JPH03210982A - Hole processing method by laser - Google Patents

Abstract

PURPOSE:To improve the accuracy of out-of-roundness and to allow high-speed processing by positioning the center of a round hole to be bored in a plate material to the axial center of a rotary processing head, then executing drilling and the movement of the axial center in accordance with the on and off of the pulse command from an NC device. CONSTITUTION:The center of the round hole to be bored in the plate material W is positioned to the center of the optical axis of the rotary processing head 1 in the case of processing of a round hole in the plate material W by a laser beam LB. The rotary processing head 1 is thereafter rotated and the hole processing is executed by the laser beam LB from a laser oscillator 27 when the pulse command from the NC device 33 is on. The rotary processing head 1 is moved relative to the plate material W when the pulse command from the NC device is off. The center of the optical axis of the rotary processing head 1 is thereby moved to the center of the round hole to be bored in the plate material W. Many pieces of the same holes are bored by repeating the above-mentioned operation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser drilling method for drilling holes in a plate material using a rotary processing head.

(Prior art) Conventionally, when drilling a circular hole in a plate material using a laser processing machine, for example, a processing head that emits a laser beam toward the plate material is fixed, and the plate material or plate material clamped by a work clamp is fixed. The machining table mounted thereon was moved in the X and Y axes directions to drill holes in the plate material.

(Problems to be Solved by the Invention) By the way, in the conventional hole machining method described above, it takes a long time to call up and read a round hole cutting program, and it takes a long time to hold the hole for piercing because there are three positioning points in this cutting hole program. There is a time to open and close the shutter. Therefore, when machining a large number of round holes of the same size, the above-mentioned time is accumulated and the machining time becomes long.

Furthermore, in order to achieve high roundness accuracy, the machining speed had to be slowed down, making it impossible to perform high-speed machining.

The purpose of the present invention is to improve the above-mentioned problems, and the object of the present invention is to improve the accuracy of roundness, perform high-speed machining, and shorten the machining time when machining a large number of holes. Our goal is to provide the following.

[Structure of the Invention (Means for Solving the Problems)] In order to achieve the above object, the present invention uses a rotary processing head in which a nozzle equipped with a condensing lens is provided so as to be eccentrically adjustable with respect to a rotating member. When drilling holes in plate materials, NC
When the pulse command from the NC device is ON, the rotary processing head is rotated and holes are machined with a laser beam from the laser oscillator, and when the pulse command from the NC device is OFF, the rotary processing head is rotated against the plate material. This is a hole drilling method using a laser, which is performed by relatively moving the laser.

(Function) By adopting the laser hole drilling method of the present invention, when drilling a round hole in a plate material with a laser beam, the center of the round hole to be drilled in the plate material is positioned at the center of the optical axis of the rotary processing head. When the pulse command from the NC device is ON, the rotary machining head is rotated and holes are machined using a laser beam from a laser oscillator. Next, when the pulse command from the NC device is OFF, the rotary processing head is moved relative to the plate material, so that the center of the optical axis of the rotary processing head is moved to the center of the round hole drilled in the plate material. By repeating the above operations, a large number of identical holes are formed in the plate material.

Further, when changing the diameter of a round hole made in a plate material, this is done by adjusting the eccentricity of a nozzle with a biased condensing lens with respect to a rotating member.

(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.

Referring to FIG.
A hollow rotary shaft 7 serving as a rotary member is rotatably supported via the rotary member.

A motor base 9 is attached to the outer wall of the housing 3, and a rotation motor 11 for rotating the rotation shaft 7 is supported on the motor base 9.

A pulley 15 is fitted onto the output shaft 13 of this rotation motor 11. Further, another pulley 17 is fitted onto the outer circumference of the rotating shaft 7. A belt 19 is wound around this pulley 17 and the pulley 15.

With the above configuration, when the rotation motor 11 is driven, the pulley 15 is rotated via the output shaft 13. Pulley 15
The rotation of belt 19. It is transmitted to the rotating shaft 7 via the pulley 17.

An offset mechanism 21 is attached to the lower end of the rotating shaft 7, and a nozzle 25 having a condensing lens 23 inside is attached to the offset mechanism 21 so as to be adjustable in the left and right directions in FIG. An assist gas supply port 27 for supplying assist gas is provided in a part of one side wall of the nozzle 25 . The offset mechanism 2
1 may have a structure in which the position of the nozzle 25 equipped with the condensing lens 23 can be eccentrically adjusted in the left-right direction with respect to the optical axis, which is the axis 01 of the rotating shaft 7. For example, an adjustment plate may be provided inside. This is to move the nozzle 25.

The laser beam LB is oscillated by a laser oscillator 27, passes through the hollow of the rotating shaft 7, is focused on the condensing lens 23, and is irradiated toward the plate material W from the tip of the nozzle 25.

Therefore, by adjusting the offset mechanism 21, the center 02 of the laser beam LB irradiated toward the plate material W is offset by the eccentric amount δ with respect to the axis OI of the rotating shaft 7. Then, by irradiating the laser beam LB toward the plate material W and driving the rotation motor 11, the rotation shaft 7 is rotated.
When the laser beam LB is rotated, the laser beam LB traces an arcuate locus with a radius δ, so that a round hole is machined in the plate material W.

Although not shown, the plate material W is clamped by a work clamp, and is moved around the X-axis and Y-axis by the X-axis and Y-axis circumferential motors 29 and 31
It is designed to be moved in the Y-axis direction.

Rotation starter 11 for the rotary processing head 1. Plate material W to X
axis, X-axis for movement in the Y-axis direction.

NC device 33 that controls the Y-axis circumferential motors 29, 31 and the laser oscillator 27 for oscillating the laser beam LB
is provided. This NC device 33 is connected to the rotation motor 11 and also to the pulse distributor 35. This pulse distributor 35 includes the laser oscillator 27. It is connected to X-axis and Y-axis circumferential motors 29 and 31.

With the above configuration, as shown in FIG. 2(A),
For example, there is a round hole H in a plate W with a radius r.

When processing the round hole H2 and then laser processing the round hole H2,
First, when the NC device 33 is activated, a pulse signal is sent to the pulse distributor 35. The pulse signal is distributed by the pulse distributor 35, and as shown in FIG. 2(B), the X-axis is divided by the pulse OFF signal.

The Y-axis circumferential motors 29 and 31 are driven to position the center of the round hole H in which the round hole H1 is to be drilled to the axis 01 of the rotating shaft 7 of the rotary processing head 1. Next, the rotation motor 11 is driven by a rotation command from the NC device 33 to rotate the nozzle 25 once, and in synchronization with the rotation command, the pulse distributor 35 drives the nozzle 25 as shown in FIG. 2(B). , a pulsed ON signal is sent to the laser oscillator 27, and the laser beam LB oscillated by the laser oscillator 27 is irradiated onto the plate material W from the tip of the nozzle 25. Thus, the nozzle 25 is rotated at a radius of δ-r, thereby machining the round hole H.

When the drilling of the round hole H1 is completed, the pulse OFF signal from the pulse distributor 35 drives the X-axis and Y-axis circumferential motors 29 and 31, and the center of the round hole H2 to be drilled is then moved to the rotary processing head 1. The nozzle 25 is positioned at the axis 01 of the rotating shaft 7, and further, the laser oscillator 27 is oscillated by a pulse ON signal from the pulse distributor 35, and the nozzle 25 is rotated once by driving the rotation motor 11 in synchronization. Thus, the round hole H2 is machined.

In this manner, by repeating the above-described operations, it is possible to machine a large number of identical round holes each having a radius of r.

Also, when changing the radius of the round hole, the offset mechanism 21
By adjusting the above and performing other operations in the same manner as described above, it is possible to machine round holes with various radii.

In this example, when performing round hole machining, piercing and 3
Point positioning is not performed, the shutter of the laser oscillator 27 is not required, and the round holes H, , H2 can be machined by simply rotating the nozzle 25 once.

Therefore, machining time can be shortened, high-speed machining can be performed, and roundness accuracy can be improved.

Note that this invention is not limited to the embodiments described above, and can be implemented in other ways by making appropriate changes. In this embodiment, an example was explained in which the plate material W is moved in the X-axis and Y-axis directions, but the plate material W is placed on a processing table and the processing table is moved in the X-axis and Y-axis directions, or the plate material W is moved in the processing table. It is also possible to place the rotary processing head on top and move the rotary processing head in the X-axis and Y-axis directions.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, when drilling a round hole in a plate material using a laser beam, the center of the round hole to be drilled in the plate material is aligned with the rotary processing head. After positioning at the axis center, the pulse command from the NC device is turned on.
At this time, the rotary processing head is rotated and the hole is processed using a laser beam from a laser oscillator. Then,
By moving the rotary processing head relative to the plate material when the pulse command from the NC device is OFF, the axis of the rotary processing head is moved to the center of the round hole drilled in the plate material. By repeating the above operations, a large number of identical holes are formed in the plate material.

Furthermore, when changing the diameter of a round hole made in a plate material, this is done by adjusting the eccentricity of a nozzle equipped with a condensing lens with respect to a rotating member.

Therefore, when machining round holes, pierce machining and 3
Point positioning is not performed, and the process can be performed without requiring a shutter of a laser oscillator, and furthermore, round holes can be processed with just one rotation of the nozzle. As a result, machining time can be shortened, high-speed machining can be performed, and roundness accuracy can be improved.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram schematically showing a laser processing apparatus for carrying out the method of the present invention, and FIGS. 2 (A) and (B) are explanatory diagrams for machining a round hole in a plate material by the method of the present invention. It is. 1... Rotary processing head 7... Rotating shaft 11... Rotating motor

Claims (1)

[Claims] When drilling a hole in a plate material using a rotary processing head in which a nozzle equipped with a condensing lens is installed so that its eccentricity can be freely adjusted with respect to a rotating member, the rotary processing head is rotated when a pulse command from the NC device is ON. a laser beam from a laser oscillator, and moves the rotary processing head relative to the plate material when a pulse command from the NC device is OFF. .