JPH03266404A - Chip type ceramic capacitor - Google Patents
Chip type ceramic capacitorInfo
- Publication number
- JPH03266404A JPH03266404A JP2065466A JP6546690A JPH03266404A JP H03266404 A JPH03266404 A JP H03266404A JP 2065466 A JP2065466 A JP 2065466A JP 6546690 A JP6546690 A JP 6546690A JP H03266404 A JPH03266404 A JP H03266404A
- Authority
- JP
- Japan
- Prior art keywords
- external electrode
- layer
- capacitor
- dielectric
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 239000003990 capacitor Substances 0.000 claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 239000004634 thermosetting polymer Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 4
- 239000011230 binding agent Substances 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 5
- 230000004907 flux Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000035515 penetration Effects 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はチップ型セラミックコンデンサに関する。特に
は外部電極の構造に関する。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to chip-type ceramic capacitors. In particular, it relates to the structure of external electrodes.
従来の技術
従来のチップ型セラミックコンデンサは、セラミックグ
リーンシートに内部電極を印刷し、このシートを複数枚
重ねて積層し、熱圧着し、切断して単体の素子を形成し
、所定温度で焼成し、コンデンサ素子の両端部に外部電
極を形成しチップ型セラミックコンデンサを製作してい
る。この外部電極には銀−パラジウムまたは銀をベース
にガラスフリットを添加したペーストをコンデンサ素子
の両端部に塗布し、焼付炉で焼付けし、内部電極と外部
電極とを電気的に接合させている。Conventional technology Conventional chip-type ceramic capacitors are manufactured by printing internal electrodes on ceramic green sheets, stacking multiple sheets, thermocompression bonding, cutting to form single elements, and firing at a predetermined temperature. , a chip-type ceramic capacitor is manufactured by forming external electrodes on both ends of a capacitor element. For this external electrode, silver-palladium or silver-based paste with glass frit added is applied to both ends of the capacitor element and baked in a baking oven to electrically connect the internal and external electrodes.
発明が解決しようとする課題
従来のチップ型セラミックコンデンサは、プリント配線
板に実装する際に、配線板上のランド部に載置し、はん
だ付けし困者している。このとき、コンデンサの外部電
極である銀−パラジウムなどの電極が溶融されたはんだ
内に拡散し、いわゆるはんだ喰われ現象を生じている。Problems to be Solved by the Invention When conventional chip-type ceramic capacitors are mounted on a printed wiring board, it is difficult to place and solder them on lands on the wiring board. At this time, the external electrode of the capacitor, such as a silver-palladium electrode, diffuses into the molten solder, causing a so-called solder eating phenomenon.
このため、この外部電極の厚さを大きくする等の対応を
行っているが、小型化の要求に合わず、品質上バラツキ
が大きい等の問題がある。For this reason, countermeasures have been taken such as increasing the thickness of this external electrode, but this does not meet the demand for miniaturization and there are problems such as large variations in quality.
また、従来の外部電極はガラスフリットを添加したもの
を用いているため、焼付したときの溶融、凝集作用によ
り、微視的な構造は多孔質になっている。Further, since conventional external electrodes use glass frit added, the microscopic structure becomes porous due to melting and agglomeration during baking.
この外部電極をはんだで被覆することも考えられるが、
直接はんだ層を形成したのみでははんだくわれを防ぐこ
とができない。銀−パラジウムの外部電極とはんだ層と
の間にはんだに溶融拡散しない遮断層としてニッケル等
をめっきによって形成することも考えられるが下層の銀
−パラジウム層が多孔質性を有しているため、めっきの
際のめつき液が浸透したまま、誘電体のセラミックと導
体としての内、外電極間に残存し、これがチップコンデ
ンサとして使用しているとき、経時変化により絶縁劣化
現象としてあられれ問題である。It is possible to cover this external electrode with solder, but
Directly forming a solder layer alone cannot prevent solder cracks. It is also possible to form nickel or the like by plating between the silver-palladium external electrode and the solder layer as a barrier layer that does not melt and diffuse into the solder, but since the underlying silver-palladium layer is porous, The plating solution during plating penetrates and remains between the dielectric ceramic and the conductor inner and outer electrodes, and when used as a chip capacitor, this can cause problems such as hail as insulation deterioration due to changes over time. be.
２１題を解決するための手段
本発明は、セラミック誘電体層の上に内部電極が形成さ
れた誘電体シートからなり、この誘電体シートの両端部
から内部電極が導出するよう複数積層してなるセラミッ
クコンデンサ素子に対し、このコンデンサ素子の内部電
極に接続する外部電極を形成するチップ型セラミックコ
ンデンサにおいて、外部電極の第１層として導電性金属
粉に熱硬化性ポリマーを添加したペーストを外部電極と
して前記コンデンサ素子の両端部に形成し、この１１１
層の上にはんだの第２層を形成したチップ型布した銀粉
がよく、熱硬化性ポリマーとしてはエポキシ樹脂がよく
、この外部電極を塗布し、焼付けることにより無孔性の
電極が形成される。Means for Solving 21 Problems The present invention consists of a dielectric sheet in which internal electrodes are formed on a ceramic dielectric layer, and a plurality of layers are stacked so that the internal electrodes are led out from both ends of the dielectric sheet. In a chip-type ceramic capacitor that forms an external electrode connected to the internal electrode of a ceramic capacitor element, a paste made by adding a thermosetting polymer to conductive metal powder is used as the first layer of the external electrode as the external electrode. formed at both ends of the capacitor element, and this 111
A second layer of solder is formed on top of the chip-shaped cloth, which is often made of silver powder, and an epoxy resin is used as the thermosetting polymer. By applying this external electrode and baking it, a non-porous electrode is formed. Ru.
作用
本発明のチップ型セラミックコンデンサは、無孔質型の
外部電極を用いることにより、コンデンサの稼動中でも
外部からの水分の侵入がなく、またはんだ付は時のはん
だフラックス洗浄の液侵入を防止できるので経時変化に
よる絶縁劣化がない。By using a nonporous external electrode, the chip-type ceramic capacitor of the present invention prevents moisture from entering from the outside even when the capacitor is in operation, and prevents liquid from entering during solder flux cleaning during soldering. Therefore, there is no insulation deterioration due to aging.
実施例
本発明のチップ型セラミックコンデンサの実施例を図面
を用い説明する。Embodiment An embodiment of the chip-type ceramic capacitor of the present invention will be described with reference to the drawings.
１はチタン酸バリウム系の強誘電体セラミックからなる
厚さ３０μｍのグリーンシートであり、このグリーンシ
ート１の表面に銀−パラジウムにガラスフリットが添加
されたペーストを内部電極２を形成したものが誘電体シ
ート３である。この誘電体シート３の内部電極２が両端
部４，５から導出するよう積層し、焼成して一体化する
ことによりコンデンサ素子７がえられる。1 is a 30 μm thick green sheet made of barium titanate-based ferroelectric ceramic, and internal electrodes 2 are formed on the surface of this green sheet 1 with a paste containing silver-palladium and glass frit. This is body sheet 3. The capacitor element 7 is obtained by stacking the dielectric sheets 3 so that the internal electrodes 2 extend from both ends 4 and 5, and baking them to integrate them.
この素子７の両端部４．５に導出されている内部電極２
と接続する外部電極８を形成する。Internal electrodes 2 led out to both ends 4.5 of this element 7
An external electrode 8 is formed to be connected to the external electrode 8.
この外部電極８は、コンデンサを実装するときはんだ付
けの際の熱に十分耐えることができ、フラックスが浸透
しないよう無孔質であること、はんだ付性がよいことの
条件を満たすものを用いる。The external electrode 8 is one that satisfies the following conditions: it can sufficiently withstand the heat during soldering when the capacitor is mounted, it is non-porous so that flux does not penetrate, and it has good solderability.
このため、外ｍｓ極のペーストとしては、はんだ喰われ
が少なく、はんだ付性のよい銅粉または銀コートした銅
粉などの導電性金属とバインダーとして熱硬化性ポリマ
ーを添加した三井金属鉱業株式会社製Ｓ−５０００型（
銀コート銅粉ポリマー）及びＥ−１０００型（純Ｃｕ粉
ポリマー）を用い５〜２０μＴｒＬ厚塗布し、予備乾燥
（６０℃１０分間）し、本硬化（１７０℃２０分間）し
て外部電極８の第１層９を形成する。しかしこのまま放
置しておくとはんだ付性が劣化するので、第２層１０と
してこの第１層９の上にはんだ層を形成する。For this reason, the paste for the outer ms electrode is a conductive metal such as copper powder or silver-coated copper powder that is less likely to be eaten by solder and has good solderability, and a thermosetting polymer added as a binder by Mitsui Mining & Mining Co., Ltd. Manufactured S-5000 model (
Coated with a thickness of 5 to 20 μTr using silver-coated copper powder polymer) and E-1000 type (pure Cu powder polymer), pre-dried (60°C for 10 minutes), and main cured (170°C for 20 minutes) to form the external electrode 8. A first layer 9 is formed. However, if left as is, the solderability will deteriorate, so a solder layer is formed as the second layer 10 on top of the first layer 9.
この第２１１１０は溶融はんだ槽に浸漬することによっ
て得ることができる。このはんだ層の第２層１０を形成
することにより、熱容量が大なる溶融はんだで急激に加
熱されるため、いまだ第１１１９の未反応ポリマーが残
存していても完全に硬化される効果もあわせ持っている
。This No. 21110 can be obtained by dipping into a bath of molten solder. By forming this second layer 10 of the solder layer, it is rapidly heated with molten solder having a large heat capacity, so that even if unreacted polymer No. 1119 still remains, it is completely cured. ing.
発明の効果
本発明のコンデンサは以上に述べた如きものであって、
特に外部電極の構造が無孔質性を有しているので、従来
の多孔性の外部電極と比べ耐湿特性に優れており、絶縁
劣化が少なく、また第２１１としてはんだ層を形成しで
あるので、従来のチップ型セラミックコンデンサの欠点
であった実装時のはんだ付性もバラツキがなくなり、本
発明のチップ型セラミックははんだ付性に優れたものが
得られ、さらに小型化が要求されているコンデンサに最
適である。Effects of the Invention The capacitor of the present invention is as described above,
In particular, since the structure of the external electrode is non-porous, it has excellent moisture resistance compared to conventional porous external electrodes, has less insulation deterioration, and has a solder layer formed as the 211th layer. The chip-type ceramic capacitor of the present invention has excellent solderability, and the chip-type ceramic capacitor of the present invention has excellent solderability, which is a drawback of conventional chip-type ceramic capacitors. Ideal for
第１図は本発明の断面図である。
１ニゲリーンシート、 ２：内部電極、３：誘電体シー
ト、 ４，５：端部、
７：コンデンサ素子、 ８：外部電極、９：第１層、
１０：第２層。FIG. 1 is a cross-sectional view of the present invention. 1 Nigeleen sheet, 2: internal electrode, 3: dielectric sheet, 4, 5: end, 7: capacitor element, 8: external electrode, 9: first layer,
10: Second layer.
Claims (2)
体シートからなり、この誘電体シートの両端部から内部
電極が導出するよう複数積層してなるセラミックコンデ
ンサ素子に対し、このコンデンサ素子の内部電極に接続
するための外部電極を形成するチップ型セラミックコン
デンサにおいて、この外部電極として導電性金属粉にバ
インダーとして熱硬化性ポリマーを添加したペーストを
塗布硬化して形成した第１層と、この第１層の上にはん
だ層を形成した第２層とからなることを特徴とするチッ
プ型セラミックコンデンサ。(1) For a ceramic capacitor element which is made of a dielectric sheet with internal electrodes formed on a ceramic dielectric layer, and which is made up of multiple layers stacked so that the internal electrodes are led out from both ends of the dielectric sheet, the inside of this capacitor element is In a chip-type ceramic capacitor that forms an external electrode for connection to an electrode, the external electrode includes a first layer formed by applying and curing a paste containing conductive metal powder and a thermosetting polymer as a binder; A chip-type ceramic capacitor comprising a first layer and a second layer formed with a solder layer.
層の厚さが５〜２０μｍであるチップ型セラミックコン
デンサ。(2) In claim 1, the first part of the external electrode
A chip-type ceramic capacitor with a layer thickness of 5 to 20 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2065466A JPH03266404A (en) | 1990-03-15 | 1990-03-15 | Chip type ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2065466A JPH03266404A (en) | 1990-03-15 | 1990-03-15 | Chip type ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03266404A true JPH03266404A (en) | 1991-11-27 |
| JPH0563927B2 JPH0563927B2 (en) | 1993-09-13 |
Family
ID=13287927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2065466A Granted JPH03266404A (en) | 1990-03-15 | 1990-03-15 | Chip type ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03266404A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226180A (en) * | 1992-02-12 | 1993-09-03 | Hitachi Aic Inc | Laminated ceramic capacitor |
| US5426560A (en) * | 1992-11-19 | 1995-06-20 | Murata Manufacturing Co., Ltd. | Electronic component |
-
1990
- 1990-03-15 JP JP2065466A patent/JPH03266404A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226180A (en) * | 1992-02-12 | 1993-09-03 | Hitachi Aic Inc | Laminated ceramic capacitor |
| JPH0793229B2 (en) * | 1992-02-12 | 1995-10-09 | 日立エーアイシー株式会社 | Monolithic ceramic capacitors |
| US5426560A (en) * | 1992-11-19 | 1995-06-20 | Murata Manufacturing Co., Ltd. | Electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563927B2 (en) | 1993-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2852372B2 (en) | Multilayer ceramic capacitors | |
| US3612963A (en) | Multilayer ceramic capacitor and process | |
| JP7302900B2 (en) | Multilayer ceramic capacitor | |
| US10121593B2 (en) | Composite electronic component | |
| KR101031111B1 (en) | Surface Mountable Composite Ceramic Chip Parts | |
| KR100274210B1 (en) | Array Multichip Components | |
| JP3535998B2 (en) | Multilayer ceramic electronic components | |
| US10453617B2 (en) | Composite electronic component and resistance element | |
| US10186381B2 (en) | Composite electronic component and resistance element | |
| US10299383B2 (en) | Composite electronic component and resistance element | |
| US4953273A (en) | Process for applying conductive terminations to ceramic components | |
| JPH0837127A (en) | Monolithic ceramic capacitor and its production | |
| JP2003022929A (en) | Laminated ceramic capacitor | |
| US6198618B1 (en) | Conductive paste and ceramic electronic part including the same | |
| JPH0563928B2 (en) | ||
| KR102734416B1 (en) | Multi-layered ceramic capacitor and method of manufacturing the same | |
| JPH03266404A (en) | Chip type ceramic capacitor | |
| JP6984688B2 (en) | Composite electronic components | |
| JPH04257211A (en) | Chip type electronic component | |
| JP6164228B2 (en) | Module and manufacturing method thereof | |
| JP2002252124A (en) | Chip-type electronic component and its manufacturing method | |
| KR20140013289A (en) | Ceramic electronic component and manufacturing method thereof | |
| JP2006041319A (en) | Surface mount type multiple capacitor and its mounting structure | |
| JP2598929Y2 (en) | Chip electronic components | |
| JPS60176296A (en) | Method of producing glazed resistance element interal multilayer substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |