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JPH03271791A - Drive circuit mounting structure in liquid crystal display devices, etc. - Google Patents

Drive circuit mounting structure in liquid crystal display devices, etc.

Info

Publication number
JPH03271791A
JPH03271791A JP7254290A JP7254290A JPH03271791A JP H03271791 A JPH03271791 A JP H03271791A JP 7254290 A JP7254290 A JP 7254290A JP 7254290 A JP7254290 A JP 7254290A JP H03271791 A JPH03271791 A JP H03271791A
Authority
JP
Japan
Prior art keywords
chip
liquid crystal
electrode
electrode substrate
flexible wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7254290A
Other languages
Japanese (ja)
Inventor
Masaru Kamimura
上村 優
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP7254290A priority Critical patent/JPH03271791A/en
Publication of JPH03271791A publication Critical patent/JPH03271791A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE:To allow the dealing with fine patterns by providing the input terminals of the electrodes on an electrode substrate in correspondence to the output wirings in three directions on a flexible wiring connecting member. CONSTITUTION:The flexible wiring connecting member 3 formed by packaging an IC chip 4 on a flexible wiring substrate 30 and disposing the output wirings 3b of the IC chip 4 in the three directions is so disposed on the electrode substrate 1B that the IC chip 4 is positioned on the electrode substrate 1B, such as liquid crystal display panel. The electrode input terminal part 12a on the electrode substrate 1B and the output wiring 3b are connected by, for example, an anisotropic conductive adhesive, etc. The output wirings 3b of the IC chip 4 are disposed in the three directions on the flexible wiring connecting member 30 and the electrode input terminal art 12a on the electrode substrate 1B connected thereto is provided in correspondence to the output wiring 3b. The sufficient dealing with the finer patterns is possible in this way.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は液晶表示装置等における駆動回路の実装構造に
関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure of a drive circuit in a liquid crystal display device or the like.

〔従来の技術〕[Conventional technology]

例えば液晶表示装置における駆動回路の実装構造として
は、従来種々の構成のものが提案されている。
For example, various configurations have been proposed as mounting structures for drive circuits in liquid crystal display devices.

第2図(a) ・ (b)は従来の液晶表示装置におけ
る駆動回路実装構造の一例を示すもので、図において1
は液晶表示パネルであり、対向面側に透明電極11・1
2を配設した上下一対の電極基板IA・18間に液晶層
13を介在させ、その周辺部をシール部材14で密封し
た構成である。
Figures 2(a) and 2(b) show an example of a drive circuit mounting structure in a conventional liquid crystal display device.
is a liquid crystal display panel, with transparent electrodes 11 and 1 on the opposite side.
In this structure, a liquid crystal layer 13 is interposed between a pair of upper and lower electrode substrates IA and 18 on which electrodes 2 are disposed, and its peripheral portion is sealed with a sealing member 14.

2は上記液晶パネル1の駆動制御用の回路基板、3はそ
の回路基板2と下側電極基板IB上の透明電極12とを
接続するいわゆるF P C(FlexiblePri
nt C1rcuit)等の可撓性配線接続部材である
2 is a circuit board for controlling the drive of the liquid crystal panel 1, and 3 is a so-called FPC (Flexible Pr) connecting the circuit board 2 and the transparent electrode 12 on the lower electrode board IB.
It is a flexible wiring connection member such as nt C1rcuit.

その可撓性配線接続部材3は、LSI等の液晶駆動用の
ICチップ4をいわゆるTAB (Tape Auto
sated Bonding)方式で実装し、そのIC
チップ4の入出力端子4a・4bに対する入出力配線3
a・3bをポリイミド樹脂等のシート状の可撓性配線基
板30上に施してなる。そして、上記の入力配線3aを
回路基板2に、出力配線3bを電極基板IB上の透明電
極12の入力端子部12aにそれぞれ異方性導電接着剤
6a・6b等で接続した構成である。
The flexible wiring connection member 3 connects an IC chip 4 for driving a liquid crystal such as an LSI to a so-called TAB (Tape Auto).
(sated bonding) method, and the IC
Input/output wiring 3 for input/output terminals 4a and 4b of chip 4
a and 3b are applied on a sheet-like flexible wiring board 30 made of polyimide resin or the like. The above input wiring 3a is connected to the circuit board 2, and the output wiring 3b is connected to the input terminal portion 12a of the transparent electrode 12 on the electrode substrate IB using anisotropic conductive adhesives 6a, 6b, etc., respectively.

ところが、例えば最近の液晶表示装置等にあっては表示
両面のカラー化や高密度化に伴って電極基板上の電極数
が増加し、電極パターンが微細化される傾向にあり、そ
れに応じて可撓性配線接続部材3上の入出力配線3a・
3b、特に出力配線3bのピッチも微細化さる傾向にあ
るが、従来はその出力配線およびそれと接続する電極基
板上の電極入力端子部は、それぞれ一方向に直線状に配
した構成であるから、上記の微細パターン化に充分に対
応できない等の問題がある。
However, in recent liquid crystal display devices, for example, the number of electrodes on the electrode substrate has increased and the electrode patterns have become finer due to colorization and higher density on both sides of the display. Input/output wiring 3a on the flexible wiring connection member 3
3b, especially the pitch of the output wiring 3b, has also tended to become finer, but conventionally, the output wiring and the electrode input terminal portions on the electrode substrate connected thereto have been arranged linearly in one direction. There are problems such as not being able to sufficiently respond to the above-mentioned fine patterning.

また、例えば第3図(a)  ・ (b)に示すように
ICチップ4をガラス等よりなる電極基板IB上に直接
載置するいわゆるC OG (Chip On Gla
sS)実装方式も提案されている。この種の実装方式は
、電極基板IB上の電極入力端子部12aを、方形のI
Cチップ4の三辺側に設けた出力端子4bに対応するよ
うに配線して導電性接着剤等で導通接続し、上記ICチ
ップ4の他の一辺側に形成した入力端子4aを、電極基
板IB上に設けた接続用配線15に上記と同様に導通接
続する。そして、その接続用配線15と制御用回路基板
2とをFPC等の可撓性配線接続部材31で接続するも
のである。30はその接続部材31の可撓性配線基板、
31aは接続用配線を示す。
Furthermore, as shown in FIGS. 3(a) and 3(b), for example, a so-called COG (Chip On Glare) method is used, in which an IC chip 4 is placed directly on an electrode substrate IB made of glass or the like.
sS) implementation method has also been proposed. In this type of mounting method, the electrode input terminal portion 12a on the electrode substrate IB is connected to a rectangular I
The output terminals 4b provided on the three sides of the C chip 4 are wired and electrically connected using a conductive adhesive or the like, and the input terminals 4a formed on the other side of the IC chip 4 are connected to the electrode substrate. Conductive connection is made to the connection wiring 15 provided on the IB in the same manner as above. Then, the connection wiring 15 and the control circuit board 2 are connected by a flexible wiring connection member 31 such as an FPC. 30 is a flexible wiring board of the connecting member 31;
31a indicates connection wiring.

上記のような実装方式は、前記の微細パターン化には対
応できるが、IC入力配線として接続部が1ケ所増える
と共に、可撓性配線接続部材を余分に要する等の不具合
がある。
Although the above-mentioned mounting method can cope with the above-mentioned fine patterning, it has disadvantages such as the need for one more connection part for IC input wiring and the need for an extra flexible wiring connection member.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

本発明は上記の問題点に鑑みて提案されたもので、前記
の微細パターン化に充分に対応することができ、しかも
構造簡単で組付容易な液晶表示装置等における駆動回路
実装構造を得ることを目的とする。
The present invention has been proposed in view of the above-mentioned problems, and an object of the present invention is to obtain a drive circuit mounting structure for a liquid crystal display device, etc., which can sufficiently cope with the above-mentioned fine patterning, has a simple structure, and is easy to assemble. With the goal.

〔課題を解決するための手段〕[Means to solve the problem]

上記の目的を達成するために本発明による液晶表示装置
等における駆動回路実装構造は以下の構成としたもので
ある。
In order to achieve the above object, a drive circuit mounting structure in a liquid crystal display device or the like according to the present invention has the following configuration.

即ち、可撓性配線基板上にICチップを実装し、そのI
Cチップの出力配線を三方向に配してなる可撓性配線接
続部材を、上記ICチップが液晶表示パネル等の電極基
板上に位置するようにして該電極基板上に配置し、上記
三方向に配した出力配線と、それに対応させて配線した
電極基板上の電極の入力端子部とを電気的に導通接続し
たことを特徴とする。
That is, an IC chip is mounted on a flexible wiring board, and its I
A flexible wiring connection member having output wiring of a C chip arranged in three directions is placed on an electrode substrate such that the IC chip is positioned on the electrode substrate of a liquid crystal display panel, etc. It is characterized in that the output wiring arranged on the output wiring and the input terminal portion of the electrode on the electrode substrate wired corresponding thereto are electrically conductively connected.

〔作 用〕[For production]

上記の構成により、可撓性配線基板上に予めICチップ
を例えばTAB方式で実装し、ICチップの入出力配線
を施してなる可撓性配線接続部材を、電極基板上に載置
して該基板上の電極入力端子部と上記出力配線とを例え
ば異方性導電接着側等で接続することができる。またI
Cチップの出力配線を可撓性配線基板上に三方向に配し
、それに接続する電極基板上の電極入力端子部を上記出
力配線に対応させて設けたことにより、前記の微細パタ
ーン化に充分に対応することが可能となる。
With the above configuration, an IC chip is mounted in advance on a flexible wiring board using, for example, the TAB method, and a flexible wiring connection member, which is formed by providing input/output wiring for the IC chip, is placed on an electrode board and connected to the flexible wiring connection member. The electrode input terminal portion on the substrate and the output wiring can be connected, for example, by an anisotropic conductive adhesive. Also I
The output wiring of the C chip is arranged in three directions on a flexible wiring board, and the electrode input terminals on the electrode board connected thereto are provided in correspondence with the output wiring, which is sufficient for the above-mentioned fine patterning. It becomes possible to correspond to

〔実施例〕〔Example〕

以下、図に示す実施例に基づいて本発明を具体的に説明
する。
Hereinafter, the present invention will be specifically explained based on embodiments shown in the drawings.

第1図(a)は本発明による液晶表示装置における駆動
回路実装構造の一例を示す斜視図、同図(b)は要部の
縦断面図、同図(c)は可撓性配線接続部材の平面図で
あり、前記従来例と同様の機能を有する部材には同一の
符号を付して再度の説明を省略する。
FIG. 1(a) is a perspective view showing an example of a drive circuit mounting structure in a liquid crystal display device according to the present invention, FIG. 1(b) is a longitudinal sectional view of the main part, and FIG. 1(c) is a flexible wiring connection member. FIG. 2 is a plan view of the conventional example, in which members having the same functions as those of the conventional example are designated by the same reference numerals and repeated explanations will be omitted.

可撓性配線接続部材3は、ポリイミド樹脂等のシート状
の合成樹脂製可撓性配線基板3oの片面に銅箔等で配線
3a・3bを施したいわゆるFPCよりなり、その配線
接続部材3上にLSI等の液晶駆動用のICチップ4が
TAB方式により実装され、いわゆルCOF (Chi
p On Film)を構成している。上記ICチップ
4に対する入力配線3aは一方向に形成され、出力配線
3bは三方向に形成されている。
The flexible wiring connection member 3 is made of a so-called FPC in which wiring 3a and 3b are formed with copper foil or the like on one side of a flexible wiring board 3o made of a sheet-like synthetic resin such as polyimide resin. An IC chip 4 for driving a liquid crystal such as an LSI is mounted in the TAB method, so-called COF (Chi
p On Film). Input wiring 3a for the IC chip 4 is formed in one direction, and output wiring 3b is formed in three directions.

上記の出力配線3bに接続される電極基板IB上の電極
入力端子部12aは、第1図のように上記三方向に形成
された出力配線3bに向がって形成され、その出力配線
3bと異方性導電接着剤6bで電気的に導通接続されて
いる。
The electrode input terminal portion 12a on the electrode substrate IB connected to the output wiring 3b is formed facing the output wiring 3b formed in the three directions as shown in FIG. An electrically conductive connection is made using an anisotropic conductive adhesive 6b.

一方、入力配線3aと接続されるPCB(Print 
C1rcuit Board)等の制御用回路基板2は
下側の電極基板IBの下面に接着剤7等の固着手段によ
り一体的に固着され、その回路基板2に上記の入力配線
3aが異方性導電接着剤6a等で接続されている0図中
30aは可撓性配線接続部材3の湾曲部に形成した基板
30の切欠き部である。
On the other hand, a PCB (Print
A control circuit board 2 such as C1rcuit Board) is integrally fixed to the lower surface of the lower electrode board IB by a fixing means such as an adhesive 7, and the input wiring 3a is anisotropically conductive bonded to the circuit board 2. Reference numeral 30a in FIG. 3 indicates a notch portion of the substrate 30 formed at the curved portion of the flexible wiring connection member 3, which is connected by a bonding agent 6a or the like.

なお、第1図における上側電極基板IAに対する可撓性
配線接続部材3の構造、およびその出力配線と上側電極
基板IA上の電極11との接続構造は下側電極基板IB
の場合と同様に構成され、可撓性配線接続部材の入力配
線は、隣り合う可撓性配線接続部材の入力配線を共通に
接続する中継用可撓性配線接続部材32を介して回路基
板2に接続されている。
The structure of the flexible wiring connection member 3 to the upper electrode substrate IA in FIG. 1 and the connection structure between the output wiring and the electrode 11 on the upper electrode substrate IA are the same as those of the lower electrode substrate IB.
The input wiring of the flexible wiring connection member is connected to the circuit board 2 via the relay flexible wiring connection member 32 that commonly connects the input wiring of adjacent flexible wiring connection members. It is connected to the.

また、実施例は液晶表示装置を例にして説明したが、プ
ラズマデイスプレーやELデイスプレーもしくはサーマ
ルヘッド等にも適用可能であり、特に多ピン高密度端子
接続の分野に有効である。
Further, although the embodiments have been described using a liquid crystal display device as an example, the present invention can also be applied to a plasma display, an EL display, a thermal head, etc., and is particularly effective in the field of multi-pin high-density terminal connection.

〔発明の効果] 以上説明したように本発明による液晶表示装置等におけ
る駆動回路実装構造は前記の構成であるから、組付ける
に当たっては、予めICチップの入出力配線を施し、T
AB方式等でICチップを実装した可撓性配線接続部材
を電極基板上に配置し、上記出力配線をそれに対応させ
て設けた電極基板上の電極の入力端子部に異方性導電接
着剤等で導通接続することにより、容易に組立てること
ができ、安価に量産することが可能となる。また上記可
撓性配線接続部材上の出力配線を三方向に配し、それと
接続される電極基板上の電極の入力端子を上記三方向の
出力配線に対応させて設けるようにしたから、微細パタ
ーン化にも充分に対応できる等の効果がある。
[Effects of the Invention] As explained above, since the drive circuit mounting structure in a liquid crystal display device or the like according to the present invention has the above-described configuration, input/output wiring of the IC chip is performed in advance and T
A flexible wiring connection member on which an IC chip is mounted using the AB method or the like is placed on an electrode substrate, and an anisotropic conductive adhesive or the like is applied to the input terminal portion of the electrode on the electrode substrate with the output wiring corresponding thereto. By making a conductive connection, it can be easily assembled and mass-produced at low cost. In addition, since the output wiring on the flexible wiring connection member is arranged in three directions, and the input terminals of the electrodes on the electrode substrate connected thereto are provided corresponding to the output wiring in the three directions, the fine pattern It has the advantage of being able to fully respond to changes in the environment.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)は本発明の一実施例を示す液晶表示装置に
おける駆動回路実装構造の一例を示す斜視図、同図(b
)はその要部の縦断面図、同図(c)は可撓性配線接続
部材の平面図、第2図(a)  ・ (b)は従来の液
晶表示装置等における駆動回路実装構造の一例を示す斜
視図および縦断面図、第3図(a)  ・ (b)は他
の従来例の斜視図および縦断面図である。 1は液晶パネル、IA・IBは電極基板、11・12は
電極、12aは入力端子部、2は回路基板、3は可撓性
配線接続部材、30は可撓性配線基板、3aは入力配線
、3bは出力配線、4はICチップ。 第2図(Q) 第2図(b)
FIG. 1(a) is a perspective view showing an example of a drive circuit mounting structure in a liquid crystal display device according to an embodiment of the present invention, and FIG.
) is a vertical sectional view of the main part, FIG. 2(c) is a plan view of the flexible wiring connection member, and FIGS. 2(a) and 2(b) are examples of drive circuit mounting structures in conventional liquid crystal display devices, etc. FIGS. 3(a) and 3(b) are a perspective view and a longitudinal sectional view of another conventional example. 1 is a liquid crystal panel, IA and IB are electrode substrates, 11 and 12 are electrodes, 12a is an input terminal section, 2 is a circuit board, 3 is a flexible wiring connection member, 30 is a flexible wiring board, and 3a is an input wiring , 3b is the output wiring, and 4 is the IC chip. Figure 2 (Q) Figure 2 (b)

Claims (1)

【特許請求の範囲】[Claims] (1)可撓性配線基板上にICチップを実装し、そのI
Cチップの出力配線を三方向に配してなる可撓性配線接
続部材を、上記ICチップが液晶表示パネル等の電極基
板上に位置するようにして該電極基板上に配置し、上記
三方向に配した出力配線と、それに対応させて配線した
電極基板上の電極の入力端子部とを電気的に導通接続し
たことを特徴とする液晶表示装置等における駆動回路実
装構造。
(1) Mount an IC chip on a flexible wiring board, and
A flexible wiring connection member having output wiring of a C chip arranged in three directions is placed on an electrode substrate such that the IC chip is positioned on the electrode substrate of a liquid crystal display panel, etc. 1. A drive circuit mounting structure for a liquid crystal display device, etc., characterized in that an output wiring arranged on the substrate is electrically conductively connected to an input terminal portion of an electrode on an electrode substrate wired correspondingly to the output wiring.
JP7254290A 1990-03-22 1990-03-22 Drive circuit mounting structure in liquid crystal display devices, etc. Pending JPH03271791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7254290A JPH03271791A (en) 1990-03-22 1990-03-22 Drive circuit mounting structure in liquid crystal display devices, etc.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7254290A JPH03271791A (en) 1990-03-22 1990-03-22 Drive circuit mounting structure in liquid crystal display devices, etc.

Publications (1)

Publication Number Publication Date
JPH03271791A true JPH03271791A (en) 1991-12-03

Family

ID=13492352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7254290A Pending JPH03271791A (en) 1990-03-22 1990-03-22 Drive circuit mounting structure in liquid crystal display devices, etc.

Country Status (1)

Country Link
JP (1) JPH03271791A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528403A (en) * 1992-04-30 1996-06-18 Sharp Kabushiki Kaisha Flat type display device having flexible wiring board and common wiring board bonded to display panel
US5739887A (en) * 1994-10-21 1998-04-14 Hitachi, Ltd. Liquid crystal display device with reduced frame portion surrounding display area
JP2001083898A (en) * 1999-09-13 2001-03-30 Seiko Epson Corp Electro-optical devices and electronic equipment
JP2001085812A (en) * 1999-09-13 2001-03-30 Seiko Epson Corp Substrate connection structure and electro-optical device
JP2001083899A (en) * 1999-09-13 2001-03-30 Seiko Epson Corp Manufacturing method of electro-optical device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528403A (en) * 1992-04-30 1996-06-18 Sharp Kabushiki Kaisha Flat type display device having flexible wiring board and common wiring board bonded to display panel
US5606440A (en) * 1992-04-30 1997-02-25 Sharp Kabushiki Kaisha Assembling method of flat type display device
US5739887A (en) * 1994-10-21 1998-04-14 Hitachi, Ltd. Liquid crystal display device with reduced frame portion surrounding display area
JP2001083898A (en) * 1999-09-13 2001-03-30 Seiko Epson Corp Electro-optical devices and electronic equipment
JP2001085812A (en) * 1999-09-13 2001-03-30 Seiko Epson Corp Substrate connection structure and electro-optical device
JP2001083899A (en) * 1999-09-13 2001-03-30 Seiko Epson Corp Manufacturing method of electro-optical device

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