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JPH0325791A - Semiconductor memory device - Google Patents

Semiconductor memory device

Info

Publication number
JPH0325791A
JPH0325791A JP1161235A JP16123589A JPH0325791A JP H0325791 A JPH0325791 A JP H0325791A JP 1161235 A JP1161235 A JP 1161235A JP 16123589 A JP16123589 A JP 16123589A JP H0325791 A JPH0325791 A JP H0325791A
Authority
JP
Japan
Prior art keywords
data transfer
data
latch circuit
resistance
memory device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1161235A
Other languages
Japanese (ja)
Inventor
Takayuki Miyamoto
宮元 崇行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1161235A priority Critical patent/JPH0325791A/en
Publication of JPH0325791A publication Critical patent/JPH0325791A/en
Pending legal-status Critical Current

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  • Dram (AREA)

Abstract

PURPOSE:To accurately perform data transfer and to realize a fast access by increasing the resistance of a power source or a ground wire when performing the data transfer, and decreasing the driving capacity of a latch circuit. CONSTITUTION:The data in a storage element 1 on a row selected with a row selection line 2 is amplified with a sense amplifier 4, and appears on column lines 3a and 3b. The data is transmitted to the latch circuits 8-11 with a data transfer signal 7 and data transfer gates 6a and 6b. At this time, a gate voltage is supplied to MOS transistors TR 18 and 19 when a difference between the driving capacity of the amplifier 4 and that of the circuits 8-11 exists, which decreases the conductivity of the TRs 18 and 19. Then, the resistance of the power source 16 and the ground wire 17 are increased, and the driving capacity of the circuits 8-11 are decreased. Thereby, the data transfer can be performed accurately without inverting the amplifier 4, and the fast access can be easily obtained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体メモリ装置に関し、特にその動作マージ
ンの改善に関するものである.〔従来の技術〕 第2図は従来の半導体メモリ装置の一例を示す.図にお
いて、1は記憶要素、2は行選択線、3a,3bは列線
対、4はセンスアンプ、5a.5bはセンス駆動信号で
ある.本例は本発明の主たる実施例としたダイナミック
形メモリの場合を示す. 記憶要素1,センスアンプ4等の構成要素は本発明に直
接関係ないので説明を省略する.6a,6bはデータ転
送ゲート、7はデータ転送制御信号、8,9、10.1
1はそれぞれCMOSインバータであり、交叉結合され
ることによりラッチ回路を構成している,12a.12
bはそれぞれインバータ8,9、10.11の出力接点
、13a.13bは列選択ゲート、14は列選択線、1
5a.15bは入力または/および出力信号線対である
.16は上記ラッチ回路列の電源配線、17は同じ<G
ND配線である. 次にデータ出力時の動作について説明する.行選択線2
で選択された行の記憶素子1内のデータはセンスアンブ
4及びセンス駆動信号5によって増幅されて列線3a,
3bに現われる。このデータはデータ転送制御信号7,
データ転送ゲ−}6a.6bによって出力接点12a,
12bに伝えられ、転送ゲー}6a,6bが閉じられた
後もラッチ回路8〜1lに保持される.このようにして
保持されたデータは列選択線14で列選択ゲ−413a
,13bが活性化されることにより入出力信号線15a
,15bへ出力される.〔発明が解決しようとする課題
〕 従来の半導体メモリ装置は以上のように構成されていた
ので、ラッチ回路8〜11のトランジスタサイズが、セ
ンスアンブ4のサイズと比較して大きすぎるとラッチ回
路のドライブ能力がセンスアンプのドライブ能力より大
きくなってデータ転送時にセンスアンプの方が反転して
しまったり、一方小さすぎると出力信号線対へのデータ
出力速度が遅くなったりするという問題点があった.本
発明は上記のような問題点を解消するためになされたも
ので、データ転送が正確に行える,データ転送マージン
を広げることができ、かつ出力信号線対へのデータ出力
速度が遅くなることなく高速アクセスを可能とできる半
導体メモリ装置を提供することを目的とする. 〔課題を解決するための手段〕 本発明にかかる半導体メモリ装置は、複数の記憶要素と
行選択線,列線対.およびセンスアンプから構戒される
メモリアレイと、上記各列線対に付随し、2個のインバ
ータで構成されるラッチ回路列と、上記列線対と上記ラ
ッチ回路との間に設けられたスイッチング手段と、上記
ラッチ回路列に接続される電源またはGND線の抵抗を
可変とする手段とを備えたものである. 〔作用〕 本発明における半導体メモリ装置では、データ転送時に
はラッチ回路列に接続される電源またはGND線の抵抗
を上げてラッチ回路のドライブ能力を下げることによっ
てセンスアンプが反転する恐れはなくなり、一方出力信
号線対へのデータ出力時等にはラッチ回路のドライブ能
力を元に戻すことによって高速データ出力,ひいては高
速アクセスを得ることができる. 〔実施例〕 以下、この発明の一実施例を図について説明する. 第1図はこの発明の一実施例による半導体メモリ装置の
回路図であり、図において、第2図と同一符号は同一部
分を示す。18.19はラッチ回路列に接続される電源
またはGND線の抵抗を可変とする手段としてのMOS
トランジスタであり、これは、そのゲートに印加される
電圧に応じてその導電度が変化するものである. 次に動作について説明する. 行選択線2で選択された行の記憶素子1内のデータはセ
ンスアンブ4で増幅されて列線3a.3bに現われる。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor memory device, and particularly to improving the operating margin thereof. [Prior Art] Figure 2 shows an example of a conventional semiconductor memory device. In the figure, 1 is a storage element, 2 is a row selection line, 3a, 3b is a pair of column lines, 4 is a sense amplifier, 5a . 5b is a sense drive signal. This example shows the case of a dynamic memory, which is the main embodiment of the present invention. Components such as the storage element 1 and the sense amplifier 4 are not directly related to the present invention, so their explanation will be omitted. 6a, 6b are data transfer gates, 7 is a data transfer control signal, 8, 9, 10.1
1 are CMOS inverters, which are cross-coupled to form a latch circuit, 12a. 12
b are output contacts of inverters 8, 9, 10.11, 13a. 13b is a column selection gate, 14 is a column selection line, 1
5a. 15b is a pair of input and/or output signal lines. 16 is the power supply wiring of the above latch circuit array, 17 is the same <G
This is ND wiring. Next, we will explain the operation when outputting data. Row selection line 2
The data in the memory element 1 in the row selected by is amplified by the sense amplifier 4 and the sense drive signal 5 and sent to the column lines 3a,
Appears in 3b. This data is the data transfer control signal 7,
Data transfer game}6a. 6b connects the output contact 12a,
12b, and is held in latch circuits 8 to 1l even after transfer gates 6a and 6b are closed. The data held in this way is transferred to the column selection gate 413a by the column selection line 14.
, 13b are activated, the input/output signal line 15a
, 15b. [Problems to be Solved by the Invention] Since the conventional semiconductor memory device is configured as described above, if the transistor size of the latch circuits 8 to 11 is too large compared to the size of the sense amplifier 4, the drive of the latch circuit becomes difficult. There were problems in that if the drive capacity was larger than the drive capacity of the sense amplifier, the sense amplifier would be inverted during data transfer, and if it was too small, the data output speed to the output signal line pair would be slow. The present invention was made to solve the above-mentioned problems, and it is possible to perform data transfer accurately, widen the data transfer margin, and without slowing down the data output speed to the output signal line pair. The purpose is to provide a semiconductor memory device that enables high-speed access. [Means for Solving the Problems] A semiconductor memory device according to the present invention includes a plurality of storage elements, row selection lines, column line pairs. and a memory array connected to the sense amplifier, a latch circuit array consisting of two inverters attached to each column line pair, and a switching circuit provided between the column line pair and the latch circuit. and means for varying the resistance of the power supply or GND line connected to the latch circuit array. [Function] In the semiconductor memory device of the present invention, during data transfer, the resistance of the power supply or GND line connected to the latch circuit array is increased to lower the drive capability of the latch circuit, thereby eliminating the risk of sense amplifier inversion. When outputting data to a pair of signal lines, high-speed data output and, in turn, high-speed access can be achieved by restoring the drive capability of the latch circuit. [Example] An example of the present invention will be described below with reference to the drawings. FIG. 1 is a circuit diagram of a semiconductor memory device according to an embodiment of the present invention, and in the figure, the same reference numerals as in FIG. 2 indicate the same parts. 18.19 is a MOS as a means for varying the resistance of the power supply or GND line connected to the latch circuit array
A transistor whose conductivity changes depending on the voltage applied to its gate. Next, we will explain the operation. The data in the storage element 1 in the row selected by the row selection line 2 is amplified by the sense amplifier 4 and sent to the column line 3a. Appears in 3b.

このデータはデータ転送信号7,データ転送ゲート6a
,6bによってラッチ回路8〜11に伝えられる.この
とき、製造プロセスの欠陥等によりセンスアンブ4のド
ライブ能力が小さく、ラッチ回路8〜11のドライブ能
力との間に差ができていたとしても、それに応じてMO
Sトランジスタ18.19の導電度が低くなるように、
該MOS}ランジスタ18.19に適度のゲート電圧を
与えると、該ラッチ回路8〜11に接続される電源また
はGND′aの抵抗が大きくなることによってラッチ回
路のドライブ能力が下がり、これによりラッチ回路8〜
11がセンスアンプ4を反転するということはなくなり
、容易にデータを転送することができる. 上記データ転送時以外には上記MOS}ランジスタ18
,19のゲート電圧を調整してその導電度を高くなるよ
うにし、従来回路と同様の状態とすることにより、出力
信号線対へのデータ出力時等にも、ラッチ回路8〜11
の安定性.アクセス速度に支障がでる恐れはなくなり、
容易に高速アクセスを得ることができる。
This data is the data transfer signal 7, data transfer gate 6a
, 6b to the latch circuits 8-11. At this time, even if the drive ability of the sense amplifier 4 is small due to defects in the manufacturing process and there is a difference between the drive ability of the latch circuits 8 to 11, the MO
So that the conductivity of the S transistors 18 and 19 is low,
When a moderate gate voltage is applied to the MOS} transistors 18 and 19, the resistance of the power supply or GND'a connected to the latch circuits 8 to 11 increases, thereby reducing the drive ability of the latch circuit. 8~
11 no longer inverts the sense amplifier 4, and data can be easily transferred. The above MOS} transistor 18 is used except when transferring the above data.
By adjusting the gate voltages of the latch circuits 8 to 19 to increase their conductivity and making them in the same state as the conventional circuit, the latch circuits 8 to 11 can be used even when outputting data to the output signal line pair.
stability of There is no longer any risk of access speed being affected.
You can easily get high-speed access.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明によれば、ラッチ回路列に接続され
る電源またはGND線の抵抗を可変とする手段を設け、
データ転送時には該′gl源またはGND線の抵抗を大
きくしてラッチ回路のドライブ能力を下げるようにした
から、該データ転送時にもセンスアンプが反転する恐れ
はなくなってデー夕転送マージンを広げることができ、
またデータ転送時以外には出力信号線対へのデータ出力
速度等が遅くなることなく容易に高速アクセスを得るこ
とができる効果がある。
As described above, according to the present invention, means is provided for varying the resistance of the power supply or GND line connected to the latch circuit array,
During data transfer, the resistance of the 'gl source or GND line is increased to reduce the drive ability of the latch circuit, so there is no fear that the sense amplifier will be inverted during data transfer, and the data transfer margin can be expanded. I can do it,
In addition, there is an effect that high-speed access can be easily obtained without slowing down the data output speed to the output signal line pair except during data transfer.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例による半導体メモリ装置の構
成図、第2図は従来の半導体メモリ装置の構戒図である
. 図中、lは記憶要素、2は行選択線、3a.3bは列線
対、4はセンスアンプ、5a,5bはセンス駆動信号、
6a,6bはデータ転送ゲート、7はデータ転送制御信
号、8,9.10.11はラッチ回路を構成するCMO
Sインバータ、12a、12bはインバータの出力接点
、13a,13bは列選択ゲート、14は列選択線、1
5a51 5 b ハ出力信号線対、16411Km配
線、17はGND配線、1B,i9はMOS}ランジス
タ(抵抗可変手段)である。
FIG. 1 is a block diagram of a semiconductor memory device according to an embodiment of the present invention, and FIG. 2 is a block diagram of a conventional semiconductor memory device. In the figure, l is a storage element, 2 is a row selection line, 3a. 3b is a column line pair, 4 is a sense amplifier, 5a and 5b are sense drive signals,
6a and 6b are data transfer gates, 7 is a data transfer control signal, and 8, 9.10.11 is a CMO that constitutes a latch circuit.
S inverter, 12a and 12b are inverter output contacts, 13a and 13b are column selection gates, 14 is a column selection line, 1
5a51 5b C Output signal line pair, 16411km wiring, 17 is GND wiring, 1B, i9 are MOS transistors (resistance variable means).

Claims (1)

【特許請求の範囲】[Claims] (1)複数の記憶要素と行選択線、列線対、およびセン
スアンプから構成されるメモリアレイと、上記各列線対
に付随し、2個のインバータで構成されるラッチ回路列
と、 上記列線対と上記ラッチ回路列との間に設けられたスイ
ッチング手段と、 上記ラッチ回路列に接続される電源またはグランド線の
抵抗を可変とする手段とを備えたことを特徴とする半導
体メモリ装置。
(1) A memory array consisting of a plurality of storage elements, row selection lines, column line pairs, and sense amplifiers, and a latch circuit array consisting of two inverters attached to each column line pair; A semiconductor memory device comprising: switching means provided between a column line pair and the latch circuit array; and means for varying the resistance of a power supply or ground line connected to the latch circuit array. .
JP1161235A 1989-06-23 1989-06-23 Semiconductor memory device Pending JPH0325791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1161235A JPH0325791A (en) 1989-06-23 1989-06-23 Semiconductor memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1161235A JPH0325791A (en) 1989-06-23 1989-06-23 Semiconductor memory device

Publications (1)

Publication Number Publication Date
JPH0325791A true JPH0325791A (en) 1991-02-04

Family

ID=15731207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1161235A Pending JPH0325791A (en) 1989-06-23 1989-06-23 Semiconductor memory device

Country Status (1)

Country Link
JP (1) JPH0325791A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146587A (en) * 1990-10-08 1992-05-20 Nec Ic Microcomput Syst Ltd Semiconductor memory
US5361236A (en) * 1991-12-19 1994-11-01 Oki Electric Industry Co., Ltd. Serial access memory
US5698757A (en) * 1996-06-26 1997-12-16 Phillips Petroleum Company Hydrodealkylation catalyst composition and process therewith
US6208566B1 (en) 1998-04-28 2001-03-27 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit
JP2012015336A (en) * 2010-06-30 2012-01-19 Nuflare Technology Inc Deflection amplifier estimating method and charged particle beam drawing device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146587A (en) * 1990-10-08 1992-05-20 Nec Ic Microcomput Syst Ltd Semiconductor memory
US5361236A (en) * 1991-12-19 1994-11-01 Oki Electric Industry Co., Ltd. Serial access memory
US5698757A (en) * 1996-06-26 1997-12-16 Phillips Petroleum Company Hydrodealkylation catalyst composition and process therewith
US5807799A (en) * 1996-06-26 1998-09-15 Phillips Petroleum Company Catalyst composition and process therewith
US6208566B1 (en) 1998-04-28 2001-03-27 Oki Electric Industry Co., Ltd. Semiconductor integrated circuit
JP2012015336A (en) * 2010-06-30 2012-01-19 Nuflare Technology Inc Deflection amplifier estimating method and charged particle beam drawing device

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