JPH0328289B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a device for supplying a measured amount of molding material to a pot of a molding device for sealing and molding an electronic component attached to a lead frame.

[Background Art] Generally, when electronic parts are sealed and molded, a transfer mold is used. In other words, the lead frame with the electronic components attached is placed in the cavity between the upper and lower molds, lowered to the upper mold and clamped together, and after the molds are clamped, the plunger is driven to confirm the mold clamping. The molding material is injected into the cavity. The metered molding material is fed from the hopper to the pot of the molding die device by reciprocating the conveying basin between the hopper and the pot. In other words, the weighed molding material from the hopper is received in the transfer box, the transfer box is moved between the upper mold and the lower mold of the molding die device that has opened the mold, and the transfer box is moved above the pot. The shutter is opened and the molding material is dropped into the pot. However, in such conventional methods, since the molding material is dropped from above the pot, the molding material does not fall into the pot reliably, and the molding material is scattered around the pot periphery of the lower mold, and a predetermined amount of molding material is not supplied into the pot. However, there are disadvantages in that molding defects may occur, and molding material may adhere to the excess area between the upper mold and the lower mold, causing problems.

[Object of the Invention] The present invention has been made in view of the points described above, and an object of the present invention is to prevent the lower part of the chute from entering the pot and guiding it by the chute when the molding material is put into the pot. To provide a molding material supply device for sealing molding of electronic parts, which can reliably supply molding material from a conveying basin and can supply a predetermined amount of molding material into a pot.

[Disclosure of the Invention] The molding material supply device for electronic component encapsulation molding of the present invention has a tapered inner surface of a cylindrical conveying basin 20 for receiving and conveying the weighed molding material 3 of powder or granules, the diameter of which increases upwardly. This conveying basin 20 is made reciprocatingly movable between the measuring section and the pot 28 of the molding die device C, and is also vertically movable. A shutter 22 that opens when material 3 is introduced is provided so as to be openable and closable, and a cylindrical chute 61 whose lower part enters the pot 28 to guide the injection of the molding material 3 when the molding material 3 is introduced from the conveying basin 20 into the pot 28.
This is characterized in that it is vertically installed below the conveying box, and by configuring it as described above, the drawbacks of the conventional example are solved. In other words, when the molding material 3 is put into the pot 28 from the conveying chute 20, the conveying chute 20 descends and the lower part of the chute 61 enters the pot 28, and the molding material 3 can be thrown in using the chute 61 as a guide, so that the molding material 3 does not spill out. A predetermined amount of the molding material 3 can be supplied into the pot 28 without any problem, and troubles such as the molding material 3 spilling outside the pot 28 can be prevented.

The present invention will be explained in detail below with reference to Examples.

The continuous electronic component encapsulation molding apparatus is comprised of a conveyance device A, an elevating device B, a molding die device C, a material supply device D of the present invention, and a runner cal separation device E.

First, the transport device A will be described. Conveying device A is the fifth
As shown in FIG. 6, they are placed at the front and rear of the continuous electronic component encapsulation molding apparatus (the conveying direction of the lead frame 2 is the front, and the opposite direction is the rear). The conveying device A has an upper roller 6 and a lower roller 7, and is configured to convey the long lead frame 2 by sandwiching it between the upper roller 6 and the lower roller 7. A conveyance motor 8 is disposed below either the front or rear conveyance device A, and a chain 9 is suspended between the conveyance motor 8 and the lower roller 7. By driving the conveyance motor 8, the lower roller 7 is moved. It is designed to be driven. The conveyance motor 8 is driven intermittently, and is adapted to convey the lead frame 2 by a fixed length (the length to be molded at one time by a molding die device C, which will be described later). In the case of this example 2
The strip lead frames 2 are conveyed in parallel. Further, on the supply side, the lead frame 2 is wound into a hoop shape and then unwound and supplied.

A lifting device B is arranged below the conveying device A. In this embodiment, this elevating device B mainly consists of an elevating cylinder 10. The lower end of the piston rod 10a of the lifting cylinder 10 is connected to the base plate 1.
A support part 12 is provided at the upper end of the cylinder 10b of the lifting cylinder 10, and the above-mentioned upper roller 6 and lower roller 7 are supported on the support part 12. However, when the lifting cylinder 10 is driven, the fifth
As shown in the figure, the conveying device A rises and the lead frame 2 rises, or as shown in FIG. 6, the conveying device A descends and the lead frame 2 descends.

A molding die device C is disposed in front of the rear conveyance device A, and a material supplying device D of the present invention is disposed on the side of the molding die device C. Next, this material supply device D will be described. As shown in Figs. 1 and 2, a hopper 13 stores the molding material 3 in the upper part.
Hopper 1 is provided at the bottom of hopper 13.
A shutter 14 is provided to open and close the outlet at the bottom of 3. A plurality of (five in this embodiment) measuring rotors 15 are arranged below the outlet, and each measuring rotor 15 is provided with a measuring recess 16. A metering adjustment plate 17 is movably housed at the bottom of the metering recess 16, and an adjustment bolt 18 integrally connected to the metering adjustment plate 17 is screwed onto the metering rotor 15 and the other end is extended outward. A lock nut 19 is screwed onto the other end of the adjustment bolt 18. The amount to be measured can be adjusted by loosening the lock nut 19 and rotating the adjustment bolt 18 to adjust the metering adjustment plate 17. However, the measuring rotor 1
When the molding material 5 is rotated, a certain amount of the molding material 3 that has entered the measuring recess 16 is dropped downward. The metering rotor 15 is driven by, for example, converting the reciprocating motion of an air cylinder into a rotational motion. Measuring rotor 1
A plurality of transport boxes 20 are arranged below the weighing rotor 5 so as to correspond to the respective weighing rotors 15, and these transport boxes 20 are mounted on a first base plate 21. A shutter 22 that can be opened and closed is arranged at the bottom of the transfer box 20, and a drive cylinder 23 drives the shutter 2.
2 opening/closing operations are performed. A through hole 62 is formed in the first base 21 so as to correspond to the lower opening of each of the conveying basins 20, and the upper end of a cylindrical chute 61 communicating with the lower opening of the conveying basin 20 is formed in the through hole 62. is installed. The chute 61 has a tapered cylindrical shape whose diameter decreases toward the bottom. A second base 24 is disposed below the first base 21, and the first base 21 can be moved left and right by a drive cylinder 25 disposed on the second base 24. A drive cylinder 26 is arranged below the second base 25, and the drive cylinder 26 connects the second base 24 and the first base 21.
can be moved up and down. In the case of this embodiment, as shown in FIG. 2, the second base plate 24 is made vertically movable by sliding the slide portion 65 along the pillar 64 of the base plate 63 that supports the hopper 13. Slide rail 66 provided in
By sliding the slide body 67 along the first base plate 21, the first base plate 21 slides from side to side. However, when the molding material 3 falls from the metering rotor 15 as shown in FIG.
A weighed molding material 3 is received. At this time, the shutter 22 is closed. Then, the drive cylinder 25 is driven, and as shown in FIGS. 3b and 4a, the conveying box 20 moves together with the first base 21 above the pot 28 of the lower die 27 of the molding die device C, which will be described later. The drive cylinder 26 is then driven to
As shown in FIG. c and FIG.
The lower part of the is inserted into the pot 28. In this state, the drive cylinder 23 is driven to open the shutter 22 as shown in FIG. 4b, and the molding material 3 is supplied into the pot 28. At this time, the molding material 3 is guided by the chute 61 and falls, and the molding material 3 is reliably thrown into the pot 28. By driving in the opposite direction to that described above, the conveying box 20 returns below the weighing rotor 15 and operates in the same manner as described above.

Next, the molding die device C will be described. As shown in FIG. 7, an upper first die plate 29, an upper second die plate 30, an upper third die plate 31
are arranged. The upper first die plate 29 is vertically movable, and a mold clamping cylinder 32 is mounted on the upper first die plate 29. The upper second die plate 30 is fixed. Upper third die plate 3
1 is vertically movable, has an upper mold 33 mounted on its lower surface, and is connected to a piston rod 34 of a mold clamping cylinder 32. A lower die plate 35, a plunger plate 36, and a cylinder mounting plate 37 are arranged below. The lower die plate 35 is fixed, a mounting base 38 is mounted on the lower die plate 35, and a lower mold 27 is arranged on the mounting base 38. A pot 28 is provided at the center of the upper surface of the lower mold 27, and a plurality of runner grooves 39 are bored on the left and right sides so as to communicate with the pot 28. At the tips of the runner grooves 39, the upper mold 33 and the lower mold A cavity 40 is formed between it and 27.
A molding pressure regulating valve 41 is provided on the upper mold 33 at a position corresponding to the pot 28. A plunger 42 is passed through the lower mold 27 in the vertical direction at a position corresponding to the pot 28, and the lower end of the plunger 42 is connected to a plunger drive plate 43 which is vertically movable. A knockout pin 44 is vertically passed through the lower die 27 at a position corresponding to the cavity 40, and the lower end of the knockout pin 44 is connected to a knockout plate 45. Knockout plate 45 is located above plunger drive plate 43. The upper second die plate 30 and the lower die plate 35 are connected to the connecting rod 4.
The upper first die plate 29 and the plunger plate 36 are connected by an interlocking rod 47. Cylinder mounting plate 37
A resistance/ejection cylinder 48 is attached to the cylinder 48, and a piston rod 49 of the resistance/ejection cylinder 48 is connected to the plunger plate 36, and a rod 50 connects the plunger plate 36 and the plunger drive plate 43. It is connected at. The resistance/ejection cylinder 48 serves as a resistance for mold clamping and also performs a knockout function, and is connected to the hydraulic piping 5 as shown in FIG.
2 has a resistance valve 51. However, Figure 7a
As shown in FIG. 2, the lead frame 2, which is not sealed and molded in an open state in which the upper mold 33 is separated from the lower mold 27, is supplied to the cavity 40, and the molding material weighed from the transfer box 20 of the material supply device D is supplied to the cavity 40. 3 is supplied to pot 28. From this state, as shown by the arrow in FIG. 8, hydraulic pressure is supplied to the upper chamber 53 of the mold clamping cylinder 32, and hydraulic pressure is discharged from the lower chamber 54, and the piston rod 34 is lowered and raised together with the upper third die plate 31. The mold 33 is lowered and FIG. 7b
The mold is clamped as shown. After the mold clamping is completed, the mold clamping cylinder 32 is further driven. Then, since the lower die plate 35 is fixed, the upper first die plate 29 rises, the plunger plate 36 rises via the interlocking rod 47, and the connecting rod 50,
The plunger 42 is raised via the plunger drive plate 43, and the molding material 3 in the pot 28 is injected into the cavity 40. At this time, the resistance/ejection cylinder 48 is not driven, but since the resistance valve 51 is in communication with the upper chamber 55, it becomes a resistance when the plunger plate 36 rises, and the output of the mold clamping cylinder 32 and the resistance/ejection cylinder 48 are connected to each other. The difference in the resistance of the cylinder 48 becomes a force that raises the plunger 42, and this force injects the molding material 3 into the cavity 40. In other words, good molding is achieved by gradually injecting the material with a relatively weak force. Further, fine adjustment of the injection pressure is performed by a molding pressure adjustment valve 41. When the molding material 3 is filled into the cavity 40 and molding is completed, the mold clamping cylinder 32 is driven in the opposite direction, and the upper mold 33 is raised together with the upper third die plate 31 to open the mold. At this time, hydraulic pressure is supplied to the lower chamber 56 of the resistance/ejecting cylinder 48 as shown by the arrow in FIG. 6, and the plunger plate 36 is driven upward as shown in FIG. 7c. 43, knockout plate 4
5, the plunger 42 and the knockout pin 44 are driven upward, and the molded product 57 is pushed into the runner 4.
It is ejected along with Cal 5. Next, the knockout pin 44 and plunger 42 return to their original positions, and the portion of the lead frame 2 that is not sealed is placed in the upper mold 3.
3 and the lower mold 27, and is sealed and molded in the same manner as described above.

A runner cal separation device E is disposed in front of the molding die device C, and the runner cal separation device E will be described next. Lead frame 2
A pair of dies 58 which are long in the conveyance direction are arranged at intervals on the left and right, a separation plate 59 is arranged above between the pair of dies 58, and the separation plate 59 is connected to a drive cylinder 60. . When the molded product 57 having the runner 4 and the cull 5 is sent onto the die 58, the drive cylinder 60 is driven and the separation plate 59 is lowered as shown in FIG. The runner 4 and cull 5 are separated from the molded product 57 by cutting between them.

Next, the overall operation of the continuous electronic component sealing molding apparatus configured as described above will be explained. The lead frame 2 is unwound from the hoop-shaped state,
The paper is conveyed while being sandwiched between the upper roller 6 and lower roller 7 of the conveyance device A. First, as shown in FIG. 5, the molding die device C is opened, the upper mold 33 is separated upward, and the separation plate 59 of the runner cal separation device E is separated upward. In this state, the conveying device A is raised by the lifting cylinder 10 of the lifting device B, and the lead frame 2 is raised upward, and the lead frame 2 is separated from the lower die 27 and the die 58. In this state, the drive motor 8 of the conveyance device A is driven, and the lead frame 2 is conveyed forward by the length of the molding die device C. Then, the lead frame 2 that is not sealed is located above the lower die 27 of the molding die device C, and the molded product 57 that was sealed earlier is placed above the die 58 of the runner cal separation device E.
Lead frame 2 with runner 4 and cull 5
It's coming. At this time, the conveyor box 20 of the material supply device D disposed on the side of the forming mold device C is connected to the metering rotor 15.
The molding material 3 is received from the measuring recess 16 of the conveyor 2.
0 moves above the pot 28 of the lower mold 27, and the molding material 3 is supplied to the pot 28 from the conveying box 20 via the chute 61. Then, the lifting cylinder 10 of the lifting device B is driven in the opposite direction, and the conveying device A is lowered, and the lead frame 2 is placed on the lower mold 27 and the lead frame 2 is placed on the die 58.
Then, in the molding die device C, the mold clamping cylinder 32 is driven, the upper mold 33 is lowered, and the mold is clamped as shown in FIG. , interlocking rod 47, plunger plate 36, connecting rod 5
0, the plunger 42 is raised via the plunger drive plate 43, and the molding material 3 flows from the pot 28 through the runner groove 39 into the cavity 40.
It is injected and sealed. On the other hand, at this time, in the runner cal separation device E, the separation plate 59 is lowered by the drive cylinder 60, and the separation plate 59 is lowered by the drive cylinder 60.
The molded product 57 and the runner 4 are separated from the cull 5 by cutting between the molded product 57 and the die 58. Molding mold device C
After sealing is performed, the mold clamping cylinder 32 is driven in the opposite direction, and the upper mold 33 is raised to open the mold.
Then, the resistance/ejecting cylinder 48 is driven, and the plunger 42 and knockout pin 44 are raised via the plunger plate 36, connecting rod 50, plunger drive plate 43, and knockout plate 45, and the molded product 57 and runner 4 are raised. and Cal 5 are pushed upwards. At this time, the lead frame 2 is lifted up by the lifting cylinder 10 of the lifting device B.
is raised, and the lead frame 2 having the molded product 57, runner 4, and cull 5 is located above the lower die 27, and the lead frame 2 having only the molded product 57 is located above the die 58. Then, the drive motor 8 of the conveyance device A is driven to advance the lead frame 2 by the length of the molding die device C, and the lead frame 2 containing only the molded product 57 is taken out as a product in front of the runner cal separation device E. By repeating the above operations, a continuously sealed product is manufactured.

[Effects of the Invention] As described above, the present invention includes a cylindrical chute whose lower part enters into the pot and guides the injection of the molding material when the molding material is introduced from the conveyance basin into the pot, which is suspended below the conveyance basin. Since the transfer pail can be moved up and down, when the transfer pail containing the weighed molding material is transferred onto the pot, the shutter is opened, and the molding material is introduced into the pot, the transfer pail is lowered and the chute is placed into the pot. Even if powdered molding material is to be introduced into the pot, the chute can be used as a guide to ensure that the molding material is poured into the pot. It is possible to reliably supply molding material without causing molding defects, and there is no risk of molding material spilling outside the pot and causing trouble. Because of its tapered shape, when pouring the weighed molding material into the conveyor, it can be inserted through the large opening at the top, allowing the molding material to be poured smoothly without spilling, allowing molding from the conveyor to the pot. When material is introduced, it can be smoothly discharged so that no molding material remains in the conveyor.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the material supply device of the present invention, FIG. 2a is a side view of the same material supply device as above,
Figure 2b is a partially omitted plan view of Figure 2a, Figure 2c
is a partially omitted front view of Fig. 2 b, Fig. 3 a, b, c
is a sectional view illustrating the operation of the material supply device same as above,
4a and 4b are enlarged sectional views explaining the operation of the same as above, FIG. 5 is a front view of a continuous electronic component sealing molding apparatus using the material supply device of the present invention, and FIG. 6 is different from FIG. 5 of the same. Front view in different states, Figure 7 a, b, c
8 is a sectional view showing the operation of the above molding die device, FIG. 9 is a sectional view of the runner cal separation device same as the above, and C is a sectional view of the above molding die device. device, 3 is a molding material, 20 is a conveying box, 2
2 is a shutter, 28 is a pot, and 61 is a shoot.

Claims (1)

[Claims] 1. The inner surface of a cylindrical transport box that receives and transports the weighed molding material of powder and granular material is tapered so that the diameter increases toward the top, and this transport box is reciprocated between the measuring section and the molding die device. The shutter is made to be freely movable up and down and can be opened and closed when the molding material is put into the pot from the transport pit. 1. A molding material supply device for electronic component encapsulation molding, characterized in that a cylindrical chute for guiding the introduction of molding material is vertically disposed below a conveying box.