JPH03226680A - Rf evaluation jig - Google Patents

Abstract

PURPOSE:To achieve the contact with a connector needle wire with excellent durability and good reproducibility by making the connection part of a reverse microstrip line and the microstrip line on an IC chip side movable. CONSTITUTION:A reverse microstrip line 12 reverse up and down is provided to a jig side plate 4 and this line and a connector needle wire 6 are connected using a solder material and the connection part of the microstrip line 12 and the microstrip line 3 on the side of an IC chip 1 is made movable. When high frequency characteristics (RF) are evaluated, an evaluating IC package 9 is fixed to a jig stage 8 and the jig side plate 4 is moved downwardly to connect the microstrip line 3 to the reverse microstrip line 12 and fixed in this state using a screw 13. Since the connector needle wire 6 is supported by a support plate 11 and does not directly come into contact with the microstrip line 3, no damage is generated even when excessive force is applied. By this constitution, the contact of the connector needle wire can be achieved with good reproducibility.

Description

[Detailed description of the invention]

[Industrial Application Field] This invention is applicable to fj, for example, several tens of MHz, Id, and C band (approximately 5 MHz).
The present invention relates to a jig (hereinafter referred to as an RF evaluation jig) for measuring the parasitic frequency characteristics of a semiconductor device that operates in a high frequency band up to the X band (about 10 GHz) or the X band (approximately 10 GHz). [Prior art] Fig. 6 is a perspective view showing a conventional RF evaluation jig for high-frequency band IC chips, and Figs. 7 to 9 show situations in which an evaluation IC package is mounted on the RF evaluation jig shown in Fig. 6. Figure 7 is a side view showing the RF weighing jig is electrically disconnected, and Figure 8 is a side view showing the RF weighing jig.
The figure shows a state in which the RF weighing jig is electrically connected, and FIG. 9 shows a state in which the connector needle wire is bent. In the figure, the crests are IC chips, (2) are dielectric substrates, (3) are microstrip lines, (4) are jig side plates, (5) are coaxial connectors, (6) are connector wires, (7) is a coaxial cable, 181 is a jig stage, (9) is an evaluation IC package, and (13 is a screw.) Next, the operation will be explained.Evaluation IC package (9)
), fix the evaluation IC package (9) on the jig stage (8), move the jig side plate (4) to the lower blade, and connect the connector needle line ( 63 was in contact with the microstrip line (31) and the jig side plate (41) was fixed using screw α3, and RF evaluation was performed.

[Problems to be solved by the invention] Since the conventional RF evaluation jig is constructed as described above, when the connector needle wire is brought into contact with the microstrip line, the connector needle wire may be damaged as shown in FIG. %<
However, there was a problem in that the durability of the RFN value jig was insufficient. This invention was made to solve the above-mentioned problems, and aims to provide an RF evaluation jig that has excellent durability and can contact a connector needle wire with good reproducibility. [Means for Solving the Problems] The RF evaluation jig according to the present invention provides an upside-down microstrip line on the side plate of the jig, connects this to a connector wire using solder material, etc., and forms the above-mentioned inverted microstrip. The connection part between the line and the microstrip line on the IC chip side is made into a "J-motion". In order to connect the side microstrip line and the connector needle wire, an RF evaluation jig with excellent durability and good reproducibility of contact can be created. [Example] An example of the present invention will be described below with reference to the drawings. Figure 1 is a perspective view showing the RF evaluation jig, Figure 2 is a perspective view of Figure 1 with the jig stage and evaluation IC package removed, and Figures 3 and 4 are the same as in Figure 1. R
Figure 3 i! is a side view showing the situation where the evaluation IC package is attached to the F evaluation jig. FIG. 4 shows a state in which the RF evaluation jig is electrically disconnected, and a state in which the RF evaluation jig is electrically connected. FIG. 5 is a side view showing an RF evaluation jig according to another embodiment of the present invention. In the figure (11-(9), Q31
i;! Since this is the same as that shown in "Conventional V" in FIGS. 6 and 7, the explanation will be omitted. dz is a reverse microstrip line, t]DI +; The connector needle wire (6) and the reverse microstrip line t12 are connected using solder material or the like. Next, the effect will be explained. To perform RF evaluation (for example, fix the evaluation IC package (9) on the jig stage (8), move the jig side plate (4) downward as shown in Figure 4, and place the microstrip line ( 3) and the reverse microstrip line σ2, fix the jig side plate (4) using the screws 113. Connector needle wire +61
i;! Because it is supported by the support plate Gll and does not come into direct contact with the microstrip line (3),
No damage will occur even if excessive force is applied. In addition, in the above example N, the connector needle wire (6) or the support plate opening υ
Although shown as being located inside the dielectric substrate (2), as shown in FIG. [Effects of the Invention] As described above, according to the present invention, an upside-down inverted microstrip line is provided on the side plate of the jig, and this and the connector needle wire are connected using a solder material or the like, and the above-mentioned microstrip line and Since the connection part with the microstrip line on the IC chip side is made OT@, it has the effect of providing an R1' evaluation jig that has excellent durability and makes contact with the connector needle wire with good reproducibility.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an RF evaluation jig according to an embodiment of the present invention, FIG. 2 is a perspective view showing the state in which the jig stage and evaluation IC package are removed in FIG.
Figures 4 and 4 are side views showing the condition in which the evaluation IC package is mounted on the RF evaluation jig shown in Figure 1, Figure 3 shows the RF evaluation jig in a state where it is not electrically connected, and Figure 4 shows the condition where the RF evaluation jig is not electrically connected. This shows the state in which the RF evaluation jig is electrically connected. Fig. 5 is a side view showing an RF evaluation jig according to another embodiment of the present invention, Fig. 6 is a perspective view showing a conventional RF evaluation jig, and Figs. 7 to 9 are RF evaluation of Fig. 6. These are side views showing the state in which the evaluation IC package is mounted on the jig. Figure 7 shows the RF evaluation jig in a state where it is not electrically connected, Figure 8 shows the state in which the RF jig is electrically connected, and Figure 8 shows the state in which the RF evaluation jig is electrically connected. Figure 9 shows a state where the connector needle wire is bent. In the figure, (1) is an IC chip, +2) is an f2 dielectric substrate, (3) is a microstrip line, (4) is a jig side plate, (5 is a coaxial connector, (6) is a connector wire, and is a +7112 coaxial cable. , (8; is the jig stage, (
9) is an IC package for evaluation, tlG is a ground metal for an inverted microstrip line, an is a support plate, and ■ is an inverted microstrip line. In addition, in the figure, the same reference numerals are the same, and 1 indicates a part.

Claims (1)

[Claims] In an RF characteristic evaluation jig that has a conversion part between a coaxial line and a microstrip line, an upside-down microstrip line is provided on the side plate of the jig, and this and the connector needle wire are connected using solder material, etc. An RF evaluation jig characterized by a movable connection part between the strip line and the microstrip line on the IC chip side.