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JPH03205815A - Variable fairing diaphragm - Google Patents

Variable fairing diaphragm

Info

Publication number
JPH03205815A
JPH03205815A JP67690A JP67690A JPH03205815A JP H03205815 A JPH03205815 A JP H03205815A JP 67690 A JP67690 A JP 67690A JP 67690 A JP67690 A JP 67690A JP H03205815 A JPH03205815 A JP H03205815A
Authority
JP
Japan
Prior art keywords
shaping
diaphragm
shaping diaphragm
electron beam
variable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP67690A
Other languages
Japanese (ja)
Inventor
Katsuhiro Kuroda
勝広 黒田
Hideo Todokoro
秀男 戸所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP67690A priority Critical patent/JPH03205815A/en
Publication of JPH03205815A publication Critical patent/JPH03205815A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial application field]

本発明は、電子線描画装置に係り、特に多層配線に用い
る配線基板の高密度化、高速描画化に好適な可変整形絞
りに関する。
The present invention relates to an electron beam lithography system, and more particularly to a variable shaping aperture suitable for increasing the density and speed of lithography of a wiring board used for multilayer wiring.

【従来の技術】[Conventional technology]

電子線描両装置の高速描画化のために可変整形描画法は
広く用いられており,すでにLSI製造のりソグラフィ
技術として不可欠なものになっている。このような状況
のもとに、可変整形描画技術は任意図形の微細描画化を
目指して追求されてきた。一方、大型計算機の心臓部に
,セラミック配線基盤上にLSIチップを搭載させたモ
ジュールがある.この多層配線基盤のパターンも徐々に
微細化されてきたために、このパターンニングも従来の
光学方式に代わって,電子線描画装置で行ないたいとい
う要求が生じてきた。この場合、従来のLSI描画に比
べて線幅はほぼ一定であるが任意方向に描画したいとい
う要求がより強くなってきた. このような要求に対して、第4図(a).(b)に示し
たような開口を有する絞りの組み合わせによる従来の可
変整形絞りでは、同図(C)のようなパターン10を描
画しようとすると、分割数が多くなって、描画に長時間
を要するという問題があった。 なお、本発明に関連する従来技術として、特開昭53−
148980、特開平1−112729などが挙げられ
る。
The variable shape lithography method is widely used for high-speed lithography in electron beam lithography equipment, and has already become an indispensable lithography technology for LSI manufacturing. Under these circumstances, variable shaping drawing technology has been pursued with the aim of finer drawing of arbitrary figures. On the other hand, at the heart of large computers is a module with an LSI chip mounted on a ceramic wiring board. As the patterns of this multilayer wiring board have gradually become finer, there has been a demand for patterning to be performed using an electron beam lithography system instead of the conventional optical method. In this case, compared to conventional LSI drawing, there has been a stronger demand for drawing in an arbitrary direction, although the line width is almost constant. In response to such a request, the method shown in FIG. 4(a). With a conventional variable shaping diaphragm that uses a combination of diaphragms having apertures as shown in (b), when attempting to draw pattern 10 as shown in (C) of the same figure, the number of divisions increases and it takes a long time to draw. There was a problem that it was necessary. In addition, as a prior art related to the present invention, Japanese Unexamined Patent Application Publication No. 1987-
148980, JP-A-1-112729, and the like.

【発明が解決しようとする課題】[Problem to be solved by the invention]

本発明の目的は、任意の図形描画において、単位パター
ンの分割数を少なくして,高速描画可能な整形絞りを提
供することである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a shaping aperture that can reduce the number of divisions of a unit pattern in drawing an arbitrary figure at high speed.

【課題を解決するための手段】[Means to solve the problem]

上記問題点を解決するためには、整形絞りの開口パター
ンとして、任意方向の線パターンをできるだけ少ない分
割数で表現するための基本図形を与えればよい。このよ
うな図形は基本的には多角形である。したがって、2個
の絞りを用いてこの基本図形を表現し、かつそれらを接
続して任意方向の線パターンを表現するようにすれば,
上記問題は解決できる.
In order to solve the above problem, it is sufficient to provide a basic figure for expressing a line pattern in an arbitrary direction with as few divisions as possible as the aperture pattern of the shaping diaphragm. Such figures are basically polygons. Therefore, if you express this basic figure using two apertures and connect them to express a line pattern in any direction,
The above problem can be solved.

【作用】[Effect]

いま、基本図形を第2図(a)に示すような正8角形と
して考える。この基本図形を用いて、たとえば任意角度
に傾斜している線パターンを描画することを考えると、
第2図(b)のように連続させることによって描画でき
る。本基本図形の場合,45゜以外の傾斜パターンでは
パターンの周辺部での直線性は悪いが、レジストの近接
効果によりスムージングされ,より滑らかになる。また
、本発明の主たる対象である多層配線基盤のようなもの
では、多少の凹凸はほとんど問題にならない。 この描画方式を実現するための整形絞りは、第2図a)
に示すようなもので容易に実現できる。ここで、同一パ
ターンを従来の方式で実現するためには、第4図b)に
示すようなものとなる6両者を比較すれば、本発明の方
式のほうが明らかに分割数が少ないことが分かる。すな
わち、本発明は従来より高速描画に適したものである。
Now, consider the basic figure as a regular octagon as shown in FIG. 2(a). For example, if we consider drawing a line pattern tilted at an arbitrary angle using this basic figure,
It can be drawn by making them continuous as shown in FIG. 2(b). In the case of this basic figure, the linearity at the periphery of the pattern is poor in an inclined pattern other than 45 degrees, but it is smoothed by the proximity effect of the resist and becomes smoother. Further, in the case of a multilayer wiring board, which is the main object of the present invention, some unevenness hardly poses a problem. The shaping aperture to realize this drawing method is shown in Figure 2 a)
This can be easily achieved using something like the one shown in the figure. Here, in order to realize the same pattern using the conventional method, it would be as shown in Figure 4 b) 6 Comparing the two, it can be seen that the method of the present invention clearly requires fewer divisions. . That is, the present invention is more suitable for high-speed drawing than the conventional art.

【実施例】【Example】

以下、本発明の実施例を説明する. 第1図は本発明の一実施例になる電子線描画装置の概略
縦断面図である。電子銃1からでた電子線2は、第1整
形絞り11により整形されたのち投射レンズ3により第
2整形絞り12上に投影される.この時、整形偏向器6
により電子線2は偏向されて,所望の整形電子線が第2
整形絞り12より出てくる.この電子線は縮小レンズ4
、対物レンズ5により試料9上に投影される.この時、
偏向器8により所望の位置に偏向される.また、電子線
2のオン、オフはプラン力−7により行われる。 ここで、本実施例で用いた整形絞りは第2図(a)に示
したものである.すなわち、第1整形絞り11は正8角
形を用い、第2整形絞り12は第1整形絞りの形状が周
辺にあるものである.正確には、第2絞りの中心は第1
絞りが入る十分な大きさをもち,周辺には第1絞りの形
状を4分割して各々を点対称に移動させた形状のもので
ある.このような整形絞りを用いれば、整形偏向器6を
動作させることによって第2図b)に示すように比較的
少ない分割数で任意方向に接続していくことが可能とな
る。 第2図a)の実施例はごく一例であり,本発明の本質を
損なうことなく本発明を実施するためには、第1絞りを
正4n(=1.2、……)角形で構成しておけばよい。 特に、n=のは円として考えられ、第3図に示しておく
.このような絞りで形成された整形電子線は同図に示す
ように任意方向に接続することが可能となる. なお、第1図の電子光学系は、可変整形電子線を実現で
きる基本的な構成を示したもので、本構成のものに限る
ことなく本発明を実施できることはいうまでもない。
Examples of the present invention will be described below. FIG. 1 is a schematic vertical sectional view of an electron beam lithography apparatus according to an embodiment of the present invention. The electron beam 2 emitted from the electron gun 1 is shaped by a first shaping aperture 11 and then projected onto a second shaping aperture 12 by a projection lens 3. At this time, the shaping deflector 6
The electron beam 2 is deflected by the
It comes out from the shaping aperture 12. This electron beam is transmitted through the reduction lens 4
, projected onto the sample 9 by the objective lens 5. At this time,
It is deflected to a desired position by a deflector 8. Further, the electron beam 2 is turned on and off by the plan force -7. The shaping aperture used in this example is shown in FIG. 2(a). That is, the first shaping aperture 11 is a regular octagon, and the second shaping aperture 12 has a shape similar to that of the first shaping aperture. To be precise, the center of the second aperture is the center of the first aperture.
It is large enough to accommodate a diaphragm, and the shape of the first diaphragm is divided into four parts around the periphery, and each part is moved point-symmetrically. If such a shaping aperture is used, by operating the shaping deflector 6, it becomes possible to connect in any direction with a relatively small number of divisions, as shown in FIG. 2b). The embodiment shown in Fig. 2 a) is just one example, and in order to carry out the present invention without impairing the essence of the present invention, the first diaphragm should be configured with a regular 4n (=1.2,...) square shape. Just leave it there. In particular, n= can be considered as a circle and is shown in Figure 3. The shaped electron beam formed by such an aperture can be connected in any direction as shown in the figure. Note that the electron optical system shown in FIG. 1 shows a basic configuration that can realize a variable shaping electron beam, and it goes without saying that the present invention can be practiced without being limited to this configuration.

【発明の効果】【Effect of the invention】

以上述べたごとく、本発明によればパターンの分割数を
少なくして描画することができるので,描画時間を短縮
できる効果がある.特に、多層配線基盤のように配線パ
ターンの線幅がほぼ一定であるが任意方向にあるような
パターン描画には,その効果は絶大である。
As described above, according to the present invention, it is possible to draw a pattern by reducing the number of divisions, which has the effect of shortening the drawing time. This is particularly effective for drawing patterns such as multilayer wiring boards in which the line width of the wiring pattern is approximately constant but in any direction.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例になる電子線描画装置の電子
光学系の基本構成を示す縦断面図、第2図は本発明の一
実施例の整形絞りの平面図及びそれを用いた電子線描画
方法の説明図、第3図は本発明の他の実施例の整形絞り
の平面図、第4図は従来の整形絞りの平面図およびそれ
を用いた電子線描画の説明図である。 符号の説明 1・・・電子銃、2・・・電子線、3・・・投射レンズ
、4・・・縮小レンズ、5・・・対物レンズ、6・・・
整形偏向器、7・・・プランカー、8・・・偏向器、9
・・・試料.10・・・所望の描画パターン、11・・
・第1整形絞り、12不 1 図 第 2 図 (久) (?)
FIG. 1 is a longitudinal cross-sectional view showing the basic configuration of an electron optical system of an electron beam lithography apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of a shaping aperture according to an embodiment of the present invention and a diagram using the same. An explanatory diagram of an electron beam lithography method, FIG. 3 is a plan view of a shaping aperture according to another embodiment of the present invention, and FIG. 4 is a plan view of a conventional shaping aperture and an explanatory diagram of electron beam lithography using the same. . Explanation of symbols 1...electron gun, 2...electron beam, 3...projection lens, 4...reducing lens, 5...objective lens, 6...
Shaping deflector, 7... Plunker, 8... Deflector, 9
···sample. 10... Desired drawing pattern, 11...
・First shaping aperture, 12-1 Fig. 2 (Ku) (?)

Claims (1)

【特許請求の範囲】 1、第1整形絞りを第2整形絞り上に投影して所望の整
形電子線を得て描画する電子線描画装置において、該第
1整形絞りは正4n(=1、2、……)角形で構成し、
該第2整形絞りの中心は第1整形絞りの投影パターンが
入る十分な大きさを有し、周辺には第1整形絞りの形状
を4分割して各々を点対称に移動させた形状のものであ
ることを特徴とする可変整形絞り。 2、上記nを2、すなわち第1整形絞りを正8角形とし
たことを特徴とする請求項1記載の可変整形絞り。 3、上記nを無限大、すなわち第1整形絞りを円形とし
たことを特徴とする請求項1記載の可変整形絞り。 4、請求項1から3記載のいずれかの可変整形絞りを用
いたことを特徴とする電子線描画装置。
[Claims] 1. In an electron beam lithography device that projects a first shaping diaphragm onto a second shaping diaphragm to obtain a desired shaped electron beam for drawing, the first shaping diaphragm has a positive 4n (=1, 2,...) composed of squares,
The center of the second shaping diaphragm has a sufficient size to accommodate the projection pattern of the first shaping diaphragm, and the periphery has a shape in which the shape of the first shaping diaphragm is divided into four parts and each part is moved point-symmetrically. A variable shaping diaphragm characterized by: 2. The variable shaping diaphragm according to claim 1, wherein n is 2, that is, the first shaping diaphragm is a regular octagon. 3. The variable shaping diaphragm according to claim 1, wherein n is infinity, that is, the first shaping diaphragm is circular. 4. An electron beam lithography apparatus characterized by using the variable shaping aperture according to any one of claims 1 to 3.
JP67690A 1990-01-08 1990-01-08 Variable fairing diaphragm Pending JPH03205815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP67690A JPH03205815A (en) 1990-01-08 1990-01-08 Variable fairing diaphragm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP67690A JPH03205815A (en) 1990-01-08 1990-01-08 Variable fairing diaphragm

Publications (1)

Publication Number Publication Date
JPH03205815A true JPH03205815A (en) 1991-09-09

Family

ID=11480352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP67690A Pending JPH03205815A (en) 1990-01-08 1990-01-08 Variable fairing diaphragm

Country Status (1)

Country Link
JP (1) JPH03205815A (en)

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US9400857B2 (en) 2011-09-19 2016-07-26 D2S, Inc. Method and system for forming patterns using charged particle beam lithography
US10031413B2 (en) 2011-09-19 2018-07-24 D2S, Inc. Method and system for forming patterns using charged particle beam lithography
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US9859100B2 (en) 2012-04-18 2018-01-02 D2S, Inc. Method and system for dimensional uniformity using charged particle beam lithography
US9343267B2 (en) 2012-04-18 2016-05-17 D2S, Inc. Method and system for dimensional uniformity using charged particle beam lithography
US10431422B2 (en) 2012-04-18 2019-10-01 D2S, Inc. Method and system for dimensional uniformity using charged particle beam lithography
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US8984451B2 (en) 2013-02-22 2015-03-17 Aselta Nanographics Free form fracturing method for electronic or optical lithography
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