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JPH03218004A - Feed-through capacitor - Google Patents

Feed-through capacitor

Info

Publication number
JPH03218004A
JPH03218004A JP1458090A JP1458090A JPH03218004A JP H03218004 A JPH03218004 A JP H03218004A JP 1458090 A JP1458090 A JP 1458090A JP 1458090 A JP1458090 A JP 1458090A JP H03218004 A JPH03218004 A JP H03218004A
Authority
JP
Japan
Prior art keywords
capacitor
lead wire
solder
wire terminal
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1458090A
Other languages
Japanese (ja)
Inventor
Hironobu Kinoshita
木下 浩信
Iwao Fukutani
福谷 巌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP1458090A priority Critical patent/JPH03218004A/en
Publication of JPH03218004A publication Critical patent/JPH03218004A/en
Pending legal-status Critical Current

Links

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To prevent connecting solder from re-melting at the time of mounting, by inserting a lead wire terminal composed of wire material of small thermal conductivity into the axial core part of a capacitor element, and soldering the lead wire terminal and a capacitor electrode. CONSTITUTION:Stainless wire, copper coated steel wire, etc., whose thermal conductivity is small are used as the wire material of a lead wire terminal 1. The lead wire 1 is inserted into a hole formed at the center of a capacitor element 5, and a stopper part 2 is fixed to a capacitor electrode 7a of the element 5 via solder 13a. Insulative resin 5 is poured into a metal case 10, and the space in the case 10 is filled with said resin. When this feed-through capacitor is mounted on a printed wiring board and the like, the soldering heat at the time of mounting is scarcely transmitted to the solder 13, because the thermal conductivity of the terminal 1 is small. As a result, the solder 13a can be prevented from re-melting.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、1子回路等を構成する際に使用される貫通コ
ンデンサに関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a feedthrough capacitor used in constructing a single child circuit or the like.

発明の背景及び課題 従来、貫通コンデンサの中心導体であるリード線端子は
導T性の優れている銅線が使用きれていた。しかし、銅
線を使用した場合、貫通コンデンサをプリント配線板等
へ実装する際の半田付け温度が高過ぎたり、半田付け時
間が長過ぎたり、あるいは半田付け熱源が近過ぎたりす
ると、リード線端子とコンデンサ素子の一方の容量電極
とを接続している半田が再溶融することがあった。この
とき、再溶融した半田が別の部分に移動して他方の容量
軍極との間でショートを生じさせたりする不具合いが発
生した。きらに、容量電極としてAg材を使用している
場合には、再溶融した半田によって「軍極くわれ」を起
こし、静電容量の値が設計値より低くなるという重大な
機能低下を引き起こすことがあった。
Background of the Invention and Problems Conventionally, copper wires with excellent conductivity have been used for lead wire terminals, which are the center conductors of feedthrough capacitors. However, when using copper wire, if the soldering temperature is too high, the soldering time is too long, or the soldering heat source is too close when mounting the feedthrough capacitor to a printed wiring board, the lead wire terminals may The solder connecting the capacitor and one capacitor electrode of the capacitor element sometimes remelted. At this time, a problem occurred in that the remelted solder moved to another part and caused a short circuit with the other capacitor terminal. In addition, when Ag material is used as a capacitor electrode, remelted solder can cause "gun-pumping", resulting in a serious functional deterioration in which the capacitance value becomes lower than the designed value. was there.

前記問題点を解決する方法として、リード線端子とコン
デンサ素子の容量電極とを接続している半田に融点の高
い半田材料を使用することが考えられる。しかし、この
方法はリード線とコンデンサ素子とを融点の高い半田に
よって接続する際に、部品全体が高温にきらされること
となり、貫通コンデンサを構成している金属部分が酸化
され、外観が悪くなるおそれがある。この酸化を防止す
るためには特別な半田付け設備を必要とするであろうし
、必然的にコストアップにつながるであろうことが予想
きれる。
One possible solution to the above problem is to use a solder material with a high melting point for the solder connecting the lead wire terminal and the capacitor electrode of the capacitor element. However, with this method, when connecting the lead wire and the capacitor element with high melting point solder, the entire component is exposed to high temperatures, which may cause the metal parts that make up the feedthrough capacitor to oxidize, resulting in poor appearance. There is. In order to prevent this oxidation, special soldering equipment will be required, and it can be expected that this will inevitably lead to an increase in cost.

そこで、本発明の課題は、製造工程において特別な設備
を必要とすることなく、実装する際にリード線端子とコ
ンデンサ素子の容量電極とを接続している半田が再溶融
するのを抑止することができる貫通コンデンサを提供す
ることにある。
Therefore, an object of the present invention is to prevent the solder connecting the lead wire terminal and the capacitor electrode of the capacitor element from remelting during mounting without requiring special equipment in the manufacturing process. The purpose of this invention is to provide a feedthrough capacitor that can

課題を解決するための手段 以上の課題を解決するため、本発明に係る貫通コンデン
サは、 熱伝導率が小さい線材からなるリード線端子と、容量電
極を有するコンデンサ素子とを備え、前記リード線端子
をコンデンサ素子の軸芯部に挿通し、リード線端子とコ
ンデンサ素子の一方の容量電極とを半田を介して接続し
たこと、を特徴とする。
Means for Solving the Problems In order to solve the problems above, a feedthrough capacitor according to the present invention includes a lead wire terminal made of a wire material with low thermal conductivity and a capacitor element having a capacitive electrode, and the lead wire terminal is inserted into the shaft core of the capacitor element, and the lead wire terminal and one capacitance electrode of the capacitor element are connected via solder.

作用 中心導体であるリード線端子が熱伝導率の小さい線材か
らなるため、貫通コンデンサをプリント配線板等へ半田
付けする際の熱がリード線端子を伝導しにくくなり、リ
ード線端子とコンデンサ素子の一方の容量寛極とを接続
している半田が融点に達しないか、又は達しにくくなる
Since the lead wire terminal, which is the central conductor of action, is made of a wire material with low thermal conductivity, the heat generated when soldering the feedthrough capacitor to a printed wiring board, etc., is difficult to conduct through the lead wire terminal, and the contact between the lead wire terminal and the capacitor element is The solder connecting one capacitance-relaxing pole does not reach its melting point or becomes difficult to reach it.

実施例 以下、本発明に係る貫通コンデンサの一実施例を添付図
面を参照して説明する。
Embodiment Hereinafter, one embodiment of a feedthrough capacitor according to the present invention will be described with reference to the accompanying drawings.

第1図は貫通コンデンサの垂直断面図である。FIG. 1 is a vertical cross-sectional view of a feedthrough capacitor.

この貫通コンデンサは、中心導体であるリード線端子1
、このリード線端子1が挿通しているコンデンサ素子5
と金属製ケース10から構成されている。
This feedthrough capacitor has lead wire terminal 1 which is the center conductor.
, a capacitor element 5 through which this lead wire terminal 1 is inserted.
and a metal case 10.

ノード線端子1は、通常その横断面が円形のものが使用
きれる。リード線端子1の中央にはコンデンサ素子5を
位置決めして半田接続するためのストッパ部2がリード
線端子1の半径外方向に延在している。リード線端子1
の線材には熱伝導率の小さいもの、例えばステンレス線
、CP線(銅被覆鋼線)等が使用される。ステンレス線
の熱伝導率は25.4W/m・Kであり、銅線の熱伝導
率約400W / m−Kと比較して極めて低い数値と
なっている. コンデンサ素子5は、中心に孔8を有するドーナツ型誘
竃体6とその表裏面に設けた容量電極7a.7bとから
なる。
Normally, the node line terminal 1 having a circular cross section can be used. At the center of the lead wire terminal 1, a stopper portion 2 for positioning and soldering the capacitor element 5 extends in a radial outward direction of the lead wire terminal 1. Lead wire terminal 1
As the wire rod, one having low thermal conductivity, such as stainless steel wire or CP wire (copper-coated steel wire), is used. The thermal conductivity of stainless steel wire is 25.4 W/m-K, which is extremely low compared to the thermal conductivity of copper wire, which is approximately 400 W/m-K. The capacitor element 5 includes a donut-shaped dielectric body 6 having a hole 8 in the center, and capacitive electrodes 7a provided on the front and back surfaces of the donut-shaped dielectric body 6. 7b.

金属製ケース10は、略円筒形状を有していて、大径部
11と小径部12とからなる。通常、金属製ケース10
はグランド端子として使用される。
The metal case 10 has a substantially cylindrical shape and includes a large diameter portion 11 and a small diameter portion 12. Usually metal case 10
is used as a ground terminal.

コンデンサ素子5は金属製ケース10の大径部11開口
端側から収納され、その容量1極7bが大径部11の一
部を構成している移行壁部分11aの内壁に取付け半田
13bを介して電気的に接続された状態で固定されてい
る。きらに、リード線端子1がコンデンサ素子5の中心
に設けられた孔8に挿通され、そのストツパ部2がコン
デンサ素子5の容量T極7aに取付け半田13aを介し
て宣気的に接続された状態で固定されている。こうして
組み立てられた構成のものに、絶縁性樹脂を金属製ケー
ス10の大径部11開口と小径部12開口から流し込み
、リド線端子1の両端が絶縁性樹詣15から露出するよ
うに金属製ケース10内の空間を絶縁性樹脂15で充填
している. 得られた貫通コンデンサをプリント配線板等へ実装した
場合、中心導体であるリード線端子1の熱伝導率が小さ
いため、実装する際の半田付け温度が高過ぎたり、半田
付け時間が長過ぎたりしても、その熱がリード線端子1
を伝わりにくく、その結果リード線端子1とコンデンサ
素子5の容量寛極7aとを接続している取付け半田13
aが融点に達しないか、又は達しにくくなる。従って、
取付け半田13aは再溶融しないか、再溶融しにくくな
る。
The capacitor element 5 is housed from the open end side of the large diameter section 11 of the metal case 10, and its capacitance 1 pole 7b is attached to the inner wall of the transition wall portion 11a forming a part of the large diameter section 11 via solder 13b. It is fixed in an electrically connected state. Then, the lead wire terminal 1 was inserted into the hole 8 provided in the center of the capacitor element 5, and the stopper part 2 was attached to the capacitance T pole 7a of the capacitor element 5 and was electrically connected via the solder 13a. Fixed state. Insulating resin is poured into the thus assembled structure through the large diameter part 11 opening and the small diameter part 12 opening of the metal case 10, and the metal case 10 is made of metal so that both ends of the lead wire terminal 1 are exposed from the insulating tree 15. The space inside the case 10 is filled with an insulating resin 15. When the obtained feedthrough capacitor is mounted on a printed wiring board, etc., because the thermal conductivity of the lead wire terminal 1, which is the center conductor, is low, the soldering temperature during mounting may be too high or the soldering time may be too long. Even if the heat is
As a result, the mounting solder 13 connecting the lead wire terminal 1 and the capacitive electrode 7a of the capacitor element 5
a does not reach the melting point or becomes difficult to reach. Therefore,
The mounting solder 13a does not re-melt or becomes difficult to re-melt.

なお、本発明に係る貫通コンデンサは前記実施例に限定
きれるものではなく、その要旨の範囲内で種々に変更す
ることができ、特にコンデンサ素子の形状は板状のみで
なく、筒状であってもよく、また、コンデンサ素子を金
属ケースに装填しないものにも適用できる。
Note that the feedthrough capacitor according to the present invention is not limited to the above-mentioned embodiments, and can be modified in various ways within the scope of the invention. Furthermore, the present invention can also be applied to devices in which the capacitor element is not mounted in a metal case.

発明の効果 以上の説明で明らかなように、本発明によれば、中心導
体であるリード線端子が熱伝導率の小さい線材からなる
ため、貫通コンデンサをプリント配線板等へ半田付けす
る際の熱がリード線端子を伝達しにくくなり、リード線
端子とコンデンサ素子の容量電極とを接続している半田
が再溶融しにくい貫通コンデンサが得られる。この結果
、「竃極くわれ,や容量竃極間のショート等の不具合い
を低減することができる。
Effects of the Invention As is clear from the above explanation, according to the present invention, since the lead wire terminal, which is the center conductor, is made of a wire material with low thermal conductivity, the heat generated when soldering the feedthrough capacitor to a printed wiring board, etc. Therefore, a feedthrough capacitor is obtained in which the solder connecting the lead wire terminal and the capacitance electrode of the capacitor element is less likely to be remelted. As a result, it is possible to reduce problems such as ``crossing of the furnace poles'' and short circuits between the capacitor electrodes.

また、貫通コンデンサの製造工程において特別な設備を
必要とせず、従来の設備をそのまま利用できるので、安
価な貫通コンデンサとなる。
Further, the manufacturing process of the feedthrough capacitor does not require any special equipment, and conventional equipment can be used as is, resulting in an inexpensive feedthrough capacitor.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る貫通コンデンサの一実施例を示す
垂直断面図である。 1・・・リード線端子、5・・・コンデンサ素子、7a
・・・容量T極、13a・・・取付け半田。
FIG. 1 is a vertical sectional view showing an embodiment of a feedthrough capacitor according to the present invention. 1... Lead wire terminal, 5... Capacitor element, 7a
...Capacity T pole, 13a...Mounting solder.

Claims (1)

【特許請求の範囲】[Claims] 1.熱伝導率が小さい線材からなるリード線端子と、容
量電極を有するコンデンサ素子とを備え、前記リード線
端子をコンデンサ素子の軸芯部に挿通し、リード線端子
とコンデンサ素子の一方の容量電極とを半田を介して接
続したこと、 を特徴とする貫通コンデンサ。
1. A lead wire terminal made of a wire with low thermal conductivity and a capacitor element having a capacitor electrode are provided, the lead wire terminal is inserted into the shaft core of the capacitor element, and the lead wire terminal and one capacitor electrode of the capacitor element are connected to each other. A feed-through capacitor characterized by: connected through solder.
JP1458090A 1990-01-23 1990-01-23 Feed-through capacitor Pending JPH03218004A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1458090A JPH03218004A (en) 1990-01-23 1990-01-23 Feed-through capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1458090A JPH03218004A (en) 1990-01-23 1990-01-23 Feed-through capacitor

Publications (1)

Publication Number Publication Date
JPH03218004A true JPH03218004A (en) 1991-09-25

Family

ID=11865104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1458090A Pending JPH03218004A (en) 1990-01-23 1990-01-23 Feed-through capacitor

Country Status (1)

Country Link
JP (1) JPH03218004A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5440447A (en) * 1993-07-02 1995-08-08 The Morgan Crucible Company, Plc High temperature feed-through system and method for making same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819414B2 (en) * 1976-09-29 1983-04-18 日立造船株式会社 Electrolytic buffing processing equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819414B2 (en) * 1976-09-29 1983-04-18 日立造船株式会社 Electrolytic buffing processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5440447A (en) * 1993-07-02 1995-08-08 The Morgan Crucible Company, Plc High temperature feed-through system and method for making same

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