JPH03246503A - Production of color filter - Google Patents

Abstract

PURPOSE:To improve color reproducibility and to prevent the malfunction of an optical element by applying colored resins formed by incorporating coloring materials into the resins on a substrate formed with non-light transparent metallic patterns, then subjecting the resins to exposing and developing through a mask. CONSTITUTION:The non-lihgt transparent metallic patterns 2 are formed on the substrate 1 and after the colored resin 3 formed by incorporating the coloring material into the resin is applied thereon and is subjected to exposing and developing via the mask 4. The colored resin patterns of plural colors are so formed as to cover the surfaces of the non-light transparent metallic patterns 2 by using the colored resins of different hues and repeating the above-mentioned operation plural times. The unnecessary colored resins 5a to 7a laminated to cover the surfaces of the non-light transparent metallic patterns 2 are then removed by polishing. The non-light transparent metallic films 2 are closely formed between color filter picture elements of respective colors by the simple method of merely necessitating rough alignment at the time of formation of the colored resin patterns. Color reproducibility is improved and the malfunction of the optical element is prevented.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a color filter, and in particular, a method for manufacturing a color filter suitable for use in fine color separation such as color image pickup devices, color sensors, and color display devices. It is related to.

[Prior Art] Conventionally, color filters have been manufactured by sequentially repeating the formation of a plurality of colored patterns having different hues on a transparent substrate such as glass or plastic, or an opaque substrate such as Si.

Typical manufacturing methods for color filters include dyeing methods, electrodeposition methods, printing methods, etc., but in recent years Sumitomo Corporation has been steadily producing fine pattern color filters (one of the manufacturing methods is JP-A-57-16407, JP-A-57-74707, JP-A-60-129707
JP-A No. 62-218902 and the like propose a method of forming a pattern by photolithography using a photosensitive resin.

On the other hand, as the performance of color devices equipped with color filters increases, it is strongly desired to improve the color reproducibility of the device.For example, in the case of color image sensors and color sensors, color filter pixels It is desirable to prevent the generation of stray light due to light transmitted between pixels, and to prevent color mixing with adjacent pixel colors due to obliquely incident light.Furthermore, in the case of color displays, it is desirable to prevent contrast and color purity due to light transmitted between color filter pixels. In recent years, there has been a strong desire to prevent this decline.In recent years, there has been a strong demand for these, especially with the trend toward smaller size and higher density image sensors and larger size and higher definition sensors and displays.

As a solution to this problem, a method is generally adopted in which a non-light-transmitting film is formed between the pixels of the color filter.

Conventionally, methods for forming such a non-transparent film between color filter pixels include, for example, a method in which a color filter is formed while being aligned on a substrate on which a non-transparent film pattern has been formed in advance; Alternatively, a method was used in which a non-light-transmitting film pattern was formed while aligning on a substrate on which a color filter pattern was previously formed.

In other words, in any case, these methods involve an alignment operation between the color filter pattern formation and the non-transparent film pattern formation, so this precision allows for alignment between the color filter patterns and the transparent part. It was difficult to form non-transparent film patterns with no consistent size. Furthermore, when these overlapping portions occur, a step is created on the color filter, making it difficult to form a color filter with excellent flatness, which requires strong structural requirements.

[Problems to be Solved by the Invention] An object of the present invention is to eliminate the drawbacks of the above-mentioned conventional examples, and to eliminate gaps between color filter pixels having fine patterns (non-transparent metal film) by a simple manufacturing process. An object of the present invention is to provide a method for manufacturing a color filter in which color filters can be arranged.

A further object of the present invention is to provide a color device with excellent characteristics.

[Means for Solving the Problems] and [Operations] That is, the present invention provides a method for manufacturing a color filter in which a metal film is arranged on a substrate so that there is no gap between each color filter pixel on the substrate. a step of forming a non-transparent metal pattern; (b) applying a colored resin containing a coloring material in the resin onto the substrate on which the non-transparent metal pattern is formed; A process of patterning a colored resin film over a non-transparent metal pattern by exposure and development, and (c) repeating the process of (b) multiple times using colored resins of different hues to create multiple colors. A process of forming a colored resin pattern and a process of removing by polishing the colored resin laminated on the non-transparent metal pattern (forming a metal film) without gaps between the color filter pixels of each color. A method for producing a color filter characterized by:

The present invention will be explained in detail below.

The method for producing a color filter of the present invention involves forming a non-transparent metal pattern on a substrate, applying a colored resin containing a coloring material thereon, and then exposing and developing the pattern through a mask. This step was repeated multiple times using colored resins of different hues to form colored resin patterns of multiple colors over the non-transparent metal pattern, and then laminated over the non-transparent metal pattern. By removing unnecessary colored resin by polishing, it is a simple method that requires only rough alignment, especially when forming colored resin patterns, and it is possible to form a non-transparent metal film with no gaps between color filter pixels of each color.

In image sensors and sensor devices using such color filters, it is expected that color reproducibility will be improved, and sufficient light shielding will also prevent malfunctions of optical elements. Furthermore, in LCD display devices,
In addition to improving contrast and color purity, it is also possible to have the function of an auxiliary electrode line, and low-resistance wiring of pixel electrodes reduces display quality problems caused by signal delays and heat generation inside cells on large screen displays. It is also effective in preventing deterioration.

Furthermore, since it is possible to have a color filter structure with better flatness than before, it is possible to obtain devices with excellent display quality with fewer alignment defects in types that have color filters built into the liquid crystal display. .

Hereinafter, the present invention will be explained based on the drawings.

FIGS. 1(a) to 1(g) are process diagrams showing typical embodiments of the method for producing a color filter of the present invention.

First, as shown in FIG. 1(a), a non-transparent metal pattern 2 is formed on a substrate 1.

Next, as shown in FIG. 1(b), a predetermined pattern is applied onto the substrate 1 on which the non-transparent metal pattern 2 is formed using a first colored resin liquid containing a colored material in the resin. After coating to a desired film thickness, prebaking is performed under appropriate temperature conditions to form the colored resin film 3.

Next, as shown in FIG. 1C, a photomask 4 having a predetermined pattern corresponding to the pattern to be formed is formed using light having the sensitivity of the colored resin film 3 (for example, a high-pressure mercury lamp, etc.). After exposure to light through a wafer, development, and rinsing, a post-baking process is performed to form a colored resin pattern 5 covering the non-transparent metal pattern 2 as shown in FIG. 1(d). . In addition, when forming a color filter consisting of two or more colors, if necessary, that is, depending on the number of colors of the filter used, a colored resin liquid in which a coloring material corresponding to each color is dispersed may be used. 1(b) to (d) are repeated to form a three-color colored resin pattern 5, as shown in FIG. 1(e), for example.
6.7 color filters can be formed.

Next, as shown in FIG. 1(f), in the colored resin pattern forming step, unnecessary colored resins 5 a, 6 a, which are laminated so as to cover the non-transparent metal pattern 2 are removed.
By removing 7a by polishing, it is possible to obtain a color filter in which the non-transparent metal pattern 2 is arranged between the color filter pixels of each color.
If necessary, a protective film 8 can be formed on the top of the color filter as shown in FIG. 1(g).

The non-transparent metal film in the present invention is Cr.

It can be arbitrarily selected from general metal materials including Aj', Ni, Mo, Cu, etc. In particular, in a liquid crystal display, in order to lower the resistance value of the transparent electrode, it is preferable to select one having a lower specific resistance. In addition, the non-transparent metal film is formed by using a vacuum film forming method such as vapor deposition or sputtering using the metal material, and the film thickness is 1.
00 people to about 3 pm, preferably about 1000 people to 2 μm is suitable.

Further, microfabrication techniques such as etching and lift-off are used for patterning the non-transparent metal film.

Examples of the resin forming the colored resin pattern of the color filter in the present invention include photosensitive gelatin, casein, grue, polyvinyl alcohol, polyimide, polyamideimide, polyesterimide, polyamide, polyester, polycarbonate, polyvinyl acetal, and polyacetic acid. It can be arbitrarily selected from vinyl, polystyrene, cellulose resin, melamine resin, urea resin, acrylic resin, epoxy resin, polyurethane resin, polysilicon resin, general photoresist resin, and the like.

The coloring material forming the colored resin pattern of the color filter in the present invention is not particularly limited, and may be any of organic pigments, inorganic pigments, dyes, etc. as long as desired spectral characteristics can be obtained. . In this case, each material can be used alone or as a mixture of some of these materials. However, in view of the color characteristics and various performances of the color filter, organic pigments are most preferable as the coloring material.

Organic pigments include azo pigments such as soluble azo, insoluble azo, condensed azo, phthalocyanine pigments,
and fused polycyclic pigments including indigo, anthraquinone, perylene, perinone, dioxazine, quinacridone, isoindolinone, phthalone, methine/azomethine, and other metal complex systems, or any number of these. A mixture of these is used.

In the present invention, the colored resin liquid used to form the colored resin pattern is obtained by blending the above-mentioned coloring material having the desired spectral characteristics with the above-mentioned resin solution at a ratio of about 10 to 150% by weight, and applying ultrasonic waves or After sufficiently dispersing using a main roll etc., large particles are removed using a filter.

The colored resin film of the color filter in the present invention is formed by applying the colored resin liquid onto a substrate using a coating device such as a spinner or a roll coater 9 printing device. The film thickness is determined depending on the desired spectral characteristics, but is usually about 0.5 to 5 pm, preferably 1
~2pm is desirable.

In addition, when the color filter of the present invention is used for a liquid crystal display or the like, the thickness of the colored resin film is the same as or thicker than that of the non-transparent metal film (by coating or forming a film, The polishing process makes it possible to flatten the surface of the color filter, making it possible to form a panel with excellent display quality with fewer liquid crystal alignment defects.Furthermore, the transparent electrode formed on the color filter and the electrical connection By making contact, it is possible to use low-resistance wiring, which is effective in countering signal delays and heat generation within the panel in large-screen displays, making it possible to form panels with excellent display quality.

As a polishing method in the present invention, for example, polishing using a wheel or a belt can be performed. Specifically, polishing is performed by attaching abrasive grains to a rotating wheel or belt and pressing them against the substrate. As the abrasive used for polishing, alumina, chromium oxide, diamond powder, zirconium oxide, silicon oxide, silicon carbide, cerium oxide, iron oxide, boron carbide, corundum, emery, garnet, flint, clay, etc. are used.

Note that the colored resin pattern of the color filter in the present invention may be coated on the surface of the colored resin pattern as necessary.
Organic resins such as polyamide, polyimide, polyurethane, polycarbonate, acrylic, epoxy, silicone, and 5iJ4. SiO□, 5iOAI! zO3, Ta2
An inorganic film such as O3 can be provided as a protective film by a coating method such as spin cord or roll coating, or by a vapor deposition method.

A color filter having a colored resin pattern as described above can be formed on a suitable substrate. For example, glass plates, transparent resin plates, resin films, cathode ray tube display surfaces, image pickup tube light receiving surfaces, CCDs, BBDs,
Close-contact image sensor-1 using wafers and thin film semiconductors on which solid-state imaging devices such as CID and BASIS are formed
Examples include liquid crystal display surfaces and color electrophotographic photoreceptors.

If it is necessary to further increase the adhesion between the colored resin pattern and the underlying substrate, either apply a thin layer of silane coupling agent, etc. on the substrate in advance, and then form the colored resin pattern. A layer effect can be achieved by forming a color filter using a color filter containing a small amount of a silane coupling agent or the like.

[Example] Examples of the present invention will be shown below and explained in more detail.

Example 1 Ap film with a thickness of 1.5 gm was deposited on a glass substrate by EB evaporation method.
After forming a film, a photoresist 0FPR-
800 (trade name, manufactured by Tokyo Ohka Kogyo ■) by a spinner coating method, and prebaked at 80° C. for 30 minutes. The photoresist was then exposed to light using a high-pressure mercury lamp through a striped pattern mask corresponding to the shape of the non-transparent metal pattern to be formed. After the exposure, the photoresist was developed with a special developer NMD-3 (trade name, manufactured by Tokyo Ohka Kogyo ■) that dissolves only the exposed areas, washed with water, and then incubated at 120°C for 30 minutes. I did a boss bake. Then, the substrate was etched in a mixed acid aluminum solution (trade name, manufactured by Wako Tsugyaku Kogyo ■) heated to 40°C. The etched substrate was treated with resist stripping solution N-303 (trade name, manufactured by Nagase Sangyo ■) to strip the photoresist. In this manner, a striped non-light-transmitting metal pattern was formed on the glass substrate.

A blue colored resin material [Heliogen Blue L7] that can obtain the desired spectral characteristics is applied on a glass substrate on which a non-transparent metal pattern is formed.
080 (Product name, manufactured by BASF, C, 1, No.
, 74160) was dispersed in PA-1000 (trade name, manufactured by Ube Industries, Ltd., polymer content 10%, solvent = N-methyl-2-pyrrolidone, pigment: polymer = 1:2 blend),
A photosensitive colored resin solution diluted with a cellosolve solvent] was applied to a film thickness of 1.5 μm by a spinner coating method, and prebaked at 70° C. for 20 minutes.

Next, the colored resin film was exposed to light using a high-pressure mercury lamp through a pattern mask corresponding to the pattern shape to be formed. At this time, care was taken so that the edges of the colored resin pattern to be formed overlapped with the non-transparent metal pattern. After exposure, the colored resin film is developed using ultrasonic waves in a special developer that dissolves only the unexposed areas, treated with a special rinse solution, and then post-baked at 150°C for 30 minutes to remove the pattern. A blue colored resin film having a shape in which edges overlapped on a non-transparent metal pattern was formed.

Next, a green colored resin material [Lionol Green 6YK (trade name)] was applied as a second color onto the glass substrate on which the blue colored pattern was formed.

Manufactured by Toyo Ink Co., Ltd., C, 1, No. 74265)
A-1000 (product name, manufactured by Ube Industries, polymer content: 10
%, solvent = N-methyl-2-pyrrolidone, pigment dipolymer = 1:2 blend) and diluted with cellosolve solvent]. Then, a green colored pattern having a shape in which the edges of the pattern overlapped with the non-transparent metal pattern was formed at a predetermined position on the substrate.

Furthermore, a red colored resin material [Irgazin Red BPT] was applied as a third color onto the substrate on which the blue and green patterns were formed in this way.
(Product name, manufactured by Ciba-Geigy).

C, 1, No. 71127) was dispersed in PA-1000 (trade name, manufactured by Ube Industries, Ltd., polymer content 10%, solvent 2N-methyl-2-pyrrolidone, pigment: polymer = 1 = 2 combination) and cellosolve. A red colored pattern with the edges of the pattern overlapping the non-transparent metal pattern is placed on the substrate in the same manner as described above, except that a photosensitive colored resin liquid prepared by diluting with a solvent is used. A colored resin pattern of three color stripes of R (red), G (green), and B (blue) was obtained.

The surface of the substrate having the colored resin pattern of three-color stripes thus obtained was pressed against a polyurethane pad rotating at 60 rpm, and a solution containing alumina abrasive grains with a particle size of 1.0 μm dispersed in water was applied. Polishing was performed by dropping it onto the pad. Polishing was carried out until all the colored resin on the non-transparent metal pattern was removed.

The obtained color filter had a metal film arranged between each color stripe pattern, and the film thickness of each color stripe pattern and metal film was uniform.Furthermore,
The obtained color filter had excellent properties such as heat resistance, light resistance, and mechanical properties.

Example 2 Ai film with a thickness of 1.0 μm was deposited on a glass substrate by EB evaporation method.
), photoresist 0FP is applied on this Al1.
R-800 (trade name, manufactured by Tokyo Ohka Kogyo ■) was applied by a spinner coating method, and prebaked at 80°C for 30 minutes. The photoresist was then exposed to light using a high-pressure mercury lamp through a grid pattern mask corresponding to the shape of the non-transparent metal pattern to be formed. After exposure,
The photoresist was developed with a special developer NMD-3 (trade name, manufactured by Tokyo Ohka Kogyo ■) that dissolves only the exposed areas, washed with water, and then post-baked at 120°C for 30 minutes. . Then, the substrate was etched in a mixed acid aluminum solution (trade name, manufactured by Wako Pure Chemical Industries, Ltd.) heated to 40°C. The etched substrate was treated with resist stripping solution N-303 (trade name, manufactured by Nagase Sangyo ■) to strip the photoresist. In this manner, a grid-like non-transparent metal pattern was formed on the glass substrate.

A blue colored resin material [Heliogen Blue L7] that can obtain desired spectral characteristics is applied on a glass substrate on which a non-transparent metal pattern is formed.
A photosensitive colored resin liquid prepared by dispersing 080 (trade name, manufactured by BASF) in an aqueous polyvinyl alcohol resin solution containing ammonium dichromate as a crosslinking agent was applied to a film thickness of 1.0 μm using a spinner coating method. , 8
Prebaking was performed for 0°C12O minutes. Next, the colored resin film was exposed to light using a high-pressure mercury lamp through a pattern mask corresponding to the pattern shape to be formed. At this time, care was taken so that the edges of the colored resin pattern to be formed overlapped with the non-transparent metal pattern. After exposure, water/I
The colored resin film was developed using a PA mixture. And 1
Bost baking was performed at 50° C. for 30 minutes to form a blue colored resin film having a patterned shape.

Next, green colored resin material [Lionol] was used as the second color.
Green (Lionol Green) 6YK (Product name.

(manufactured by Toyo Ink Co., Ltd.) in an aqueous polyvinyl alcohol resin solution containing ammonium dichromate as a crosslinking agent], and as a third color,
Red colored resin material [Irgazin Red
Red) BPT (trade name, manufactured by Ciba Geigy) was dispersed in an aqueous polyvinyl alcohol resin solution containing ammonium dichromate as a crosslinking agent]. is overlapped on the non-transparent metal pattern (
A colored resin pattern of three colors (red), G (green), and B (blue) c) was obtained.

The surface of the thus obtained substrate having the three-color mosaic colored resin pattern was polished to remove the colored resin on the non-transparent metal pattern. The color filter thus obtained had a structure in which metal films were arranged in gaps between the mosaic patterns of each color.

Example 3 Using the color filter substrate formed in Example 1,
A ferroelectric liquid crystal element 21 having the structure shown in FIG. 2 was formed as follows.

That is, a protective film 29 made of photosensitive polyimide [
PI-300 (trade name, manufactured by Ube Industries, Ltd.)] to 1.0 μm
It was coated to a film thickness of .

Next, using a pattern mask compatible with forming a pattern that makes contact with the non-transparent metal film, exposure, development, and rinsing are performed, followed by post-baking to form a protective film pattern with through holes on the non-transparent metal film. was formed.

Then, an ITO film with a thickness of 1,500 mm was formed by sputtering, and a pattern was formed to make contact with the non-transparent metal film to obtain a pattern for the transparent electrode 25. Next, polyimide was printed as the orientation control film 27 by printing method.
The film was coated with a film thickness of 0.00 mm and subjected to rubbing treatment.

Silica beads with a diameter of 1.5 μm were sprinkled between the color filter substrate obtained in this way and the counter substrate, and the striped pattern electrodes of both substrates were bonded to each other at right angles to form a cell assembly. Dielectric liquid crystal 24 was injected and sealed to obtain a liquid crystal element.

The obtained ferroelectric liquid crystal element has excellent contrast and color purity, and the low resistance of the transparent electrode due to the non-transparent metal film with contacts reduces the deterioration of display quality due to signal delay and heat generation within the cell. It was not that good.

Furthermore, due to the excellent flatness of the color filter surface, a liquid crystal element with fewer alignment defects could be obtained.

Example 4 A color liquid crystal display element was manufactured in the following manner using a thin film transistor as a substrate and forming the color filter of the present invention on the substrate.

First, as shown in Figure 3(a), a glass substrate (product name:
7059, manufactured by Corning Inc.) 1, is formed into a desired pattern by a photolithography process, and then Ai) is further vacuum-deposited on this surface to a thickness of 1000 layers. The layer was patterned into a desired shape by a photolithography process to form a gate electrode 32 as shown in FIG. 3(b).

Subsequently, photosensitive polyimide is coated on the surface of the substrate on which the electrodes are provided to form an insulating layer 33, and through-holes 34 forming contact portions between the drain electrode 38 and the pixel electrode 31 are formed by pattern exposure and development processing. Figure 3 (c
).

Here, the substrate 1 is set at a predetermined position in the deposition tank, SiH4 diluted with H2 is introduced into the deposition tank, and the electrodes 31, 32 and the insulating layer 3 are
A-3 with a layer thickness of 2000 people on the entire surface of the base ml provided with 3
After depositing a photoconductive layer (intrinsic layer) 35 consisting of i, an n1 layer 36 having a thickness of 1000 layers was formed on this photoconductive layer 35 by the same operation as shown in FIG. 3(d). Laminated like this. This substrate 1 is taken out from the deposition bath, and the n° layer 36 and the photoconductive layer 35 are each shaped into a desired shape by dry etching in this order (see FIG. 3).
Patterning was performed as shown in e).

Next, on the substrate surface on which the photoconductive layer 35 and the n+ layer 36 are provided, AP is vacuum-deposited to a thickness of 1000 layers, and this Ail-deposited layer is patterned into a desired shape by a photolithography process. Then, a source electrode 37 and a drain electrode 38 as shown in FIG. 3(f) were formed.

Furthermore, after forming an insulating layer 39 on this, a non-light-transmitting metal pattern 2 made of a light-shielding layer of metal film is formed between the patterns by the same method as in Example 2, corresponding to each pixel electrode 31. After forming colored resin patterns 5, 6.7 in three colors of red, blue and green as shown in FIG. 3(g), an alignment function is applied to the entire surface of this substrate as shown in FIG. 3(h). The polyimide resin provided as the protective film 8 was applied to a thickness of 1,200 mm, and the resin was cured by heat treatment at 250° C. for 1 hour to produce a thin film transistor with an integrated color filter.

A color liquid crystal display element was further formed using the thus produced thin film transistor with a color filter.

That is, 1,000 ITO electrode layers were formed on the - side of a glass substrate (trade name: 7059, manufactured by Corning Inc.) in the same manner as described above, and then a polyimide resin with an orientation function was formed on the electrode layer. An insulating layer having a thickness of 1,200 layers was formed, and a liquid crystal was sealed between this substrate and the previously formed thin film transistor with a color filter, and the whole was fixed to obtain a color liquid crystal display element.

The color liquid crystal display element thus formed had good characteristics.

Example 5 A color filter having a color filter of the present invention was prepared in the same manner as in Example 4 except that a three-color color filter having a non-transparent metal film between patterns was provided on the counter electrode instead of on the pixel electrode. A liquid crystal display element for use was obtained.

The color liquid crystal display element thus formed has good characteristics.

Example 6 A color having a color filter of the present invention was prepared in the same manner as in Example 4 except that a three-color color filter having a non-transparent metal film between patterns was first formed on a counter substrate, and then a counter electrode was provided. A liquid crystal display element for use was obtained.

The color liquid crystal display element thus formed had good characteristics.

Example 7 A wafer on which a CCD (charge, coupled, device) was formed was used as a substrate, and a pattern was placed between the patterns so that each colored pattern of the color filter was arranged corresponding to each light receiving cell of the CCD. A color solid-state imaging device having a color filter of the present invention was formed in the same manner as in Example 2, except that a three-color stripe color filter having a non-transparent metal film was formed. Note that an acrylic resin-based protective film was formed on the color filter.

The color solid-state imaging device thus formed had good characteristics.

Example 8 The color filters formed in Example 2 were placed on a wafer on which a CCD (charge, coupled, device) was formed, and each colored pattern of the color filter was colored in correspondence to each light receiving cell of the CCD. They were aligned and attached to form a color solid-state image sensor.

The color solid-state imaging device thus formed had good characteristics.

Example 9 A color photosensor array having the color filter of the present invention as shown in the partial plan schematic diagram of FIG. 4 was formed in the following manner according to the steps shown in FIG.

First, a photoconductive layer (intrinsic layer) 45 made of an a-5i (amorphous silicon) layer is formed on a glass substrate (trade name: 7059, manufactured by Corning Inc.) 1 by a glow discharge method, as shown in FIG. 5(a). It was set up like this.

That is, SiH4 diluted to 10% by volume with H2 was heated at a gas pressure of 0.50 Torr and RF (Radio Fre
A photoconductive layer 45 with a thickness of 0.7 μm was obtained by depositing the photoconductive layer 45 on the substrate for 2 hours at a power of 10 W and a substrate temperature of 250° C.

Subsequently, a fifth layer is formed on this photoconductive layer 45 by a glow discharge method.
As shown in Figure (b), an n+ layer 46 was provided.

That is, SiH4 diluted to 10% by volume with H2,
PH3 diluted to 100 ppm with H2 and 1=10
Continuing to the photoconductive layer 45, using the gas mixed in step 4 as a raw material, and using the same conditions as the previous deposition conditions for the photoconductive layer,
An n'' layer 46 with a layer thickness of 0.1 μm was provided.

Next, as shown in FIG. 5(C), A
A conductive layer 49 was deposited by stacking 6 layers on 4 n''' layers to a layer thickness of 0.3 μm.Subsequently, as shown in FIG. 5(d), the light conversion portion of the conductive layer 49 was The part corresponding to the part was removed.

That is, positive type Microposit 1300-27 (
After forming a photoresist pattern in the desired shape using photoresist (trade name, 5hipley), phosphoric acid (85% by volume aqueous solution) and nitric acid (60% by volume aqueous solution)
, using an etching solution containing glacial acetic acid and water in a ratio of 16:1:2:1, removing the conductive layer 49 from the exposed portion (the portion where the resist pattern is not provided) from the substrate;
A common electrode 41 and individual electrodes 40 were formed.

Next, the n+ layer 46 that will become the light conversion part is shown in FIG. 5(e).
It was removed as shown.

That is, after the Microposit 1300-27 photoresist is peeled off from the substrate, it is etched with RF power using a plasma etching method (also known as reactive ion etching method) using a parallel plate plasma etching device DEM-451 (manufactured by Nikkei Anelva Co., Ltd.). 120W, gas pressure 0. IT
Dry etching with CF4 gas was performed for 5 minutes at ORR to remove exposed portions of the n+ layer 46 and a portion of the surface layer of the photoconductive layer 45 from the substrate.

In this example, in order to prevent implantation of the cathode material of the etching device, a polysilicon sputtering target (8 inches, purity 99.999%) was placed on the cathode, and the sample was placed on top of it. The exposed portion of the SUS of the cathode material was covered with a Teflon (registered trademark) sheet cut out in the shape of a donut, and etching was performed in a state in which the three surfaces of the SUS were hardly exposed to plasma.

Thereafter, heat treatment was performed at 20° C. for 60 minutes in an oven in which nitrogen was flowed at a rate of 34)/min.

Next, a protective layer was formed on the surface of the photosensor array thus created in the following manner.

That is, a silicon nitride layer as a protective layer 47 was formed on the photosensor array by a glow discharge method.

i.e. SiH diluted to 1O volume % with H2
Silicon nitride (a-Si
A protective layer 47 consisting of an N old layer was formed as shown in FIG. 5(f).

Furthermore, using this protective layer 47 as a substrate, a color filter consisting of colored patterns of three colors of blue, green, and red having a non-transparent metal film between the patterns was formed in the same manner as in Example 1, and then the protective layer 47 was used as a substrate. A film was formed to form a color photosensor array in which a colored filter was placed on each photosensor, as shown in FIG.

The color photosensor array formed in this example also had good characteristics.

Example IO A color photosensor array was formed by pasting the color filter formed in Example 1 onto the photosensor array formed in Example 9 using an adhesive.

The color photosensor formed in this example also had good characteristics, similar to that formed in Example 9.

[Effects of the Invention] As explained above, according to the method of manufacturing a color filter of the present invention, it is possible to provide a non-light-transmitting metal film without any gaps between color filter pixels of each color by a simple method. Become.

Therefore, in image pickup elements and sensor devices in which such color filters are arranged, (1) improvement of color reproducibility, (2) prevention of malfunction of optical elements, and furthermore, in liquid crystal display devices, (1)
Improved contrast and color purity (2) Reduced orientation defects due to flatness (3) By using the non-transparent metal film as an auxiliary electrode line, it is possible to prevent signal delays or deterioration of display quality due to heat generation within the cell. Excellent effects can be obtained.

[Brief explanation of drawings]

FIGS. 1(a) to (g) are process diagrams showing the method for producing a color filter of the present invention, FIG. 2 is a cross-sectional view of a ferroelectric liquid crystal element using the color filter obtained according to the present invention, and FIG. (a) to (h) are process diagrams for forming a liquid crystal display element using a color filter obtained according to the present invention, and FIG. 4 is a schematic partial plan view of a photosensor array using a color filter obtained according to the present invention. Figure 5(a)~
(g) is a process diagram for forming the photosensor array shown in FIG. 4. 1, 22.23... Substrate 2... Non-transparent metal pattern 3... Colored resin film 4... Photomask 5.6.7... Colored resin pattern 5 a, 6 a, 7 a...Unnecessary colored resin8.
29... Protective film 21... Ferroelectric liquid crystal element 24... Ferroelectric liquid crystal 25, 26... Transparent electrodes 27, 28... Alignment control film 30... Non-transparent metal film 31... Pixel electrode 32... Gate electrode 33, 39... Insulating layer 34... Through hole 35, 45... Photoconductive layer 36, 46... N1 layer 37... Source electrode 38 ...Drain electrode 40...Individual electrode 41...Common electrode 47...Protective layer 49...Conductive layer

Claims (4)

[Claims] (1) A method for manufacturing a color filter in which a metal film is arranged without any gaps between color filter pixels of each color on a substrate, which includes the steps of (a) forming a non-transparent metal pattern on the substrate; A colored resin containing a coloring material is applied onto a substrate on which a translucent metal pattern is formed, and then a colored resin film is applied to the non-transparent metal pattern by exposing and developing the resin through a mask. (c) repeating the step (b) a plurality of times using colored resins of different hues to form colored resin patterns of multiple colors; and (d) the non-transparent pattern. A method for manufacturing a color filter, characterized in that a metal film is formed without gaps between color filter pixels of each color by a process of removing colored resin laminated on a color metal pattern by polishing. (2) The method for manufacturing a color filter according to claim 1, wherein the substrate is a display section of a display device. (3) The method for manufacturing a color filter according to claim 1, wherein the substrate is a solid-state image sensor. (4) The method for manufacturing a color filter according to claim 1, wherein the substrate is a light receiving surface of an image sensor.