JPH03197025A - Heat joining of phenolic resin pipe and joint - Google Patents
Heat joining of phenolic resin pipe and jointInfo
- Publication number
- JPH03197025A JPH03197025A JP33481989A JP33481989A JPH03197025A JP H03197025 A JPH03197025 A JP H03197025A JP 33481989 A JP33481989 A JP 33481989A JP 33481989 A JP33481989 A JP 33481989A JP H03197025 A JPH03197025 A JP H03197025A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- pipe
- temp
- joint
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 7
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 7
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 18
- 230000001070 adhesive effect Effects 0.000 abstract description 18
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229920006332 epoxy adhesive Polymers 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔従来の技術と問題点〕
フェノール樹脂製パイプとその継手類の接合においては
、常温硬化型の２液性工ポキシ系接着剤が適当とされて
いる。接着剤塗布後十分な接着強度を得るためには１日
以上常温での放置が必要である。このように長時間を要
する接合作業はフェノール樹脂製パイプの利用上大きな
障害となっていた。DETAILED DESCRIPTION OF THE INVENTION [Prior Art and Problems] For joining phenolic resin pipes and their joints, a two-component poxy-based adhesive that cures at room temperature is considered appropriate. After applying the adhesive, it is necessary to leave it at room temperature for one day or more in order to obtain sufficient adhesive strength. This long time-consuming joining operation has been a major obstacle to the use of phenolic resin pipes.
接合作業の時間を短くするには、接着剤の硬化時間を短
くすることが必要である。一般にエポキシ樹脂は加熱に
より硬化反応が促進されることが知られているが、これ
まで知られているプラスチック製パイプでは８０℃程度
までの加熱でもパイプ自体が変形をきたすため、常温で
の接合以外にはエポキシ樹脂系接着剤による接着接合は
応用されていない、しかるに、本発明における対象であ
るフェノール樹脂製パイプは、熱間での剛性に優れ、２
００°Ｃまでの加熱では変形するごともない。In order to shorten the time required for bonding work, it is necessary to shorten the curing time of the adhesive. It is generally known that the curing reaction of epoxy resins is accelerated by heating, but with conventional plastic pipes, the pipe itself deforms even when heated up to about 80 degrees Celsius, so joining at room temperature is not possible. Adhesive bonding using epoxy resin adhesives has not been applied to phenolic resin pipes.However, the phenolic resin pipes that are the subject of the present invention have excellent hot rigidity and
No deformation occurs when heated to 00°C.
本発明者等はこの特徴に着目し、接着面の加熱温度と接
着強度の関連について鋭意研究の結果、本発明の方法に
到達した。The present inventors focused on this feature, and as a result of intensive research on the relationship between the heating temperature of the bonding surface and the adhesive strength, they arrived at the method of the present invention.
すなわち、接着面の平均温度が９０°Ｃ以上であればエ
ポキシ樹脂系接着剤の硬化を効果的に促進できる。９０
°Ｃに近い比較的低温よりの加熱では、約９分間の保持
時間で、また１３０″Ｃに近い加熱では約６分間の保持
時間で、さらに２００℃に近い高温側での加熱では約４
分間の保持時間で接合に十分な強度を得ることができる
。９０°Ｃ未満の加熱でも常温での接着時間に比べて著
しい時間の短縮になるが加熱操作を付加するに値する効
果であるかという点で疑問がある。２００℃を超える加
熱はパイプ損傷の恐れがあり、また時間短縮の効果も小
さいので好ましくない。That is, if the average temperature of the adhesive surface is 90° C. or higher, curing of the epoxy resin adhesive can be effectively promoted. 90
Heating to a relatively low temperature close to 130°C requires a holding time of approximately 9 minutes, heating to a temperature close to 130"C requires a holding time of approximately 6 minutes, and heating to a high temperature close to 200°C requires a holding time of approximately 4 minutes.
Sufficient strength for bonding can be obtained with a holding time of 1 minute. Although heating to less than 90° C. significantly shortens the bonding time compared to the bonding time at room temperature, it is questionable whether the effect is worth adding the heating operation. Heating above 200° C. is not preferable because there is a risk of pipe damage and the time saving effect is small.
加熱方法の一例を図により説明する。An example of the heating method will be explained using figures.
図１において、パイプ■と継手■との接着剤塗布面（接
着面）■に２液性工ポキシ系接着剤を塗布し、しかる後
、加熱媒体■を用いて接着面の平均温度が９０〜２００
°Ｃになるように加熱し、４〜９分間保持させる。加熱
媒体としては、接着面の平均温度を９０〜２００°Ｃに
できるものであれば使用可能だが、例えば電気ヒーター
、直火バーナーなどがある。直火バーナーの場合は表面
温度を監視し、バーナーとパイプの間隔を調節すること
でパイプ表面の劣化を防止することが必要である。In Figure 1, a two-component engineered poxy adhesive is applied to the adhesive-applied surface (adhesive surface) ■ of the pipe ■ and the fitting ■, and then the average temperature of the adhesive surface is raised to 90~90°C using a heating medium ■. 200
Heat to °C and hold for 4-9 minutes. Any heating medium that can raise the average temperature of the adhesive surface to 90 to 200°C can be used, such as an electric heater or an open flame burner. In the case of open flame burners, it is necessary to monitor the surface temperature and adjust the distance between the burner and the pipe to prevent deterioration of the pipe surface.
このようにしてえられた接合部は、従来のもの接着剤塗
布後、常温で１日以上放置したものに比して、同等以上
の強度を有しており、かつ、短詩図１はフェノール樹脂
製パイプとその継手類の接合部を示し、■はパイプ、■
は継手、■は接着剤塗布面（接着面）、■は加熱媒体を
それぞれ示す。The joints obtained in this way have a strength equal to or higher than that of conventional joints that are left at room temperature for one day or more after application of adhesive. The joints of manufactured pipes and their fittings are shown, ■ indicates pipe, ■
2 indicates a joint, 2 indicates an adhesive coated surface (adhesive surface), and 2 indicates a heating medium.
Claims (1)
用いる接着接合において、接着面の平均温度が９０〜２
００℃になるように加熱し、４〜９分間保持することを
特徴とする加熱接合方法。In adhesive bonding of phenolic resin pipes and their fittings using epoxy resin, the average temperature of the bonding surface is 90 to 2.
A heating bonding method characterized by heating to 00°C and holding for 4 to 9 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33481989A JPH03197025A (en) | 1989-12-26 | 1989-12-26 | Heat joining of phenolic resin pipe and joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33481989A JPH03197025A (en) | 1989-12-26 | 1989-12-26 | Heat joining of phenolic resin pipe and joint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03197025A true JPH03197025A (en) | 1991-08-28 |
Family
ID=18281571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33481989A Pending JPH03197025A (en) | 1989-12-26 | 1989-12-26 | Heat joining of phenolic resin pipe and joint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03197025A (en) |
-
1989
- 1989-12-26 JP JP33481989A patent/JPH03197025A/en active Pending
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