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JPH03266453A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH03266453A
JPH03266453A JP2066418A JP6641890A JPH03266453A JP H03266453 A JPH03266453 A JP H03266453A JP 2066418 A JP2066418 A JP 2066418A JP 6641890 A JP6641890 A JP 6641890A JP H03266453 A JPH03266453 A JP H03266453A
Authority
JP
Japan
Prior art keywords
main body
case main
cap
pellet
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2066418A
Other languages
Japanese (ja)
Inventor
Yukio Tanaka
幸男 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2066418A priority Critical patent/JPH03266453A/en
Publication of JPH03266453A publication Critical patent/JPH03266453A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a sealing material from flowing from the joint of a case main body with a cap to an inner semiconductor pellet by a method wherein a groove is provided to the inner side of the sealing part of the case main body of a hermetically sealed semiconductor device running along the sealing part. CONSTITUTION:A semiconductor pallet 2 is mounted on the upside center of a plate-like case main body 1, and a conductive pattern 3 provided around the mount of the pellet 2 is connected to the electrode of the pellet 2 through a bonding wire 4. The conductive pattern 3 is led to the base of the case main body 1 through a conductive path which penetrates through the case main body 1 and connected to an external lead 7 laterally led out from the base of the case main body 1. The upper peripheral part of the case main body 1 is hermetically bonded to the lower face of the circumferential wall of a cap 6 with a sealing material 6, where a groove U-shaped in cross section is provided along a sealing part between the sealing part where the case main body 1 is bonded to the cap 5 and the conductive patterns. By this setup, the sealing material 6 is prevented from flowing into the central part of a case main body.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は気密封止型半導体装置、特に半導体ペレットを
搭載する容器本体とキャップがシール材で接着して気密
封止された半導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hermetically sealed semiconductor device, and more particularly to a semiconductor device in which a container body in which semiconductor pellets are mounted and a cap are hermetically sealed by bonding with a sealing material.

〔従来の技術〕[Conventional technology]

従来、この種の半導体装置は、第３図の断面図に示す様
に、半導体ペレット２を搭載する容器本体１は、上下平
行な平坦な面の板体で形成され、その上面中央の半導体
ペレット搭載部に半導体ペレット２が搭載され、容器本
体周辺のシール部とキャップ５との間はシール材６を介
して気密に封着されていた。Conventionally, in this type of semiconductor device, as shown in the cross-sectional view of FIG. A semiconductor pellet 2 was mounted on the mounting portion, and the seal portion around the container body and the cap 5 were airtightly sealed via a sealing material 6.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の半導体装置は、容器本体のシール部の内
側が平坦であったため、特に小型な半導体装置では、容
器本体とキャップを接着する際に、シール材が容器内に
流れ込むことがあり、最悪の場合は、半導体ペレットの
電極との間を接続するポンディングワイヤの接続されて
いる導電パターンのところまで流れこみ、ポンディング
ワイヤ４を切断したり、さらにはペレット部まで流れて
ペレット２の破壊を生じるという欠点がある。In the conventional semiconductor devices mentioned above, the inside of the seal part of the container body was flat, so especially in small semiconductor devices, when bonding the container body and the cap, the sealing material may flow into the container, causing a worst-case scenario. In this case, it may flow to the conductive pattern connected to the bonding wire that connects the electrode of the semiconductor pellet, cutting the bonding wire 4, or even flowing to the pellet part and destroying the pellet 2. It has the disadvantage of causing

〔課題を解決するための手段〕[Means to solve the problem]

上記課題に対し本発明の半導体装置は、容器本体周辺の
シール部の内側に溝を設け、この溝により容器本体の中
央部へ流れ込むシール材を阻止している。In order to solve the above problem, the semiconductor device of the present invention provides a groove inside the sealing portion around the container body, and this groove prevents the sealant from flowing into the center of the container body.

〔実施例〕〔Example〕

つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.

第１図は本発明の一実施例の断面図である。第１図にお
いて、板状の容器本体１の上面中央に半導体ペレット２
が搭載され、ペレット２の搭載部の周囲に設けである導
電パターン３とペレットの電極との間はポンディングワ
イヤ４で接続されている。導電パターン３は容器本体を
貫通する導電路により底面に導かれ、容器本体１の底面
から横方向に引圧されている外部リード７につながって
いる。また、容器本体１の上面周辺には、周壁を有する
キャップ５の周壁下面がシール材６で気密封着されてい
るが、容器本体１の、キャップ５とが接着されたシール
部と、導電パターン３との間には、断面Ｕ字状の溝８が
シール部に沿うように設けられている。この溝８により
、容器本体の中央部までも流れ込もうとするシール材６
は阻止される。FIG. 1 is a sectional view of an embodiment of the present invention. In FIG. 1, a semiconductor pellet 2 is placed in the center of the top surface of a plate-shaped container body 1.
is mounted, and a conductive pattern 3 provided around the mounting portion of the pellet 2 and the electrode of the pellet are connected by a bonding wire 4. The conductive pattern 3 is guided to the bottom surface by a conductive path penetrating the container body, and is connected to an external lead 7 that is laterally pulled from the bottom surface of the container body 1. Further, around the upper surface of the container body 1, the lower surface of the peripheral wall of a cap 5 having a peripheral wall is hermetically sealed with a sealing material 6. 3, a groove 8 having a U-shaped cross section is provided along the seal portion. This groove 8 allows the sealing material 6 to flow into the center of the container body.
is prevented.

第２図は本発明の他の実施例の断面図である。FIG. 2 is a sectional view of another embodiment of the invention.

第１図では、容器本体のシール部の内側に断面Ｕ字状の
溝を形成したが、第２図では、前記シール材流入阻止用
の溝９は、Ｖ字状断面としている。In FIG. 1, a groove with a U-shaped cross section is formed inside the sealing portion of the container body, but in FIG. 2, the groove 9 for preventing the sealant from flowing in has a V-shaped cross section.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、容器本体とキャップがシ
ール材で接着される気密封止型半導体装置の容器本体側
のシール部の内側に、該シール部に沿った溝を設けるこ
とにより、容器本体とキャップの接着部から、内部半導
体ペレット側へ、シール材が流れ込むことを防止する効
果がある。As explained above, the present invention provides a hermetically sealed semiconductor device, in which the container body and the cap are bonded together with a sealing material, by providing a groove along the seal portion on the side of the container body. This has the effect of preventing the sealant from flowing into the internal semiconductor pellet from the bonded portion between the main body and the cap.

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図はそれぞれ本発明の一実施例および
他の実施例の断面図、第３図は従来の半導体装置の断面
図である。 １・・・・・・容器本体、２・・・・・・半導体ペレッ
ト、３・・・・・・導１［パターン、４・・・・・・ポ
ンディングワイヤ、５・・・・・・キャップ、６・・・
・・・シール材、７・・・・・・外部リード、８，９・
・・・・・シール材流入阻止用溝。1 and 2 are sectional views of one embodiment and another embodiment of the present invention, respectively, and FIG. 3 is a sectional view of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Container body, 2... Semiconductor pellet, 3... Conductor 1 [pattern, 4... Bonding wire, 5... Cap, 6...
... Seal material, 7 ... External lead, 8, 9.
...Groove for preventing seal material inflow.

Claims (1)

【特許請求の範囲】[Claims] 　容器本体の上面中央に半導体ペレットを搭載し、キャ
ップをかぶせて気密封着した半導体装置において、前記
容器本体とキャップを接着するシール材が容器本体の中
央部へ流れ込むのを阻止するための溝が容器本体のシー
ル部の内側に、このシール部に沿って設けられているこ
とを特徴とする半導体装置。In a semiconductor device in which a semiconductor pellet is mounted on the center of the upper surface of a container body and a cap is placed on the semiconductor device for airtight sealing, a groove is provided to prevent a sealing material that adheres the container body and the cap from flowing into the center of the container body. A semiconductor device characterized in that the semiconductor device is provided inside a seal portion of a container body and along the seal portion.
JP2066418A 1990-03-15 1990-03-15 Semiconductor device Pending JPH03266453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2066418A JPH03266453A (en) 1990-03-15 1990-03-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2066418A JPH03266453A (en) 1990-03-15 1990-03-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH03266453A true JPH03266453A (en) 1991-11-27

Family

ID=13315229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2066418A Pending JPH03266453A (en) 1990-03-15 1990-03-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH03266453A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543663A (en) * 1993-12-27 1996-08-06 Kabushiki Kaisha Toshiba Semiconductor device and BGA package
JP2013051560A (en) * 2011-08-31 2013-03-14 Nippon Dempa Kogyo Co Ltd Piezoelectric device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543663A (en) * 1993-12-27 1996-08-06 Kabushiki Kaisha Toshiba Semiconductor device and BGA package
JP2013051560A (en) * 2011-08-31 2013-03-14 Nippon Dempa Kogyo Co Ltd Piezoelectric device

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