JPH03196693A - Manufacture of resistor and conductor of printed wiring board by replication - Google Patents
Manufacture of resistor and conductor of printed wiring board by replicationInfo
- Publication number
- JPH03196693A JPH03196693A JP33719589A JP33719589A JPH03196693A JP H03196693 A JPH03196693 A JP H03196693A JP 33719589 A JP33719589 A JP 33719589A JP 33719589 A JP33719589 A JP 33719589A JP H03196693 A JPH03196693 A JP H03196693A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- conductor
- printed wiring
- wiring board
- jumper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 230000010076 replication Effects 0.000 title 1
- 238000000034 method Methods 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 claims description 7
- 239000003989 dielectric material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産」ＬＥ＠利」ｂ辷１
本発明はプリント配線板上に抵抗体・ジャンパー導体を
形成する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming resistors and jumper conductors on a printed wiring board.
従米坐肢血
従来、プリント配線板上に抵抗体又はジャンパー導体を
形成するには抵抗体ペースト又は導体ペーストをスクリ
ーン印刷によってパターンを形成し、ｆＪ！化して製造
された。Traditionally, to form a resistor or jumper conductor on a printed wiring board, a resistor paste or conductor paste is screen printed to form a pattern, and fJ! It was manufactured by converting it into
よ１と る
しかし、従来のスクリーン印刷による製造方法では、抵
抗体に関しては、印刷のにじみやばらつきによって精度
が悪く、所要の抵抗値を得るためにトリミング等を行う
必要が生じ、原価、工数共に高価になる。更に、ジャン
パー導体に関しては断線、短絡等を生じ歩留りが悪い。However, in the conventional manufacturing method using screen printing, the accuracy of resistors is poor due to bleeding and unevenness in printing, and trimming, etc., are required to obtain the desired resistance value, which increases both cost and man-hours. Becomes expensive. Furthermore, jumper conductors cause disconnections, short circuits, etc., resulting in poor yield.
本発明の目的はプリント配線板上の抵抗体・導体の転写
法による製造方法を提供して上述の問題点を解決するに
ある。An object of the present invention is to solve the above-mentioned problems by providing a method for manufacturing resistors and conductors on a printed wiring board by a transfer method.
゛ るための
上述の課題を解決するための本発明によるブリント配線
板上に抵抗体・導体の転写法による製造方法は、プリン
ト配線板上に抵抗体・ジャンパー導体を形成するために
、所要の寸法、膜厚とした抵抗体・導体材料をベースフ
ィルムに塗布し、ベースフィルムをプリント配線板に転
写して抵抗体・ジャンパー導体をプリント配線板上に形
成して成る。In order to solve the above-mentioned problems in order to form a resistor/jumper conductor on a printed wiring board, the manufacturing method according to the present invention uses a transfer method for resistors/conductors on a printed wiring board. A resistor/conductor material with a certain size and film thickness is applied to a base film, and the base film is transferred to a printed wiring board to form a resistor/jumper conductor on the printed wiring board.
本発明の好適な実施例によって、抵抗体・導体材料を共
に同じベースフィルムに塗布する。According to a preferred embodiment of the invention, both resistor and conductor materials are applied to the same base film.
他の実施例によって、ベースフィルム上に誘電体材料と
導体材料を塗布してコンデンサ等のチップを形成する。In other embodiments, a dielectric material and a conductive material are coated on a base film to form a chip such as a capacitor.
１里
上述の本発明の構成によって、従来のスクリーン印刷に
よる抵抗体の抵抗値の修正、導体の断線短絡等の欠点の
生ずることはなく、簡単安価に抵抗体・ジャンパー導体
を形成できる。With the configuration of the present invention as described above, resistors and jumper conductors can be formed easily and inexpensively without the disadvantages of modifying the resistance value of the resistor by conventional screen printing, disconnection and short-circuiting of the conductor, etc.
更に、抵抗体とジャンパー導体とを同じベースフィルム
上に形成して転写でき、従来の２回のスクリーン印刷の
手数を１回にできる。Furthermore, the resistor and the jumper conductor can be formed and transferred onto the same base film, and the conventional two screen printing steps can be reduced to one.
更に、従来ははんだ付としたコンデンサ等のチップを転
写法によって形成できる。Furthermore, chips such as capacitors, which were conventionally soldered, can be formed by the transfer method.
実１皿
本発明を例示とした実施例並びに図面について説明する
。Embodiments and drawings illustrating the present invention will be described.
第１図は本発明の実施例を示し、絶縁基板１上に＃ｉＩ
箔による回路２を形成し、アンダーコート３をスクリー
ン印刷等によって塗布する。所要の抵抗体又は導体４を
転写法によって形成する。転写法は次の通りである。FIG. 1 shows an embodiment of the present invention, in which #iI is placed on an insulating substrate 1.
A circuit 2 made of foil is formed, and an undercoat 3 is applied by screen printing or the like. A required resistor or conductor 4 is formed by a transfer method. The transfer method is as follows.
プラスチック又は金属製のシート上に感光性の導体（抵
抗体）ペーストを塗布し、仮乾燥して導体（抵抗体）シ
ートを製造する。このシートをマスキングフィルムを経
て感光させ、現像液によって現像して所要パターンを形
成する。上述のアンダーコート３を施したプリント配線
板上に導体・抵抗体パターンを圧着又は熱圧着して転写
して抵抗体又は導体４を形成する。この後の硬化し１図
示しない絶縁層をスクリーン印刷等によって形成する。A photosensitive conductor (resistor) paste is applied onto a plastic or metal sheet and temporarily dried to produce a conductor (resistor) sheet. This sheet is exposed to light through a masking film and developed with a developer to form a desired pattern. A conductor/resistor pattern is transferred by pressure bonding or thermocompression bonding onto the printed wiring board provided with the above-mentioned undercoat 3 to form a resistor or conductor 4. After curing, an insulating layer (not shown) is formed by screen printing or the like.
上述のシートの感光過程はプリント配線板上に転写した
後にマスキングフィルムを使用して行うこともできる。The photosensitive process of the sheet described above can also be carried out using a masking film after being transferred onto a printed wiring board.
更に、アンダーコート３を施したプリント配線板上に直
接感光性導体ペーストを塗布し、マスキングフィルムを
使用して感光させ現像して導体等を形成することもでき
る。Furthermore, it is also possible to directly apply a photosensitive conductor paste onto the printed wiring board provided with the undercoat 3, expose it to light using a masking film, and develop it to form a conductor or the like.
本発明の転写法によれば、 Ｉｊ！厚はペースト塗布量
によって正確に制御でき１寸法はマスキングフィルム上
のパターンによって正確に制御できるため、後の修正に
必要はない、更に、転写の密着性はよく、剥離等の惧れ
はない。According to the transfer method of the present invention, Ij! Since the thickness can be accurately controlled by the amount of paste applied and one dimension can be accurately controlled by the pattern on the masking film, there is no need for subsequent corrections.Furthermore, the adhesion of the transfer is good and there is no risk of peeling.
第２図に示す実施例はプリント配線板の絶縁基板１上に
銅箔による回路２を形成し、アンダーコート３は一部の
回路２゛上を覆う、この上に抵抗体５と導体ジャンパー
６とを混成回路としてベースフィルムに形成して転写す
る。この方法によってプリント配線板上に１回の転写過
程によって抵抗体５と接続導体６とを形成することがで
きる。In the embodiment shown in FIG. 2, a circuit 2 made of copper foil is formed on an insulating substrate 1 of a printed wiring board, an undercoat 3 covers a part of the circuit 2, and a resistor 5 and a conductive jumper 6 are placed on top of the undercoat 3. A hybrid circuit is formed on the base film and transferred. By this method, the resistor 5 and the connecting conductor 6 can be formed on the printed wiring board in one transfer process.
通常は抵抗体とジャンパー線とは２回のスクリーン印刷
によって形成する。Typically, resistors and jumper wires are formed by two rounds of screen printing.
第３図に示す実施例はプリント配線板の絶縁基板１上に
銅箔による回路２を形成し、アンダーコート３をスクリ
ーン印刷等によって形成する。この上に誘電体７と導体
パターン６とを混成回路として転写法によって形成し、
コンデンサを形成する０通常はコンデンサははんだ付に
よって形成するため工数は著しく減少する。このために
、感光性レジンに誘電体を混合して感光性誘電体ペース
トを作成し、誘電体ペーストを導体でサンドインチ構造
としプリント配線板上に転写してコンデンサとする。In the embodiment shown in FIG. 3, a circuit 2 made of copper foil is formed on an insulating substrate 1 of a printed wiring board, and an undercoat 3 is formed by screen printing or the like. A dielectric material 7 and a conductor pattern 6 are formed on this as a hybrid circuit by a transfer method,
Forming a capacitor Since capacitors are normally formed by soldering, the number of man-hours is significantly reduced. For this purpose, a photosensitive dielectric paste is prepared by mixing a dielectric with a photosensitive resin, and the dielectric paste is formed into a sandwich structure using a conductor and transferred onto a printed wiring board to form a capacitor.
更に多層基板の内層回路として導体及び抵抗体を形成す
ることもできる。Furthermore, conductors and resistors can also be formed as inner layer circuits of a multilayer substrate.
光皿坐立来
本発明による転写法を抵抗体形成に使用すれば膜厚２寸
法が一定になり、修正のトリミングの必要がなく、信頼
性再現性が高い。If the transfer method according to the present invention is used to form a resistor, the film thickness will be constant in two dimensions, there will be no need for corrective trimming, and the reliability and reproducibility will be high.
ジャンパー導体として使用すれば、断線短絡のトラブル
がなく、検査手数が減少し、プリント配線板の歩留りは
向上する。If used as a jumper conductor, there will be no problems with disconnections or short circuits, the number of inspections will be reduced, and the yield of printed wiring boards will be improved.
更に、上述の各種の応用範囲が広い。Furthermore, the various applications mentioned above have a wide range of applications.
第１図は本発明の実施例による抵抗体・導体の転写法に
よるプリント配線板を示す部分拡大断面図、第２図は抵
抗体と導体の混成パターンの転写法によるプリント配線
板を示す部分拡大断面図。
第３図はプリント配線板上のコンデンサを転写法によっ
て形成した部分拡大断面図である。
１０．絶縁基板 ２．、、ｍ箔回路
３０１．アンダーコート４．、、導体・抵抗体５０１．
抵抗体 ６．９．ジャンパー導体 ７１０．誘電体作出
願人 日本シイエムケイ株式会社１０．絶縁基板 ２
．、、ｆＩ箔回路FIG. 1 is a partially enlarged sectional view showing a printed wiring board obtained by transferring a resistor/conductor pattern according to an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view showing a printed wiring board obtained by transferring a hybrid pattern of resistors and conductors. Cross-sectional view. FIG. 3 is a partially enlarged sectional view of a capacitor formed on a printed wiring board by a transfer method. 10. Insulating substrate 2. ,,m foil circuit 301. Undercoat 4. , , conductor/resistor 501 .
Resistor 6.9. Jumper conductor 710. Dielectric material applicant: Japan CMK Co., Ltd. 10. Insulated substrate 2
．． ,, fI foil circuit
Claims (3)
するために， 所要の寸法，膜厚とした抵抗体・導体材料をベースフィ
ルムに塗布し， 該ベースフィルムをプリント配線板に転写して抵抗体・
ジャンパー導体をプリント配線板上に形成して成るプリ
ント配線板の抵抗体・ジャンパー導体の転写法による製
造方法。1. To form a resistor/jumper conductor on a printed wiring board, the resistor/conductor material with the required dimensions and film thickness is applied to a base film, and the base film is transferred to the printed wiring board to form the resistor/jumper conductor.
A method of manufacturing a printed wiring board by forming jumper conductors on a printed wiring board using a transfer method for resistors and jumper conductors.
塗布するして混成回路を形成する請求項１記載の方法。2. 2. The method of claim 1, wherein said resistor and conductor materials are both applied to the same base film to form a hybrid circuit.
てコンデンサ等のチップを形成する請求項１記載の方法
。3. 2. The method of claim 1, wherein a dielectric material and a conductive material are coated on the base film to form a chip such as a capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33719589A JPH03196693A (en) | 1989-12-26 | 1989-12-26 | Manufacture of resistor and conductor of printed wiring board by replication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33719589A JPH03196693A (en) | 1989-12-26 | 1989-12-26 | Manufacture of resistor and conductor of printed wiring board by replication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03196693A true JPH03196693A (en) | 1991-08-28 |
Family
ID=18306339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33719589A Pending JPH03196693A (en) | 1989-12-26 | 1989-12-26 | Manufacture of resistor and conductor of printed wiring board by replication |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03196693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049369A (en) * | 2007-08-17 | 2009-03-05 | Samsung Electro Mech Co Ltd | Capacitor-embedded printed circuit board and manufacturing method thereof |
-
1989
- 1989-12-26 JP JP33719589A patent/JPH03196693A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049369A (en) * | 2007-08-17 | 2009-03-05 | Samsung Electro Mech Co Ltd | Capacitor-embedded printed circuit board and manufacturing method thereof |
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