JPH03293781A - Manufacture of optically coupled element - Google Patents
Manufacture of optically coupled elementInfo
- Publication number
- JPH03293781A JPH03293781A JP2097022A JP9702290A JPH03293781A JP H03293781 A JPH03293781 A JP H03293781A JP 2097022 A JP2097022 A JP 2097022A JP 9702290 A JP9702290 A JP 9702290A JP H03293781 A JPH03293781 A JP H03293781A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- transparent
- light
- bonding areas
- low viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は光結合素子の製造方法に関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a method for manufacturing an optical coupling device.
〈従来の技術〉
従来の光結合素子について、第２図を参照して説明する
。図中、１は発光素子、２は１次側リードフレーム、３
は発光素子のボンディングエリア、４は受光素子、５は
２次側リードフレーム、６は受光素子のボンディングエ
リア、７はシリコーン樹脂、８は遮光性樹脂である。<Prior Art> A conventional optical coupling device will be described with reference to FIG. 2. In the figure, 1 is a light emitting element, 2 is a primary lead frame, and 3 is a light emitting element.
4 is a bonding area for a light emitting element, 4 is a light receiving element, 5 is a secondary lead frame, 6 is a bonding area for a light receiving element, 7 is a silicone resin, and 8 is a light shielding resin.
第２図に示すように、発光素子１をボンディングした１
次側リードフレーム２端邪のボンディングエリア３と、
受光素子４をボンディングした２次側リードフレーム５
端邪のボンディングエリア６とを互いに平行反対向させ
、そのすき間にシリコーン樹脂７を充填し、さらにその
周囲を遮光性樹脂８で包んでいる。このときのボンディ
ングエリア３．６間のギャップは大きい方が絶縁上は望
ましいが、前記遮光性樹脂８の外形寸法が小型に設計さ
れることから、１〜２１１１１程度のギャップに制限さ
れる。As shown in FIG.
Bonding area 3 at the 2nd end of the next lead frame,
Secondary lead frame 5 to which the light receiving element 4 is bonded
The outer bonding areas 6 are arranged parallel to each other in opposite directions, the gap between them is filled with silicone resin 7, and the periphery thereof is further wrapped with light-shielding resin 8. At this time, it is desirable for the gap between the bonding areas 3.6 to be large in terms of insulation, but since the external dimensions of the light-shielding resin 8 are designed to be small, the gap is limited to about 1 to 21111.
〈発明が解決しようとする課題〉
ところで、光結合素子における１次側と２次側の絶縁距
離は素子の特性のうち絶縁耐圧（Ｖｉｓｏ）、瞬時同相
除去電圧（ＣＯＭＭＯＮ ＭＯＤＥＲＥＪＥＣＴＩＯ
Ｎ 、ＣＭＲ，以下ＣＭＲと記す）に大きく影響する。<Problems to be Solved by the Invention> By the way, the insulation distance between the primary side and the secondary side of an optical coupling device is determined by the dielectric strength voltage (Viso) and instantaneous common mode rejection voltage (COMMON MODEREJECTIO) among the characteristics of the device.
N, CMR (hereinafter referred to as CMR) is greatly affected.
絶縁距離が長ければ長い程、絶縁破壊電圧は向上し、さ
らに１次側と２次側の間の結合容量が小さくなることに
よ、りＣＭＨの向上も期待される。The longer the insulation distance, the higher the dielectric breakdown voltage, and the smaller the coupling capacitance between the primary side and the secondary side, so it is expected that the CMH will also improve.
そこで、リードフレーム２．５の先端部のボンディング
エリア３，６間の絶縁距離を長くする必要があるが、そ
のためには、光結合素子の製造工程中、前記ボンディン
グエリア３，６間へ充填するシリコン樹脂７の粘度が高
い方が樹脂だれもなく形成し易い。Therefore, it is necessary to increase the insulation distance between the bonding areas 3 and 6 at the tip of the lead frame 2.5, but to do so, during the manufacturing process of the optical coupling element, filling between the bonding areas 3 and 6 is required. The higher the viscosity of the silicone resin 7, the easier it is to form without resin dripping.
ところが、粘度が高いシリコーン樹脂７を使うと、この
シリコーン樹脂７と遮光、性樹脂８との密着性が悪くな
る為に界面はく離が生じ、絶縁耐圧性が悪くなる。However, if a silicone resin 7 with a high viscosity is used, the adhesion between the silicone resin 7 and the light-shielding resin 8 deteriorates, resulting in interfacial peeling, resulting in poor dielectric strength.
一方、粘度が低い樹脂を使うと、樹脂だれを生じ易いの
でボンディングエリア３．６間の距離を長くすることは
できなかった。On the other hand, if a resin with low viscosity is used, the distance between the bonding areas 3 and 6 cannot be increased because the resin tends to sag.
そこで本発明の目的は、ボンディングエリア３゜６間へ
充填するシリコーン樹脂７として低粘度の樹脂を使用し
、且つ前記ポンディングエリア３．６間の距離を長くと
れる光結合素子の製造方法を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for manufacturing an optical coupling element, which uses a low-viscosity resin as the silicone resin 7 filled between the bonding areas 3 and 6, and which can increase the distance between the bonding areas 3 and 6. It's about doing.
〈課題を解決するための手段〉
前記目的を達成するために本発明は、１次側及び２次側
のリードフレーム上にそれぞれ載置され互い反対向する
発光素子及び受光素子を有してなる光結合素子の製造方
法において、前記発光素子及び受光素子間に透明樹脂を
充填後、前記透明樹脂を仮硬化し、次に前記両リードフ
レームを互いに外側反対方向へ動かして前記透明樹脂を
引き伸ばし、その後前記透明樹脂の周囲を遮光性樹脂で
包むことを特徴とする。<Means for Solving the Problems> In order to achieve the above object, the present invention includes a light emitting element and a light receiving element placed on primary and secondary lead frames and facing oppositely to each other. In the method for manufacturing an optical coupling device, after filling a transparent resin between the light emitting element and the light receiving element, the transparent resin is temporarily cured, and then both the lead frames are moved in opposite directions outward to stretch the transparent resin, The transparent resin is then wrapped around the transparent resin with a light-shielding resin.
〈作 用〉
１次側及び２次側のリードフレームのポンディングエリ
ア間へ樹脂を充填後、前記両リードフレームを互いに贋
対方向へ移動して離すことによって、前記ポンディング
エリア間の樹脂が引き伸ばされるので、低粘度の樹脂で
も長い絶縁距離を形成できる。<Function> After filling the resin between the bonding areas of the primary and secondary lead frames, the resin between the bonding areas is moved by moving the lead frames in opposite directions and separating them. Since it is stretched, long insulation distances can be formed even with low viscosity resin.
〈実施例〉
本発明の一実施例について、第１図（ａ）及び（ｂ）を
参照して説明する。<Example> An example of the present invention will be described with reference to FIGS. 1(a) and 1(b).
１ず、第１図（ａ）に示すように、１次側リードフレー
ム２反対し外向きに４５°の角度を有し、発光素子ｌを
搭載したボンディングエリア３と、同様に２次側リード
フレーム５反対し、１次側リードフレーム２とは逆方向
外向きに４５°の角度を有し受光素子４を搭載したボン
ディングエリア６とを平行となるよう反対向させる。1. As shown in FIG. 1(a), the primary lead frame 2 is opposite to the bonding area 3 that faces outward at an angle of 45 degrees, and has the light emitting element l mounted thereon, as well as the secondary lead frame 2. The frame 5 is opposite to the primary lead frame 2 and is oriented outward at an angle of 45° in the opposite direction, and the bonding area 6 on which the light receiving element 4 is mounted is oriented in the opposite direction so as to be parallel to the bonding area 6.
次に、前記構造において、樹脂抽入用針９によって光伝
達の変換効率が高く、粘度の低いゲルタイプの透明シリ
コーン樹脂７を前記ボンディングエリア３，６間に注入
する。Next, in the above structure, gel-type transparent silicone resin 7 having high light transmission conversion efficiency and low viscosity is injected between the bonding areas 3 and 6 using the resin injection needle 9 .
ここで、前記ボンディングエリア３．６間のギャップは
、粘度の低い透明シリコーン樹脂７でも樹脂だれを生じ
ずに光結合路が形成できるよう、１ｎ或いはそれ以下に
する。Here, the gap between the bonding areas 3.6 is set to 1n or less so that an optical coupling path can be formed even with the transparent silicone resin 7 having a low viscosity without causing resin sag.
次に、前記ボンディングエリア３．６間への樹脂充填を
終えた後、３０分程度の仮硬化を行なう。Next, after filling the resin between the bonding areas 3 and 6, temporary curing is performed for about 30 minutes.
その後、第１図（ｂ）に示すように１次側リードフレー
ム２と２次側リードフレーム５を互いに反対方向へ動か
し、仮硬化状態の透明シリコーン樹脂７を該透明シリコ
ーン樹脂７の表面張力を利用して引き伸ばす。Thereafter, as shown in FIG. 1(b), the primary lead frame 2 and the secondary lead frame 5 are moved in opposite directions to reduce the surface tension of the transparent silicone resin 7 in the temporarily cured state. Use it and stretch it.
この時のボンディングエリア３．６間のギャップは、リ
ードフレームの形状、樹脂の粘度等により異なるが、２
ｆｆかあるいはそれ以上に広げる。The gap between the bonding areas 3 and 6 at this time varies depending on the shape of the lead frame, the viscosity of the resin, etc.
ff or more.
最後に、前記透明シリコーン樹脂７及びボンディングエ
リア３．６の周囲を遮光エポキシ樹脂８で包んで製造を
完了する。Finally, the transparent silicone resin 7 and the bonding area 3.6 are wrapped with a light-shielding epoxy resin 8 to complete the manufacturing process.
ここで、光伝達については、発光素子１から直接受光素
子４へ到達する光の他に、樹脂界面（透明シリコン樹脂
７と遮光エポキシ樹脂８の界面）における反射光をも利
用すればより効果的である。Here, regarding light transmission, in addition to the light that directly reaches the light receiving element 4 from the light emitting element 1, it is more effective to use reflected light at the resin interface (the interface between the transparent silicone resin 7 and the light-shielding epoxy resin 8). It is.
このため、遮光エポキシ樹脂８としでは白色系のものを
用いる。For this reason, a white-colored material is used as the light-shielding epoxy resin 8.
なお、本実施例においては、ボンディングエリア３．６
間への樹脂充填後に８０分程度の仮硬化を行なったが、
この際、短時間熱を加えることによる仮硬化を行なえば
、さらに引き離した光結合路の形成が容易に行なえる。In addition, in this embodiment, the bonding area 3.6
After filling the space with resin, temporary curing was performed for about 80 minutes, but
At this time, if temporary curing is performed by applying heat for a short time, optical coupling paths that are further separated can be easily formed.
〈発明の効果〉
以上のように本発明によれば、ポンディングエリア間へ
の充填樹脂が低粘度であっても、前記ポンディングエリ
ア間の絶縁距離を大きくとれる。<Effects of the Invention> As described above, according to the present invention, even if the resin filled between the bonding areas has a low viscosity, the insulation distance between the bonding areas can be increased.
第１図（ａ）及び（ｂｌは本発明の一実施例による光結
合素子の製造方法を説明するための断面図、第２図は従
来例による光結合素子の断面図である。
１・・・発光素子、 ２・・・１次側リードフレーム、
４・・・受光素子、 ５・・・２次側リードフレーム、
７・・・透明樹脂、 ８・・・遮光性樹脂。FIGS. 1(a) and 1(bl) are sectional views for explaining a method of manufacturing an optical coupling device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional optical coupling device. 1.・Light emitting element, 2...Primary side lead frame,
4... Light receiving element, 5... Secondary side lead frame,
7...Transparent resin, 8...Light-shielding resin.
Claims (1)
置され、互いに対向する発光素子及び受光素子を有して
なる光結合素子の製造方法において、 前記発光素子及び受光素子間に透明樹脂を充填後、前記
透明樹脂を仮硬化し、 次に前記両リードフレームを互いに外側反対方向へ動か
して前記透明樹脂を引き伸ばし、その後前記透明樹脂の
周囲を遮光性樹脂で包むことを特徴とする光結合素子の
製造方法。[Scope of Claims] 1. A method for manufacturing an optical coupling device comprising a light emitting element and a light receiving element placed on primary side and secondary side lead frames respectively and facing each other, comprising: the light emitting element and the light receiving element; After filling the space between the light-receiving elements with transparent resin, the transparent resin is temporarily cured, and then both the lead frames are moved outward in opposite directions to stretch the transparent resin, and then the transparent resin is surrounded by a light-shielding resin. A method for manufacturing an optical coupling device, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2097022A JPH03293781A (en) | 1990-04-12 | 1990-04-12 | Manufacture of optically coupled element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2097022A JPH03293781A (en) | 1990-04-12 | 1990-04-12 | Manufacture of optically coupled element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03293781A true JPH03293781A (en) | 1991-12-25 |
Family
ID=14180782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2097022A Pending JPH03293781A (en) | 1990-04-12 | 1990-04-12 | Manufacture of optically coupled element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03293781A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335982A (en) * | 1994-06-08 | 1995-12-22 | Sharp Corp | Semiconductor device and its manufacture |
| DE4327133B4 (en) * | 1993-08-12 | 2006-07-13 | Vishay Europe Gmbh | Method for applying an optical coupling medium |
| JP2008085166A (en) * | 2006-09-28 | 2008-04-10 | Sharp Corp | Optical coupling type semiconductor device, production method thereof, and electronic instrument |
-
1990
- 1990-04-12 JP JP2097022A patent/JPH03293781A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4327133B4 (en) * | 1993-08-12 | 2006-07-13 | Vishay Europe Gmbh | Method for applying an optical coupling medium |
| JPH07335982A (en) * | 1994-06-08 | 1995-12-22 | Sharp Corp | Semiconductor device and its manufacture |
| JP2008085166A (en) * | 2006-09-28 | 2008-04-10 | Sharp Corp | Optical coupling type semiconductor device, production method thereof, and electronic instrument |
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