JPH03288478A - Light emitting element - Google Patents
Light emitting elementInfo
- Publication number
- JPH03288478A JPH03288478A JP2089891A JP8989190A JPH03288478A JP H03288478 A JPH03288478 A JP H03288478A JP 2089891 A JP2089891 A JP 2089891A JP 8989190 A JP8989190 A JP 8989190A JP H03288478 A JPH03288478 A JP H03288478A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting element
- face
- reflected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 description 7
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
- G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、光通信用光源、光センサ用光源、光通信用モ
ジュール等に用いられる発光ダイオードやレーザダイオ
ード等の発光素子に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to light emitting elements such as light emitting diodes and laser diodes used in optical communication light sources, optical sensor light sources, optical communication modules, and the like.
従来この種の用途に用いられる発光ダイオードなどでは
、ダイオードチップから放射される光を、レンズ等によ
り集光して光ファイバ等への結合効率を高めるようにな
っている。Conventionally, in light emitting diodes and the like used for this type of application, the light emitted from the diode chip is focused by a lens or the like to increase coupling efficiency to an optical fiber or the like.
第４図（特開昭６２−７３７８６号公報）はこの種の発
光ダイオードの従来技術を示すものである。FIG. 4 (Japanese Unexamined Patent Publication No. 62-73786) shows the conventional technology of this type of light emitting diode.
このものは、リードフレーム４１のヘッド部４２がアル
ミニウム等の金属で構成されており、その中央に凹溝４
２ａが形成され、この凹溝４２ｇにダイオードチップ４
３がマウントされている。凹溝４２ａの周壁は曲面とな
っており、この曲面がダイオードチップ４３の放射光を
前方へ反射する反射面４２ｂとなっている。そして、こ
れらが樹脂モールドされて一体に形成されている。In this device, a head portion 42 of a lead frame 41 is made of metal such as aluminum, and a groove 4 is formed in the center of the head portion 42 of a lead frame 41.
A diode chip 4 is formed in this groove 42g.
3 is mounted. The peripheral wall of the groove 42a is a curved surface, and this curved surface serves as a reflecting surface 42b that reflects the light emitted from the diode chip 43 forward. These are resin molded and integrally formed.
したがって、通常は損失光となるようなダイオードチッ
プ４３から斜め横方向に放射される光が、この反射面４
２ｂで前方に反射される。Therefore, the light emitted obliquely and laterally from the diode chip 43, which would normally be lost light, is transmitted to the reflecting surface 4.
It is reflected forward at 2b.
モールド樹脂４４の射出面部分４４ｇは、レンズ作用を
持たせるように半球形に形成され、放射光がこの部分で
収束されるようになっている。The exit surface portion 44g of the molded resin 44 is formed into a hemispherical shape so as to have a lens effect, and the emitted light is converged at this portion.
このように、反射面４２ｂで光のロスを少なくして輝度
ムラを解消し、射出面部分４４ａで光を積極的に集光す
るようにしている。In this way, the reflective surface 42b reduces light loss and eliminates uneven brightness, and the exit surface portion 44a actively focuses the light.
このように上記従来の発光ダイオードでは、光のロスを
解消する部分と光を積極的に集光する部分とが別体で構
成されており、その分、構造が複雑となり、また製造工
程も複雑となっていた。In this way, in the conventional light emitting diode mentioned above, the part that eliminates light loss and the part that actively focuses light are constructed as separate parts, which makes the structure complex and the manufacturing process complicated. It became.
また、反射面４２ｂが構成されるリードフレーム４１の
ヘッド部４２は、ダイオードチップ４３をダイボンドす
る際に加熱されるため、この反射面４２ｂが荒れ易く反
射効率が低下する不具合があった。Furthermore, since the head portion 42 of the lead frame 41, where the reflective surface 42b is formed, is heated when the diode chip 43 is die-bonded, the reflective surface 42b tends to become rough, resulting in a reduction in reflection efficiency.
本発明は、このような事情を考慮してなされたものであ
り、構造および製造が簡単で集光度の優れた発光素子を
提供することをその目的とする。The present invention has been made in consideration of such circumstances, and an object thereof is to provide a light emitting element that is simple in structure and manufacture and has excellent light condensing power.
本発明は上記目的を達成すべく、フレーム上にマウント
した発光素子チップを透光性樹脂のモールドにより一体
成型して成る発光素子において、発光素子チップの発光
面側のモールド樹脂がレンズ作用を奏するように形成さ
れた作用面部を備え、作用面部に発光面からの光を反射
する反射層が形成されていることを特徴とする。In order to achieve the above object, the present invention provides a light emitting element in which a light emitting element chip mounted on a frame is integrally molded with a translucent resin mold, in which the molded resin on the light emitting surface side of the light emitting element chip functions as a lens. The device is characterized in that it has a working surface portion formed as such, and a reflective layer that reflects light from the light emitting surface is formed on the working surface portion.
レンズ作用を奏するように形成された作用面部は反射層
と相俟って凹面鏡（又はフレネルレンズ状の反射鏡）の
作用を為す。したがって、発光素子チップの発光面から
放射された光は、作用面部の反射層で反射されると共に
集光される。また、発光面から放射される拡散光もこの
凹面鏡（又はフレネルレンズ状の反射鏡）で反射して無
駄無く収束される。The working surface portion formed to have a lens function acts as a concave mirror (or a Fresnel lens-like reflecting mirror) in conjunction with the reflective layer. Therefore, the light emitted from the light emitting surface of the light emitting element chip is reflected and condensed by the reflective layer of the working surface. Further, the diffused light emitted from the light emitting surface is also reflected by this concave mirror (or a Fresnel lens-like reflecting mirror) and converged without waste.
反射層は作用面部の外部から形成することができるので
、極めて容易にかつ高反射率のものを製造できる。Since the reflective layer can be formed from outside the working surface, it can be manufactured very easily and with high reflectance.
Ｃ実施例〕
第１図を参照して本発明の発光素子の第１の実施例に係
る発光ダイオードについて説明する。C Example] A light emitting diode according to a first example of the light emitting element of the present invention will be described with reference to FIG.
この発光ダイオード１は、リードフレーム２上にマウン
トしたダイオードチップ３を透明の樹脂４でモールドし
てほぼ卵形に一体成型したものである。This light emitting diode 1 is formed by integrally molding a diode chip 3 mounted on a lead frame 2 with a transparent resin 4 into a substantially oval shape.
ダイオードチップ３は、カソードリード５のヘッド部５
ａにグイボンドされ、アノードリード６の先端部６ａと
の間に渡したワイヤ７によりワイヤボンドされている。The diode chip 3 is attached to the head portion 5 of the cathode lead 5.
a, and is wire-bonded to the tip 6a of the anode lead 6 by a wire 7 passed between them.
ダイオードチップ３は、モールド樹脂４のほぼ中心に埋
め込まれており、その発光面３ａの向き、すなわち光軸
りはリードフレーム２に直交する方向となっている。The diode chip 3 is embedded almost in the center of the molded resin 4, and the direction of its light emitting surface 3a, that is, the optical axis, is perpendicular to the lead frame 2.
モールド樹脂４の発光面３ａ側は、発光面３ａとその光
軸りを同一としてレンズ作用を奏するような作用面部で
ある凸面部４ａとなっている。そして、凸面部４ａには
、発光面３ａからの光が反射されるような反射層８が形
成されており、この反射層８はその反射面８ａが放物面
となっていて反射した光が平行光となるような凹面鏡を
構成する。反射層８は、モールド樹脂４の凸面部４ａ１
；Ａｌ（アルミニウム）やＡｇ（銀）等の金属を蒸着す
るか、あるいはＡ１やＡｇ等の金属をメツキすることに
より形成される。このため、反射面８ａの形成がきわめ
て容易で、反射効率の良好なものとなっている。The light emitting surface 3a side of the molded resin 4 is a convex surface portion 4a which is an active surface portion that has the same optical axis as the light emitting surface 3a and exhibits a lens effect. A reflective layer 8 is formed on the convex surface portion 4a so that the light from the light emitting surface 3a is reflected, and the reflective layer 8 has a paraboloidal reflective surface 8a so that the reflected light is reflected. Construct a concave mirror that produces parallel light. The reflective layer 8 is formed on the convex surface portion 4a1 of the molded resin 4.
; It is formed by vapor depositing a metal such as Al (aluminum) or Ag (silver), or by plating a metal such as A1 or Ag. Therefore, the reflective surface 8a is extremely easy to form and has good reflection efficiency.
このように構成されるので、ダイオードチップ３の発光
面３ａから放射した拡散光は反射層８の反射面８ａで反
射され収束されて平行光となる。With this configuration, the diffused light emitted from the light emitting surface 3a of the diode chip 3 is reflected by the reflective surface 8a of the reflective layer 8 and converged to become parallel light.
一方、ダイオードチップ３を挾んで凸面部４ａと反対側
の射出面側には、ダイオードチップ３と同一の光軸り上
に位置させて、球レンズ９がモールド樹脂４内に埋め込
まれている。反射層８で略平行先に収束された放射光は
、この球レンズ９によりさらに収束され、球レンズ９の
前方直近に焦点を結ぶようにざら収束される。これによ
って十分に集光度が高められる。球レンズ９は、その後
半部がモールド樹脂４に埋め込まれ、前半部が露出して
おり、この露出部分で金型に位置決めされ樹脂モールド
されるようになっている。もっとも、球レンズ９はモー
ルド樹脂４に埋め込まなくとも、モールド樹脂４のこの
部分に凹溝を形成し、これに接着するようにしてもよい
。On the other hand, on the exit surface side opposite to the convex surface portion 4a across the diode chip 3, a ball lens 9 is embedded in the molded resin 4 so as to be positioned on the same optical axis as the diode chip 3. The emitted light that has been converged in a substantially parallel direction by the reflective layer 8 is further converged by this ball lens 9, and is roughly converged so as to be focused immediately in front of the ball lens 9. This sufficiently increases the light convergence. The rear half of the ball lens 9 is embedded in the mold resin 4, and the front half is exposed, and this exposed portion is positioned in a mold and resin molded. However, the ball lens 9 does not have to be embedded in the molded resin 4, but may be bonded to a groove formed in this part of the molded resin 4.
この実施例ではダイオードチップ３からの放射光（拡散
光）が反射層８で平行光になり球レンズ９でさらに収束
されて焦点を結ぶようになっているので、球レンズ９は
射出光の焦点位置等を考慮しつつ大きなものが使われる
。また、球レンズ９の材質は、モールド樹脂４の屈折率
が１．５であるため、１．７乃至１．９以上の透明物質
、特にガラス球レンズが好ましい。したがって、この実
施例ではコスト面を考慮し、ＴｉＯ、ＢａＯ１Ｓ ｉＯ
Ｚ系ガラスの球レンズが用いられ、その大きさに加えて
屈折率もある程度自由に選択できるようになっている。In this embodiment, the emitted light (diffuse light) from the diode chip 3 becomes parallel light on the reflective layer 8, and is further converged and focused on the ball lens 9, so the ball lens 9 serves as the focal point of the emitted light. A large one is used, taking into account its location, etc. Furthermore, since the mold resin 4 has a refractive index of 1.5, the ball lens 9 is preferably made of a transparent material with a refractive index of 1.7 to 1.9 or more, particularly a glass ball lens. Therefore, in this example, considering the cost, TiO, BaO1S iO
A ball lens made of Z-type glass is used, and in addition to its size, its refractive index can be selected freely to some extent.
このように、反射層８で構成される凹面鏡と球レンズ９
とで２段階に放射光の収束を行うので、きわめて集光度
の高い発光ダイオード１を得ることができる。したがっ
て、コア径の小さいファイバとの結合でも高い結合効率
を得ることができる。In this way, the concave mirror and the spherical lens 9 made up of the reflective layer 8
Since the emitted light is converged in two stages, it is possible to obtain a light-emitting diode 1 with extremely high light convergence. Therefore, high coupling efficiency can be obtained even when coupling with a fiber having a small core diameter.
また、この実施例では気密封止ではなく樹脂モールドを
採用するため、製造が容易でかつ製品のバラツキを少な
くすることができ、製造コストを低減できる。しかも、
発光ダイオード１の形状はそれが利用される装置や機器
の取付部分等により自由に変更できる。Further, in this embodiment, since a resin mold is used instead of an airtight seal, manufacturing is easy and variations in products can be reduced, and manufacturing costs can be reduced. Moreover,
The shape of the light emitting diode 1 can be freely changed depending on the installation part of the device or equipment in which it is used.
なお、本実施例では、球レンズを１個用いるようにして
いるが、２個以上用いるようにしてもよく、高集光度を
要求されないものでは省略してもよい。In this embodiment, one ball lens is used, but two or more ball lenses may be used, and may be omitted if a high light condensing degree is not required.
第２図は本発明の第２の実施例に係る発光ダイオードで
ある。この発光ダイオード１では、モールド樹脂４の凸
面部４ａを半球面に形成し、これに反射層８を形成する
ようにしている。ま′た、球レンズに代えてロフトレン
ズ１０を用いるようにしている。この場合でも発光面３
ａからの光はほぼ平行光となり、またロフトレンズ１０
と相俟って、集光度が高められる。FIG. 2 shows a light emitting diode according to a second embodiment of the present invention. In this light emitting diode 1, the convex surface portion 4a of the molded resin 4 is formed into a hemispherical surface, and the reflective layer 8 is formed on this. Furthermore, a loft lens 10 is used instead of the ball lens. Even in this case, the light emitting surface 3
The light from a becomes almost parallel light, and the loft lens 10
Together with this, the light concentration can be increased.
第３図は本発明の第３の実施例に係る発光ダイオードで
ある。この発光ダイオード１では、モールド樹脂４の凸
面部４ａを放物面の一部で構成し、これに反射層８を形
成するようにしている。そして、ダイオードチップ３が
なるべくこの反射層８に近づくようにしてモールドされ
ている。したがって、放射光が拡散幅が小さいうちに反
射して平行光に収束され、また球レンズ９は比較的小さ
く形成されており、モールド樹脂４内に完全に埋め込ま
れている。FIG. 3 shows a light emitting diode according to a third embodiment of the present invention. In this light emitting diode 1, the convex surface portion 4a of the molded resin 4 is constituted by a part of a paraboloid, and the reflective layer 8 is formed on this. The diode chip 3 is molded so as to be as close to the reflective layer 8 as possible. Therefore, the emitted light is reflected and converged into parallel light while the diffusion width is small, and the ball lens 9 is formed relatively small and is completely embedded in the molded resin 4.
なお、これらの実施例において、反射層８によって構成
される凹面鏡は、放物面鏡と半球面鏡であるが、これに
限定されるものではなく、反射によって光を収束できる
レンズと等価のもの、例えば双曲面鏡や楕円面鏡、フレ
ネルレンズ形状の反射鏡であってもよい。図示しないが
、このフレネルレンズ形状の反射鏡とすれば発光ダイオ
ードをコンパクトと形成できる。In addition, in these examples, the concave mirror constituted by the reflective layer 8 is a parabolic mirror or a hemispherical mirror, but is not limited to these, and may be equivalent to a lens that can converge light by reflection, For example, it may be a hyperboloid mirror, an ellipsoid mirror, or a Fresnel lens-shaped reflecting mirror. Although not shown, a light emitting diode can be formed compactly by using this Fresnel lens-shaped reflecting mirror.
〔発明の効果〕
以上のように本発明によれば、フレーム上にマウントし
た発光素子チップを透光性の樹脂でモールドして一体成
型すると共に、モールド樹脂に反射層を形成して発光素
子チップの発光面に対する凹面鏡等を構成することによ
り、高い集光度を奏する発光素子を容易に製造すること
ができ、製品のコストを低減する効果を有する。[Effects of the Invention] As described above, according to the present invention, a light emitting element chip mounted on a frame is integrally molded with a translucent resin, and a reflective layer is formed on the molded resin to form a light emitting element chip. By configuring a concave mirror or the like for the light emitting surface, a light emitting element that exhibits a high degree of light convergence can be easily manufactured, which has the effect of reducing the cost of the product.
第１図は本発明の第１実施例に係る発光ダイオードの縦
断面図、第２図は第２実施例に係る発光ダイオードの縦
断面図、第３図は第３実施例に係る発光ダイオードの縦
断面図、第４図は従来の発光ダイオードの縦断面図であ
る。
１・・・発光ダイオード、２・・・リードフレーム、３
・・・ダイオードチップ、３ａ・・・発光面、４・・・
モールド樹脂、４ａ・・・凸面部、５・・・カソードリ
ード、８・・・反射層、９・・・球レンズ、１０・・・
ロッドレンズ、Ｌ・・・光軸。FIG. 1 is a longitudinal sectional view of a light emitting diode according to a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a light emitting diode according to a second embodiment, and FIG. 3 is a longitudinal sectional view of a light emitting diode according to a third embodiment. FIG. 4 is a vertical cross-sectional view of a conventional light emitting diode. 1... Light emitting diode, 2... Lead frame, 3
...Diode chip, 3a... Light emitting surface, 4...
Mold resin, 4a... Convex surface portion, 5... Cathode lead, 8... Reflective layer, 9... Ball lens, 10...
Rod lens, L...optical axis.
Claims (1)
脂のモールドにより一体成型して成る発光素子において
、前記発光素子チップの発光面側のモールド樹脂がレン
ズ作用を奏するように形成された作用面部を備え、当該
作用面部に発光面からの光を反射する反射層が形成され
ていることを特徴とする発光素子。A light-emitting element formed by integrally molding a light-emitting element chip mounted on a frame with a light-transmitting resin mold, the light-emitting element having a working surface portion formed such that the molded resin on the light-emitting surface side of the light-emitting element chip functions as a lens. A light-emitting element, characterized in that a reflective layer that reflects light from a light-emitting surface is formed on the working surface portion.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2089891A JPH03288478A (en) | 1990-04-04 | 1990-04-04 | Light emitting element |
| EP91105169A EP0450560B1 (en) | 1990-04-03 | 1991-04-02 | An optical device |
| DE69129817T DE69129817T2 (en) | 1990-04-03 | 1991-04-02 | Optical device |
| US07/680,236 US5175783A (en) | 1990-04-03 | 1991-04-03 | Optical molded device including two lenses and active element integrally |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2089891A JPH03288478A (en) | 1990-04-04 | 1990-04-04 | Light emitting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03288478A true JPH03288478A (en) | 1991-12-18 |
Family
ID=13983365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2089891A Pending JPH03288478A (en) | 1990-04-03 | 1990-04-04 | Light emitting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03288478A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0590336A1 (en) * | 1992-10-02 | 1994-04-06 | TEMIC TELEFUNKEN microelectronic GmbH | Optoelectronic element with narrow beam angle |
| JP2014107502A (en) * | 2012-11-29 | 2014-06-09 | Citizen Holdings Co Ltd | Light emitting device |
-
1990
- 1990-04-04 JP JP2089891A patent/JPH03288478A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0590336A1 (en) * | 1992-10-02 | 1994-04-06 | TEMIC TELEFUNKEN microelectronic GmbH | Optoelectronic element with narrow beam angle |
| US5384471A (en) * | 1992-10-02 | 1995-01-24 | Temic Telefunken Microelectronic Gmbh | Opto-electronic component with narrow aperture angle |
| JP2014107502A (en) * | 2012-11-29 | 2014-06-09 | Citizen Holdings Co Ltd | Light emitting device |
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