JPH0324259U - - Google Patents
Info
- Publication number
- JPH0324259U JPH0324259U JP1989084079U JP8407989U JPH0324259U JP H0324259 U JPH0324259 U JP H0324259U JP 1989084079 U JP1989084079 U JP 1989084079U JP 8407989 U JP8407989 U JP 8407989U JP H0324259 U JPH0324259 U JP H0324259U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- motherboard
- pin
- joint structure
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の第一の実施例を示す図、第２
図は第１図における各工程の状態図、同図ａは初
期時、同図ｂはベーパーリフロ時、同図ｃケーブ
ルコネクタ嵌合時、第３図は本考案の他の実施例
を示す図、第４図は本考案が適用される全体構成
図、第５図は従来の構造図、第６図ａおよびｂは
従来の欠点を示す図である。
図において、１はマザーボード、２はコネクタ
、３は部品、３ａは先端部、４はスルーホール、
７は硬質クロムメツキ、１２は突起をそれぞれ示
す。
Fig. 1 shows the first embodiment of the present invention; Fig. 2 shows the first embodiment of the present invention;
The figures are state diagrams of each process in Figure 1, Figure a shows the initial state, Figure b shows vapor reflow, Figure c shows the cable connector fitted, and Figure 3 shows another embodiment of the present invention. , FIG. 4 is an overall configuration diagram to which the present invention is applied, FIG. 5 is a conventional structural diagram, and FIGS. 6 a and 6 b are diagrams showing the drawbacks of the conventional method. In the figure, 1 is the motherboard, 2 is the connector, 3 is the component, 3a is the tip, 4 is the through hole,
7 indicates hard chrome plating, and 12 indicates a protrusion.
Claims (1)
１と、 該スルーホール４を貫通し、且つその外周に金
メツキ６が施されたピン３を有するコネクタ２と
を有し、 該スルーホール４と該ピン３とが半田９にて接
合される半田接合構造に於いて、 金メツキ６がその外周に施されてなる前記ピン
３上に、前記マザーボード１に挿入した際、当該
マザーボード１上に形成された前記スルーホール
４を挟み込む少なくとも ２ケ所に半田漏れ性の悪い材質を塗布したこと
を特徴とする半田接合構造。 (2) 前記スルーホール４の内壁に突起部１２が
形成されてなることを特徴とする請求項１記載の
半田接合構造。[Scope of Claim for Utility Model Registration] (1) A motherboard 1 having a through hole 4 formed therein, and a connector 2 having a pin 3 passing through the through hole 4 and having a gold plating 6 on its outer periphery. However, in the solder joint structure in which the through hole 4 and the pin 3 are joined with solder 9, when the pin 3 having the gold plating 6 applied to its outer periphery is inserted into the motherboard 1. A solder joint structure characterized in that a material with poor solder leakage is applied to at least two locations sandwiching the through hole 4 formed on the motherboard 1. (2) The solder joint structure according to claim 1, wherein a protrusion 12 is formed on the inner wall of the through hole 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989084079U JPH0722044Y2 (en) | 1989-07-19 | 1989-07-19 | Solder joint structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989084079U JPH0722044Y2 (en) | 1989-07-19 | 1989-07-19 | Solder joint structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0324259U true JPH0324259U (en) | 1991-03-13 |
| JPH0722044Y2 JPH0722044Y2 (en) | 1995-05-17 |
Family
ID=31632270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989084079U Expired - Lifetime JPH0722044Y2 (en) | 1989-07-19 | 1989-07-19 | Solder joint structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722044Y2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213070A (en) * | 1995-02-03 | 1996-08-20 | Dai Ichi Denshi Kogyo Kk | Solder run-up preventive structue of electronic part terminal |
| JPH10294142A (en) * | 1997-04-18 | 1998-11-04 | Hirose Electric Co Ltd | Electrical connector for circuit board |
| JPH11167944A (en) * | 1997-10-03 | 1999-06-22 | Fujitsu Ltd | I / O pins with solder dam for connection between boards |
| JP2006216729A (en) * | 2005-02-03 | 2006-08-17 | Fuji Electric Device Technology Co Ltd | Semiconductor device and manufacturing method thereof |
| JP2008226681A (en) * | 2007-03-14 | 2008-09-25 | Japan Aviation Electronics Industry Ltd | connector |
| JP2010212723A (en) * | 2010-05-17 | 2010-09-24 | Fuji Electric Systems Co Ltd | Method of manufacturing semiconductor device |
| JP2011151247A (en) * | 2010-01-22 | 2011-08-04 | Sumitomo Wiring Syst Ltd | Terminal metal fitting and connection structure of terminal metal fitting |
| JP2013093232A (en) * | 2011-10-26 | 2013-05-16 | Toyota Motor Corp | Connector terminal |
| JP2019083308A (en) * | 2017-10-31 | 2019-05-30 | 乾坤科技股▲ふん▼有限公司 | Current detection resistor and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5693976U (en) * | 1979-12-21 | 1981-07-25 | ||
| JPS5797382U (en) * | 1980-12-06 | 1982-06-15 |
-
1989
- 1989-07-19 JP JP1989084079U patent/JPH0722044Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5693976U (en) * | 1979-12-21 | 1981-07-25 | ||
| JPS5797382U (en) * | 1980-12-06 | 1982-06-15 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213070A (en) * | 1995-02-03 | 1996-08-20 | Dai Ichi Denshi Kogyo Kk | Solder run-up preventive structue of electronic part terminal |
| JPH10294142A (en) * | 1997-04-18 | 1998-11-04 | Hirose Electric Co Ltd | Electrical connector for circuit board |
| JPH11167944A (en) * | 1997-10-03 | 1999-06-22 | Fujitsu Ltd | I / O pins with solder dam for connection between boards |
| JP2006216729A (en) * | 2005-02-03 | 2006-08-17 | Fuji Electric Device Technology Co Ltd | Semiconductor device and manufacturing method thereof |
| JP4600065B2 (en) * | 2005-02-03 | 2010-12-15 | 富士電機システムズ株式会社 | Semiconductor device and manufacturing method thereof |
| JP2008226681A (en) * | 2007-03-14 | 2008-09-25 | Japan Aviation Electronics Industry Ltd | connector |
| JP2011151247A (en) * | 2010-01-22 | 2011-08-04 | Sumitomo Wiring Syst Ltd | Terminal metal fitting and connection structure of terminal metal fitting |
| JP2010212723A (en) * | 2010-05-17 | 2010-09-24 | Fuji Electric Systems Co Ltd | Method of manufacturing semiconductor device |
| JP2013093232A (en) * | 2011-10-26 | 2013-05-16 | Toyota Motor Corp | Connector terminal |
| JP2019083308A (en) * | 2017-10-31 | 2019-05-30 | 乾坤科技股▲ふん▼有限公司 | Current detection resistor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0722044Y2 (en) | 1995-05-17 |
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