JPH03209727A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH03209727A JPH03209727A JP474490A JP474490A JPH03209727A JP H03209727 A JPH03209727 A JP H03209727A JP 474490 A JP474490 A JP 474490A JP 474490 A JP474490 A JP 474490A JP H03209727 A JPH03209727 A JP H03209727A
- Authority
- JP
- Japan
- Prior art keywords
- collector
- emitter
- base
- electrode
- diffused
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体装置に関し、特にラテラルPNPトラ
ンジスタ(以下ラテラルPNPTrと呼ぶ)の構造を改
良した半導体装置を提供するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and in particular provides a semiconductor device with an improved structure of a lateral PNP transistor (hereinafter referred to as lateral PNPTr).
第4図、第5図は従来の半導体装置のベース・コレクタ
をショートしたラテラルPNPTrで構成した第3図に
示すダイオードの構造を示す平面図および断面図で、図
において、(1)はカソード電極、(2)はアノード電
極、(8)は分離拡散、(4)はベース拡lk、(5)
はコレクタ電極用コンタクト部、(6)はベース拡散(
4)と同じベース拡散、(γ)はエミッタ電極用コンタ
クト部、(8)はエミッタ拡散、(9)はベース電極用
フンタクト部s (10)は酸化膜、(11)はN型
埋込層、(12)はP型基板、 (13)はエピタキシ
ャル層である。4 and 5 are a plan view and a cross-sectional view showing the structure of the diode shown in FIG. 3, which is composed of a lateral PNPTr with the base and collector of the conventional semiconductor device shorted. In the figure, (1) is the cathode electrode. , (2) is the anode electrode, (8) is the separation diffusion, (4) is the base expansion lk, (5)
(6) is the base diffusion (
Same base diffusion as in 4), (γ) is the contact part for the emitter electrode, (8) is the emitter diffusion, (9) is the contact part for the base electrode, (10) is the oxide film, and (11) is the N-type buried layer. , (12) is a P-type substrate, and (13) is an epitaxial layer.
次に動作について説明する。Next, the operation will be explained.
一般に、パイポーラエCに使用されているダイオードは
数種類あるが、ラテラルPNPTrのベース・コレクタ
をショートしてカソードとし、エミッタをアノードとし
たダイオードは高耐圧用として使用される。Generally, there are several types of diodes used in Pipolar E-C, but a diode with a lateral PNPTr whose base and collector are short-circuited to serve as a cathode and whose emitter is an anode is used for high breakdown voltage.
従来の半導体装置のベース・コレクタをショートしたラ
テラルPNPThで構成したダイオードは第4図および
第5図の様な構造をしているので、逆バイアス電圧が大
きくなると第6図に示すように、アノード電極(2)下
のベース拡散(4)間にチャネル(141が発生する。A diode composed of a lateral PNPTh whose base and collector are shorted in a conventional semiconductor device has a structure as shown in Figs. 4 and 5, so when the reverse bias voltage increases, the anode A channel (141) occurs between the base diffusions (4) under the electrode (2).
逆バイアスが大きくなるということは低電位側のアルミ
(アノード端子)(2)と高電位側のエピタキシャル層
0が酸化膜(至)を絶縁層としたコンデンサとなるので
、エピタキシャル層(13のP型キャリアが81表面に
吸い寄せられ、P型キャリアが貯るとチャネルα4とな
シベース拡散(4)のPからベース拡散(6)のPへリ
ークする。よってカソードからアノードにリークし易く
なるという問題点があった。An increase in reverse bias means that the aluminum (anode terminal) on the low potential side (2) and the epitaxial layer 0 on the high potential side form a capacitor with an oxide film (to) as an insulating layer. When type carriers are attracted to the surface of 81 and P type carriers are accumulated, they leak from the P of the base diffusion (4) to the P of the base diffusion (6) in the channel α4.Therefore, the problem is that they tend to leak from the cathode to the anode. There was a point.
この発明は上記の様な問題点を解消するためになされた
もので、チャネルが発生しにくい構造のベースコレクタ
をショートしたラテラルPNPTrで構成し次ダイオー
ドの半導体装置を得ることを目的とするう
〔課題を解決するための手段〕
この発明に係る半導体装置は、アノード電極のアルミ配
線下にコレクタ部のP型拡散を設けない構造にしたもの
である。This invention was made in order to solve the above-mentioned problems, and the object is to obtain a diode semiconductor device by constructing a lateral PNPTr with a short-circuited base collector, which has a structure in which channel formation is difficult. Means for Solving the Problems] A semiconductor device according to the present invention has a structure in which a P-type diffusion of the collector portion is not provided under the aluminum wiring of the anode electrode.
この発明における半導体装置は、アノード電極のアルミ
配線下にコレクタ部のP型拡散を設けない構造としたの
で、エミッターコレクタ間(ベース拡散間)にチャネル
が発生しにくくなり、従来のものよυ高耐圧のダイオー
ドが得られる。The semiconductor device of this invention has a structure in which no P-type diffusion is provided in the collector section under the aluminum wiring of the anode electrode, so a channel is less likely to occur between the emitter and the collector (between the base diffusion), and the υ is higher than that of the conventional device. A diode with high voltage resistance can be obtained.
以下、この発明の一実施例を図について説明する。第1
図・第2図は本発明の一実施例によるベース・コレクタ
をショートしたラテラルPNPTrで構成したダイオー
ドを示す平面図および断面図であシ、図において、図中
符号(1)〜α3は前記従来のものと同−又は相当部分
で、以下説明は省略する。An embodiment of the present invention will be described below with reference to the drawings. 1st
FIG. 2 is a plan view and a sectional view showing a diode constituted by a lateral PNPTr with a short-circuited base and collector according to an embodiment of the present invention. This is the same or equivalent part to that of , and the explanation thereof will be omitted below.
本実施例においてはアノード電極(2)のアルミ配線下
のコレクタ部のP型拡散を設けないようにしたので、エ
ミッターコレクタ間(ベース拡散間)にチャネルα滲は
発生しにくい。In this embodiment, since no P-type diffusion is provided in the collector portion under the aluminum wiring of the anode electrode (2), channel α leakage is unlikely to occur between the emitter and collector (between the base diffusion).
以上のようにこの発明によれば、アノード電極のアルミ
配線下にコレクタ部のP型拡散を設けない構造としたの
で、エミッターコレクタ間(ベース拡散間)にチャネル
が発生しにくくなり、従来のものよシ高耐圧の半導体装
置(ダイオード)が得られる効果がある。As described above, according to the present invention, since the structure is such that no P-type diffusion in the collector part is provided under the aluminum wiring of the anode electrode, a channel is less likely to occur between the emitter and the collector (between the base diffusion), and compared to the conventional one. This has the effect of providing a semiconductor device (diode) with a much higher breakdown voltage.
第1図、第2図はこの発明の一実施例による半導体装置
を示す平面図および第1図のト」線断面図、第3図はP
NPTrのベース・コレクタをショートしたダイオード
の説明図、第4図、第5図は従来の半導体装置を示す平
面図および第4図の■−V線断面図、第6図は第5図の
一部を拡大してチャネルの発生部を示す説明図である。
図において、(1)はカソード電極、(2)はアノード
電極、(8)は分離拡散、(4)はベース拡散(コレク
タ用)、(5)はコレクタ電極用コンタクト部、(6)
はベース拡散(エミッタ用)、(γ)はエミッタ電極用
コンタクト部、(8)はエミッタ拡散、(9)はベース
電極用コンタクト部、(10)は酸化膜、(11)はN
型埋込層、(12)はP型基板、(13)はエピタキシ
ャル層を示す。
々お、図中、同一符号は同一 又は相当部分を示す。
代
理
人
大
岩
増
雄
第1図
第2図
第3図
第4図1 and 2 are a plan view showing a semiconductor device according to an embodiment of the present invention, and a sectional view taken along the line T in FIG.
An explanatory diagram of a diode in which the base and collector of the NPTr are short-circuited. FIGS. 4 and 5 are a plan view showing a conventional semiconductor device and a sectional view taken along the line ■-V in FIG. 4. FIG. FIG. 2 is an explanatory diagram showing a channel generation part in an enlarged manner. In the figure, (1) is the cathode electrode, (2) is the anode electrode, (8) is the separation diffusion, (4) is the base diffusion (for collector), (5) is the contact part for the collector electrode, (6)
is the base diffusion (for emitter), (γ) is the contact part for the emitter electrode, (8) is the emitter diffusion, (9) is the contact part for the base electrode, (10) is the oxide film, (11) is the N
A type buried layer, (12) a P-type substrate, and (13) an epitaxial layer. In the figures, the same symbols indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
ョートし、そのショートした端子とエミッタでダイオー
ドを構成する半導体装置において、アノード電極のアル
ミ配線下にコレクタ部のP型拡散を設けないようにした
ことを特徴とする半導体装置。A semiconductor device in which the base and collector of a lateral PNP transistor are short-circuited and the short-circuited terminal and emitter constitute a diode, characterized in that a P-type diffusion in the collector portion is not provided under the aluminum wiring of the anode electrode. Semiconductor equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP474490A JPH03209727A (en) | 1990-01-11 | 1990-01-11 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP474490A JPH03209727A (en) | 1990-01-11 | 1990-01-11 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03209727A true JPH03209727A (en) | 1991-09-12 |
Family
ID=11592424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP474490A Pending JPH03209727A (en) | 1990-01-11 | 1990-01-11 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03209727A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01274469A (en) * | 1988-04-26 | 1989-11-02 | Fuji Electric Co Ltd | diode |
-
1990
- 1990-01-11 JP JP474490A patent/JPH03209727A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01274469A (en) * | 1988-04-26 | 1989-11-02 | Fuji Electric Co Ltd | diode |
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