム部材2と、吸引領
域の区分部材3と、表面部材4とから構成されている。
前記円板状のフレーム部材2は、その上面に所定深さの
円形状の四部5が形成され、上面周縁部にリング状部2
aが形成される。前記凹部5の底部2bには、その中心
部に凹陥部6を設けると共に、該凹陥部を中心にして複
数のリング状の溝部7〜10が同心円状に形成され、前
記凹陥部6には一個の吸気孔11が設けられ、前記各溝
部には複数の吸気孔12〜15が夫々設けられている。
前記吸引領域の区分部材3は、前記フレーム部材2の凹
部5内に嵌り込む円板状を呈しており、全体として通気
性を有する材料で形成される。そして、被加工物のサイ
ズに対応して吸引領域が区分されるように、複数のリン
グ状の仕切り部16〜19が同心円状に設けられている
。これ等仕切り部16〜19は、前記リング状の溝部7
〜10間に対応するように設けられており、例えば仕切
り部16が凹陥部6と溝部7との間に位置し、仕切り部
1γが溝部7と溝部8との間に位置するように、他の仕
切り部18.19も順次これに倣って形成されている。
この場合の区分部材3は、全体として通気性を有するも
のであるが、前記仕切り部16〜19はほとんど通気性
を有しないようになっている。例えば、各仕切り部を金
属又はセラミックで形成し、他の部分をセラミック等の
無機質材料を焼結させ、通気性を右するように形成しで
ある。特に、本発明の実施例においては、全体を無i質
材料で形成する場合には、仕切り部16〜19を#60
0メツシュのカーボランダム、アルミナ等のセラミック
ス粉末が使用され、他の部分は#36メツシユのセラミ
ックス粉末を用いて全体を円板状に形成し、それを焼結
することにより一体焼結物として形成すれば良い。この
ように形成することで、特に仕切り部が細かいメツシュ
の粉末で形成されているので、焼結させても通気性が大
巾に抑制された構成になるのである。
又、前記仕切り部16〜19のリング状の径は、被処理
物のサイズに対応させである。即ち、仕切り部16は略
3インチにし、仕切り部17は略4インチ、仕切り部1
8は略5インチ、仕切り部19は略6インチにし、そし
て前記吸引領域の区分部材3仝体の直径を略8インチ、
厚みを略3#に形成するのである。このように形成する
ことで、被処理物のす11〜15・・・・・・吸気孔
16〜19・・・・・・リング状の仕切り部21〜25
・・・・・・吸気手段 26〜30・・・・・・バルブ
a−e・・・・・・吸引領域Detailed Description of the Invention [Industrial Application Field 1] According to the present invention, workpieces such as semiconductor wafers of different sizes are selectively placed, and the workpieces are appropriately placed in accordance with the respective sizes of the workpieces. This invention relates to a universal chuck table which is held by suction by a vacuum means and whose surface is subjected to, for example, polishing (grinding) or grinding. (Prior art) This type of chuck table, for example,
The structures disclosed in Japanese Patent Nos. 1-182738 are well known as conventional examples. The structure of the tick mechanism in this conventional example is that tables corresponding to the size of the workpiece, that is, porous ceramics, are arranged concentrically in multiple stages, and a ring-shaped partition is provided at the V4 section of each porous ceramic. It has a structure that exists on the surface. [Problem to be Solved by the Invention 1] In the conventional example described above, when a particularly large workpiece is mounted and adsorbed and subjected to cinder processing, ring-shaped partitions corresponding to each size are created on the table. Because it has an exposed structure, when the workpiece is held by vacuum suction and the surface is FA-polished using a suitable grinder with a predetermined pressure blade, the pressing force and the vacuum suction will cause the The workpiece is strongly pressed onto the table surface, and due to the difference in material or slight step between the partition and the table, that is, the porous ceramic, the surface of the polished workpiece is The shape of the partition, that is, the concentric pattern is projected. Such phenomena are generally referred to as "transcription"
Not only is the transferred pattern visible, but the steps in the pattern can be several microns wide. Therefore, in this type of free-size or universal table, the above-mentioned "transfer" problem has become a problem that must be solved. [Means for Solving the Problems] As a specific means for solving the problems in the conventional example, the present invention provides a suction area in which a plurality of suction areas are divided by ring-shaped partitions corresponding to objects to be treated of different sizes. The present invention provides a universal chuck table characterized in that the partition part is configured so that it is not exposed to the surface on which the workpiece is placed, and more specifically, it has a ring-shaped partition part and has air permeability. A suction area partitioning member having a suction area and a surface member having a flat and air permeable surface are arranged in an overlapping manner, the suction area partitioning member is formed of an inorganic material, and the ring-shaped partition is made of a finer mesh. A material formed of powder and bonded with a binder or integrally sintered is used, and thereby no one-transfer phenomenon occurs on the object to be processed. [Embodiment 1] Next, the present invention will be explained in more detail with reference to the illustrated embodiment. Reference numeral 1 indicates the entire chuck table, and the chuck table includes a disc-shaped frame member 2 and a suction area section. It is composed of a member 3 and a surface member 4. The disk-shaped frame member 2 has four circular portions 5 of a predetermined depth formed on its upper surface, and a ring-shaped portion 2 on the periphery of the upper surface.
a is formed. A recess 6 is provided at the center of the bottom 2b of the recess 5, and a plurality of ring-shaped grooves 7 to 10 are formed concentrically around the recess. An intake hole 11 is provided, and a plurality of intake holes 12 to 15 are provided in each of the grooves. The suction area dividing member 3 has a disk shape that fits into the recess 5 of the frame member 2, and is made of a material that has air permeability as a whole. A plurality of ring-shaped partitions 16 to 19 are provided concentrically so that the suction area is divided according to the size of the workpiece. These partition parts 16 to 19 are the ring-shaped groove part 7.
. The partition portions 18 and 19 are also formed following this pattern. Although the partitioning member 3 in this case has air permeability as a whole, the partitions 16 to 19 have almost no air permeability. For example, each partition is made of metal or ceramic, and the other parts are made of sintered inorganic material such as ceramic to improve air permeability. In particular, in the embodiment of the present invention, when the entire structure is made of an iridium-free material, the partitions 16 to 19 are made of #60
0 mesh ceramic powder such as carborundum and alumina is used, and the other parts are formed into a disk shape using #36 mesh ceramic powder, and then sintered to form an integral sintered product. Just do it. By forming it in this way, especially since the partition portion is made of fine mesh powder, the structure is such that the air permeability is greatly suppressed even if it is sintered. Further, the diameter of the ring-shaped partitions 16 to 19 is made to correspond to the size of the object to be processed. That is, the partition portion 16 is approximately 3 inches, the partition portion 17 is approximately 4 inches, and the partition portion 1 is approximately 4 inches.
8 is about 5 inches, the partition part 19 is about 6 inches, and the diameter of the dividing member 3 of the suction area is about 8 inches.
The thickness is approximately 3#. By forming in this way, the objects to be processed 11 to 15...Intake holes 16 to 19...Ring-shaped partitions 21 to 25
...Intake means 26-30...Valve a-e...Suction area
Claims (3)
切り部で吸引領域が複数に区画され、その仕切り部が被
処理物の載置表面に露出しないように構成したことを特
徴とするユニバーサルチャックテーブル。(1) The suction area is divided into a plurality of ring-shaped partitions to accommodate objects of different sizes, and the partition is configured so that it is not exposed to the surface on which the objects are placed. Universal chuck table.
引領域の区画部材と、表面が平坦で且つ通気性を有する
表面部材とを重ねて配設した請求項(1)記載のユニバ
ーサルチャックテーブル。(2) The universal chuck according to claim (1), wherein a suction area dividing member having a ring-shaped partition portion and having air permeability and a surface member having a flat surface and having air permeability are arranged in an overlapping manner. table.
状の仕切り部をより細かいメッシュの粉末で形成して一
体焼結した請求項(1)、(2)記載のユニバーサルチ
ャックテーブル。(3) The universal chuck table according to claims (1) and (2), wherein the suction area partitioning member is formed of an inorganic material, and the ring-shaped partition is formed of finer mesh powder and integrally sintered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16583589A JPH0332537A (en) | 1989-06-28 | 1989-06-28 | Universal chuck table |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16583589A JPH0332537A (en) | 1989-06-28 | 1989-06-28 | Universal chuck table |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0332537A true JPH0332537A (en) | 1991-02-13 |
Family
ID=15819907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16583589A Pending JPH0332537A (en) | 1989-06-28 | 1989-06-28 | Universal chuck table |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0332537A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0572336U (en) * | 1992-03-05 | 1993-10-05 | 武藤工業株式会社 | 3D processing machine |
JPH0839376A (en) * | 1994-07-29 | 1996-02-13 | Ckd Corp | Adsorbing plate of vacuum chuck and manufacture of vacuum chuck and adsorbing plate |
KR20040036404A (en) * | 2002-10-25 | 2004-04-30 | 주식회사 마이크로 세미콘 | Multi Dressing Chuck Table |
US7654887B2 (en) | 2004-03-25 | 2010-02-02 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
JP2012033640A (en) * | 2010-07-29 | 2012-02-16 | Disco Abrasive Syst Ltd | Chuck table |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111350A (en) * | 1974-07-18 | 1976-01-29 | Tdk Electronics Co Ltd | |
JPS61182738A (en) * | 1985-02-07 | 1986-08-15 | Shibayama Kikai Kk | Free size chucking mechanism for wafer |
-
1989
- 1989-06-28 JP JP16583589A patent/JPH0332537A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111350A (en) * | 1974-07-18 | 1976-01-29 | Tdk Electronics Co Ltd | |
JPS61182738A (en) * | 1985-02-07 | 1986-08-15 | Shibayama Kikai Kk | Free size chucking mechanism for wafer |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0572336U (en) * | 1992-03-05 | 1993-10-05 | 武藤工業株式会社 | 3D processing machine |
JPH0839376A (en) * | 1994-07-29 | 1996-02-13 | Ckd Corp | Adsorbing plate of vacuum chuck and manufacture of vacuum chuck and adsorbing plate |
KR20040036404A (en) * | 2002-10-25 | 2004-04-30 | 주식회사 마이크로 세미콘 | Multi Dressing Chuck Table |
US7654887B2 (en) | 2004-03-25 | 2010-02-02 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
JP2012033640A (en) * | 2010-07-29 | 2012-02-16 | Disco Abrasive Syst Ltd | Chuck table |
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