JPH03188283A - Sealing method for gold-plated materials - Google Patents
Sealing method for gold-plated materialsInfo
- Publication number
- JPH03188283A JPH03188283A JP32270189A JP32270189A JPH03188283A JP H03188283 A JPH03188283 A JP H03188283A JP 32270189 A JP32270189 A JP 32270189A JP 32270189 A JP32270189 A JP 32270189A JP H03188283 A JPH03188283 A JP H03188283A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- treatment
- sealing
- acid
- corrosion resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、金及び金合金めっきを施した素材表面へ封孔
処理を行う方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for sealing the surface of a material plated with gold or gold alloy.
[従来の技術]
コネクタなどの接点部に接触信頼性を確保する目的で、
金めつき等が施されている。ところが近年コスト低減の
目的で益々めっき厚の減少が進んでいる。金めつきの厚
さを薄くすると、めっき層に多数のピンホールが生じ、
ピンホールから下地めっき(一般にNi)の腐食が始ま
るので、ピンホールを何らかの方法で封孔し、腐食を抑
制する必要がある。又、コネクタ用の金めつきは、耐摩
耗性も要求されている。そこで耐食性及び耐摩耗性を向
上させるために封孔処理を施すことが一般的である。従
来の封孔処理は、有機アミン、ワックス、メルカプタン
、オクタデカン誘導体等の処理液中に金めつき材を浸漬
して行っている。[Conventional technology] In order to ensure contact reliability at contact parts such as connectors,
It is decorated with gold plating, etc. However, in recent years, the plating thickness has been increasingly reduced in order to reduce costs. When the thickness of gold plating is reduced, many pinholes occur in the plating layer,
Corrosion of the underlying plating (generally Ni) begins from pinholes, so it is necessary to seal the pinholes by some method to suppress corrosion. Gold plating for connectors is also required to have wear resistance. Therefore, it is common to perform a sealing treatment to improve corrosion resistance and abrasion resistance. Conventional pore sealing treatment is performed by immersing the gold-plated material in a treatment liquid of organic amine, wax, mercaptan, octadecane derivative, or the like.
[発明が解決しようとする課題]
従来の封孔処理においては、往々にしてピンホールの中
まで処理液が浸入せず、充分にピンホールを封孔せず、
ピンホールの部分の耐食性が悪いという問題点があった
。[Problems to be solved by the invention] In conventional hole sealing treatment, the treatment liquid often does not penetrate into the pinhole, and the pinhole is not sufficiently sealed.
There was a problem in that the corrosion resistance of the pinhole portion was poor.
[課題を解決するための手段]
上記問題点を解決するため、本発明者等は鋭意研究した
結果、金めつき材のピンホール部を充分に封孔すること
により、耐食性並びに耐摩耗性が更に向上することを知
見し、本発明に至った。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present inventors conducted extensive research and found that corrosion resistance and wear resistance can be improved by sufficiently sealing the pinhole portions of the gold-plated material. It was discovered that this could be further improved, leading to the present invention.
すなわち、本発明は、金あるいは金合金めっきを施した
素材表面に封孔処理を行う際に前処理として酸洗処理す
ることを特徴とする特許き材の封孔処理方法である。That is, the present invention is a patented method for sealing a material, which is characterized in that pickling is performed as a pretreatment when sealing the surface of a material plated with gold or gold alloy.
本発明を具体的に説明すると、まず、本発明の対象とな
る素材としては、銅又は銅合金、鉄鋼又はステンレス等
の金をめっきすることができる金属あるいは合成樹脂、
セラミックス等の有機、無機質材に金属を貼ったもの又
は無電解めっき等により金属を析出させ、その上に金め
っきしたものにも適用できる。金めつきは、電気めっき
、無電解めっき、蒸着、スパッタリング等によって行う
。封孔処理をする金めつき材は、条、ブロック体、端子
等全ての形状に適用でき特に制限されない。更に封孔処
理液は公知の技術である前述の有機アミン、ワックス、
メルカプタン、オクタデカン誘導体等のいずれの処理で
も実施することができ、特定の処理を規定するものでは
ない。又、封孔処理を行うときに用いる金めつき厚みは
、下地表面が露出しないようにして、それぞれの用途に
適した経済的な厚みを選定して行う。−例を示すと金め
っきを電気めっきで行う場合には、少なくとも0,05
μm以上好ましくは0.1μm以上必要である。To explain the present invention specifically, first, materials to which the present invention is applied include metals or synthetic resins that can be plated with gold such as copper or copper alloys, steel or stainless steel;
It can also be applied to organic or inorganic materials such as ceramics coated with metal, or to metal deposited by electroless plating or the like and then gold plated thereon. Gold plating is performed by electroplating, electroless plating, vapor deposition, sputtering, etc. The gold-plated material for sealing can be applied to all shapes such as strips, blocks, terminals, etc., and is not particularly limited. Furthermore, the pore sealing liquid is a known technique such as the above-mentioned organic amine, wax,
Any treatment with mercaptan, octadecane derivatives, etc. can be carried out, and no specific treatment is prescribed. Furthermore, the thickness of the gold plating used when performing the sealing treatment is selected to be an economical thickness suitable for each application so that the underlying surface is not exposed. - For example, when gold plating is done by electroplating, at least 0.05
The thickness is required to be at least .mu.m, preferably at least 0.1 .mu.m.
特に金めつき素材を封孔処理する前に酸洗処理すること
で、ピンホールの下地金属を活性化することにより、浸
漬塗布だけのものに比し、−段と下地との反応性が良好
となり、しかも充分な封孔性を示し、耐食性も向上する
という特徴がある。In particular, by acid-pickling the gold-plated material before sealing it, the underlying metal of the pinhole is activated, resulting in better reactivity between the layer and the underlying layer compared to dip coating alone. Moreover, it exhibits sufficient pore-sealing properties and is characterized by improved corrosion resistance.
封孔処理法は、特定の封孔処理法を規定するものではな
い。The sealing method does not specify a specific sealing method.
又、使用する酸は下地金属を活性化するものであればよ
く、硝酸、塩酸、硫酸等いずれの酸でも実施でき、特定
の液を規定するものではない。Further, the acid used may be any acid that activates the base metal, and any acid such as nitric acid, hydrochloric acid, sulfuric acid, etc. can be used, and a specific liquid is not specified.
[実施例]
第1表に示す各封孔処理液を1.1.1− トリクロロ
エタンに所定の濃度に溶解した溶液に、金めつきを施し
た条を浸漬する前に 1Ovo1%硫酸溶液に浸漬・処
理した。前処理を行わないものは比較例とした。浸漬6
0秒後、常温で風乾し、下記のテストを行った。[Example] Before immersing the gold-plated strip in a solution in which each sealing solution shown in Table 1 was dissolved in 1.1.1-trichloroethane to a predetermined concentration, it was immersed in a 1Ovo 1% sulfuric acid solution.・Processed. A sample without pretreatment was used as a comparative example. Soaking 6
After 0 seconds, it was air-dried at room temperature, and the following test was performed.
(1)耐食性テスト
封孔処理剤を塗布した金めつき材を5O2X LOpp
a+ X 40℃X65時間X90%以上相対温度の中
に放置した。(1) Corrosion resistance test Gold-plated material coated with a sealing agent is 5O2X LOpp
a+X 40°C x 65 hours x 90% or more of relative temperature.
(2)接触抵抗
耐食性テスト後、金めつき材の接触抵抗の最大値(r+
−200、荷重10g)を求めた。(2) Contact resistance After the corrosion resistance test, the maximum value of contact resistance (r+
-200, load 10g).
テストの結果を第1表に示す。この結果から明らかなよ
うに、本発明実施例では格段に耐食性が優れていること
がわがる。The test results are shown in Table 1. As is clear from these results, it can be seen that the examples of the present invention have significantly excellent corrosion resistance.
[発明の効果]
以上説明したように、本発明の金あるいは金合金めっき
を施した素材表面に封孔処理を行う前に、酸洗処理を行
うことで、ピンホール部にある下地と封孔処理液の反応
性、吸着性に優れたものとなり、耐食性、耐摩耗性に優
れた金あるいは金合金めっき材を得ることができる。[Effects of the Invention] As explained above, by performing pickling treatment before sealing the surface of the material plated with gold or gold alloy of the present invention, the base material and the sealing in the pinhole area can be removed. The treatment solution has excellent reactivity and adsorption properties, and a gold or gold alloy plated material with excellent corrosion resistance and wear resistance can be obtained.
Claims (1)
行う際に前処理として酸洗処理することを特徴とする金
めっき材の封孔処理方法。A method for sealing a gold-plated material, which comprises carrying out pickling treatment as a pretreatment when performing sealing treatment on the surface of a material plated with gold or gold alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32270189A JPH03188283A (en) | 1989-12-14 | 1989-12-14 | Sealing method for gold-plated materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32270189A JPH03188283A (en) | 1989-12-14 | 1989-12-14 | Sealing method for gold-plated materials |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03188283A true JPH03188283A (en) | 1991-08-16 |
Family
ID=18146655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32270189A Pending JPH03188283A (en) | 1989-12-14 | 1989-12-14 | Sealing method for gold-plated materials |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03188283A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010525169A (en) * | 2007-04-18 | 2010-07-22 | エントン インコーポレイテッド | Metal surface strengthening |
US8002595B2 (en) | 2007-01-12 | 2011-08-23 | Furukawa Electric Co., Ltd. | Electrical contact material, method of manufacturing the same, and electrical contact |
-
1989
- 1989-12-14 JP JP32270189A patent/JPH03188283A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8002595B2 (en) | 2007-01-12 | 2011-08-23 | Furukawa Electric Co., Ltd. | Electrical contact material, method of manufacturing the same, and electrical contact |
JP2010525169A (en) * | 2007-04-18 | 2010-07-22 | エントン インコーポレイテッド | Metal surface strengthening |
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