JPH0328078B2 - - Google Patents
Info
- Publication number
- JPH0328078B2 JPH0328078B2 JP60178574A JP17857485A JPH0328078B2 JP H0328078 B2 JPH0328078 B2 JP H0328078B2 JP 60178574 A JP60178574 A JP 60178574A JP 17857485 A JP17857485 A JP 17857485A JP H0328078 B2 JPH0328078 B2 JP H0328078B2
- Authority
- JP
- Japan
- Prior art keywords
- cardboard
- cartridge
- conductive
- chip
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Credit Cards Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、ICカトリツジに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an IC cartridge.
［従来の技術］
従来のICカートリツジは、導電パターンを有
するガラスエポキシ等の回路基板にICを搭載し
たものである。[Prior Art] A conventional IC cartridge has an IC mounted on a circuit board made of glass epoxy or the like having a conductive pattern.
つまり、ガラスエポキシ等の回路基板に銅箔を
貼り、この銅箔をエツチングすることによつて、
所定の導電パターンを形成し、この導電パターン
の所定部分に、DIPパツケージまたはフラツトパ
ツケージ等のパツケージを有するICを搭載して
ある。 In other words, by pasting copper foil on a circuit board such as glass epoxy and etching this copper foil,
A predetermined conductive pattern is formed, and an IC having a package such as a DIP package or a flat package is mounted on a predetermined portion of the conductive pattern.
しかし、導電パターンを作る場合に、エツチン
グ工程が含まれているので、ICカートリツジ製
造における全体の工程が煩雑になるという問題が
ある。また、回路基板にガラスエポキシを使用し
ているために、コストが高くなるという問題があ
る。 However, since an etching process is included when forming the conductive pattern, there is a problem in that the entire process for manufacturing the IC cartridge becomes complicated. Furthermore, since glass epoxy is used for the circuit board, there is a problem in that the cost is high.
［発明の目的］
本発明は、ICカートリツジを容易に製造する
ことができるとともに、紙を基材とした割には、
ICカートリツジのコネクタ部分の強度が高いIC
カートリツジを提供することを目的とするもので
ある。[Object of the invention] The present invention enables easy manufacture of IC cartridges, and although paper is used as the base material,
IC with high strength connector part of IC cartridge
The purpose is to provide cartridges.
［発明の概要］
本発明は、ICチツプのピンが導電性接着剤で
厚紙に固定され、ICチツプのピンと厚紙の端部
との間に導電性インクが塗布されたICカートリ
ツジであつて、厚紙の片端部および他端部に塗布
された導電性インクがコネクタの導電部を形成
し、厚紙を折返したときに、片端部と他端部とが
背中合せになるようにしたものである。[Summary of the Invention] The present invention provides an IC cartridge in which pins of an IC chip are fixed to cardboard with a conductive adhesive, and conductive ink is applied between the pins of the IC chip and the ends of the cardboard. The conductive ink applied to one end and the other end of the connector forms the conductive part of the connector, so that when the cardboard is folded back, the one end and the other end are back to back.
［発明の実施例］
第１図は、本発明の一実施例を示す平面図であ
る。[Embodiment of the Invention] FIG. 1 is a plan view showing an embodiment of the invention.
厚紙１０は、端部１１，１２と中央折返し部分
１３とを有し、絶縁性を有し、所定の厚みを有す
るものである。 The cardboard 10 has end portions 11 and 12 and a central folded portion 13, has insulation properties, and has a predetermined thickness.
ICチツプ２０は、厚紙１０に設けられた複数
の孔に、そのICピンが挿入され、これらのICピ
ンと厚紙とが導電性接着剤３０によつて固定され
ている。 The IC chip 20 has its IC pins inserted into a plurality of holes provided in the cardboard 10, and these IC pins and the cardboard are fixed with a conductive adhesive 30.
導電性インク４０は、導電性接着剤３０と厚紙
の端部１１または１２との間であつて、厚紙１０
の上に塗布されている。 The conductive ink 40 is between the conductive adhesive 30 and the edge 11 or 12 of the cardboard 10.
is coated on top.
また、上記実施例において、厚紙１０の片端部
１１および他端部１２に塗布された導電性インク
４０がコネクタの導電部を形成し、厚紙１０を折
返したときに、片端部１１と他端部１２とが背中
合せになるようになつている。 Further, in the above embodiment, the conductive ink 40 applied to one end 11 and the other end 12 of the cardboard 10 forms the conductive part of the connector, and when the cardboard 10 is folded back, the one end 11 and the other end 12 are placed back to back.
次に、上記実施例の作用について説明する。 Next, the operation of the above embodiment will be explained.
まず、上記ICカートリツジは、第１図の状態
で、本の付録等として、または１つつの商品とし
て、ユーザーの手に渡る。 First, the above-mentioned IC cartridge is delivered to the user in the state shown in FIG. 1 as an appendix to a book or as a single product.
ユーザーは、厚紙１０の中央折返し部分１３に
沿つて、第２図に示すように、折返し、または貼
り合せる。この場合、端部１１と１２とを一致さ
せて背中合せにして、コネクタ部分を形成させ
る。 The user folds or pastes the cardboard 10 along the center folded portion 13 as shown in FIG. In this case, the ends 11 and 12 are aligned back to back to form the connector portion.
そして、第３図に示すように、上記コネクタ部
分を、パーソナルコンピユータ等のハードウエア
５０のコネクタ（スロツト）５１に差し込む。 Then, as shown in FIG. 3, the connector portion is inserted into a connector (slot) 51 of hardware 50 such as a personal computer.
これによつて、ICチツプ２０にゲームプログ
ラムが記録されていれば、そのゲームを楽しむこ
とができ、他のプログラムが記録されていれば、
そのプログラムを実行することができる。 With this, if a game program is recorded on the IC chip 20, you can enjoy that game, and if another program is recorded,
The program can be executed.
導電性インク４０は、その回路基板である厚紙
１０を多少曲げても、通電するので、導電パター
ンとして充分、実用に耐える。そして、導電イン
ク４０は、通常の印刷工程でそのパターンを形成
できるので、エツチング工程よりもその工程が容
易である。 The conductive ink 40 conducts electricity even if the cardboard 10, which is the circuit board, is slightly bent, so that it can be used as a conductive pattern for practical use. Since the pattern of the conductive ink 40 can be formed by a normal printing process, the process is easier than an etching process.
また、回路基板として厚紙１０を使用してお
り、これは従来のガラスエポキシよりも安価であ
る。また、印刷工程はエツチング工程よりも安価
であるので、上記ICカートリツジは、安価に製
造できる。 Additionally, cardboard 10 is used as the circuit board, which is cheaper than conventional glass epoxy. Furthermore, since the printing process is cheaper than the etching process, the above IC cartridge can be manufactured at low cost.
ICチツプ２０は、上記の場合ROM（リードオ
ンリーメモリ）であつたが、RAM（ランダムア
クセスメモリ）であつてもよい。 Although the IC chip 20 is a ROM (read only memory) in the above case, it may also be a RAM (random access memory).
［発明の効果］
本願発明によれば、ICカートリツジを容易に
製造することができるとともに、紙を基材とした
割には、ICカートリツジのコネクタ部分の強度
が高くなるという効果を奏する。[Effects of the Invention] According to the present invention, it is possible to easily manufacture an IC cartridge, and the strength of the connector portion of the IC cartridge is increased even though paper is used as the base material.
第１図は、本発明の一実施例を示す正面図であ
る。第２図は、上記実施例を折返した場合の説明
図である。第３図は、上記実施例の使用例を示す
斜視図である。
１０……厚紙、２０……ICチツプ、３０……
導電性接着剤、４０……導電性インク。
FIG. 1 is a front view showing one embodiment of the present invention. FIG. 2 is an explanatory diagram when the above embodiment is folded back. FIG. 3 is a perspective view showing an example of use of the above embodiment. 10...Thick paper, 20...IC chip, 30...
Conductive adhesive, 40... Conductive ink.
Claims (1)
定され、上記ICチツプのピンと上記厚紙の端部
との間に導電性インクが塗布されたICカートリ
ツジであつて、 上記厚紙の片端部および他端部に塗布された上
記導電性インクがコネクタの導電部を形成し、上
記厚紙を折返したときに、上記片端部と上記他端
部とが背中合せになることを特徴とするICカー
トリツジ。[Scope of Claims] 1. An IC cartridge in which pins of an IC chip are fixed to cardboard with a conductive adhesive, and conductive ink is applied between the pins of the IC chip and the ends of the cardboard, comprising: The conductive ink applied to one end and the other end of the cardboard forms a conductive part of the connector, and when the cardboard is folded back, the one end and the other end are back to back. IC cartridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178574A JPS6240733A (en) | 1985-08-15 | 1985-08-15 | Ic cartridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178574A JPS6240733A (en) | 1985-08-15 | 1985-08-15 | Ic cartridge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6240733A JPS6240733A (en) | 1987-02-21 |
| JPH0328078B2 true JPH0328078B2 (en) | 1991-04-17 |
Family
ID=16050853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60178574A Granted JPS6240733A (en) | 1985-08-15 | 1985-08-15 | Ic cartridge |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240733A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08202844A (en) * | 1995-01-25 | 1996-08-09 | Nippon Retsuku Kk | Electronic unit and its manufacture |
| JP2012507081A (en) * | 2008-10-23 | 2012-03-22 | オセロット，エルエルシー． | Data storage devices |
| CN113599079B (en) | 2016-08-12 | 2022-10-11 | 宝洁公司 | Elastic laminate and method for assembling an elastic laminate for an absorbent article |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5222770A (en) * | 1975-08-13 | 1977-02-21 | Seikosha Kk | Method of mounting circuit parts on circuit board |
| JPS5453264A (en) * | 1977-10-04 | 1979-04-26 | Suwa Seikosha Kk | Bilateral printed board |
| JPS5538073A (en) * | 1978-09-12 | 1980-03-17 | Citizen Watch Co Ltd | Electronic watch circuit structure |
| JPS5623297A (en) * | 1979-07-31 | 1981-03-05 | Seiko Epson Corp | Partial plating method |
-
1985
- 1985-08-15 JP JP60178574A patent/JPS6240733A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6240733A (en) | 1987-02-21 |
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